Heat dissipation structure of module component

Abstract

A module component heat dissipation structure comprises an FPC (Flexible Printed Circuit) and a component, the FPC comprises an FPCIC (Flexible Printed Circuit Integrated Circuit) and a copper layer; the copper layer is arranged in the FPCIC; the component is arranged at the central position of the left side of the FPC, the component comprises a high-power-consumption component, and a via hole is formed in the connecting position between the high-power-consumption component and the FPC. According to the module component heat dissipation structure of the utility model, the copper layer arranged in the FPC, the via hole arranged near the high-power-consumption component in the components and the via hole arranged near the reinforcing steel sheet connected with the other side of the FPC correspond to each other, and the copper layer is exposed out of the via holes. Therefore, heat generated after the high-power-consumption component is powered on can be conducted to the other face of the FPC through the via hole to be dissipated, the module component heat dissipation structure can rapidly conduct and dissipate heat near the FPC component, and the purposes of rapidly dissipating heat and preventing the component from being overheated and necrotic are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of display modules, in particular to a heat dissipation structure of module components. Background Art

[0002] At present, the FPC of the existing display module will generate a lot of heat when it is powered on and working, especially on the components of the FPC. Therefore, heat dissipation is required when the display module is working. Once the heat accumulates and is not quickly discharged from the vicinity of the components, it is easy for the components to overheat and necrotize, thereby affecting the normal operation of the product. For this reason, a module component heat dissipation structure is designed, which can quickly conduct and dissipate the heat near the FPC components, thereby achieving rapid heat dissipation and preventing the components from overheating and necrotizing. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a module component heat dissipation structure.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A module component heat dissipation structure comprises: an FPC and components; the FPC comprises an FPCIC and a copper layer; the copper layer is arranged in the FPCIC; the components are arranged at the central position on the left side of the FPC, the components comprise high-power consumption components, and vias are arranged at the connection position between the high-power consumption components and the FPC.

[0006] In one of the embodiments, the copper layer is disposed in the interlayer of the FPC, and the length and width of the copper layer are matched with the length and width of the front surface of the FPC.

[0007] In one embodiment, the thickness of the copper layer is between 0.5 mm and 1.5 mm.

[0008] In one of the embodiments, a reinforcing steel sheet is provided at the center of the right side of the FPC, and the reinforcing steel sheet corresponds to the high power consumption components on the left side of the FPC.

[0009] In one of the embodiments, the via is disposed around the high power consumption component, and the via extends toward the FPC and extends all the way to the surface of the copper layer.

[0010] In one of the embodiments, a plurality of the via holes are provided on a side of the FPC close to the reinforcing steel sheet.

[0011] In one of the embodiments, the positions of the via holes on the FPC side close to the reinforcing steel sheet and the via holes on the FPC side close to the component correspond to each other.

[0012] In one of the embodiments, thermal conductive adhesive is provided in the via hole on the side of the FPC close to the reinforcing steel sheet.

[0013] In one embodiment, the edges and corners around the FPC are rounded.

[0014] In one of the embodiments, a plurality of heat dissipation holes are provided at the connection positions between the FPC, the components and the reinforcing steel sheet.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The heat dissipation structure of module components of the utility model, through the copper layer arranged in the FPC and the vias opened near the high-power consumption components in the components, and corresponding to the vias opened near the reinforcing steel sheet connected to the other side of the FPC, and the copper layer is exposed in the vias, so that the heat generated by the high-power consumption components after power-on can be conducted to the other side of the FPC through the vias for dissipation, and the vias close to the reinforcing steel sheet need to be sealed with thermal conductive glue to avoid forming air thermal resistance, and at the same time accelerate the heat transfer, so that the heat dissipation effect can be faster, so that the heat dissipation structure of module components can achieve the purpose of quickly conducting and dissipating the heat near the FPC components, so as to achieve the purpose of quickly dissipating heat and preventing the components from being overheated and necrotic. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the side stacking of the heat dissipation structure of the module components of the utility model;

[0019] Figure 2 It is a partial schematic diagram of components of the heat dissipation structure of the module components of the utility model.

[0020] In the figure: 1. FPC; 11. Copper layer; 12. FPCIC; 2. Components; 21. High-power components; 3. Reinforcement steel sheet; 4. Via; 5. Thermal conductive adhesive. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0022] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0023] Unless otherwise clearly stipulated and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0025] like Figure 1-2 As shown, a module component heat dissipation structure includes: FPC1 and component 2; FPC1, FPC1 includes FPCIC12 and copper layer 11; copper layer 11 is arranged in FPCIC12; component 2, component 2 is arranged at the central position on the left side of FPC1, component 2 includes high-power consumption component 21, and a via 4 is arranged at the connection position between high-power consumption component 21 and FPC1. It should be noted that this design scheme can be designed not only on FPC1, but also on PCB board, and when FPC1 or PCB is assembled to the backlight, it should be noted that there should be no closed space on the back of the heat dissipation component area to avoid air thermal resistance and heat accumulation.

[0026] like Figure 1-2As shown, in one embodiment, the copper layer 11 is arranged in the interlayer of FPC1, and the length and width of the copper layer 11 are adapted to the length and width of the front surface of FPC1. The thickness of the copper layer 11 is between 0.5 mm and 1.5 mm. It should be noted that the thickness of the copper layer 11 is enhanced compared with the original design, and the thickening can dissipate and conduct heat more quickly.

[0027] like Figure 1-2 As shown, in one embodiment, a reinforcing steel sheet 3 is disposed at the center of the right side of the FPC 1, and the reinforcing steel sheet 3 corresponds to the high power consumption component 21 on the left side of the FPC 1. It should be noted that the reinforcing steel sheet 3 is made of steel sheet and has heat dissipation capability.

[0028] like Figure 1-2 As shown, in one embodiment, the via 4 is arranged around the high power consumption component 21, and the via 4 extends toward the FPC 1 and extends all the way to the surface of the copper layer 11. It should be noted that this design allows the copper layer 11 to be exposed, so that the heat on the component 2 can be transferred to the copper layer 11 more quickly.

[0029] like Figure 1-2 As shown, in one embodiment, a plurality of vias 4 are provided on the side of the FPC1 close to the reinforcing steel sheet 3. The vias 4 on the side of the FPC1 close to the reinforcing steel sheet 3 correspond to the vias 4 on the side of the FPC1 close to the component 2. It should be noted that the corresponding design of the vias 4 on both sides of the FPC1 can better dissipate heat and conduct heat.

[0030] like Figure 1-2 As shown, in one embodiment, the thermal conductive adhesive 5 is disposed in the via hole 4 on the side of the FPC 1 close to the reinforcing steel sheet 3. It should be noted that when the thermal conductive adhesive 5 is disposed, the bottom of the via hole 4 should not be left alone to avoid forming air thermal resistance.

[0031] like Figure 1-2 As shown, in one embodiment, the edges and corners around the FPC 1 are rounded.

[0032] like Figure 1-2 As shown, in one embodiment, a plurality of heat dissipation holes are provided at the connection positions between the FPC 1 and the components 2 and the reinforcing steel sheet 3. It should be noted that this design can enhance the heat dissipation capability of the FPC 1.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A module component heat dissipation structure, characterized in that: include: FPC (1) and components (2); An FPC (1), the FPC (1) comprising an FPCIC (12) and a copper layer (11); the copper layer (11) is arranged in the FPCIC (12); A component (2) is arranged at a central position on the left side of the FPC (1), the component (2) comprises a high power consumption component (21), and a via (4) is arranged at a connection position between the high power consumption component (21) and the FPC (1).

2. The module component heat dissipation structure according to claim 1, characterized in that: The copper layer (11) is arranged in the interlayer of the FPC (1), and the length and width of the copper layer (11) are adapted to the length and width of the front surface of the FPC (1).

3. The module component heat dissipation structure according to claim 1, characterized in that: The thickness of the copper layer (11) is between 0.5 mm and 1.5 mm.

4. The module component heat dissipation structure according to claim 1, characterized in that: A reinforcing steel sheet (3) is provided at the central position of the right side of the FPC (1), and the reinforcing steel sheet (3) corresponds to the high power consumption component (21) on the left side of the FPC (1).

5. The module component heat dissipation structure according to claim 1, characterized in that: The via hole (4) is arranged around the large power consumption component (21), and the via hole (4) extends onto the FPC (1) and extends all the way to the surface of the copper layer (11).

6. The module component heat dissipation structure according to claim 4, characterized in that: A plurality of via holes (4) are provided on one side of the FPC (1) close to the reinforcing steel sheet (3).

7. The module component heat dissipation structure according to claim 6, characterized in that: The positions of the via holes (4) on the side of the FPC (1) close to the reinforcing steel sheet (3) and the via holes (4) on the side of the FPC (1) close to the component (2) correspond to each other.

8. The module component heat dissipation structure according to claim 6, characterized in that: A heat-conducting adhesive (5) is provided in the through hole (4) on the side of the FPC (1) close to the reinforcing steel sheet (3).

9. The module component heat dissipation structure according to claim 1, characterized in that: The edges and corners around the FPC (1) are rounded.

10. The module component heat dissipation structure according to claim 4, characterized in that: A plurality of heat dissipation holes are provided at the connection positions between the FPC (1), the components (2) and the reinforcing steel sheet (3).

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