Semiconductor refrigeration device and equipment
By opening a flow channel for circulating refrigeration liquid in the substrate contacting the heat-expressing surface of the semiconductor refrigeration unit, the problem of reduced energy efficiency of the thermoelectric refrigerator is solved, and a more efficient heat dissipation effect and faster temperature control are achieved.
Patent Information
- Application Number
- CN202421165447.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-27
AI Technical Summary
There is a long heat transfer distance between the existing thermoelectric cooler and the radiator outside the encapsulated tube shell, which causes the heat to not be exported in time, thereby reducing the energy efficiency of the thermoelectric cooler.
A semiconductor refrigeration device is designed to accelerate heat dissipation efficiency by opening a flow channel for circulating the refrigeration liquid in the substrate contacting the heat-expressing surface of the semiconductor refrigeration unit.
By accelerating the heat dissipation efficiency of the heat-expressing surface of the semiconductor refrigeration unit, the energy efficiency of the semiconductor refrigeration device and equipment is improved, the heat transfer distance and thermal resistance are significantly reduced, and the corresponding temperature control speed is improved.
Smart Images
Figure CN222459859U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor refrigeration technology, and more specifically, to a semiconductor refrigeration device and equipment. Background Art
[0002] As a commonly used temperature controller, thermoelectric cooler has the advantages of fast response and high precision, and is also widely used in optoelectronic chip packaging.
[0003] In traditional optoelectronic microsystem packaging, the thermoelectric cooler is a discrete rectangular module containing a large number of cooling particles. Thermoelectric coolers generally include a heating surface and a cooling surface. When used, the chip that needs temperature control is attached to the cooling surface, and then the thermoelectric cooler is mounted on the packaging substrate. The thermoelectric cooler fixed on the substrate is in contact with the packaging heat-conducting shell through thermal conductive adhesive for heat conduction. Finally, the shell quickly removes heat through natural convection, air cooling or liquid cooling equipment.
[0004] Currently, this type of thermoelectric cooler and the heat sink outside the package tube shell will experience a long heat transfer distance, and contain various low thermal conductivity interface materials, so the heat cannot be discharged in time, thereby reducing the energy efficiency of the thermoelectric cooler. Utility Model Content
[0005] The purpose of the embodiments of the present application is to provide a semiconductor refrigeration device and equipment to solve the problem that the heat cannot be discharged in time due to the long heat transfer distance between the thermoelectric cooler and the heat sink outside the packaging tube shell, thereby reducing the energy efficiency of the thermoelectric cooler.
[0006] In the first aspect, the utility model provides a semiconductor refrigeration device, which includes: a substrate, a semiconductor refrigeration unit and a contact plate; the first end of the semiconductor refrigeration unit is connected to the first outer surface of the substrate, and the opposite end of the first end of the semiconductor refrigeration unit is connected to the first surface of the contact plate; the opposite surface of the first surface of the contact plate is used to contact the device to be refrigerated; a channel inlet is provided on the first side of the substrate, a channel outlet is provided on the second side of the substrate, and a channel connecting the channel inlet and the channel outlet is provided in the substrate; wherein the channel is used to circulate a refrigeration liquid, and the first side and the second side of the substrate are both perpendicular to the first outer surface of the substrate; the semiconductor refrigeration unit is configured to release heat from the first end and absorb heat from the opposite end of the first end under electrical modulation.
[0007] The semiconductor refrigeration device designed as above, this scheme opens a flow channel for circulating the refrigerant liquid in the substrate that contacts the heat release surface of the semiconductor refrigeration unit, thereby accelerating the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit by circulating the refrigerant liquid in the flow channel, thereby improving the energy efficiency of the designed semiconductor refrigeration device and equipment.
[0008] In an optional embodiment of the first aspect, the semiconductor refrigeration unit includes a plurality of semiconductor refrigeration materials, the first ends of the plurality of semiconductor refrigeration particles are all connected to the first outer surface of the substrate, and the opposite ends of the first ends of the plurality of semiconductor refrigeration particles are all connected to the first surface of the contact plate.
[0009] In an optional implementation of the first aspect, the plurality of semiconductor refrigeration particles include a plurality of N-type semiconductors and a plurality of P-type semiconductors; the N-type semiconductors and the P-type semiconductors are arranged alternately, and the alternately arranged plurality of N-type semiconductors and the P-type semiconductors form a series connection.
[0010] In the above-mentioned implementation mode, N-type semiconductors and P-type semiconductors are alternately arranged, and a plurality of N-type semiconductors and P-type semiconductors are connected in series, so as to ensure that when all semiconductors are conductive, the same side thereof exhibits heat generation or heat absorption, that is, the first end thereof exhibits heat release, and the opposite end thereof exhibits heat absorption, thereby achieving cooling.
[0011] In an optional embodiment of the first aspect, a first outer surface of the substrate is provided with a first metal connection wiring, and a first outer surface of the contact plate is provided with a second metal connection wiring; the first ends of the plurality of N-type semiconductors and the plurality of P-type semiconductors are electrically connected to the first metal connection wiring, and the opposite ends of the first ends of the plurality of N-type semiconductors and the plurality of P-type semiconductors are electrically connected to the second metal connection wiring to form a series connection.
[0012] In an optional embodiment of the first aspect, the first ends of multiple N-type semiconductors and multiple P-type semiconductors are electrically connected to the first metal connection wiring through solder; the relative ends of the first ends of multiple N-type semiconductors and multiple P-type semiconductors are electrically connected to the second metal connection wiring through solder.
[0013] In the above-mentioned implementation mode, the first metal connection wiring is arranged on the first outer surface of the substrate, and the second metal connection wiring is arranged on the first surface of the contact plate, so that the structure is more compact and miniaturized. In addition, the present invention adopts SMT solder paste welding method between the refrigeration particles and the metal connection wiring, which has high bonding strength and strong thermal conductivity, thereby improving the reliability of the designed semiconductor refrigeration device.
[0014] In an optional embodiment of the first aspect, the semiconductor refrigeration particles may include semiconductor refrigeration particles made of any one of Bi2Te3, PbTe, Mg3(Sb,Bi)2, SnTe, and GeTe.
[0015] In an optional implementation of the first aspect, the channel includes a plurality of sub-channels, and the plurality of sub-channels are sequentially connected end to end to form a zigzag channel.
[0016] In the above embodiment, the channel is designed to be a zigzag channel, so that the area of the cooling liquid flowing under the first outer surface of the substrate is wider, thereby further accelerating the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit.
[0017] In an optional embodiment of the first aspect, the channel includes a plurality of mutually parallel linear sub-channels, each of the plurality of linear sub-channels is connected to a channel inlet and a channel outlet, wherein the plurality of linear sub-channels are parallel to the third side of the substrate, and the third side of the substrate is perpendicular to the first side of the substrate.
[0018] In the above-mentioned implementation mode, the present solution designs a plurality of mutually parallel linear sub-channels, which can make the cooling liquid flowing under the first outer surface of the substrate have a wider area, thereby further accelerating the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit.
[0019] In an optional implementation of the first aspect, a heat-conducting metal is provided on the surface opposite to the first surface of the contact plate; the surface opposite to the first surface of the contact plate is used to contact the device to be refrigerated through the heat-conducting metal.
[0020] In the above embodiment, a heat-conducting metal may be disposed on the opposite side of the first surface of the contact plate designed in this solution, so that the contact plate contacts the device to be cooled through the heat-conducting metal, thereby enhancing the packaging bonding strength and thermal conductivity with the device to be cooled.
[0021] In a second aspect, the present application provides a semiconductor refrigeration device, which includes a semiconductor refrigeration device according to any optional embodiment of the first aspect.
[0022] The semiconductor refrigeration equipment designed as above includes the semiconductor refrigeration device of the first aspect. Therefore, the designed semiconductor refrigeration equipment can accelerate the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit by opening a flow channel for circulating the refrigerant liquid in the substrate in contact with the heat release surface of the semiconductor refrigeration unit, thereby improving the energy efficiency of the designed semiconductor refrigeration device and equipment by circulating the refrigerant liquid in the flow channel. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1 A three-dimensional schematic diagram of a semiconductor refrigeration device provided in an embodiment of the present application;
[0025] Figure 2 A schematic diagram of the structure of a substrate provided in an embodiment of the present application;
[0026] Figure 3 A cross-sectional schematic diagram of a semiconductor refrigeration device provided in an embodiment of the present application;
[0027] Figure 4 A connection diagram of a semiconductor refrigeration unit provided in an embodiment of the present application;
[0028] Figure 5 A schematic diagram of the structure of a semiconductor refrigeration device provided in an embodiment of the present application.
[0029] Icon: 1-semiconductor refrigeration device; 10-substrate; 110-channel entrance; 120-channel exit; 130-channel; 1310-sub-channel; 20-semiconductor refrigeration unit; 210-semiconductor refrigeration particles; 2110-N-type semiconductor; 2120-P-type semiconductor; 30-contact plate; 40-first metal connection wiring; 50-second metal connection wiring. DETAILED DESCRIPTION
[0030] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.
[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.
[0032] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.
[0033] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0034] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.
[0035] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).
[0036] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.
[0037] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0038] As a commonly used temperature controller, thermoelectric cooler has the advantages of fast response and high precision, and is also widely used in optoelectronic chip packaging.
[0039] In traditional optoelectronic microsystem packaging, the thermoelectric cooler is a discrete rectangular module containing a large number of cooling particles. Thermoelectric coolers generally include a heating surface and a cooling surface. When used, the chip that needs temperature control is attached to the cooling surface, and then the thermoelectric cooler is mounted on the packaging substrate. The thermoelectric cooler fixed on the substrate is in contact with the packaging heat-conducting shell through thermal conductive adhesive for heat conduction. Finally, the shell quickly removes heat through natural convection, air cooling or liquid cooling equipment.
[0040] Currently, this type of thermoelectric cooler and the heat sink outside the package tube shell will experience a long heat transfer distance, and contain various low thermal conductivity interface materials, so the heat cannot be discharged in time, thereby reducing the energy efficiency of the thermoelectric cooler.
[0041] Based on the above problems, the present application designs a semiconductor refrigeration device and equipment, by opening a flow channel for circulating refrigerant liquid in a substrate in contact with the heat release surface of the semiconductor refrigeration unit, so that the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit is accelerated by the circulation of refrigerant liquid in the flow channel, thereby improving the energy efficiency of the designed semiconductor refrigeration device and equipment. In addition, the refrigeration particles and microchannels of the semiconductor refrigeration unit designed in this scheme are separated by only one layout of the substrate, thereby significantly reducing the heat transfer distance, reducing thermal resistance, and improving the temperature control response speed of the semiconductor refrigeration device.
[0042] Based on the above ideas, the present application first provides a semiconductor refrigeration device, such as Figure 1 As shown, the semiconductor refrigeration device may include a substrate 10, a semiconductor refrigeration unit 20 and a contact plate 30. The first end of the semiconductor refrigeration unit 20 is connected to the first outer surface of the substrate 10, and the opposite end of the first end of the semiconductor refrigeration unit 20 is connected to the first surface of the contact plate 30, that is, the semiconductor refrigeration unit 20 is arranged between the substrate 10 and the contact plate 30. Among them, the opposite surface of the first surface of the contact plate 30 is used to contact the device to be refrigerated. For example, the device to be refrigerated can be attached to the opposite surface of the first surface of the contact plate 30, so as to achieve heat exchange refrigeration of the device to be refrigerated. The device to be refrigerated may specifically include a chip, a controller, a CPU, and other devices and equipment that require refrigeration.
[0043] Please continue to refer to Figure 1 The first side of the substrate 10 designed in the present application is provided with a channel inlet 110, the second side of the substrate 10 is provided with a channel outlet 120, and a channel 130 connecting the channel inlet 110 and the channel outlet 120 is provided in the substrate 10, wherein the channel 130 is used to circulate the refrigerant liquid, and the first side and the second side of the substrate 10 represent sides perpendicular to the first outer surface of the substrate 10.
[0044] The semiconductor refrigeration device of the above design can supply power to the semiconductor refrigeration unit 20 when in use. When the semiconductor refrigeration unit 20 is electrically modulated, its first end releases heat, that is, the first outer surface of the substrate 10 has high heat. In this case, the present solution circulates the refrigerant liquid through the channel 130 arranged in the substrate 10, thereby accelerating the heat dissipation efficiency of the heat-releasing surface of the semiconductor refrigeration unit by circulating the refrigerant liquid in the flow channel, thereby improving the energy efficiency of the designed semiconductor refrigeration device and equipment; the opposite end of the first end of the semiconductor refrigeration unit 20 absorbs heat to cool the contact plate 30, and then the contact plate 30 cools the device to be refrigerated to achieve the refrigeration function.
[0045] The semiconductor refrigeration device designed as above, this scheme opens a flow channel for circulating the refrigerant liquid in the substrate that contacts the heat release surface of the semiconductor refrigeration unit, thereby accelerating the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit by circulating the refrigerant liquid in the flow channel, thereby improving the energy efficiency of the designed semiconductor refrigeration device and equipment.
[0046] In an optional implementation manner of this embodiment, the channel 130 for circulating the refrigerant liquid designed in this solution can have various forms. As a possible implementation manner, Figure 2 As shown, the channel 130 designed in this scheme may include a plurality of sub-channels 1310, and the plurality of sub-channels 1310 are connected end to end in sequence to form a zigzag channel. In this way, the zigzag channel allows a wider area of refrigeration liquid flowing under the first outer surface of the substrate 10, thereby further accelerating the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit.
[0047] In an optional implementation of the present embodiment, as another possible implementation, the channel 130 designed in the present scheme may include a plurality of mutually parallel linear sub-channels (not shown in the figure), each of the plurality of linear sub-channels is connected to the channel inlet 110 and the channel outlet 120, the plurality of linear sub-channels are parallel to the third side surface of the substrate 10, and the third side surface of the substrate 10 is perpendicular to the first side surface of the substrate 10.
[0048] In the implementation mode of the above-mentioned design, the refrigerant liquid can be divided into various mutually parallel linear sub-channels after entering from the channel inlet 110, and then flow out through a plurality of mutually parallel linear sub-channels into the channel outlet 120. The plurality of mutually parallel linear sub-channels can make the area of the refrigerant liquid flowing under the first outer surface of the substrate 10 wider, thereby further accelerating the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit.
[0049] It should be noted here that the above-mentioned channel structure is only used as an example of this solution, and its structure can be a channel of any structural form, and this solution does not specifically limit it.
[0050] In addition, the substrate 10 designed in this solution can be directly fired into a ceramic shell structure with a specific structure having a channel inlet 110, a channel outlet 120 and a channel 130 by using a ceramic material, or can be prepared into a ceramic shell structure with a channel inlet 110, a channel outlet 120 and a channel 130 by a ceramic substrate multilayer stacking process. Specifically, the substrate 10 can be a substrate made of aluminum nitride or other non-conductive and heat-conductive materials.
[0051] In an optional implementation of this embodiment, if Figure 3 As shown, the semiconductor refrigeration unit 20 designed in this scheme may include a plurality of semiconductor refrigeration particles 210, the first ends of the plurality of semiconductor refrigeration particles 210 are all connected to the first outer surface of the substrate 10, and the opposite ends of the first ends of the plurality of semiconductor refrigeration particles 210 are all connected to the first surface of the contact plate 30.
[0052] Specifically, Figure 4 As shown, the plurality of semiconductor cooling particles 210 may include a plurality of N-type semiconductors 2110 and a plurality of P-type semiconductors 2120 , the N-type semiconductors 2110 and the P-type semiconductors 2120 are alternately arranged, and the alternately arranged plurality of N-type semiconductors 2110 and P-type semiconductors 2120 form a series connection.
[0053] In the implementation of the above design, the N-type semiconductor 2110 represents a semiconductor obtained by doping a semiconductor with a donor impurity, wherein free electrons are majority carriers and holes are minority carriers, and the free electrons are mainly used for conducting electricity. The P-type semiconductor 2120 represents a semiconductor obtained by doping a semiconductor with an acceptor impurity, wherein holes are majority carriers and free electrons are minority carriers, and the free electrons are mainly used for conducting electricity.
[0054] The semiconductor refrigeration unit designed as above, in this scheme, is arranged alternately by N-type semiconductors and P-type semiconductors, and a plurality of N-type semiconductors 2110 and P-type semiconductors 2120 are connected in series, thereby ensuring that when all semiconductors are conductive, the same side thereof exhibits heat generation or heat absorption, that is, the first end thereof exhibits heat release, and the opposite end thereof exhibits heat absorption, thereby achieving refrigeration.
[0055] In an optional implementation of this embodiment, in order to realize the series connection of multiple N-type semiconductors 2110 and multiple P-type semiconductors 2120, please continue to refer to Figure 4This design scheme can design a first metal connection wiring 40 and a second metal connection wiring 50. The first metal connection wiring 40 can be set on the first outer surface of the substrate 10, and the second metal connection wiring 50 can be set on the first surface of the contact plate 30. The first ends of multiple N-type semiconductors 2110 and multiple P-type semiconductors 2120 are all electrically connected to the first metal connection wiring 40, and the opposite ends of the first ends of multiple N-type semiconductors 2110 and multiple P-type semiconductors 2120 are all electrically connected to the second metal connection wiring 50, thereby forming a series connection.
[0056] Each semiconductor may be connected to the metal connection wiring by soldering. In addition, the metal connection wiring may be soldered to the first outer surface of the substrate 10 and the first surface of the contact plate 30 by soldering. Specifically, the soldering may be electrically connected by SMT solder paste soldering or other component soldering. The first metal connection wiring 40 and the second metal connection wiring 50 may be made of any high-conductivity metal material, such as gold, silver, copper, aluminum, etc.
[0057] In the above-mentioned embodiment, the present scheme arranges the first metal connection wiring 40 on the first outer surface of the substrate 10, and arranges the second metal connection wiring 50 on the first surface of the contact plate 30, thereby making the structure more compact and miniaturized. In addition, the present scheme adopts SMT solder paste welding method between the cooling particles and the metal connection wiring, which has high bonding strength and strong thermal conductivity, thereby improving the reliability of the designed semiconductor refrigeration device.
[0058] In an optional implementation manner of this embodiment, the semiconductor refrigeration particles designed in this scheme may include semiconductor refrigeration particles made of any one of Bi2Te3, PbTe, Mg3(Sb,Bi)2, SnTe, and GeTe, wherein both N-type semiconductors and P-type semiconductors may be made of any of the above materials, except that the impurities doped in the N-type semiconductors and the P-type semiconductors are different. An N-type semiconductor can be obtained by doping a semiconductor with donor impurities, and a P-type semiconductor can be obtained by doping a semiconductor with acceptor impurities.
[0059] In an optional implementation manner of the present embodiment, the contact plate 30 designed in the present scheme may specifically be made of ceramic material, and specifically may be made of aluminum nitride. In addition, a heat-conducting metal may be provided on the opposite surface of the first surface of the contact plate 30 designed in the present scheme, so that the contact plate 30 is in contact with the device to be refrigerated through the heat-conducting metal, thereby enhancing the packaging bonding strength and thermal conductivity with the device to be refrigerated.
[0060] The present application also provides a semiconductor refrigeration device, such as Figure 5 As shown, the semiconductor refrigeration equipment includes a semiconductor refrigeration device 1 of any optional embodiment described above.
[0061] The semiconductor refrigeration equipment designed as above includes the semiconductor refrigeration device described above. Therefore, the designed semiconductor refrigeration equipment can accelerate the heat dissipation efficiency of the heat release surface of the semiconductor refrigeration unit by opening a flow channel for circulating the refrigerant liquid in the substrate in contact with the heat release surface of the semiconductor refrigeration unit, thereby improving the energy efficiency of the designed semiconductor refrigeration device and equipment by circulating the refrigerant liquid in the flow channel.
[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.
Claims
1. A semiconductor refrigeration device, characterized in that: The semiconductor refrigeration device comprises: a substrate, a semiconductor refrigeration unit and a contact plate; The first end of the semiconductor refrigeration unit is connected to the first outer surface of the substrate, and the opposite end of the first end of the semiconductor refrigeration unit is connected to the first surface of the contact plate; the opposite surface of the first surface of the contact plate is used to contact the device to be refrigerated; A channel inlet is provided on the first side of the substrate, a channel outlet is provided on the second side of the substrate, and a channel connecting the channel inlet and the channel outlet is provided in the substrate; wherein the channel is used to circulate cooling liquid, and the first side and the second side of the substrate are both perpendicular to the first outer surface of the substrate; The semiconductor refrigeration unit is configured to release heat from the first end and absorb heat from an end opposite to the first end under electrical modulation.
2. The semiconductor refrigeration device according to claim 1, characterized in that: The semiconductor refrigeration unit includes a plurality of semiconductor refrigeration particles, the first ends of the plurality of semiconductor refrigeration particles are connected to the first outer surface of the substrate, and the opposite ends of the first ends of the plurality of semiconductor refrigeration particles are connected to the first surface of the contact plate.
3. The semiconductor refrigeration device according to claim 2, characterized in that: The plurality of semiconductor refrigeration particles include a plurality of N-type semiconductors and a plurality of P-type semiconductors; The N-type semiconductors and the P-type semiconductors are arranged alternately and spaced apart, and the plurality of N-type semiconductors and the P-type semiconductors arranged alternately form a series connection.
4. The semiconductor refrigeration device according to claim 3, characterized in that: The first outer surface of the substrate is provided with a first metal connection wiring, and the first surface of the contact plate is provided with a second metal connection wiring; The first ends of the multiple N-type semiconductors and the multiple P-type semiconductors are electrically connected to the first metal connection wiring, and the opposite ends of the first ends of the multiple N-type semiconductors and the multiple P-type semiconductors are electrically connected to the second metal connection wiring to form the series connection.
5. The semiconductor refrigeration device according to claim 4, characterized in that: The first ends of the multiple N-type semiconductors and the multiple P-type semiconductors are electrically connected to the first metal connection wiring through solder; the opposite ends of the first ends of the multiple N-type semiconductors and the multiple P-type semiconductors are electrically connected to the second metal connection wiring through solder.
6. The semiconductor refrigeration device according to claim 2, characterized in that: The semiconductor refrigeration particles may include semiconductor refrigeration particles made of any one of Bi2Te3, PbTe, Mg3(Sb,Bi)2, SnTe, and GeTe.
7. The semiconductor refrigeration device according to claim 1, characterized in that: The channel includes a plurality of sub-channels, and the plurality of sub-channels are sequentially connected end to end to form a zigzag channel.
8. The semiconductor refrigeration device according to claim 1, characterized in that: The channel includes a plurality of mutually parallel linear sub-channels, each of the plurality of linear sub-channels is connected to the channel inlet and the channel outlet, wherein the plurality of linear sub-channels are parallel to the third side surface of the substrate, and the third side surface of the substrate is perpendicular to the first side surface of the substrate.
9. The semiconductor refrigeration device according to claim 1, characterized in that: A heat-conducting metal is arranged on the surface opposite to the first surface of the contact plate; the surface opposite to the first surface of the contact plate is used to contact the device to be refrigerated through the heat-conducting metal.
10. A semiconductor refrigeration device, characterized in that: The semiconductor refrigeration equipment comprises the semiconductor refrigeration device according to any one of claims 1-9.