Anode plate coating electroplating device

Abstract

The utility model relates to the field of electroplating equipment, and discloses an anode plate coating electroplating device. According to the device, a fine electrolytic tank is welded to the outer surface of a main electrolytic tank, a side supporting shell is welded to the outer surface of the end, away from the fine electrolytic tank, of the main electrolytic tank, a side supporting plate is welded to the outer surface of the end, away from the main electrolytic tank, of the fine electrolytic tank, and a supporting beam is movably connected to the inner surface of a connecting groove; a connecting supporting rod is fixedly connected to the lower surface of the supporting beam, an anode expansion slot is movably connected to the outer surface of the connecting supporting rod, a limiting block is arranged on the outer surface of the anode expansion slot, electrolyte is stored in the main electrolytic tank and the fine electrolytic tank, electroplating is conveniently completed, the fine electrolytic tank can better conduct electroplating under the action of semiconductor cooling fins, and the electroplating efficiency is improved. The side supporting shell and the side supporting plate guarantee supporting of equipment at the two ends, the limiting block is pulled to 90 degrees by being inserted into the inner surface of the anode expansion groove to complete fixation, and then the size adjustment of the anode plate is completed.

Description

Technical Field

[0001] The present application belongs to the technical field of electroplating equipment, and specifically relates to an anode plate coating electroplating device. Background Art

[0002] Existing electroplating equipment generally adopts a deep tank electroplating mode, that is, the depth of the electroplating tank is relatively deep, the plate to be plated is hung on the conductive rail and extends into the electroplating tank along the length direction, and a large current flows through the conductive rail. Since the short side of the plate to be plated is hung on the conductive rail and the long side extends into the electroplating tank, the current is difficult to conduct to the entire plate to be plated but is concentrated on the top of the plate. The current distribution of the plate to be plated is uneven, resulting in low electroplating efficiency and high unit power consumption. In addition, due to the large depth of the electroplating tank and the deep length of the circuit board in the electroplating tank, it is inconvenient to take and put.

[0003] For example, an electroplating device is disclosed in the application with publication number CN205821498U, which includes an electroplating tank and a conductive hanger arranged above the electroplating tank, and also includes an anode plate and a cathode plate arranged inside the electroplating tank, wherein the anode plate and the cathode plate are rectangular plates, and the long sides of the anode plate and the cathode plate are hung on the conductive hanger; the electroplating tank of the plate to be electroplated is a rectangular parallelepiped with an open top, and the width of the electroplating tank is greater than its height. The width of the electroplating tank is greater than the height. During electroplating, the long sides of the anode plate and the cathode plate are hung on the conductive hanger, and the anode plate and the cathode plate are immersed in the electroplating solution. The conductive hanger contacts the long sides of the anode plate and the cathode plate, and the current can be evenly distributed on the cathode and cathode plates, thereby improving the electrolysis efficiency and the uniformity of electroplating. Since the depth of the electroplating tank is small, it is convenient to take and put the cathode and cathode plates, and there is no need to use an electric lifting device, so the equipment is simple and the cost is low.

[0004] But common Utility Model Content

[0005] The purpose of the present application is to provide an anode plate coating electroplating device in order to solve the above-mentioned problems.

[0006] The technical solution adopted in the present application is as follows: an anode plate coating electroplating device, comprising a main electrolytic cell, a fine electrolytic cell welded to the outer surface of the main electrolytic cell, a side support shell welded to the outer surface of one end of the main electrolytic cell away from the fine electrolytic cell, a side support plate welded to the outer surface of one end of the fine electrolytic cell away from the main electrolytic cell, a connecting groove fixedly connected to the outer surface of the connecting groove, a support beam movably connected to the inner surface of the connecting groove, a connecting support rod fixedly connected to the lower surface of the support beam, an anode expansion slot movably connected to the outer surface of the connecting support rod, and a limiting block is arranged on the outer surface of the anode expansion slot.

[0007] By adopting the above technical scheme, the main electrolytic cell and the fine electrolytic cell store electrolyte to facilitate electroplating. The fine electrolytic cell is better electroplated under the action of the semiconductor heat sink. The side support shell and the side support plate ensure the support of the equipment at both ends. By inserting the inner surface of the anode expansion slot, the limit block is turned to 90 degrees to complete the fixation, thereby completing the size adjustment of the anode plate. Similarly, the cathode extension block can be inserted to complete the size adjustment of the cathode plate. The connecting groove, support beam, and connecting support rod ensure the connectivity of the circuit during activity. By inserting the inner surface of the anode expansion slot, the limit block is turned to 90 degrees to complete the fixation, thereby completing the size adjustment of the anode plate, realizing precise size control, repair and correction, and increasing the thickness and performance of the product.

[0008] In a preferred embodiment, the anode expansion slot corresponds to a small anode plate movably connected to the outer surface of the limit block, the anode expansion slot corresponds to a medium anode plate movably connected to the outer surface of the limit block, and the anode expansion slot corresponds to a large anode plate movably connected to the outer surface of the limit block.

[0009] By adopting the above technical solution, the small anode plate, the medium anode plate and the large anode plate are of different sizes, thereby completing the size adjustment of the anode plate.

[0010] In a preferred embodiment, the outer surface of the connecting support rod away from the anode expansion slot is movably connected to a cathode expansion block, and a cathode plate is welded to the lower surface of the cathode expansion block.

[0011] By adopting the above technical solution, the cathode extension block and the cathode plate can be easily inserted into the cathode end of the electroplating, thereby facilitating the efficiency expansion of the equipment.

[0012] In a preferred embodiment, a motor is disposed on the outer surface of the side support shell, and a semiconductor heat sink is fixedly connected to the outer surface of the side support plate.

[0013] By adopting the above technical solution, the motor provides mechanical power for the lifting and lowering of the electroplating equipment, and the semiconductor heat sink facilitates further heat dissipation to ensure better electroplating of the fine electrolytic cell.

[0014] In a preferred embodiment, a driving wheel is fixedly connected to the outer surface of the motor output end, a transmission belt is movably connected to the inner surface of the side support shell corresponding to the motor, and a driven wheel is movably connected to the outer surface of the transmission belt.

[0015] By adopting the above technical solution, the driving wheel, the transmission belt and the driven wheel transmit the rotation of the motor to the rotating rod through force.

[0016] In a preferred embodiment, a rotating rod is welded to the outer surface of the driven wheel, and a winding rope is welded to the outer surface of the supporting beam corresponding to the semiconductor heat sink.

[0017] By adopting the above technical solution, the rotation of the rotating rod reels in the reeling rope, thereby facilitating the lifting and lowering of the support beam and completing the electroplating.

[0018] In a preferred embodiment, connecting shells are welded to the outer surfaces of both ends of the refined electrolytic cell, and connecting channels are welded to the outer surfaces of the connecting shells.

[0019] By adopting the above technical solution, the main electrolytic cell and the fine electrolytic cell are connected by the connecting shell, the connecting channel, and the supporting channel shell, and the electroplating of the equipment and the heat dissipation of the electrolyte are facilitated by the flow of the electrolyte.

[0020] In a preferred embodiment, a supporting channel shell is welded to the outer surface of the connecting shell, and an air pressure pump is fixedly connected to the upper surface of the supporting channel shell.

[0021] By adopting the above technical solution, the supporting channel shell ensures that the electrolyte circulates, and the air pressure pump circulates the electrolyte by outputting it to the main electrolytic cell, thereby increasing heat dissipation and electroplating cycles.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0023] In the present application, the main electrolytic cell and the fine electrolytic cell store electrolyte to facilitate electroplating. The fine electrolytic cell is better electroplated under the action of the semiconductor heat sink. The side support shell and the side support plate ensure the support of the equipment at both ends. By inserting the inner surface of the anode expansion slot, the limit block is turned to ninety degrees to complete the fixation, thereby completing the size adjustment of the anode plate. Similarly, the cathode extension block can be inserted to complete the size adjustment of the cathode plate. The connecting groove, support beam, and connecting support rod ensure the connectivity of the circuit during activity. By inserting the inner surface of the anode expansion slot, the limit block is turned to ninety degrees to complete the fixation, thereby completing the size adjustment of the anode plate, realizing precise size control, repair and correction, and increasing the thickness and performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a front view of the device for this application;

[0025] Figure 2 This is a schematic diagram of the device structure in this application;

[0026] Figure 3 This is a schematic diagram of the electroplating structure of the equipment in this application;

[0027] Figure 4 This is a disassembled diagram of the electroplating structure of the equipment in this application.

[0028] Markings in the figure: 1. main electrolytic cell; 2. fine electrolytic cell; 3. side support shell; 4. side support plate; 5. connecting groove; 6. support beam; 7. connecting support rod; 8. anode extension slot; 9. limit block; 10. small anode plate; 11. middle anode plate; 12. large anode plate; 13. cathode extension block; 14. cathode plate; 15. motor; 16. driving wheel; 17. transmission belt; 18. driven wheel; 19. semiconductor heat sink; 20. rotating rod; 21. winding rope; 22. connecting shell; 23. connecting channel; 24. support channel shell; 25. air pressure pump. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0030] Example:

[0031] Reference Figure 1-4 A positive plate coating electroplating device comprises a main electrolytic cell 1, a fine electrolytic cell 2 is welded on the outer surface of the main electrolytic cell 1, a side support shell 3 is welded on the outer surface of one end of the main electrolytic cell 1 away from the fine electrolytic cell 2, a side support plate 4 is welded on the outer surface of one end of the fine electrolytic cell 2 away from the main electrolytic cell 1, a connecting groove 5 is fixedly connected to the outer surface of the side support shell 3, a supporting beam 6 is movably connected to the inner surface of the connecting groove 5, a connecting support rod 7 is fixedly connected to the lower surface of the supporting beam 6, an anode expansion slot 8 is movably connected to the outer surface of the connecting support rod 7, and a limiting block 9 is arranged on the outer surface of the anode expansion slot 8.

[0032] The main electrolytic cell 1 and the fine electrolytic cell 2 store electrolyte to facilitate electroplating. The fine electrolytic cell 2 is better electroplated under the action of the semiconductor heat sink 19. The side support shell 3 and the side support plate 4 ensure the support of the equipment at both ends. By inserting the inner surface of the anode expansion slot 8, the limit block 9 is turned to ninety degrees to complete the fixation, and then the size of the anode plate is adjusted. Similarly, the cathode expansion block 13 can be inserted to complete the size adjustment of the cathode plate. The connecting groove 5, the support beam 6, and the connecting support rod 7 ensure the connectivity of the circuit during activity. By inserting the inner surface of the anode expansion slot 8, the limit block 9 is turned to ninety degrees to complete the fixation, and then the size of the anode plate is adjusted, and precise size control, repair and correction are achieved, thereby increasing the thickness and performance of the product.

[0033] Reference Figure 1-4A small anode plate 10 is movably connected to the outer surface of the limit block 9 corresponding to the anode expansion slot 8, a middle anode plate 11 is movably connected to the outer surface of the limit block 9 corresponding to the anode expansion slot 8, and a large anode plate 12 is movably connected to the outer surface of the limit block 9 corresponding to the anode expansion slot 8.

[0034] The small anode plate 10 , the middle anode plate 11 , and the large anode plate 12 have different sizes, thereby completing the size adjustment of the anode plates.

[0035] Reference Figure 1-4 A cathode expansion block 13 is movably connected to the outer surface of the connecting support rod 7 away from the anode expansion slot 8, and a cathode plate 14 is welded to the lower surface of the cathode expansion block 13.

[0036] The cathode expansion block 13 and the cathode plate 14 are conveniently inserted into the cathode end of the electroplating, thereby facilitating the efficiency expansion of the equipment.

[0037] Reference Figure 1-4 A motor 15 is disposed on the outer surface of the side support shell 3 , and a semiconductor heat sink 19 is fixedly connected to the outer surface of the side support plate 4 .

[0038] The motor 15 provides mechanical power for the lifting and lowering of the electroplating equipment, and the semiconductor heat sink 19 facilitates further heat dissipation to ensure better electroplating of the fine electrolytic cell 2.

[0039] Reference Figure 1-4 A driving wheel 16 is fixedly connected to the outer surface of the output end of the motor 15, a transmission belt 17 is movably connected to the inner surface of the side support shell 3 corresponding to the motor 15, and a driven wheel 18 is movably connected to the outer surface of the transmission belt 17.

[0040] The driving wheel 16 , the transmission belt 17 , and the driven wheel 18 transmit the rotation of the motor 15 to the rotating rod 20 through force.

[0041] Reference Figure 1-4 A rotating rod 20 is welded on the outer surface of the driven wheel 18, and a winding rope 21 is welded on the outer surface of the semiconductor heat sink 19 corresponding to the supporting beam 6.

[0042] The rotation of the rotating rod 20 reels in the reeling rope 21, thereby facilitating the lifting and lowering of the support beam 6 and completing the electroplating.

[0043] Reference Figure 1-4 A connecting shell 22 is welded on the outer surfaces of both ends of the refined electrolytic cell 2, and a connecting channel 23 is welded on the outer surface of the connecting shell 22.

[0044] The connecting shell 22, the connecting channel 23, and the supporting channel shell 24 connect the main electrolytic cell 1 and the fine electrolytic cell 2, and facilitate the electroplating of the equipment and the heat dissipation of the electrolyte through the flow of the electrolyte.

[0045] Reference Figure 1-4A supporting channel shell 24 is welded to the outer surface of the connecting shell 22 , and an air pressure pump 25 is fixedly connected to the upper surface of the supporting channel shell 24 .

[0046] The supporting channel housing 24 ensures that the electrolyte forms a circulation, and the air pressure pump 25 circulates the electrolyte by outputting it to the main electrolytic cell 1, thereby increasing heat dissipation and electroplating cycles.

[0047] The implementation principle of an embodiment of an anode plate coating electroplating device of the present application is as follows:

[0048] When in use, the material to be electroplated is connected to the small anode plate 10, the medium anode plate 11, and the large anode plate 12 of different sizes, and is inserted into the inner surface of the anode expansion slot 8, and the limit block 9 is turned to ninety degrees to complete the fixation, thereby completing the size adjustment of the anode plate. Similarly, the cathode expansion block 13 can be inserted to complete the size adjustment of the cathode plate. The connecting slot 5, the support beam 6, and the connecting support rod 7 ensure the connectivity of the circuit during activity. The opening and rotation of the motor 15 is driven by the driving wheel 16, the transmission belt 17, and the driven wheel 18 to rotate the rotating rod 20 and reel in the reeling rope 21 to complete the lifting and lowering of the support beam 6. The material to be electroplated is placed in the main electrolytic cell 1 and the fine electrolytic cell 2 to complete the electroplating.

[0049] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An anode plate coating electroplating device, comprising a main electrolytic cell (1), characterized in that: The outer surface of the main electrolytic cell (1) is welded with a fine electrolytic cell (2); the outer surface of the main electrolytic cell (1) away from the fine electrolytic cell (2) is welded with a side support shell (3); the outer surface of the fine electrolytic cell (2) away from the main electrolytic cell (1) is welded with a side support plate (4); the outer surface of the side support shell (3) is fixedly connected with a connection groove (5); the inner surface of the connection groove (5) is movably connected with a support beam (6); the lower surface of the support beam (6) is fixedly connected with a connection support rod (7); the outer surface of the connection support rod (7) is movably connected with an anode expansion slot (8); and the outer surface of the anode expansion slot (8) is provided with a limit block (9).

2. The anode plate coating electroplating device according to claim 1, characterized in that: The anode expansion slot (8) corresponds to a limit block (9) whose outer surface is movably connected to a small anode plate (10), the anode expansion slot (8) corresponds to a limit block (9) whose outer surface is movably connected to a middle anode plate (11), and the anode expansion slot (8) corresponds to a limit block (9) whose outer surface is movably connected to a large anode plate (12).

3. The anode plate coating electroplating device according to claim 1, characterized in that: The outer surface of the connecting support rod (7) away from the anode expansion slot (8) is movably connected to a cathode expansion block (13), and a cathode plate (14) is welded to the lower surface of the cathode expansion block (13).

4. The anode plate coating electroplating device according to claim 1, characterized in that: The outer surface of the side support shell (3) is provided with a motor (15), and the outer surface of the side support plate (4) is fixedly connected with a semiconductor heat sink (19).

5. The anode plate coating electroplating device according to claim 4, characterized in that: The outer surface of the output end of the motor (15) is fixedly connected to a driving wheel (16), the inner surface of the side support shell (3) corresponding to the motor (15) is movably connected to a transmission belt (17), and the outer surface of the transmission belt (17) is movably connected to a driven wheel (18).

6. The anode plate coating electroplating device according to claim 5, characterized in that: A rotating rod (20) is welded to the outer surface of the driven wheel (18), and a winding rope (21) is welded to the outer surface of the semiconductor heat sink (19) corresponding to the supporting beam (6).

7. The anode plate coating electroplating device according to claim 1, characterized in that: A connecting shell (22) is welded to the outer surfaces of both ends of the refined electrolytic cell (2), and a connecting channel (23) is welded to the outer surface of the connecting shell (22).

8. The anode plate coating electroplating device according to claim 7, characterized in that: A supporting channel housing (24) is welded to the outer surface of the connecting housing (22), and an air pressure pump (25) is fixedly connected to the upper surface of the supporting channel housing (24).

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