Copper dissolving device and conductive metal film production equipment

Abstract

The utility model discloses a copper dissolving device and conductive metal film production equipment. The copper dissolving device comprises a copper dissolving tank, a filter plate, a diffusion pipe, a first spraying assembly, a second spraying assembly and a pump body assembly. The copper dissolving tank is provided with a reaction cavity; a reflux inlet is formed in the top of the reaction cavity; the filter plate is arranged in the reaction cavity and divides the reaction cavity into an upper chamber and a lower chamber; the diffusion pipe is arranged in the reaction cavity and extends in the vertical direction of the reaction cavity, the top end of the diffusion pipe is connected with the reflux inlet, and the bottom end of the diffusion pipe extends to the side, close to the lower cavity, of the filter plate; the first spraying assembly is arranged in the lower cavity and communicates with the diffusion pipe. The second spraying assembly is arranged at the top of the upper cavity and communicates with the backflow opening; the liquid pumping assembly is arranged outside the copper dissolving tank so as to pump a solution in the lower cavity to the backflow opening. The copper dissolving device can solve the problem that the reaction speed of metal copper and sulfuric acid in a copper dissolving device in the prior art is low.

Description

Technical Field

[0001] This utility model relates to the field of conductive metal thin film production technology, and more specifically, to a copper melting device and conductive metal thin film production equipment. Background Technology

[0002] Conductive metal thin films are a class of materials with a variety of excellent properties and are now widely used in batteries as positive or negative electrode current collectors. Copper dissolution is a crucial step in the production of conductive metal thin films, providing copper sulfate solution for copper foil production.

[0003] In existing technologies, copper sulfate solutions are typically prepared using copper dissolving tanks. During the preparation process, the solution at the bottom of the tank is continuously pumped back to the tank via the top, where it mixes with air and reacts with metallic copper to form copper sulfate. Throughout the process, the reaction rate within the tank needs to be constantly controlled to ensure the copper sulfate concentration remains within a set range. However, in existing copper dissolving devices, the contact time between metallic copper and air is relatively short, resulting in a slow reaction rate between metallic copper and sulfuric acid. Utility Model Content

[0004] The main objective of this invention is to provide a copper dissolving device and a conductive metal thin film production equipment, so as to at least solve the problem that the reaction rate of metallic copper and sulfuric acid in the copper dissolving device in the prior art is relatively slow.

[0005] According to one aspect of the present invention, a copper melting apparatus is provided, comprising:

[0006] A copper melting vessel, wherein the copper melting vessel is provided with a reaction chamber, and the top of the reaction chamber is provided with a reflux port;

[0007] A filter plate is disposed in the reaction chamber and divides the reaction chamber into an upper chamber and a lower chamber.

[0008] A diffuser tube is disposed in the reaction chamber and extends along the vertical direction of the reaction chamber. The top end of the diffuser tube is connected to the reflux port, and the bottom end of the diffuser tube extends to the side of the filter plate near the lower chamber.

[0009] A first injection assembly is disposed in the lower chamber and communicates with the diffuser tube;

[0010] A second injection assembly, disposed at the top of the upper chamber and communicating with the reflux port; and

[0011] A pump assembly is disposed outside the copper melting tank to pump the solution in the lower chamber to the reflux port.

[0012] Furthermore, the first spray assembly includes a support plate and a first nozzle, and the diffuser is vertically connected to the support plate;

[0013] The diffuser tube has multiple through holes on its outer peripheral sidewall near the support plate, and the support plate has multiple pipes on its side near the filter plate. The multiple pipes are connected to the multiple through holes one by one, and the first nozzle is disposed on the pipes.

[0014] Furthermore, multiple pipes are arranged radially along the outer periphery of the diffuser, and each pipe is provided with multiple first nozzles, which are spaced apart along the extension direction of the pipe.

[0015] Furthermore, a sealing portion is provided at the bottom end of the diffuser tube, and a flow guiding protrusion is provided on the sealing portion. The flow guiding protrusion is at least used to guide the fluid in the diffuser tube to the through hole.

[0016] Furthermore, the centerline of the flow-guiding protrusion is located on the axis of the diffuser tube, and the distance from the axis of the diffuser tube to the outer peripheral surface of the flow-guiding protrusion gradually increases along the direction from the upper chamber to the lower chamber.

[0017] Furthermore, a mounting plate is provided at the top of the upper chamber, and a mounting hole is provided on the mounting plate. The second injection assembly includes a second nozzle, which is installed in the mounting hole and communicates with the liquid outlet.

[0018] Furthermore, there are multiple mounting holes, which are spaced apart along the outer periphery of the diffuser tube, and there are multiple second nozzles, which are installed one-to-one in the multiple mounting holes.

[0019] Furthermore, the copper melting tank is provided with a liquid outlet, and a filter structure is provided at the liquid outlet.

[0020] Furthermore, the pump assembly includes:

[0021] A liquid pump is disposed outside the copper melting tank;

[0022] A liquid extraction pipe, one end of which is connected to the lower chamber, and the other end of which is connected to the inlet of the liquid extraction pump;

[0023] A reflux pipe, one end of which is connected to the outlet of the pump, and the other end of which is connected to the reflux port;

[0024] A control motor is provided, which is electrically connected to the liquid pump.

[0025] On the other hand, this application also provides a conductive metal thin film production equipment, which includes the copper dissolving device described above.

[0026] In this invention, by setting a first spray assembly at the bottom of the diffuser tube and a second spray assembly at the top of the upper chamber, the impact force and diffusion area of ​​sulfuric acid, copper sulfate solution, and air at the bottom and top of the filter plate can be increased, allowing the bubbles in the sulfuric acid and copper sulfate solution to fully contact the metallic copper. Furthermore, the fluid sprayed by the first spray assembly can generate bubbles in the lower chamber. Utilizing the rising characteristic of bubbles, and with metallic copper located along the rising path of the bubbles, the contact time between metallic copper and the bubbles can be further increased. This allows the metallic copper to fully contact and react with the air and sulfuric acid to generate a copper sulfate solution, thereby increasing the preparation rate of the copper sulfate solution in the reaction chamber of this application. Attached Figure Description

[0027] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0028] Figure 1 This is a first perspective structural view of the copper melting device disclosed in an embodiment of the present utility model;

[0029] Figure 2 This is a front view of the copper melting device disclosed in an embodiment of this utility model;

[0030] Figure 3 for Figure 2 AA section view in the middle;

[0031] Figure 4 for Figure 3 A magnified view of region M in the image;

[0032] Figure 5 This is a perspective structural diagram of the spray assembly disclosed in an embodiment of the present utility model;

[0033] Figure 6 for Figure 3 BB section view in the middle;

[0034] Figure 7 This is a second perspective structural diagram of the copper melting device disclosed in an embodiment of this utility model;

[0035] Figure 8 for Figure 7 CC section view in the image.

[0036] The above figures include the following reference numerals:

[0037] 10. Copper melting tank; 11. Reaction chamber; 12. Return port; 111. Upper chamber; 112. Lower chamber; 13. Liquid outlet; 14. Feed port; 15. Vent; 20. Filter plate; 30. Diffuser; 31. Through hole; 32. Sealing part; 321. Guide protrusion; 33. Diffusion section; 40. First injection assembly; 41. Support plate; 42. First nozzle; 43. Pipeline; 50. Pump assembly; 51. Liquid pump; 52. Liquid extraction pipeline; 521. Manifold; 522. Branch pipe; 5221. Extension section; 5222. Port; 53. Return pipeline; 54. Control motor; 60. Cooling water tank; 61. Inlet pipeline; 62. Outlet pipeline; 70. Second injection assembly; 71. Second nozzle; 80. Mounting plate; 81. Mounting hole; 90. Ejector. Detailed Implementation

[0038] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0040] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0041] See Figures 1 to 8 As shown, according to an embodiment of this application, a copper dissolving device is provided. The copper dissolving device includes a copper dissolving tank 10, a filter plate 20, a diffuser 30, a first spray assembly 40, a second spray assembly 70, and a pump assembly 50.

[0042] The copper melting tank 10 is provided with a reaction chamber 11, and a reflux port 12 is provided at the top of the reaction chamber 11. A filter plate 20 is provided in the reaction chamber 11 and divides the reaction chamber 11 into an upper chamber 111 and a lower chamber 112. A diffuser tube 30 is provided in the reaction chamber 11 and extends along the vertical direction of the reaction chamber 11. The top end of the diffuser tube 30 is connected to the reflux port 12, and the bottom end of the diffuser tube 30 extends to the side of the filter plate 20 near the lower chamber 112. A first spray assembly 40 is provided in the lower chamber 112 and communicates with the diffuser tube 30. A second spray assembly 70 is provided at the top of the upper chamber and communicates with the reflux port 12. A pump assembly 50 is provided outside the copper melting tank 10 to pump the solution in the lower chamber 112 to the reflux port 12.

[0043] In this invention, the reaction chamber 11 of the copper dissolving tank 10 is used to prepare copper sulfate solution. During actual preparation, sulfuric acid is placed in the reaction chamber 11, and then copper blocks or balls are placed on the filter plate 20 of the reaction chamber 11. At this time, the sulfuric acid, metallic copper, and air in the reaction chamber 11 react to prepare the copper sulfate solution. During the reaction, the pump assembly 50 can pump the sulfuric acid and copper sulfate solution at the bottom of the reaction chamber 11 to the return port 12 as needed. At this time, the sulfuric acid and copper sulfate solution can flow along the diffuser 30 to the bottom of the diffuser 30 and be sprayed out from the first spray assembly 40. Simultaneously, the sulfuric acid and copper sulfate solution returning from the return port 12 can also be sprayed out from the second spray assembly 70. That is to say, the sulfuric acid, copper sulfate solution, and air sprayed from the first spray assembly 40 and the second spray assembly 70 can all be sprayed towards the top and bottom of the filter plate 20, thereby allowing them to fully contact and react with the metallic copper on the filter plate 20, which can improve the preparation rate of the copper sulfate solution in the reaction chamber 11 to a certain extent.

[0044] In other words, by setting a first spray assembly 40 at the bottom of the diffuser tube 30 and a second spray assembly 70 at the top of the upper chamber 111 in this embodiment, the impact force and diffusion area of ​​sulfuric acid, copper sulfate solution, and air at the bottom and top of the filter plate 20 can be increased, allowing the bubbles in the sulfuric acid and copper sulfate solution to fully contact the metallic copper. Furthermore, the fluid sprayed by the first spray assembly 40 can generate bubbles in the lower chamber 112. Utilizing the rising characteristic of bubbles, and with metallic copper located along the rising path of the bubbles, the contact time between metallic copper and the bubbles can be further increased. This allows the metallic copper to fully contact and react with air and sulfuric acid to generate copper sulfate solution, thereby increasing the preparation rate of copper sulfate solution in the reaction chamber 11 in this embodiment.

[0045] Furthermore, in this embodiment, the first spraying assembly 40 includes a support plate 41 and a first nozzle 42, and the diffuser 30 is vertically connected to the support plate 41. The diffuser 30 has multiple through holes 31 on its outer peripheral sidewall near the support plate 41, and the support plate 41 has multiple pipes 43 on its side near the filter plate 20. These pipes 43 are connected to the through holes 31 in a one-to-one correspondence, and the first nozzle 42 is disposed on the pipes 43. In this embodiment, by providing multiple pipes 43 connected to multiple through holes 31, and by correspondingly distributing the first nozzle 42 on the pipes 43, the solution flowing back from the top of the diffuser 30 can be sprayed out from different locations above the support plate 41. This further allows the sulfuric acid, copper sulfate solution, and air to fully contact and react with the metallic copper on the filter plate 20, further increasing the preparation rate of the copper sulfate solution in the reaction chamber 11.

[0046] Optionally, in this embodiment, the support plate 41 includes a circular plate, and the aforementioned multiple pipes 43 are arranged radially along the center of the circular plate, that is, the aforementioned multiple pipes 43 are arranged radially along the outer periphery of the diffuser 30. This arrangement allows the solution flowing back from the top of the diffuser 30 to be sprayed more evenly from different locations above the support plate 41, which is more convenient for sulfuric acid, sulfuric acid solution, air, and metallic copper.

[0047] It is understood that the support plate 41 in this application can also be a square plate, an elliptical plate, or other irregularly shaped plates, which can be designed and selected according to the cross-section of the reaction chamber 11. In actual installation, the pipes 43 in this embodiment can be two, three, four, or more, and no specific limitation is made in this embodiment.

[0048] Furthermore, in this embodiment, each pipe 43 is provided with a plurality of first nozzles 42, which are spaced apart along the extension direction of the pipe 43. This arrangement can increase the spray area of ​​the sulfuric acid solution, thereby allowing the sulfuric acid, copper sulfate solution and air sprayed from the first nozzles 42 to fully contact and react with the metallic copper on the filter plate 20, thereby increasing the preparation rate of the copper sulfate solution in the reaction chamber 11.

[0049] See Figures 3 to 5As shown, in this embodiment, a sealing portion 32 is provided at the bottom end of the diffuser 30, and a flow-guiding protrusion 321 is provided on the sealing portion 32. The flow-guiding protrusion 321 is used at least to guide the fluid in the diffuser 30 to the through hole 31. Optionally, in this embodiment, the center line of the flow-guiding protrusion 321 is located on the axis of the diffuser 30, and along the direction from the upper chamber 111 to the lower chamber 112, the distance from the axis of the diffuser 30 to the outer peripheral surface of the flow-guiding protrusion 321 gradually increases. That is to say, in this embodiment, the flow-guiding protrusion 321 is arranged with a thin top and a thick bottom. In this way, when the fluid flows along the outer surface of the flow-guiding protrusion 321, it can expand outward, thereby facilitating the flow to the through hole 31 at the outer peripheral edge of the diffuser 30 and entering the pipe 43.

[0050] Furthermore, the diffuser tube 30 includes a diffuser section 33, the diameter of which gradually increases along the direction from the upper chamber 111 to the lower chamber 112, so as to facilitate the effective diffusion and delivery of the solution flowing down from the return port 12 into the multiple pipes 43.

[0051] In this application, the copper melting vessel 10 is generally cylindrical. For example, the copper melting vessel 10 can be cylindrical, prismatic, elliptical, or other irregular cylindrical. The reaction chamber 11 can be a cylindrical cavity, a prismatic cavity, an elliptical cylindrical cavity, or other irregular cylindrical cavity.

[0052] Optionally, the copper melting tank 10 in this embodiment is provided with an outlet 13, which is equipped with a filter structure, such as a filter screen, to facilitate the filtration of the copper sulfate solution generated during the reaction and its conveying to the electroplating tank, while preventing unreacted copper powder from flowing out of the copper melting tank 10. The copper melting tank 10 is also provided with a drain port (not shown in the figure), which is located at the bottom of the reaction chamber 11 to facilitate the discharge of impurities generated during the operation of the copper melting tank 10. A feeding port 14 is provided at the top of the copper melting tank 10 to facilitate the addition of copper balls and copper blocks. An exhaust port 15 is provided at the top of the copper melting tank 10, which is connected to the reaction chamber 11 to facilitate the discharge of gases from the reaction chamber 11 into the copper melting tank 10.

[0053] Combination Figures 1 to 6As shown, the pump assembly 50 in this embodiment includes a pump 51, a pumping pipe 52, a return pipe 53, and a control motor 54. The pump 51 is located outside the copper melting tank 10; one end of the pumping pipe 52 is connected to the lower chamber 112, and the other end of the pumping pipe 52 is connected to the inlet end of the pump 51; one end of the return pipe 53 is connected to the outlet end of the pump 51, and the other end of the return pipe 53 is connected to the return port 12; the control motor 54 is electrically connected to the pump 51. During the reaction of metallic copper, sulfuric acid, and air, the pumping speed of the pump 51 can be controlled by controlling the pump 51 through the control motor 54. This allows the sulfuric acid and copper sulfate solution at the bottom of the reaction chamber 11 to be pumped to the return port 12 and then re-entering the reaction chamber 11 as needed, thereby controlling the reaction rate of metallic copper and sulfuric acid and the concentration of the copper sulfate solution.

[0054] In this embodiment, the liquid extraction pipe 52 includes a manifold 521 and at least two branch pipes 522. The first end of the manifold 521 is connected to the inlet end of the liquid extraction pump 51, and the first end of each branch pipe 522 is connected to the second end of the manifold 521. The second ends of at least two branch pipes 522 are arranged along the outer periphery of the reaction chamber 11 and communicate with the reaction chamber 11 so that the liquid in the reaction chamber 11 forms a vortex when the liquid extraction pump 51 is working.

[0055] In this application, since the liquid extraction pipe 52 has at least two branch pipes 522, and the second ends of the at least two branch pipes 522 are arranged circumferentially along the reaction chamber 11 and communicate with the reaction chamber 11, when the liquid extraction pump 51 is working, the liquid in the reaction chamber 11 can enter the branch pipes 522 from the second ends of each branch pipe 522. During this process, the liquid in the reaction chamber 11 can form a vortex at the center of the reaction chamber 11. The bubble density in the vortex is relatively low, and it will flow towards the center of the vortex. The bubbles are not easy to accumulate on the inner wall of the reaction chamber 11. That is to say, when the liquid extraction pump 51 is working, the liquid extracted by the branch pipes 522 has a relatively low bubble content, which is not easy to cause cavitation on the blades of the liquid extraction pump 51, thereby improving the service life of the liquid extraction pump 51 in this embodiment and reducing the risk of danger.

[0056] In this application, each branch pipe 522 has an extension section 5221 extending into the reaction chamber 11. Within the vertical projection of the copper melting vessel 10, the extension section 5221 extends in a clockwise or counterclockwise direction. (See appendix of this application.) Figure 6The diagram illustrates the arrangement of the extension sections 5221 extending counterclockwise. That is, in this embodiment, at least two extension sections 5221 are arranged generally in a spiral shape along the circumference of the reaction chamber 11 within the vertical projection. Thus, when the pump 51 operates, the suction forces exerted by each extension section 5221 on the liquid within the reaction chamber 11 combine to exert a clockwise or counterclockwise force on the liquid inside the reaction chamber 11, thereby causing the liquid within the reaction chamber 11 to form a vortex at the center of the reaction chamber 11. At this time, the density of bubbles in the vortex is less than the density of the liquid, and the bubbles will converge towards the center of the reaction chamber 11. The extension sections 5221 located at the edge of the vortex draw in a relatively small amount of bubbles in the liquid, thus preventing cavitation of the pump blades 51 by the bubbles. Optionally, the branch pipes 522 in this embodiment can be two, three, four, or more. Figure 1 The diagram shows the case when there are two branch pipes 522.

[0057] Furthermore, the aforementioned at least two extension segments 5221 are evenly spaced circumferentially along the first circumference of the reaction chamber 11 (the outline of the first circumference is consistent with the outer circumferential outline of the reaction chamber 11), and the axes of the extension segments 5221 are in the same plane. That is to say, in this embodiment, at least two extension segments 5221 are located at the same height in the reaction chamber 11. When the pump 51 is working, the extension segments 5221, which are evenly spaced circumferentially along the first circumference and are in the same plane, can apply suction force to the liquid at the same height in the reaction chamber 11. This can effectively make the liquid in the reaction chamber 11 form a vortex at the center of the reaction chamber 11. The bubbles in the liquid will flow towards the center of the vortex. The bubbles are not easy to accumulate on the inner wall of the reaction chamber 11. The liquid pumped by the branch pipe 522 has a relatively low bubble content, which is less likely to cause cavitation on the blades of the pump 51 and can improve the service life of the pump 51 in this embodiment. Of course, in other embodiments of this application, the above-mentioned at least two extension sections 5221 can also be staggered at a certain position along the height direction of the copper melting tank 10, as long as it is ensured that the liquid in the reaction chamber 11 can form a vortex in the center of the reaction chamber 11 when the pump 51 is working.

[0058] Furthermore, the distance from the port 5222 of each extending segment 5221 to the center of the first circumference is 2 / 3 to 5 / 6 of the radius of the first circumference. That is to say, when the radius of the first circumference is r, the distance from the port 5222 of each extending segment 5221 to the center of the first circumference is 2*r / 3 to 5*r / 6, for example, 2*r / 3, 3*r / 4, or 5*r / 6, etc. When the distance from the port 5222 of the extension section 5221 to the center of the first circumference is greater than 5*r / 6, the port 5222 of the extension section 5221 is relatively close to the center of the vortex, and the extension section 5221 can easily draw in the air bubbles at the center of the vortex. When the distance from the port 5222 of the extension section 5221 to the center of the first circumference is less than 2*r / 3, it is not easy to apply suction force to the liquid in the reaction chamber 11 to form a vortex at the center of the reaction chamber 11, and it is not convenient to draw in the liquid in the reaction chamber 11. In other words, by making the distance from the port 5222 of each extension section 5221 to the center of the first circumference 2 / 3 to 5 / 6 of the radius of the first circumference, this application can ensure the efficiency of liquid circulation while effectively preventing air bubbles from entering the pump 51 and causing cavitation to the pump 51.

[0059] Furthermore, the extension section 5221 extends along the inner wall of the reaction chamber 11. That is to say, from the position where the extension section 5221 connects to the reaction chamber 11 to the port 5222 of the extension section 5221, the distance from the axis of the extension section 5221 to the center of the first circumference remains unchanged. The extension section 5221 is an arc segment. With this configuration, when the liquid pump 51 is working, the suction force of each extension section 5221 on the liquid in the reaction chamber 11 makes it easier for the liquid in the reaction chamber 11 to form a vortex at the center of the reaction chamber 11.

[0060] In other embodiments not shown in this application, the extension segment 5221 can also be a straight segment. Multiple extension segments 5221 are arranged to extend in a counterclockwise or clockwise direction within the projection of the copper melting tank 10 in the vertical direction. When the liquid pump 51 is working, the suction force of each extension segment 5221 on the liquid in the reaction chamber 11 makes it easier for the liquid in the reaction chamber 11 to form a vortex in the center of the reaction chamber 11.

[0061] Optionally, the length of each branch pipe 522 is the same. That is to say, the distance from the port 5222 of the branch pipe 522 to the manifold 521 is equal, so as to ensure that the vortex force of each branch pipe 522 is the same, thereby ensuring that the vortex continues for a long time and plays the role of collecting bubbles to prevent cavitation of the blades of the liquid pump 51.

[0062] Furthermore, the copper dissolving device in this embodiment also includes a cooling water tank 60, a cooling circulation pump, and a radiator. The cooling water tank 60 is annularly positioned against the outer periphery of the copper dissolving tank 10. The cooling water tank 60 includes an inlet pipe 61 and an outlet pipe 62. The inlet of the cooling circulation pump is connected to the outlet pipe 62, and the outlet of the cooling circulation pump is connected to the inlet pipe 61. The radiator is mounted on the cooling water tank 60. When the cooling circulation pump operates, it pumps cooling water into the cooling water tank 60 to cool the copper dissolving tank 10, maintaining the temperature inside the copper dissolving tank 10 within a suitable range (typically 80 to 95 degrees Celsius). This allows for control of the reaction rate between copper and sulfuric acid in the reaction chamber 11, as well as the concentration of the copper sulfate solution. This embodiment, by incorporating a radiator, facilitates heat dissipation from the cooling water tank 60 to cool the water inside, improving the heat exchange effect between the cooling water tank 60 and the copper dissolving tank 10, and enabling rapid and precise temperature control of the copper dissolving tank 10.

[0063] Compared to existing technologies that control the concentration of copper sulfate solution by reducing the amount of metallic copper or stopping the addition of sulfuric acid, this embodiment only requires controlling at least one of the pumping pump 51 and the cooling water pump to control the reaction rate of copper and sulfuric acid in the reaction chamber 11 and the concentration of copper sulfate solution, without having to frequently increase or decrease the amount of metallic copper or sulfuric acid added to the reaction chamber 11. This method is simple to operate and facilitates precise control of the reaction rate of metallic copper and sulfuric acid in the reaction chamber 11 and the concentration of copper sulfate solution.

[0064] Furthermore, in this embodiment, the cooling water tank 60 is arranged in a ring shape against the outer peripheral surface of the copper melting tank 10. The cooling water tank 60 includes an inlet pipe 61 and an outlet pipe 62. The inlet of the cooling circulation pump is connected to the outlet pipe 62, and the outlet of the cooling circulation pump is connected to the inlet pipe 61. In this structure, by setting the cooling water tank 60 in a ring shape and abutting against the outer peripheral surface of the copper melting tank 10, the contact area between the cooling water tank 60 and the copper melting tank 10 can be increased, thereby facilitating rapid control and adjustment of the temperature in the reaction chamber 11, ultimately achieving the purpose of controlling the reaction rate of metallic copper and sulfuric acid as well as the concentration of copper sulfate solution.

[0065] Furthermore, in this embodiment, there are at least two cooling water tanks 60, and the at least two cooling water tanks 60 are spaced apart along the height direction of the copper melting tank 10. Exemplarily, the cooling water tanks 60 can be two, three, four, or more. In this embodiment, the additional cooling water tanks 60... Figures 1 to 3The diagram illustrates the case where there are two cooling water tanks 60. In actual installation, one cooling water tank 60 is installed in the middle of the copper melting tank 10 along its height, and the other cooling water tank 60 is installed at the bottom of the copper melting tank 10. This allows for separate cooling of the middle and bottom portions of the copper melting tank 10. By using multiple cooling water tanks 60, this application enables rapid control and adjustment of the temperature within the reaction chamber 11, thereby facilitating precise control of the reaction rate between copper and sulfuric acid. Of course, in other embodiments of this application, a single cooling water tank 60 can also be used, as long as there is a sufficiently large contact area between the cooling water tank 60 of the cooling assembly and the copper melting tank 10 to control the temperature inside the reaction chamber 11.

[0066] In the actual design process, a temperature detection element (not shown in the figure), such as a temperature sensor, can be set on the copper melting tank 10 to detect the temperature of the reaction chamber 11. The temperature detected by the temperature sensor can be transmitted to the controller of the copper melting tank control device. The controller can control the cooling circulation pump according to the temperature signal transmitted by the temperature sensor, and thus control the cooling efficiency of the cooling water tank 60 on the copper melting tank 10. The structure is simple and easy to realize automatic regulation, which can further improve the control accuracy of the reaction rate of copper and sulfuric acid and the concentration of copper sulfate solution.

[0067] Furthermore, the copper melting tank control device in this embodiment also includes an ejector 90, which is disposed on the top of the copper melting tank 10 and connected to the return port 12. The return pipe 53 is connected to the ejector 90. The inner side of the ejector 90 is a channel, allowing air to enter from the outside. When the copper melting control device is working, the cooling water tank 60 and the pump assembly 50 work together to control the reaction rate in the reaction chamber 11 from multiple aspects such as temperature control, acid supply rate, and air replenishment. This simplifies and quantifies the reaction rate control process of copper and sulfuric acid, enabling precise control of the reaction rate of copper and sulfuric acid. In other words, the pump assembly 50 of this application draws the mixture of acid and copper sulfate solution from the bottom of the copper dissolving tank 10 to the top of the copper dissolving tank 10 to react with metallic copper. By adjusting the operating frequency of the control motor 54, the pumping speed of the pump 51 can be controlled. This not only allows for adjustment of the acid supply speed but also allows for control of the amount of air mixed in through the ejector 90. Moreover, the pumping circulation process itself is a continuous heating process. Therefore, this application can control the reaction rate of copper and sulfuric acid and the concentration of copper sulfate solution from at least three dimensions.

[0068] Combined again Figures 1 to 8As shown, an installation plate 80 is provided on the top of the upper chamber 111. The installation plate 80 is provided with an installation hole 81. The second spray assembly 70 includes a second nozzle 71, which is installed in the installation hole 81 and communicates with the return port 12, so as to spray out the sulfuric acid and copper sulfate solution flowing out of the return port 12 so as to fully contact and react with the copper on the filter plate 20.

[0069] Furthermore, in this embodiment, there are multiple mounting holes 81, which are spaced apart along the outer periphery of the diffuser tube 30. Correspondingly, there are multiple second nozzles 71, which are installed one-to-one in the multiple mounting holes 81. This facilitates the uniform spraying of sulfuric acid and copper sulfate solution flowing out of the return port 12 onto the filter plate 20, which can further increase the contact area between sulfuric acid, copper sulfate solution, air and copper, and effectively improve the preparation efficiency of copper sulfate solution in this embodiment.

[0070] As can be seen, by providing several second nozzles 71 at the top of the copper melting tank 10, this embodiment can spray acid or circulating liquid onto the top of the copper material, which together with the first nozzles 42 at the bottom of the copper melting tank 10 forms a pincer attack on the copper material in the middle, greatly improving the reaction rate and space utilization.

[0071] On the other hand, this application also discloses a conductive metal thin film production apparatus, which includes the aforementioned copper melting tank control device. Therefore, this conductive metal thin film production apparatus incorporates all the technical effects of the aforementioned pumping device. Since the technical effects of the copper melting tank control device have already been described in detail above, they will not be repeated here.

[0072] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0073] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0074] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A copper dissolving device, characterized in that: include: A copper dissolving tank (10), wherein the copper dissolving tank (10) is provided with a reaction chamber (11), and a reflux port (12) is provided at the top of the reaction chamber (11); a filter plate (20), the filter plate (20) being arranged in the reaction chamber (11) and dividing the reaction chamber (11) into an upper chamber (111) and a lower chamber (112); a diffusion pipe (30), the diffusion pipe (30) being arranged in the reaction chamber (11) and extending in the up-down direction of the reaction chamber (11), the top end of the diffusion pipe (30) being connected to the reflux port (12), and the bottom end of the diffusion pipe (30) extending to a side of the filter plate (20) close to the lower chamber (112); a first injection assembly (40), the first injection assembly (40) being disposed in the lower chamber (112) and communicating with the diffusion pipe (30); a second injection assembly (70), the second injection assembly (70) being disposed at the top of the upper chamber (111) and communicating with the reflux port (12); and A liquid pumping assembly (50) is arranged outside the copper dissolving tank (10) to pump the solution in the lower chamber (112) to the reflux port (12).

2. The copper dissolving device according to claim 1, characterized in that: The first spray assembly (40) comprises a support plate (41) and a first nozzle (42), and the diffusion pipe (30) is vertically connected to the support plate (41); The diffuser tube (30) is provided with a plurality of through holes (31) on its outer peripheral side wall close to the support plate (41), and a plurality of pipes (43) are provided on one side of the support plate (41) close to the filter plate (20), the plurality of pipes (43) are connected to the plurality of through holes (31) in a one-to-one correspondence, and the first nozzle (42) is provided on the pipe (43).

3. The copper dissolving device according to claim 2, characterized in that: The plurality of pipes (43) are radially arranged along the outer circumference of the diffusion pipe (30), and each of the pipes (43) is provided with a plurality of the first nozzles (42). The plurality of the first nozzles (42) are arranged at intervals along the extension direction of the pipe (43).

4. The copper dissolving device according to claim 2, characterized in that: A sealing portion (32) is provided at the bottom end of the diffusion tube (30), and a flow-guiding protrusion (360) is provided on the sealing portion (32). The flow-guiding protrusion (360) is at least used to guide the fluid in the diffusion tube (30) to the through hole (31).

5. The copper dissolving device according to claim 4, characterized in that: The center line of the guide protrusion (360) is located on the axis of the diffuser (30), and along the direction from the upper chamber (111) to the lower chamber (112), the distance from the axis of the diffuser (30) to the outer peripheral surface of the guide protrusion (360) gradually increases.

6. The copper dissolving device according to any one of claims 1 to 5, characterized in that: A mounting plate (80) is provided on the top of the upper chamber (111), a mounting hole (81) is provided on the mounting plate (80), and the second injection assembly (70) comprises a second nozzle (71), and the second nozzle (71) is installed in the mounting hole (81) and communicated with the reflux port (12).

7. The copper dissolving device according to claim 6, characterized in that: There are a plurality of mounting holes (81), and the plurality of mounting holes (81) are arranged at intervals along the outer circumference of the diffusion pipe (30); there are a plurality of second nozzles (71), and the plurality of second nozzles (71) are mounted in the plurality of mounting holes (81) in a one-to-one correspondence.

8. The copper dissolving device according to any one of claims 1 to 5, characterized in that: The copper dissolving tank (10) is provided with a liquid outlet (13), and a filtering structure is provided at the liquid outlet (13).

9. The copper dissolving device according to any one of claims 1 to 5, characterized in that: The pump assembly (50) comprises: A liquid extraction pump (51), wherein the liquid extraction pump (51) is arranged outside the copper dissolving tank (10); A liquid extraction pipeline (52), one end of which is in communication with the lower chamber (112), and the other end of which is in communication with the inlet end of the liquid extraction pump (51); A reflux pipe (53), one end of which is in communication with the outlet end of the liquid pump (51), and the other end of which is in communication with the reflux port (12); A control motor (54) is electrically connected to the liquid pump (51).

10. A conductive metal film production device, characterized in that: The conductive metal film production equipment comprises the copper dissolving device according to any one of claims 1 to 9.

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