Upper pressing wheel assembly and chain type cleaning equipment

Abstract

The utility model belongs to the technical field of silicon wafer cleaning, and particularly relates to an upper pressing wheel assembly and chained cleaning equipment, the upper pressing wheel assembly comprises an upper pressing rod, a plurality of pressing wheel bodies are sleeved on the upper pressing rod, and the pressing marks of the pressing wheel bodies on a silicon wafer are wide; an annular hold-down ring is arranged on the side wall of the pinch roller body, the side wall of the hold-down ring is a hold-down surface, and the edges of the top and the bottom of a projection pattern of the hold-down surface along the axis of the pinch roller body are straight lines, so that a wide indentation is formed after the hold-down surface is in contact with a silicon wafer; in short, the indentations of the pinch roller body and the silicon wafer are designed to be wide, so that the indentation product of the pressing surface and the silicon wafer is increased, the pressure intensity of the pinch roller body on the silicon wafer is reduced under the same pressure, and the pinch roller body is prevented from leaving the indentations on the silicon wafer and even causing the silicon wafer to be broken.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer cleaning, and specifically relates to an upper pressure wheel assembly and a chain cleaning device. Background Art

[0002] In the chain cleaning equipment, the silicon wafer is supported by the conveyor roller, and an upper pressure wheel is used on the top to limit the silicon wafer to prevent the silicon wafer from shifting. However, the indentation between the conventional upper pressure wheel and the silicon wafer is usually narrow, and the pressure on the silicon wafer is relatively large, which can easily leave an imprint on the silicon wafer and even cause the silicon wafer to break.

[0003] Therefore, how to avoid leaving imprints or even broken pieces on the silicon wafer is a technical problem that needs to be solved urgently in this field. Utility Model Content

[0004] The utility model aims to provide an upper pressure wheel assembly and a chain cleaning device.

[0005] In order to solve the above technical problems, the utility model provides an upper pressure wheel assembly, comprising: an upper pressure rod, on which a plurality of pressure wheel bodies are sleeved, wherein the indentation of the pressure wheel body on the silicon wafer is wide; the side wall of the pressure wheel body is provided with an annular clamping ring, the side wall of the clamping ring is a clamping surface, and the top and bottom edges of the projection figure of the clamping surface along the axis of the pressure wheel body are straight lines, so that the wide indentation is formed after the clamping surface contacts the silicon wafer.

[0006] Preferably, the edges of the pressing surface are provided with arc transitions.

[0007] Preferably, the edge of the connection between the clamping ring and the pressure wheel body is provided with an arc transition.

[0008] Preferably, the upper pressure rod is provided with a plurality of pairs of assembly grooves for limiting the pressure wheel body, and limiting clamping springs are clamped in the assembly grooves to limit the pressure wheel body from both sides.

[0009] Preferably, at least three of the pressing wheel bodies form a pressing wheel set.

[0010] Preferably, at least three of the pressing wheel bodies form a pressing wheel group, and the spacing between each pressing wheel group is 15-55 mm.

[0011] The utility model also provides an upper pressing wheel assembly, including an upper pressing rod, on which a plurality of pressing wheel bodies are sleeved, wherein

[0012] The indentation of the pressing wheel body on the silicon wafer is wide;

[0013] The side wall of the pressure wheel body is provided with an annular clamping ring, the side wall of the clamping ring is a clamping surface, and the top and bottom edges of the projection figure of the clamping surface along the axis of the pressure wheel body are arcs; wherein the clamping ring is flexible so that the clamping surface deforms after contacting the silicon wafer to form the wide indentation.

[0014] The utility model also provides a chain cleaning device, comprising the above-mentioned upper pressing wheel assembly;

[0015] A driving member is arranged at two ends of the upper pressure rod.

[0016] The beneficial effects of the utility model are:

[0017] By designing the indentation between the pressing wheel body and the silicon wafer to be wide, the indentation area between the pressing surface and the silicon wafer is increased, ensuring that under the same pressure, the pressure of the pressing wheel body on the silicon wafer is reduced, avoiding the pressing wheel body leaving an impression on the silicon wafer or even causing the silicon wafer to break.

[0018] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a stereogram of a preferred embodiment of the upper pressing wheel assembly of the utility model;

[0022] Figure 2 It is a front view of a preferred embodiment of the pressing wheel body of the utility model;

[0023] Figure 3 It is a side view of a preferred embodiment of the pressure wheel body of the utility model.

[0024] In the figure:

[0025] 1. Press the bar upward;

[0026] 11. Pressing wheel body; 111. Pressing ring; 112. Pressing surface; 113. Arc transition;

[0027] 12. driving member; 121. driving gear;

[0028] 13. Assembly groove; 14. Limiting spring; 15. Connecting shaft. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] like Figures 1 to 3 As shown, at least one embodiment provides an upper pressing wheel assembly, comprising: an upper pressing rod 1, on which a plurality of pressing wheel bodies 11 are sleeved, wherein the pressing wheel bodies 11 form a wide indentation on the silicon wafer; a ring-shaped clamping ring 111 is provided on the side wall of the pressing wheel body 11, and the side wall of the clamping ring 111 is a clamping surface 112, and the top and bottom edges of the projection figure of the clamping surface 112 along the axis of the pressing wheel body 11 are straight lines, so that the wide indentation is formed after the clamping surface 112 contacts the silicon wafer; In short, by designing the indentation between the pressure wheel body 11 and the silicon wafer to be wide, so that the indentation area between the pressing surface 112 and the silicon wafer is increased, it is ensured that under the same pressure, the pressure of the pressure wheel body 11 on the silicon wafer is reduced, and the pressure wheel body 11 is prevented from leaving an impression on the silicon wafer or even causing the silicon wafer to break; further, the top and bottom edges of the projection figure of the pressing surface 112 along the axis of the pressure wheel body 11 are straight lines, which can ensure that the indentation between the pressure wheel body 11 and the silicon wafer is wide, and the clamping ring 111 can be made of rigid or flexible materials.

[0031] In some embodiments, the edges of the pressing surface 112 are provided with arc transitions 113; in short, providing the arc transitions 113 at the edges of the pressing surface 112 can ensure that the edges of the pressing surface 112 will not scratch the silicon wafer.

[0032] In some embodiments, the edge of the connection between the clamping ring 111 and the pressure wheel body 11 is provided with an arc transition 113; in short, the edge of the connection between the clamping ring 111 and the pressure wheel body 11 is provided with an arc transition 113, which can improve the strength of the connection between the clamping ring 111 and the pressure wheel body 11 and improve the service life of the pressure wheel body 11.

[0033] In some embodiments, the upper pressure rod 1 is provided with several pairs of assembly grooves 13 for limiting the pressure wheel body 11, and the assembly grooves 13 are provided with limiting springs 14 to limit the pressure wheel body 11 from both sides; in short, the pressure wheel body 11 is sleeved on the upper pressure rod 1, and the axial position of the pressure wheel body 11 can be limited by the limiting springs 14.

[0034] In some embodiments, at least three of the pressing wheel bodies 11 form a pressing wheel group; in short, at least three pressing wheel bodies 11 are responsible for conveying one silicon wafer, and multiple groups of pressing wheel groups can be provided to convey multiple groups of silicon wafers at the same time.

[0035] In some embodiments, at least three of the pressing wheel bodies 11 form a pressing wheel group, and the spacing between each pressing wheel group is 15-55 mm; in short, by designing the spacing between the pressing wheel groups to be between 15-55 mm, it can adapt to silicon wafers of various widths and avoid interference or collision between multiple silicon wafers.

[0036] At least one embodiment further provides an upper pressing wheel assembly, including an upper pressing rod 1, on which a plurality of pressing wheel bodies 11 are sleeved, wherein

[0037] The indentation of the pressing wheel body 11 on the silicon wafer is wide;

[0038] The side wall of the pressing wheel body 11 is provided with an annular clamping ring 111, and the side wall of the clamping ring 111 is a clamping surface 112, and the top and bottom edges of the projection figure of the clamping surface 112 along the axis of the pressing wheel body 11 are arcs; wherein, the clamping ring 111 is flexible, so that the clamping surface 112 is deformed after contacting with the silicon wafer to form the wide indentation; in short, when the clamping ring 111 is made of flexible material, the top and bottom edges of the projection figure of the clamping surface 112 along the axis of the pressing wheel body 11 are arcs, and when the pressing wheel body 11 contacts the silicon wafer, the clamping surface 112 is contracted and deformed to obtain a wide indentation, which can further ensure the safe transportation of the silicon wafer.

[0039] At least one embodiment further provides a chain cleaning device, comprising the upper pressing wheel assembly described above;

[0040] The driving member 12 is disposed at both ends of the upper pressure rod 1 ; the driving member 12 is preferably a driving gear 121 , and both ends of the upper pressure rod 1 are provided with a plug-in shaft 15 , and the driving gear 121 is installed on the plug-in shaft 15 .

[0041] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0043] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An upper pressure wheel assembly, characterized in that: include: An upper pressure rod (1) is sleeved with a plurality of pressure wheel bodies (11), wherein The indentation of the pressing wheel body (11) on the silicon wafer is wide; The side wall of the pressing wheel body (11) is provided with an annular pressing ring (111), the side wall of the pressing ring (111) is a pressing surface (112), and the top and bottom edges of the projection figure of the pressing surface (112) along the axis of the pressing wheel body (11) are straight lines, so that the wide indentation is formed after the pressing surface (112) contacts the silicon wafer.

2. The upper pressure wheel assembly according to claim 1, characterized in that: The edges of the pressing surface (112) are provided with arc transitions.

3. The upper pressure wheel assembly according to claim 2, characterized in that: The edge of the connection between the clamping ring (111) and the pressing wheel body (11) is provided with an arc transition.

4. The upper pressing wheel assembly according to claim 1, characterized in that: The upper pressure rod (1) is provided with a plurality of pairs of assembly grooves (13) for limiting the position of the pressure wheel body (11), and the assembly grooves (13) are provided with limit springs (14) for limiting the position of the pressure wheel body (11) from both sides.

5. The upper pressure wheel assembly according to claim 2, characterized in that: At least three of the pressing wheel bodies (11) form a pressing wheel group.

6. The upper pressure wheel assembly according to claim 5, characterized in that: At least three of the pressing wheel bodies (11) form a pressing wheel group, and the spacing between each pressing wheel group is 15-55 mm.

7. An upper pressure wheel assembly, characterized in that: include: An upper pressure rod (1) is sleeved with a plurality of pressure wheel bodies (11), wherein The indentation of the pressing wheel body (11) on the silicon wafer is wide; The side wall of the pressing wheel body (11) is provided with an annular pressing ring (111), the side wall of the pressing ring (111) is a pressing surface (112), and the top and bottom edges of the projection figure of the pressing surface (112) along the axis of the pressing wheel body (11) are arcs; wherein The clamping ring (111) is flexible, so that the clamping surface (112) deforms after contacting the silicon wafer, thereby forming the wide indentation.

8. A chain cleaning device, characterized in that: include: The upper pressing wheel assembly as described in any one of claims 1 to 7; A driving member (12) is arranged at both ends of the upper pressure rod (1).

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