Wafer chuck

Abstract

The present invention provides a wafer clamp, which relates to the technical field of semiconductor chip preparation. The wafer clamp comprises: a clamp seat, the front side of the clamp seat is provided with a fixed clamping claw, and the clamp seat is slidably connected with a movable clamping claw opposite to the fixed clamping claw; the movable clamping claw comprises a base and an arc-shaped spring sheet, and the two ends of the arc-shaped spring sheet are respectively connected to the base; the arc surface of the arc-shaped spring sheet is bent toward the side where the fixed clamping claw is located; the arc-shaped spring sheet comprises an abutting portion located in the middle part, and connecting portions located at the left and right ends, a transition portion is connected between the connecting portion and the abutting portion, and the transition portion has a plurality of through holes penetrating its front and rear surfaces.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip preparation, and in particular to a wafer clamp. Background Art

[0002] Electron beam evaporation is one of the most important processes in the field of modern semiconductor chip manufacturing. It is a process that uses a high-energy electron beam to heat the evaporated material in a vacuum chamber, transports the evaporated material to a substrate, and forms a thin film.

[0003] During the film-making process, the semiconductor chip is loaded on the wafer holder of the planetary frame, with the side of the semiconductor chip to be coated facing downward; then the planetary frame is placed in the electron beam evaporation equipment. In order to prepare a uniform thin film on the semiconductor chip, the planetary frame must continuously revolve and rotate during the film-making process.

[0004] However, the wafer clamp on the planetary frame is usually designed for wafers within a certain thickness range, and relies on the point contact between the end of the spring and the wafer to clamp the wafer. When the thickness of the wafer is less than the thickness range, the wafer will be broken due to excessive pressure from the spring; when the thickness of the wafer is greater than the thickness range, the wafer will be unstable due to insufficient pressure from the spring. Summary of the invention

[0005] The object of the present invention is to provide a wafer clamp to alleviate the technical problem in the prior art that the same clamp is used for wafers of different thicknesses, resulting in unstable wafer clamping or wafer crushing.

[0006] A wafer clamp provided by an embodiment of the present invention comprises: a clamp seat, the front side of the clamp seat has a fixed clamping claw, the clamp seat is slidably connected with a movable clamping claw opposite to the fixed clamping claw, and the movable clamping claw can move toward or away from the fixed clamping claw;

[0007] The movable clamp includes a base and an arc-shaped spring sheet, and the two ends of the arc-shaped spring sheet are respectively connected to the base; the arc surface of the arc-shaped spring sheet is bent toward the side where the fixed clamp is located; the arc-shaped spring sheet includes an abutment portion located in the middle part, and connecting portions located at the left and right ends, and a transition portion is connected between the connecting portion and the abutment portion, and the transition portion has a plurality of through holes penetrating the front and rear surfaces thereof;

[0008] A nut is provided on the back side of the clamping seat, and an adjusting bolt is connected to the internal thread of the nut, and the adjusting bolt extends in a first direction, and the first direction is consistent with the movement direction of the moving clamp; an annular groove is provided on the side wall of the adjusting bolt at one end close to the moving clamp; the wafer clamp also includes a spring extending in the first direction, one end of the spring is fixedly connected to the base, and the other end has two "L"-shaped connecting arms, the connecting arm includes a first rod extending in the first direction, and a second rod vertically connected to the first rod, the second rods on the two connecting arms extend towards each other, and a ring coaxial with the adjusting bolt is provided between the two second rods, and the ring is located in the annular groove; the back side of the clamping seat is also provided with limit rods located on both sides of the connecting arm, and the limit rods are used to prevent the connecting arm from rotating with the adjusting bolt.

[0009] Furthermore, the area of ​​all the through holes on the transition portion accounts for 30% to 80% of the arc surface area of ​​the arc-shaped spring piece.

[0010] Furthermore, the through holes on the transition portion have the same size, and the number of through holes per unit area at each position on the transition portion increases along the direction from the abutting portion toward the connecting portion.

[0011] Furthermore, along the direction from the abutting portion toward the connecting portion, the number of through holes per unit area at each position on the transition portion is the same, and the area of ​​the through holes at each position on the transition portion increases.

[0012] Furthermore, both ends of the spring have metal wires extending axially outward;

[0013] Two positioning columns are arranged on the back of the clamp seat, the metal wire between the spring and the movable clamping claw passes through one of the positioning columns, and the metal wire between the spring and the adjusting bolt passes through another positioning column.

[0014] Further, the adjusting bolt comprises a threaded portion, a scale portion and a gripping portion which are connected in sequence, the threaded portion is threadedly connected to the nut, and the annular groove is located on the threaded portion;

[0015] The scale portion has a plurality of scale lines arranged at equal intervals along the first direction, and each scale line surrounds the scale portion;

[0016] The clamping seat is provided with a reference line for aligning with the scale line, and the reference line is parallel to the scale line.

[0017] Furthermore, the holding portion includes a hexagonal insertion rod extending along the first direction, and the end surface of the scale portion has a hexagonal hole corresponding to the hexagonal insertion rod.

[0018] Furthermore, the clamping seat has a slide rail, and the movable clamping jaw is slidably connected in the slide rail, so that the movable clamping jaw moves only along the first direction.

[0019] Further, the base includes a first back plate and a second back plate connected vertically, the first back plate is connected to the spring, and the arc-shaped spring sheet is connected to the second back plate;

[0020] A first connecting plate perpendicular to the surface of the second back plate facing the fixed clamp is provided, and the number of the first connecting plates is two, and the two first connecting plates are arranged at intervals; second connecting plates extending in the direction of each other are provided on the surfaces of the two first connecting plates facing each other, and a gap is formed between the two second connecting plates, and there is a gap between the second connecting plate and the second back plate, and the connecting part of the arc-shaped spring sheet is fixed in the gap between the second connecting plate and the second back plate, and the top of the arc-shaped spring sheet is exposed from the gap, and the top of the arc-shaped spring sheet is higher than the second connecting plate.

[0021] Furthermore, a cover plate is connected to the base, the cover plate is connected to the second back plate, and the cover plate and the first back plate are respectively located at the front and rear sides of the second back plate;

[0022] The projection of the cover plate on the first back plate at least covers the projection of the arc-shaped elastic sheet on the first back plate.

[0023] When the wafer clamp provided by the embodiment of the present invention is used to clamp and fix the wafer, the clamping force of the mobile clamp can be adjusted in advance according to the thickness of the wafer. Specifically, the user rotates the adjustment bolt forward or reversely, and the adjustment bolt moves back and forth along the first direction. Because the adjustment bolt and the spring are connected through an annular groove and a collar, and the connecting arm connecting the collar and the spring is blocked by the limit rod, when the adjustment bolt is rotated, the adjustment bolt can only drive one end of the spring to move along the first direction through the annular groove, and the spring will not rotate together. After the telescopic length of the spring changes, the tension of the spring acting on the mobile clamp changes, thereby changing the force applied by the mobile clamp on the side of the wafer, so as to better adapt to wafers of different thicknesses. Furthermore, the arc-shaped spring sheet on the mobile clamp can be in uniform contact with the side wall of the wafer. Because, under the action of the spring, the top end of the arc-shaped spring piece abuts against the side wall of the wafer, and a transition portion with a through hole is arranged between the abutting portion and the connecting portion of the arc-shaped spring piece. The through hole in the transition portion can reduce the elastic force of the transition portion, thereby making it easier for the abutting portion to deform toward the connecting portion. That is to say, after the abutting portion abuts against the side wall of the wafer, the abutting portion protruding toward one side of the wafer can be more easily deformed outward and become an arc surface protruding away from the wafer, thereby forming a surface contact between the abutting portion and the side wall of the wafer, reducing the pressure exerted by the moving clamp on the side of the wafer, which is beneficial to prevent the thinner wafer from breaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A rear view of a wafer clamp provided by an embodiment of the present invention;

[0026] Figure 2 A side view of a wafer clamp provided by an embodiment of the present invention;

[0027] Figure 3 Figure 2 A partial enlarged view of position A in the middle;

[0028] Figure 4 for Figure 3 A cross-sectional view of

[0029] Figure 5 A schematic diagram of a movable clamping jaw of a wafer clamp provided in an embodiment of the present invention (with the cover plate omitted);

[0030] Figure 6 A schematic diagram of an arc-shaped spring piece in a wafer clamp provided by an embodiment of the present invention;

[0031] Figure 7 A diagram showing the process of the arc-shaped spring piece in the wafer clamp provided by an embodiment of the present invention abutting against the wafer.

[0032] Icons: 100 - clamping seat; 110 - fixing jaw; 120 - nut; 130 - adjusting bolt; 131 - threaded part; 1311 - annular groove; 132 - scale part; 133 - gripping part; 1331 - hexagonal plug rod; 140 - slide rail;

[0033] 200 - movable clamp; 211 - first back plate; 212 - second back plate; 213 - first connecting plate; 214 - second connecting plate;

[0034] 220 - arc-shaped spring piece; 221 - abutment portion; 222 - connection portion; 223 - transition portion; 2231 - through hole;

[0035] 300-spring; 310-connecting arm; 320-ring; 330-limiting rod;

[0036] 400 - positioning column; 500 - connecting column; 600 - pressure block. DETAILED DESCRIPTION

[0037] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] like Figure 1 - Figure 7 As shown, the wafer clamp provided by the embodiment of the present invention includes: a clamping base 100, the front side of the clamping base 100 is provided with a fixed jaw 110, and the clamping base 100 is slidably connected with a movable jaw 200 opposite to the fixed jaw 110, and the movable jaw 200 can move toward or away from the fixed jaw 110, and the fixed jaw 110 and the movable jaw 200 are clamped on the opposite sides of the circumferential side wall of the wafer, so as to fix the wafer, and, in addition to the fixed jaw 110 located below the movable jaw 200, anti-lateral displacement jaws with the same structure as the fixed jaw 110 can also be arranged on the left and right sides of the clamping base 100.

[0039] The movable clamp 200 includes a base and an arc-shaped spring piece 220. Both ends of the arc-shaped spring piece 220 are respectively connected to the base. The arc-shaped spring piece 220 has an arc surface protruding downward. The middle position of the arc surface is aligned with the middle position of the fixed clamp 110. The material of the arc-shaped spring piece 220 can be metal.

[0040] The arc surface of the arc-shaped spring piece 220 is bent toward the side where the fixed clamping claw 110 is located; the arc-shaped spring piece 220 includes an abutting portion 221 located in the middle part, and connecting portions 222 located at the left and right ends. A transition portion 223 is connected between the connecting portion 222 and the abutting portion 221. The transition portion 223 has a plurality of through holes 2231 penetrating its front and rear surfaces. The provision of the through holes 2231 can reduce the elasticity of the transition portion 223. The abutting portion 221 directly connected to the transition portion 223 is more likely to deform when subjected to the pressure of the wafer, thereby making it easier to change from line contact to surface contact.

[0041] The back of the clamping seat 100 is provided with a nut 120, the nut 120 is relatively fixed to the clamping seat 100, the inner thread of the nut 120 is connected with an adjusting bolt 130, and the adjusting bolt 130 extends along a first direction, which is consistent with the movement direction of the movable clamping jaw 200. Figure 1By rotating the adjusting bolt 130 in the up and down direction, the adjusting bolt 130 can be moved toward or away from the moving clamp 200. An annular groove 1311 is provided on the side wall of the adjusting bolt 130 at one end close to the moving clamp; the wafer clamp also includes a spring 300 extending along the first direction, one end of the spring 300 is fixedly connected to the base, and the other end has two "L"-shaped connecting arms 310. A collar 320 coaxial with the adjusting bolt 130 is provided between the two connecting arms 310. The connecting arm 310 includes a first rod extending along the first direction, and a second rod perpendicular to the first rod, the two second rods both extend in the direction where each other is located, and the collar is connected between the two second rods. The ring 320 is located in the annular groove 1311. The forward and backward movement of the annular groove 1311 can drive the ring 320 to move forward and backward, but the rotation of the annular groove 1311 will not affect the ring 320; the back of the clamp seat 100 is also provided with a limit rod 330 located on both sides of the connecting arm 310, and the limit rod 330 can be vertical to the back of the clamp seat 100. The limit rod 330 is used to prevent the connecting arm 310 from rotating together with the adjusting bolt 130.

[0042] When the wafer clamp provided by the embodiment of the present invention is used to clamp and fix the wafer, the clamping force of the mobile clamping jaw 200 can be adjusted in advance according to the thickness of the wafer. Specifically, the user rotates the adjusting bolt 130 forward or reversely, and the adjusting bolt 130 moves forward and backward along the first direction. Because the adjusting bolt 130 and the spring 300 are connected through the annular groove 1311 and the collar 320, and the connecting arm 310 connecting the collar 320 and the spring 300 is blocked by the limit rod 330, when the adjusting bolt 130 rotates, the adjusting bolt 130 can only drive one end of the spring 300 to move along the first direction through the annular groove 1311, and the spring 300 will not rotate together. After the telescopic length of the spring 300 changes, the tension of the spring 300 on the mobile clamping jaw 200 changes, thereby changing the force applied by the mobile clamping jaw 200 on the side of the wafer, so as to better adapt to wafers of different thicknesses. Furthermore, the arc-shaped spring piece 220 on the movable clamp 200 can be in uniform contact with the side wall of the wafer. Because, under the action of the spring 300, the top of the arc-shaped spring piece 220 abuts against the side wall of the wafer, and a transition portion 223 with a through hole 2231 is provided between the abutting portion 221 and the connecting portion 222 of the arc-shaped spring piece 220. The through hole 2231 in the transition portion 223 can reduce the elastic force of the transition portion 223, so that the abutting portion 221 is more likely to deform toward the connecting portion 222. That is, after the abutting portion 221 abuts against the side wall of the wafer, the abutting portion 221 protruding toward one side of the wafer can be more easily deformed outward and become an arc surface protruding away from the wafer, so that the abutting portion 221 forms a surface contact with the side wall of the wafer, reducing the pressure exerted by the movable clamp on the side of the wafer, which is conducive to preventing the thinner wafer from breaking.

[0043] During the use of the above-mentioned wafer clamp, after the front-line workers or technical engineers load the wafer into the clamp, they rotate the adjustment screw to move the screw back and forth according to the thickness and material of the wafer, thereby adjusting the tension of the spring. Therefore, the clamping force of the mobile clamp on the wafer can be adjusted according to the thickness and material of the wafer. Therefore, the wafer clamp can not only prevent thicker wafers from falling off the planetary frame and breaking due to insufficient clamping force; at the same time, it can also prevent thinner wafers from breaking due to excessive clamping force.

[0044] The arc surface area of ​​the abutting portion roughly accounts for about 20% of the overall area of ​​the arc surface. The area of ​​all the through holes 2231 on the transition portion 223 accounts for 30%-80% of the arc surface area of ​​the arc-shaped spring piece 220. The proportion of the through holes 2231 affects the difficulty of deformation of the abutting portion 221. Setting the proportion of the area of ​​the through holes 2231 between 30% and 80% can ensure that the abutting portion 221 is relatively easy to deform upward into a concave shape, and the abutting portion 221 will not fail to restore its original shape after the wafer is removed.

[0045] In an practicable solution, the through holes 2231 on the transition portion 223 have the same size, and the number of through holes 2231 per unit area at each position on the transition portion 223 increases along the direction from the abutting portion 221 toward the connecting portion 222 .

[0046] Specifically, along the direction from the abutting portion 221 to the connecting portion 222, the transition portion 223 is provided with multiple rows of through hole groups, and the number of through hole 2231 in each through hole group is at least one. Specifically, in this embodiment, the number of through holes 2231 in the through hole group closest to the abutting portion 221 is five, and the number of through holes 2231 in the through hole group increases by two from the middle to the bottom. Thus, the elastic force distribution on the transition portion 223 can be gradually reduced from the middle to the bottom, and elastic deformation is more and more likely to occur from the middle to the bottom, so that the abutting portion 221 can be better deformed and attached to the circumferential side wall of the wafer. Similarly, in another feasible scheme, along the direction from the abutment portion 221 toward the connection portion 222, the number of through holes 2231 per unit area at each position on the transition portion 223 is the same, and the area of ​​the through holes 2231 at each position on the transition portion 223 increases, gradually decreasing from the middle to the bottom, and elastic deformation becomes increasingly easier to occur from the middle to the bottom, so that the abutment portion 221 can be better deformed and fit to the circumferential side wall of the wafer.

[0047] Both ends of the spring 300 have metal wires extending axially outward; two positioning columns 400 are provided on the back of the clamp seat 100, and the metal wire between the spring 300 and the movable clamp 200 passes through one of the positioning columns 400, and the metal wire between the spring 300 and the adjusting bolt 130 passes through the other positioning column 400.

[0048] The main body of the spring 300 extends along the first direction and is located between the adjusting bolt 130 and the movable clamp 200. Two metal wires are led out from both ends of the spring 300. The metal wires pass through the holes on the positioning column 400, and the metal wires can move along the first direction relative to the positioning column 400. The positioning column 400 can position the spring 300 to prevent the position of the spring 300 from changing during the adjustment process.

[0049] The adjusting bolt 130 includes a threaded portion 131, a scale portion 132 and a gripping portion 133 which are connected in sequence, the threaded portion 131 is threadedly connected to the nut 120, and the annular groove 1311 is located on the threaded portion 131; the scale portion 132 has a plurality of scale lines which are equally spaced along a first direction, and each scale line surrounds the scale portion 132; the clamping seat 100 has a reference line for aligning with the scale lines, and the reference line is parallel to the scale lines.

[0050] The user holds the gripping portion 133 and then rotates the gripping portion 133, so that the adjusting bolt 130 rotates as a whole. The scale lines on the scale portion 132 can always be parallel to the reference line during the rotation process, so that the user can check the degree, which directly reflects the distance the adjusting bolt 130 moves relative to the initial position (the position where the tension of the spring 300 is 0). Therefore, the tension of the moving jaws of the spring can be quantified through the scale lines, thereby realizing the quantification of the clamping force of the chuck on the edge of the wafer.

[0051] In an practicable solution, in order to avoid accidental operation of the rotating adjustment bolt 130 after the elastic force of the spring 300 is adjusted, the gripping portion 133 and the scale portion 132 can be set to a detachable connection. Specifically, the gripping portion 133 includes a hexagonal plug rod 1331 extending along the first direction, and the end surface of the scale portion 132 has a hexagonal hole corresponding to the hexagonal plug rod 1331. When adjustment is required, the hexagonal plug rod 1331 on the gripping portion 133 is inserted into the hexagonal hole on the scale portion 132, and then the threaded portion 131 is rotated; and after the adjustment is completed, the gripping portion 133 is pulled out to avoid accidental contact, which may cause the elastic force of the spring 300 to change.

[0052] The clamping base 100 has a slide rail 140, and the movable clamping jaw 200 is slidably connected in the slide rail 140 so that the movable clamping jaw 200 only moves along the first direction, thereby preventing the movable clamping jaw 200 from deviating to the left or right direction when moving along the first direction, thereby affecting the force applied by the arc spring 220 to the side wall of the wafer.

[0053] The base includes a first back plate 211 and a second back plate 212 vertically connected. The first back plate 211 is located at the rear side of the clamp base 100. The first back plate 211 is fixedly connected to the spring 300. The arc-shaped spring piece 220 is connected to the second back plate 212, and the arc surface of the arc-shaped spring piece 220 faces downward. A first connecting plate 213 perpendicular to the surface of the second back plate 212 facing the fixed clamp 110 is provided, and the number of the first connecting plates 213 is two, and the two first connecting plates 213 are arranged at intervals; second connecting plates 214 extending in the direction of each other are provided on the surfaces facing each other on the two first connecting plates 213, and a gap is formed between the two second connecting plates 214, and there is a gap between the second connecting plate 214 and the second back plate 212, and the connecting portion 222 of the arc-shaped spring piece 220 is fixed in the gap between the second connecting plate 214 and the second back plate 212, and the top of the arc-shaped spring piece 220 is exposed from the gap, and the top of the arc-shaped spring piece 220 is higher than the second connecting plate 214, so that the top of the arc-shaped spring piece 220 can abut against the side wall of the wafer.

[0054] A cover plate is connected to the base, and the cover plate is connected to the second back plate 212, and the cover plate and the first back plate 211 are respectively located at the front and rear sides of the second back plate 212; the projection of the cover plate on the first back plate 211 at least covers the projection of the arc-shaped spring piece 220 on the first back plate 211. In addition to limiting the arc-shaped spring piece 220 between the first connecting plate 213 and the second connecting plate 214, the cover plate can also limit the wafer. The lower edge of the cover plate extends downward to below the top of the arc-shaped spring piece 220. After the wafer abuts against the arc-shaped spring piece 220, the cover plate can prevent the wafer from tilting forward, thereby protecting the wafer.

[0055] The nut 120 is welded to a bottom plate. The back of the clamp seat 100 has a groove, and the bottom plate is located in the groove. The back of the clamp seat 100 is connected to a pressing block 600 by screws. The pressing block 600 presses on the bottom plate to prevent the bottom plate from falling out of the groove.

[0056] The back of the clamp seat 100 has a connecting column 500 connected to the planet carrier. The spring 300 may be an annular spring 300 , and the connecting column 500 is located inside the circle of the annular spring 300 .

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer clamp, characterized in that: include: A clamping seat (100), wherein the front side of the clamping seat (100) is provided with a fixed clamping claw (110), and the clamping seat (100) is slidably connected with a movable clamping claw (200) opposite to the fixed clamping claw (110), and the movable clamping claw (200) is capable of moving toward or away from the fixed clamping claw (110); The movable clamping jaw (200) comprises a base and an arc-shaped spring piece (220), and the two ends of the arc-shaped spring piece (220) are respectively connected to the base; the arc surface of the arc-shaped spring piece (220) is bent toward the side where the fixed clamping jaw (110) is located; the arc-shaped spring piece (220) comprises an abutting portion (221) located in the middle part, and connecting portions (222) located at the left and right ends, and a transition portion (223) is connected between the connecting portion (222) and the abutting portion (221), and the transition portion (223) has a plurality of through holes (2231) penetrating the front and rear surfaces thereof; A nut (120) is provided on the back of the clamping seat (100), and an adjusting bolt (130) is connected to the internal thread of the nut (120), and the adjusting bolt (130) extends along a first direction, and the first direction is consistent with the movement direction of the movable clamping jaw (200); an annular groove (1311) is provided on the side wall of one end of the adjusting bolt (130) close to the movable clamping jaw; the wafer clamp also includes a spring (300) extending along the first direction, one end of the spring (300) is fixedly connected to the base, and the other end has two "L"-shaped connecting arms (310), The connecting arm (310) comprises a first rod extending in a first direction, and a second rod vertically connected to the first rod, the second rods on the two connecting arms extend towards each other, a collar (320) coaxial with the adjusting bolt (130) is provided between the two second rods, and the collar (320) is located in the annular groove (1311); the back side of the clamping seat (100) is further provided with limiting rods (330) located on both sides of the connecting arm (310), and the limiting rods (330) are used to prevent the connecting arm (310) from rotating together with the adjusting bolt (130); The area of ​​all the through holes (2231) on the transition portion (223) accounts for 30%-80% of the arc surface area of ​​the arc-shaped spring sheet (220); The through holes (2231) on the transition portion (223) have the same size, and the number of through holes (2231) per unit area at each position on the transition portion (223) increases in a direction from the abutment portion (221) toward the connection portion (222); Along the direction from the abutting portion (221) toward the connecting portion (222), the number of through holes (2231) per unit area at each position on the transition portion (223) is the same, and the area of ​​the through holes (2231) at each position on the transition portion (223) increases; Both ends of the spring (300) have metal wires extending axially outward; Two positioning posts (400) are arranged on the back of the clamp seat (100); a metal wire between the spring (300) and the movable clamping claw (200) passes through one of the positioning posts (400); and a metal wire between the spring (300) and the adjusting bolt (130) passes through another positioning post (400); The adjusting bolt (130) comprises a threaded portion (131), a scale portion (132) and a grip portion (133) which are connected in sequence, the threaded portion (131) being threadedly connected to the nut (120), and the annular groove (1311) being located on the threaded portion (131); The scale portion (132) has a plurality of scale lines arranged at equal intervals along a first direction, and each scale line surrounds the scale portion (132); The clamping seat (100) has a reference line for aligning with the scale line, and the reference line is parallel to the scale line.

2. The wafer clamp according to claim 1, characterized in that: The holding portion (133) comprises a hexagonal insertion rod (1331) extending along a first direction, and the end surface of the scale portion (132) comprises a hexagonal hole corresponding to the hexagonal insertion rod (1331).

3. The wafer clamp according to claim 1, characterized in that: The clamp seat (100) is provided with a slide rail (140), and the movable clamping jaw (200) is slidably connected in the slide rail (140) so that the movable clamping jaw (200) moves only along a first direction.

4. The wafer clamp according to claim 1, characterized in that: The base comprises a first back plate (211) and a second back plate (212) which are vertically connected, the first back plate (211) being connected to the spring (300), and the arc-shaped elastic sheet (220) being connected to the second back plate (212); A first connecting plate (213) perpendicular to the surface of the second back plate (212) facing the fixed clamp (110) is provided, and the number of the first connecting plates (213) is two, and the two first connecting plates (213) are arranged at intervals; second connecting plates (214) extending in the direction of each other are provided on the surfaces of the two first connecting plates (213) facing each other, and a gap is formed between the two second connecting plates (214), and there is a gap between the second connecting plate (214) and the second back plate (212); the connecting portion (222) of the arc-shaped spring sheet (220) is fixed in the gap between the second connecting plate (214) and the second back plate (212), and the top of the arc-shaped spring sheet (220) is exposed from the gap, and the top of the arc-shaped spring sheet (220) is higher than the second connecting plate (214).

5. The wafer clamp according to claim 4, characterized in that: A cover plate is connected to the base, the cover plate is connected to the second back plate (212), and the cover plate and the first back plate (211) are respectively located at the front and rear sides of the second back plate (212); The projection of the cover plate on the first back plate (211) at least covers the projection of the arc-shaped elastic sheet (220) on the first back plate (211).

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