Copper dissolving device and conductive metal film production equipment

Abstract

The utility model discloses a copper dissolving device and conductive metal film production equipment. The copper dissolving device comprises a copper dissolving tank, a filter plate, a diffusion pipe, a spraying assembly and a liquid pumping assembly. The copper dissolving tank is provided with a reaction cavity; a reflux inlet is formed in the top of the reaction cavity; the filter plate is arranged in the reaction cavity and divides the reaction cavity into an upper chamber and a lower chamber; the diffusion pipe is arranged in the reaction cavity and extends in the vertical direction of the reaction cavity, the top end of the diffusion pipe is connected with the reflux inlet, and the bottom end of the diffusion pipe extends to the side, close to the lower cavity, of the filter plate; the spraying assembly is arranged in the lower cavity and comprises a nozzle, and the nozzle communicates with the diffusion pipe; the liquid pumping assembly is arranged outside the copper dissolving tank so as to pump a solution in the lower cavity to the backflow opening. The copper dissolving device can solve the problem that the reaction speed of metal copper and sulfuric acid in a copper dissolving device in the prior art is low.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive metal film production, in particular to a copper dissolving device and conductive metal film production equipment. Background Art

[0002] Conductive metal film is a kind of material with many good properties. It is now widely used in batteries as positive or negative current collectors. Copper dissolution is a process in the production of conductive metal film. It is a critical process to provide copper sulfate solution for copper foil production.

[0003] In the prior art, a copper dissolving tank is usually used to prepare a copper sulfate solution. During the preparation process, the solution at the bottom of the copper dissolving tank needs to be continuously pumped back into the copper dissolving tank through the top of the copper dissolving tank and mixed with air to react with metallic copper to generate copper sulfate. During the whole process, the reaction speed in the copper dissolving tank needs to be controlled at any time to ensure that the concentration of copper sulfate is within a set range. In the existing copper dissolving device, the contact time between metallic copper and air is relatively short, and the reaction speed between metallic copper and sulfuric acid is relatively slow. Utility Model Content

[0004] The main purpose of the utility model is to provide a copper dissolving device and conductive metal film production equipment, so as to at least solve the problem that the reaction speed of metal copper and sulfuric acid in the copper dissolving device in the prior art is relatively slow.

[0005] According to one aspect of the utility model, a copper dissolving device is provided, comprising:

[0006] A copper dissolving tank, wherein the copper dissolving tank is provided with a reaction chamber, and a reflux port is provided on the top of the reaction chamber;

[0007] A filter plate, the filter plate is disposed in the reaction chamber and divides the reaction chamber into an upper chamber and a lower chamber;

[0008] A diffusion tube, the diffusion tube is arranged in the reaction chamber and extends in the up-down direction of the reaction chamber, the top end of the diffusion tube is connected to the reflux port, and the bottom end of the diffusion tube extends to a side of the filter plate close to the lower chamber;

[0009] an injection assembly, the injection assembly being disposed in the lower chamber, the injection assembly comprising a nozzle, the nozzle being communicated with the diffusion pipe; and

[0010] A liquid pump assembly is arranged outside the copper dissolving tank to pump the solution in the lower chamber to the reflux port.

[0011] Further, the injection assembly includes a support plate, and the diffusion pipe is vertically connected to the support plate;

[0012] Among them, the diffuser tube is provided with a plurality of through holes on the outer peripheral side wall close to the support plate, and a plurality of pipes are provided on one side of the support plate close to the filter plate. The plurality of pipes are connected to the plurality of through holes in a one-to-one correspondence, and the nozzle is provided on the pipe.

[0013] Furthermore, a plurality of the pipes are radially arranged along the outer circumference of the diffuser pipe.

[0014] Furthermore, each of the pipes is provided with a plurality of the nozzles, and the plurality of nozzles are arranged at intervals along the extension direction of the pipe.

[0015] Furthermore, a sealing portion is provided at the bottom end of the diffuser tube, and a flow-guiding protrusion is provided on the sealing portion, and the flow-guiding protrusion is at least used to guide the fluid in the diffuser tube to the through hole.

[0016] Furthermore, the center line of the guide protrusion is located on the axis of the diffuser, and along the direction from the upper chamber to the lower chamber, the distance from the axis of the diffuser to the outer peripheral surface of the guide protrusion gradually increases.

[0017] Furthermore, along the direction from the upper chamber to the lower chamber, the diameter of the diffusion tube gradually increases.

[0018] Furthermore, the pump assembly comprises:

[0019] A liquid pump, the liquid pump is arranged outside the copper dissolving tank;

[0020] A liquid pumping pipeline, one end of which is connected to the lower chamber, and the other end of which is connected to the inlet end of the liquid pump;

[0021] A reflux pipe, one end of which is connected to the outlet end of the liquid pump, and the other end of which is connected to the reflux port;

[0022] A control motor is electrically connected to the liquid pump.

[0023] Furthermore, the copper dissolving device further comprises:

[0024] A cooling water tank, the cooling water tank is arranged in an annular shape close to the outer peripheral surface of the copper dissolving tank, and the cooling water tank includes an inlet pipe and an outlet pipe;

[0025] a cooling circulation pump, wherein the inlet of the cooling circulation pump is communicated with the outlet pipeline, and the outlet of the cooling circulation pump is communicated with the inlet pipeline;

[0026] A radiator is arranged on the cooling water tank.

[0027] On the other hand, the present application also provides a conductive metal film production device, which includes the above-mentioned copper dissolving device.

[0028] In the utility model, by arranging a spray assembly at the bottom of the diffusion tube, the impact force and diffusion area of ​​sulfuric acid, copper sulfate solution and air at the bottom of the diffusion tube can be increased, so that the sulfuric acid and the bubbles in the copper sulfate solution can fully contact with the metal copper. At the same time, the fluid sprayed by the nozzle can generate bubbles in the lower chamber, and the rising characteristics of the bubbles are utilized. The metal copper is located on the path of the rising bubbles, which can further increase the contact time between the metal copper and the bubbles. The metal copper can fully contact with the air and sulfuric acid and react to generate the copper sulfate solution, which can improve the preparation rate of the copper sulfate solution in the reaction chamber of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0030] Figure 1 A three-dimensional structural diagram of a copper dissolving device disclosed in an embodiment of the utility model;

[0031] Figure 2 It is a front view of the copper dissolving device disclosed in the embodiment of the utility model;

[0032] Figure 3 for Figure 2 AA section view in;

[0033] Figure 4 for Figure 3 A magnified view of the M region in FIG.

[0034] Figure 5 A three-dimensional structural diagram of the injection assembly disclosed in the embodiment of the utility model;

[0035] Figure 6 for Figure 3 BB section view in.

[0036] The above drawings include the following reference numerals:

[0037] 10. Copper dissolving tank; 11. Reaction chamber; 12. Reflux port; 111. Upper chamber; 112. Lower chamber; 13. Overflow port; 14. Feed port; 15. Exhaust hole; 20. Filter plate; 30. Diffuser; 31. Through hole; 32. Sealing part; 321. Guide protrusion; 33. Diffuser section; 40. Injection assembly; 41. Support plate; 42. Nozzle; 43. Pipeline; 50. Pump liquid assembly; 51. Liquid pump; 52. Liquid pumping pipeline; 521. Collecting pipe; 522. Branch pipe; 5221. Extension section; 5222. Port; 53. Reflux pipeline; 54. Control motor; 60. Cooling water tank; 61. Inlet pipeline; 62. Outlet pipeline; 90. Ejector. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0040] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0041] See also Figures 1 to 5 As shown, according to an embodiment of the present application, a copper dissolving device is provided, which includes a copper dissolving tank 10 , a filter plate 20 , a diffusion tube 30 , a spray assembly 40 and a pump liquid assembly 50 .

[0042] Among them, the copper dissolving tank 10 is provided with a reaction chamber 11, and a reflux port 12 is provided on the top of the reaction chamber 11; the filter plate 20 is provided in the reaction chamber 11 and divides the reaction chamber 11 into an upper chamber 111 and a lower chamber 112; the diffusion tube 30 is provided in the reaction chamber 11 and extends along the up and down directions of the reaction chamber 11, the top end of the diffusion tube 30 is connected to the reflux port 12, and the bottom end of the diffusion tube 30 extends to the side of the filter plate 20 close to the lower chamber 112; the injection assembly 40 is provided in the lower chamber 112, and the injection assembly 40 includes a nozzle 42, and the nozzle 42 is connected to the diffusion tube 30; the pump liquid assembly 50 is provided outside the copper dissolving tank 10 to pump the solution in the lower chamber 112 to the reflux port 12.

[0043] In the utility model, the reaction chamber 11 of the copper dissolving tank 10 is used to prepare the copper sulfate solution. During the actual preparation, sulfuric acid is placed in the reaction chamber 11, and then a copper block or a copper ball is placed on the filter plate 20 of the reaction chamber 11. At this time, the sulfuric acid, the metal copper and the air in the reaction chamber 11 are mixed and reacted to prepare the copper sulfate solution. During the reaction process, the pump liquid component 50 can pump the sulfuric acid and the copper sulfate solution at the bottom of the reaction chamber 11 to the reflux port 12 as needed. At this time, the sulfuric acid and the copper sulfate solution can flow along the diffusion tube 30 to the bottom end of the diffusion tube 30 and spray from the nozzle 42. In this process, the sulfuric acid, the copper sulfate solution and the air sprayed from the nozzle 42 can be sprayed toward the direction of the filter plate 20, and then can fully contact and react with the metal copper on the filter plate 20, which can improve the preparation rate of the copper sulfate solution in the reaction chamber 11 to a certain extent.

[0044] That is to say, in this embodiment, by arranging the injection assembly 40 at the bottom of the diffusion tube 30, the impact force and diffusion area of ​​the sulfuric acid, copper sulfate solution and air at the bottom of the diffusion tube 30 can be increased, so that the bubbles in the sulfuric acid and copper sulfate solution can fully contact with the metallic copper. At the same time, the fluid injected by the nozzle 42 can generate bubbles in the lower chamber 112. By utilizing the rising characteristics of the bubbles and the metallic copper being located on the path of the rising bubbles, the contact time between the metallic copper and the bubbles can be further increased. The metallic copper can fully contact with the air and sulfuric acid and react to generate the copper sulfate solution, which can increase the preparation rate of the copper sulfate solution in the reaction chamber 11 of this embodiment.

[0045] Further, the injection assembly 40 in this embodiment includes a support plate 41, and the diffusion tube 30 is vertically connected to the support plate 41. Among them, a plurality of through holes 31 are provided on the outer peripheral side wall of the diffusion tube 30 close to the support plate 41, and a plurality of pipes 43 are provided on the side of the support plate 41 close to the filter plate 20, and the plurality of pipes 43 are connected with the plurality of through holes 31 one by one, and the nozzle 42 is provided on the pipe 43. In this embodiment, by providing a plurality of pipes 43 connected with the plurality of through holes 31, and correspondingly providing the nozzle 42 on the pipe 43, the solution refluxed from the top of the diffusion tube 30 can be sprayed out from different places above the support plate 41, so that sulfuric acid, copper sulfate solution and air can be further fully contacted and reacted with the metal copper on the filter plate 20, and the preparation rate of the copper sulfate solution in the reaction chamber 11 can be further improved.

[0046] Optionally, the support plate 41 in this embodiment includes a circular plate, and the plurality of pipes 43 are radially arranged along the center of the circular plate, that is, the plurality of pipes 43 are radially arranged along the outer circumference of the diffusion tube 30. In this way, the solution flowing back from the top of the diffusion tube 30 can be more evenly sprayed out from different places above the support plate 41, which is more convenient for sulfuric acid, sulfuric acid solution, air and metallic copper.

[0047] It is understandable that the support plate 41 in the present application may also be a square plate, an elliptical plate or other special-shaped plates, which may be specifically designed and selected according to the cross-section of the reaction chamber 11. In actual installation, the pipes 43 in this embodiment may be two, three, four or more than four, which is not specifically limited in this embodiment.

[0048] Furthermore, each pipe 43 in this embodiment is provided with a plurality of nozzles 42, and the plurality of nozzles 42 are arranged at intervals along the extending direction of the pipe 43. Such an arrangement can increase the spraying area of ​​the sulfuric acid solution, and further enable the sulfuric acid, copper sulfate solution and air sprayed from the nozzle 42 to fully contact and react with the metallic copper on the filter plate 20, thereby increasing the preparation rate of the copper sulfate solution in the reaction chamber 11.

[0049] See also Figures 3 to 5As shown, the bottom end of the diffuser 30 in this embodiment is provided with a sealing portion 32, and the sealing portion 32 is provided with a guide protrusion 321, and the guide protrusion 321 is at least used to guide the fluid in the diffuser 30 to the through hole 31. Optionally, the center line of the guide protrusion 321 in this embodiment is located on the axis of the diffuser 30, and along the direction from the upper chamber 111 to the lower chamber 112, the distance from the axis of the diffuser 30 to the outer peripheral surface of the guide protrusion 321 gradually increases. That is to say, the guide protrusion 321 in this embodiment is set in a way that the top is thin and the bottom is thick, so that when the fluid flows along the outer surface of the guide protrusion 321, it can expand outward, thereby facilitating the flow to the through hole 31 at the outer peripheral edge of the diffuser 30 and entering the pipeline 43.

[0050] Furthermore, the diffusion tube 30 includes a diffusion section 33 , and the diameter of the diffusion section 33 gradually increases from the upper chamber 111 to the lower chamber 112 , so as to effectively diffuse and transport the solution flowing from the reflux port 12 to the multiple pipes 43 .

[0051] In the present application, the copper dissolving tank 10 is arranged in a cylindrical shape as a whole. For example, the copper dissolving tank 10 can be arranged in a cylindrical shape, a prismatic shape, an elliptical shape or other special-shaped cylindrical shape. The reaction chamber 11 can be a cylindrical cavity, a prismatic cavity, an elliptical cavity or other special-shaped cylindrical cavity.

[0052] Optionally, the copper dissolving tank 10 in this embodiment is provided with an overflow port 13, which is connected to the reaction chamber 11. When the copper dissolving tank 10 is working, the copper sulfate solution inside the copper dissolving tank 10 can flow out from the overflow port 13; the copper dissolving tank 10 is also provided with a sewage outlet (not shown in the figure), which is arranged at the bottom of the reaction chamber 11, so as to facilitate the discharge of impurities and the like generated during the operation of the copper dissolving tank 10 out of the copper dissolving tank 10. The top of the copper dissolving tank 10 is provided with a feed port 14, which is arranged at the top of the copper dissolving tank 10, so as to facilitate the delivery of copper balls and copper blocks; the top of the copper dissolving tank 10 is provided with an exhaust hole 15, which is connected to the reaction chamber 11, so as to facilitate the discharge of gas and the like in the reaction chamber 11 out of the copper dissolving tank 10.

[0053] Combination Figures 1 to 6As shown, the pump liquid assembly 50 in this embodiment includes a liquid pump 51, a liquid pumping pipe 52, a reflux pipe 53 and a control motor 54. The liquid pump 51 is arranged outside the copper dissolving tank 10; one end of the liquid pumping pipe 52 is connected to the lower chamber 112, and the other end of the liquid pumping pipe 52 is connected to the inlet end of the liquid pump 51; one end of the reflux pipe 53 is connected to the outlet end of the liquid pump 51, and the other end of the reflux pipe 53 is connected to the reflux port 12; the control motor 54 is electrically connected to the liquid pump 51. During the reaction of metallic copper, sulfuric acid and air, the liquid pump 51 is controlled by the control motor 54, and the pumping speed of the liquid pump 51 can be controlled, so that the sulfuric acid and copper sulfate solution at the bottom of the reaction chamber 11 can be pumped to the reflux port 12 and then enter the reaction chamber 11 again according to needs to control the reaction speed of metallic copper and sulfuric acid and the concentration of the copper sulfate solution.

[0054] The liquid extraction pipeline 52 in this embodiment includes a collecting pipe 521 and at least two branch pipes 522. The first end of the collecting pipe 521 is connected to the inlet end of the liquid extraction pump 51, and the first end of each branch pipe 522 is connected to the second end of the collecting pipe 521. The second ends of at least two branch pipes 522 are arranged along the periphery of the reaction chamber 11 and are connected to the reaction chamber 11, so that the liquid in the reaction chamber 11 forms a vortex when the liquid extraction pump 51 is working.

[0055] In the present application, since the liquid extraction pipeline 52 has at least two branch pipes 522, and the second ends of at least two branch pipes 522 are arranged along the circumference of the reaction chamber 11 and are connected to the reaction chamber 11, when the liquid extraction pump 51 is working, the liquid in the reaction chamber 11 can enter the branch pipe 522 from the second end of each branch pipe 522. In this process, the liquid in the reaction chamber 11 can form a vortex in the center of the reaction chamber 11. The bubble density in the vortex is relatively small, and it will flow toward the center of the vortex. The bubbles are not easy to gather on the inner wall of the reaction chamber 11. In other words, when the liquid extraction pump 51 is working, the bubble content in the liquid extracted by the branch pipe 522 is relatively small, and it is not easy to cause cavitation to the blades of the liquid extraction pump 51, which can improve the service life of the liquid extraction pump 51 in this embodiment and is not easy to cause danger.

[0056] In the present application, each branch pipe 522 has an extension section 5221 extending into the reaction chamber 11. In the projection of the copper dissolving tank 10 along the up and down direction, the extension section 5221 is arranged to extend in a clockwise or counterclockwise direction. Figure 6The figure shows the arrangement of the extension section 5221 extending in the counterclockwise direction. That is to say, the at least two extension sections 5221 described in this embodiment are generally arranged in a spiral shape along the circumference of the reaction chamber 11 in the projection in the up-down direction. In this way, when the liquid pump 51 is working, the suction force of each extension section 5221 on the liquid in the reaction chamber 11 forms a combined force, which can apply a force in the clockwise or counterclockwise direction to the liquid inside the reaction chamber 11, so that the liquid in the reaction chamber 11 can form a vortex in the center of the reaction chamber 11. At this time, the bubble density in the vortex is less than the density of the liquid, and the bubbles will gather to the center of the reaction chamber 11, while the bubble content in the liquid sucked in by the extension section 5221 located at the edge of the vortex is relatively small, so that the bubbles can be prevented from causing cavitation to the blades of the liquid pump 51. Optionally, the branch pipes 522 in this embodiment can be two, three, four or more, and the appendix of this application Figure 1 The case where there are two branch pipes 522 is shown in FIG.

[0057] Furthermore, the at least two sections of the extending sections 5221 are evenly arranged at circumferential intervals along the first circumference of the reaction chamber 11 (the contour of the first circumference is consistent with the outer circumferential contour of the reaction chamber 11), and the axes of the extending sections 5221 are in the same plane. That is to say, the at least two sections of the extending sections 5221 in this embodiment are located at the same height of the reaction chamber 11. When the liquid pump 51 is working, the extending sections 5221 evenly arranged at circumferential intervals along the first circumference and in the same plane can apply suction force to the liquid at the same height in the reaction chamber 11, which can effectively make the liquid in the reaction chamber 11 form a vortex in the center of the reaction chamber 11, and the bubbles in the liquid will flow toward the center of the vortex. The bubbles are not easy to gather on the inner wall of the reaction chamber 11. The bubble content in the liquid sucked by the branch pipe 522 is relatively small, and it is not easy to cause cavitation to the blades of the liquid pump 51, which can improve the service life of the liquid pump 51 in this embodiment. Of course, in other embodiments of the present application, the at least two extending sections 5221 mentioned above can also be set at a certain position staggered along the height direction of the copper dissolving tank 10, as long as it is ensured that the liquid in the reaction chamber 11 can form a vortex in the center of the reaction chamber 11 when the liquid pump 51 is working.

[0058] Further, the distance from the port 5222 of each protruding section 5221 to the center of the first circle is 2 / 3 to 5 / 6 of the radius of the first circle. In other words, when the radius of the first circle is r, the distance from the port 5222 of each protruding section 5221 to the center of the first circle is 2*r / 3 to 5*r / 6, such as 2*r / 3, 3*r / 4, or 5*r / 6. When the distance from the port 5222 of the extension section 5221 to the center of the first circle is greater than 5*r / 6, the port 5222 of the extension section 5221 is relatively close to the center of the vortex, and the extension section 5221 can easily suck the bubbles in the center of the vortex; when the distance from the port 5222 of the extension section 5221 to the center of the first circle is less than 2*r / 3, it is not easy to apply suction force to the liquid in the reaction chamber 11 to form a vortex in the center of the reaction chamber 11, and it is not convenient to suck the liquid in the reaction chamber 11. That is to say, by making the distance from the port 5222 of each extension section 5221 to the center of the first circle be 2 / 3 to 5 / 6 of the radius of the first circle, the present application can ensure the liquid circulation efficiency while fully avoiding bubbles from entering the liquid pump 51 and causing cavitation to the liquid pump 51.

[0059] Furthermore, the insertion section 5221 extends along the inner wall of the reaction chamber 11. That is to say, from the position where the insertion section 5221 is connected to the reaction chamber 11 to the direction of the port 5222 of the insertion section 5221, the distance from the axis of the insertion section 5221 to the center of the first circle is constant, and the insertion section 5221 is a circular arc segment. With such a configuration, when the liquid pump 51 is working, the suction force of each insertion section 5221 on the liquid in the reaction chamber 11 makes it easier for the liquid in the reaction chamber 11 to form a vortex at the center of the reaction chamber 11.

[0060] In other embodiments not shown in the present application, the extension segment 5221 can also be a straight segment, and multiple extension segments 5221 are extended in a counterclockwise or clockwise direction within the projection of the copper dissolving tank 10 along the up and down direction. When the liquid pump 51 is working, the suction force of each extension segment 5221 on the liquid in the reaction chamber 11 makes it easier for the liquid in the reaction chamber 11 to form a vortex in the center of the reaction chamber 11.

[0061] Optionally, the lengths of the branch pipes 522 are the same. That is, the distances from the ports 5222 of the branch pipes 522 to the collecting pipe 521 are equal, so as to ensure that the force exerted by each branch pipe 522 on the vortex is the same, thereby ensuring that the vortex lasts for a long time and plays a role in collecting bubbles to avoid cavitation of the blades of the liquid pump 51.

[0062] Further, the copper dissolving device in the present embodiment also includes a cooling water tank 60, a cooling circulation pump and a radiator. The cooling water tank 60 is arranged in an annular shape against the outer peripheral surface of the copper dissolving tank 10, and the cooling water tank 60 includes an inlet pipe 61 and an outlet pipe 62; the inlet of the cooling circulation pump is connected to the outlet pipe 62, and the outlet of the cooling circulation pump is connected to the inlet pipe 61; the radiator is arranged on the cooling water tank 60. When the cooling circulation pump works, cooling water can be pumped to the cooling water tank 60 to cool the copper dissolving tank 10, so that the temperature in the copper dissolving tank 10 is maintained within a suitable range (usually 80 degrees Celsius to 95 degrees Celsius), and then the reaction rate of copper and sulfuric acid in the reaction chamber 11 and the concentration of the copper sulfate solution can be controlled. In the present embodiment, by providing a radiator, it is convenient to dissipate heat from the cooling water tank 60 to cool the water in the cooling water tank 60, improve the heat exchange effect between the cooling water tank 60 and the copper dissolving tank 10 in the present embodiment, and can quickly and accurately control the temperature of the copper dissolving tank 10.

[0063] Compared with the method of controlling the concentration of the copper sulfate solution by reducing the amount of metallic copper or stopping the addition of sulfuric acid in the prior art, in this embodiment, only at least one of the liquid pump 51 and the cooling water pump needs to be controlled to achieve the control of the reaction rate of the copper and sulfuric acid in the reaction chamber 11 and the concentration of the copper sulfate solution, without frequently increasing or decreasing the amount of metallic copper or sulfuric acid added to the reaction chamber 11. The operation is simple and it is convenient to accurately control the reaction rate of the metallic copper and sulfuric acid in the reaction chamber 11 and the concentration of the copper sulfate solution.

[0064] Furthermore, the cooling water tank 60 in this embodiment is arranged in an annular shape close to the outer peripheral surface of the copper dissolving tank 10, and the cooling water tank 60 includes an inlet pipe 61 and an outlet pipe 62. The inlet of the cooling circulation pump is connected to the outlet pipe 62, and the outlet of the cooling circulation pump is connected to the inlet pipe 61. In this structure, by setting the cooling water tank 60 in an annular shape and close to the outer peripheral surface of the copper dissolving tank 10, the contact area between the cooling water tank 60 and the copper dissolving tank 10 can be increased, thereby facilitating the rapid control and adjustment of the temperature in the reaction chamber 11, and finally achieving the purpose of controlling the reaction rate of metallic copper and sulfuric acid and the concentration of the copper sulfate solution.

[0065] Furthermore, there are at least two cooling water tanks 60 in this embodiment, and at least two cooling water tanks 60 are arranged at intervals along the height direction of the copper dissolving tank 10. Exemplarily, there can be two, three, four or more cooling water tanks 60. Figures 1 to 3The case where there are two cooling water tanks 60 is shown in the figure. During actual installation, one cooling water tank 60 is installed in the middle of the height direction of the copper dissolving tank 10, and the other cooling water tank 60 is installed at the bottom of the copper dissolving tank 10. In this way, the middle and bottom positions of the copper dissolving tank 10 can be cooled respectively. The present application can quickly control and adjust the temperature in the reaction chamber 11 by setting a plurality of cooling water tanks 60, thereby facilitating accurate control of the reaction rate of copper and sulfuric acid. Of course, in other embodiments of the present application, the cooling water tank 60 can also be set to one, as long as it is ensured that there is a sufficiently large contact area between the cooling water tank 60 of the cooling assembly and the copper dissolving tank 10 to control the temperature inside the reaction chamber 11.

[0066] In the actual design process, a temperature detection element (not shown in the figure) can be set on the copper dissolving tank 10, such as a temperature sensor to detect the temperature of the reaction chamber 11. The temperature detected by the temperature sensor can be transmitted to the controller of the copper dissolving tank control device. The controller can control the cooling circulation pump according to the temperature signal transmitted by the temperature sensor, and then the cooling efficiency of the copper dissolving tank 10 by the cooling water tank 60 can be controlled. The structure is simple, and it is easy to realize automatic control, which can further improve the control accuracy of the reaction rate of copper and sulfuric acid and the concentration of the copper sulfate solution.

[0067] Furthermore, the copper dissolving tank control device in the present embodiment further includes an ejector 90, which is arranged on the top of the copper dissolving tank 10 and communicated with the reflux port 12, and the reflux pipe 53 is communicated with the ejector 90. The inner side of the ejector 90 is a channel, and air can enter from the outside. When the copper dissolving control device is working, the cooling water tank 60 cooperates with the pump liquid component 50 to achieve the control of the reaction speed in the reaction chamber 11 from multiple aspects such as temperature control, acid supply speed, and air replenishment, thereby simplifying and quantifying the reaction speed control process of copper and sulfuric acid, and being able to accurately control the reaction speed of copper and sulfuric acid. That is to say, the pump liquid component 50 of the present application pumps the mixed liquid of the acid solution and the copper sulfate solution at the bottom of the copper dissolving tank 10 from the bottom of the copper dissolving tank 10 to the top to enter the copper dissolving tank 10 to react with the metallic copper. By adjusting the working frequency of the control motor 54, the pumping speed of the liquid pump 51 can be controlled, which can not only adjust the acid supply speed, but also control the amount of air mixed through the ejector 90. Moreover, the process of pumping liquid circulation itself is a process of continuous heating. It can be seen that the present application can realize the control of the reaction rate of copper and sulfuric acid and the concentration of copper sulfate solution from at least three dimensions.

[0068] On the other hand, the present application also discloses a conductive metal film production device, which includes the above-mentioned copper dissolving tank control device. Therefore, the conductive metal film production device includes all the technical effects of the above-mentioned pumping device. Since the technical effects of the copper dissolving tank control device have been described in detail above, they will not be repeated here.

[0069] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0070] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0071] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A copper dissolving device, characterized in that: include: A copper dissolving tank (10), wherein the copper dissolving tank (10) is provided with a reaction chamber (11), and a reflux port (12) is provided at the top of the reaction chamber (11); a filter plate (20), the filter plate (20) being arranged in the reaction chamber (11) and dividing the reaction chamber (11) into an upper chamber (111) and a lower chamber (112); a diffusion pipe (30), the diffusion pipe (30) being arranged in the reaction chamber (11) and extending in the up-down direction of the reaction chamber (11), the top end of the diffusion pipe (30) being connected to the reflux port (12), and the bottom end of the diffusion pipe (30) extending to a side of the filter plate (20) close to the lower chamber (112); an injection assembly (40), the injection assembly (40) being disposed in the lower chamber (112), the injection assembly (40) comprising a nozzle (42), the nozzle (42) being in communication with the diffusion pipe (30); and A liquid pumping assembly (50) is arranged outside the copper dissolving tank (10) to pump the solution in the lower chamber (112) to the reflux port (12).

2. The copper dissolving device according to claim 1, characterized in that: The injection assembly (40) comprises a support plate (41), and the diffusion pipe (30) is vertically connected to the support plate (41); The diffuser tube (30) is provided with a plurality of through holes (31) on its outer peripheral side wall close to the support plate (41), and a plurality of pipes (43) are provided on one side of the support plate (41) close to the filter plate (20), the plurality of pipes (43) are connected to the plurality of through holes (31) in a one-to-one correspondence, and the nozzle (42) is provided on the pipe (43).

3. The copper dissolving device according to claim 2, characterized in that: The plurality of pipes (43) are radially arranged along the outer circumference of the diffusion pipe (30).

4. The copper dissolving device according to claim 2, characterized in that: A plurality of the nozzles (42) are arranged on each of the pipes (43), and the plurality of the nozzles (42) are arranged at intervals along the extension direction of the pipe (43).

5. The copper dissolving device according to claim 2, characterized in that: A sealing portion (32) is provided at the bottom end of the diffusion tube (30), and a flow-guiding protrusion (360) is provided on the sealing portion (32). The flow-guiding protrusion (360) is at least used to guide the fluid in the diffusion tube (30) to the through hole (31).

6. The copper dissolving device according to claim 5, characterized in that: The center line of the guide protrusion (360) is located on the axis of the diffuser (30), and along the direction from the upper chamber (111) to the lower chamber (112), the distance from the axis of the diffuser (30) to the outer peripheral surface of the guide protrusion (360) gradually increases.

7. The copper dissolving device according to any one of claims 1 to 6, characterized in that: Along the direction from the upper chamber (111) to the lower chamber (112), the diameter of the diffusion tube (30) gradually increases.

8. The copper dissolving device according to any one of claims 1 to 6, characterized in that: The pump assembly (50) comprises: A liquid extraction pump (51), wherein the liquid extraction pump (51) is arranged outside the copper dissolving tank (10); A liquid extraction pipeline (52), one end of which is in communication with the lower chamber (112), and the other end of which is in communication with the inlet end of the liquid extraction pump (51); A reflux pipe (53), one end of which is in communication with the outlet end of the liquid pump (51), and the other end of which is in communication with the reflux port (12); A control motor (54) is electrically connected to the liquid pump (51).

9. The copper dissolving device according to any one of claims 1 to 6, characterized in that: The copper dissolving device also includes: A cooling water tank (60), the cooling water tank (60) is arranged in an annular shape and close to the outer peripheral surface of the copper dissolving tank (10), and the cooling water tank (60) comprises an inlet pipe (61) and an outlet pipe (62); a cooling circulation pump, wherein the inlet of the cooling circulation pump is connected to the outlet pipe (62), and the outlet of the cooling circulation pump is connected to the inlet pipe (61); A radiator is arranged on the cooling water tank (60).

10. A conductive metal film production device, characterized in that: The conductive metal film production equipment comprises the copper dissolving device according to any one of claims 1 to 9.

Images