Tuning fork type resonator

Abstract

The utility model provides a tuning fork type resonator, which comprises a bottom plate, two first bonding pads, a tuning fork wafer, conductive slurry, a glass solder layer and an upper cover, and is characterized in that one end of the tuning fork wafer stretches across the two first bonding pads; conductive holes are formed in the two first bonding pads and the positions, corresponding to the first bonding pads, of the bottom plate, the conductive holes are filled with conductive slurry, and the first bonding pads are connected with an external electrode through the conductive slurry; the outer edge of the upper surface of the bottom plate is coated with the glass solder layer in the circumferential direction; the edge of the bottom of the upper cover seals the upper surface of the bottom plate through the glass solder layer. The conductive holes are formed in the first bonding pad and the position, corresponding to the first bonding pad, of the bottom plate, and after the upper cover is fixed to the upper surface of the bottom plate, the interior of the upper cover can be vacuumized through the conductive holes, so that packaging of the tuning fork wafer is achieved, and the packaging efficiency of the tuning fork wafer is improved. And the technical problem of vacuum sealing during glass packaging is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of resonators, in particular to a tuning fork type resonator. Background Art

[0002] With the miniaturization of communication terminal electronic products, ultra-thin, especially smart wearable electronic products, have strict requirements on line installation space, and electronic devices also require small size and miniaturization. As tuning fork-type quartz crystal resonators that generate clock signals in electronic products, the packaging size and packaging cost are gradually reduced, but the low-cost glass packaging is difficult to overcome the problem of sealing under vacuum. Therefore, the vacuum sealing of tuning fork-type resonators is an important technical problem that needs to be overcome in manufacturing technology. Utility Model Content

[0003] Based on the above problems existing in the prior art, the utility model aims to solve the technical problem that the tuning fork type quartz crystal resonator in the prior art is difficult to overcome the sealing under vacuum when using glass packaging.

[0004] The utility model provides a tuning fork type resonator, which comprises:

[0005] Base plate;

[0006] Two first solder pads are fixedly arranged side by side on the upper surface of the base plate;

[0007] A tuning fork wafer, one end of which is arranged across the two first pads;

[0008] Conductive paste, conductive holes are provided on the two first pads and at positions of the bottom plate corresponding to the first pads, the conductive holes are filled with the conductive paste, and the first pads are connected to the external electrode through the conductive paste;

[0009] A glass solder layer is coated on the outer edge of the upper surface of the bottom plate along the circumferential direction;

[0010] The bottom edge of the upper cover is sealed to the upper surface of the base plate through the glass solder layer.

[0011] According to an embodiment of the present invention, the tuning fork resonator further includes two bottom pads fixedly disposed at the bottom of the base plate and corresponding to the first pads one by one, and the bottom pads are connected to the corresponding first pads through the conductive paste.

[0012] According to an embodiment of the present invention, the conductive hole is formed on the bottom pad, and the conductive hole on the bottom pad is connected to the corresponding conductive hole on the first pad.

[0013] According to an embodiment of the present invention, the bottom pad is a metal pad.

[0014] According to an embodiment of the present invention, the tuning fork resonator further includes a supporting pad fixedly disposed at the bottom of the base plate and away from one side of the two first pads.

[0015] According to an embodiment of the utility model, the upper cover includes an upper cover body and a skirt integrally formed at the bottom edge of the upper cover body, and the skirt is sealed and welded to the upper surface of the bottom plate through the glass solder layer.

[0016] According to an embodiment of the present invention, the skirt is integrally formed on the bottom edge of the upper cover body through a stamping process.

[0017] According to an embodiment of the present invention, the bottom plate is a ceramic bottom plate, and the top cover is a metal top cover.

[0018] According to an embodiment of the present invention, the conductive paste includes any one of AuSn, In, PbSn or Ag paste.

[0019] The beneficial effect of the utility model is as follows: in a tuning fork type resonator provided by an embodiment of the utility model, conductive holes are opened on the first soldering pad and at positions corresponding to the first soldering pad on the bottom plate. After the upper cover is fixed to the upper surface of the bottom plate by using the glass solder layer, the interior of the upper cover can be evacuated through the conductive holes, thereby realizing the packaging of the tuning fork chip, overcoming the technical difficulty of vacuum sealing during glass packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a structural schematic diagram of a tuning fork type resonator provided in an embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of a tuning fork type resonator provided by an embodiment of the utility model with the upper cover removed;

[0023] Figure 3 It is a schematic diagram of the bottom structure of a tuning fork type resonator provided in an embodiment of the utility model.

[0024] Figure numerals: 1 - bottom plate; 2 - first pad; 3 - tuning fork wafer; 4 - conductive paste; 5 - glass solder layer; 6 - upper cover; 61 - upper cover body; 62 - skirt; 7 - bottom pad; 8 - support pad. DETAILED DESCRIPTION

[0025] The following descriptions of the embodiments are made with reference to the attached drawings to illustrate specific embodiments in which the present invention may be implemented. The directional terms mentioned in the present invention, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the drawings, units with similar structures are represented by the same reference numerals.

[0026] The utility model provides a tuning fork type resonator, the structure of which is as follows Figure 1 and Figure 2 As shown, it includes a base plate 1, two first pads 2, a tuning fork chip 3, a conductive paste 4, a glass solder layer 5 and an upper cover 6, wherein the base plate 1 is a ceramic base plate, and the two first pads 2 are fixedly arranged side by side on the upper surface of the base plate 1; one end of the tuning fork chip 3 is arranged across the two first pads 2; conductive holes are opened on the two first pads 2 and at the positions corresponding to the base plate 1 and the first pads 2, and the conductive holes are filled with the conductive paste 4, and the first pads 2 are connected to the external electrode through the conductive paste 4, specifically, the conductive paste 4 can be any one of AuSn, In, PbSn or Ag paste; the glass solder layer 5 is circumferentially coated on the outer edge of the upper surface of the base plate 1, specifically, the glass solder layer 5 is a low-melting point glass powder with a softening temperature of 390°C; the bottom edge of the upper cover 6 is sealed to the upper surface of the base plate 1 through the glass solder layer 5; as a specific embodiment, the upper cover 6 is a metal upper cover.

[0027] Compared with the prior art, the tuning fork type resonator provided by the utility model can utilize the glass solder layer 5 to realize the packaging of the base plate 1 and the upper cover 6 in a nitrogen environment. After the packaging is completed, the conductive hole can be used to evacuate the area between the base plate 1 and the upper cover 6, and then the conductive paste is filled in the conductive hole in a vacuum environment to complete the sealing. At the same time, the electrical connection between the first pad 2 and the external electrode can be realized, which solves the sealing problem of glass packaging under vacuum in the prior art.

[0028] Please continue to refer to Figure 2Specifically, in order to facilitate the packaging of the bottom plate 1 and the upper cover 6, the upper cover 6 includes an upper cover body 61 and a skirt 62 integrally formed at the bottom edge of the upper cover body 61, and the skirt 62 is sealed and welded to the upper surface of the bottom plate 1 through the glass solder layer. As a specific embodiment, the skirt 62 is integrally formed at the bottom edge of the upper cover body 61 through a stamping process.

[0029] like Figure 3 The figure shows a schematic diagram of the bottom structure of a tuning fork type resonator provided by an embodiment of the utility model. According to an embodiment of the utility model, in order to facilitate the connection of the first pad 2 with the external electrode through the conductive paste, the tuning fork type resonator also includes two bottom pads 7 fixedly arranged at the bottom of the base plate 1 and corresponding to the first pad 2 one by one. The bottom pad 7 is connected to the corresponding first pad 2 through the conductive paste. Specifically, the bottom pad 7 is a metal pad.

[0030] Furthermore, in order to ensure the reliability of the connection between the bottom pad 7 and the conductive paste, the bottom pad 7 is provided with the conductive hole, and the conductive hole on the bottom pad 7 is interconnected with the corresponding conductive hole on the first pad 2 .

[0031] According to an embodiment of the present invention, the tuning fork resonator further comprises a supporting pad 8 fixedly disposed at the bottom of the base plate 1 and away from the two first pads 2 , and the supporting pad 8 has the same thickness as the bottom pad 7 .

[0032] It can be understood that the arrangement of the first pad 2 makes the flat bottom of the base plate 1 uneven, and by arranging the supporting pad 8, height compensation can be performed and a triangular support can be formed with the two first pads 2.

[0033] The packaging process of a tuning fork resonator provided by the utility model is as follows: first, the first solder pad 2 and the tuning fork chip 3 are fixed on the upper surface of the base plate 1, and then, in a nitrogen environment, the upper cover 6 is sealed and fixed to the upper surface of the base plate 1 through the glass solder layer 5 to package the tuning fork chip 3 fixed on the upper surface of the base plate 1. Specifically, the sealing temperature is 420-550°C; then, a vacuum device is used to evacuate the interior of the upper cover 6 in conjunction with the conductive hole, and finally the conductive hole is filled with conductive paste in a vacuum environment.

[0034] In summary, in a tuning fork resonator provided by an embodiment of the utility model, conductive holes are opened on the first soldering pad 2 and at positions corresponding to the first soldering pad 2 of the base plate 1. After the upper cover 6 is fixed to the upper surface of the base plate 1 by using the glass solder layer 5, the interior of the upper cover 6 can be evacuated through the conductive holes, thereby realizing the packaging of the tuning fork chip 3, overcoming the technical difficulty of vacuum sealing during glass packaging.

[0035] It should be noted that although the present invention is disclosed as above with specific embodiments, the above embodiments are not intended to limit the present invention. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A tuning fork resonator, characterized in that: include: Bottom plate (1); Two first solder pads (2) are fixedly arranged side by side on the upper surface of the base plate (1); A tuning fork chip (3), one end of which is arranged across the two first pads (2); Conductive paste (4), conductive holes are provided on the two first pads (2) and at positions corresponding to the base plate (1) and the first pads (2), the conductive holes are filled with the conductive paste (4), and the first pads (2) are connected to external electrodes through the conductive paste (4); A glass solder layer (5) is coated on the outer edge of the upper surface of the bottom plate (1) along the circumferential direction; The bottom edge of the upper cover (6) is sealed to the upper surface of the base plate (1) through the glass solder layer (5).

2. A tuning fork resonator according to claim 1, characterized in that: It also comprises two bottom pads (7) fixedly arranged at the bottom of the base plate (1) and corresponding to the first pads (2) one by one, and the bottom pads (7) are connected to the corresponding first pads (2) through the conductive paste.

3. A tuning fork resonator according to claim 2, characterized in that: The bottom pad (7) is provided with the conductive hole, and the conductive hole on the bottom pad (7) is connected to the corresponding conductive hole on the first pad (2).

4. A tuning fork resonator according to claim 2, characterized in that: The bottom pad (7) is a metal pad.

5. A tuning fork resonator according to claim 1, characterized in that: It also comprises a supporting pad (8) which is fixedly arranged at the bottom of the base plate (1) and is away from one side of the two first pads (2).

6. A tuning fork resonator according to claim 1, characterized in that: The upper cover (6) comprises an upper cover body (61) and a skirt (62) integrally formed at the bottom edge of the upper cover body (61); the skirt (62) is sealed and welded to the upper surface of the bottom plate (1) via the glass solder layer.

7. A tuning fork resonator according to claim 6, characterized in that: The skirt (62) is integrally formed on the bottom edge of the upper cover body (61) through a stamping process.

8. A tuning fork resonator according to claim 1, characterized in that: The bottom plate (1) is a ceramic bottom plate, and the upper cover (6) is a metal upper cover.

9. A tuning fork resonator according to claim 1, characterized in that: The conductive paste (4) comprises any one of AuSn, In, PbSn or Ag paste.

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