Ceramic chip packaging structure and nitrogen oxygen sensor

Abstract

The utility model relates to a ceramic chip packaging structure and a nitrogen oxygen sensor, the ceramic chip packaging structure comprises a packaging sleeve, a supporting ceramic block is coaxially arranged in the packaging sleeve, a press-fitting ceramic block is coaxially arranged at the position of a sleeve opening of the packaging sleeve, and the supporting ceramic block and the press-fitting ceramic block are coaxially arranged at the position of the sleeve opening of the packaging sleeve. The ceramic chip is fixed in the supporting ceramic block and the press-fitting ceramic block in a penetrating manner, and a filling medium is filled between the supporting ceramic block and the press-fitting ceramic block; the end face, close to the filling medium, of the supporting ceramic block is provided with a first chamfer used for releasing axial pressure. According to the utility model, through the optimization of the structure, the reliability and stability of ceramic chip packaging are improved, and the improvement of the packaging airtightness of the nitrogen-oxygen sensor is realized.

Description

Technical Field

[0001] The utility model relates to the field of nitrogen oxygen sensor design, in particular to a ceramic chip packaging structure and a nitrogen oxygen sensor. Background Art

[0002] At present, the ceramic chip packaging of nitrogen oxide sensors usually adopts the process and structure of combining ceramic blocks with talcum powder (coating powder), in which the ceramic block is usually designed in a cylindrical shape. Talc is used to fill the gap between the ceramic block and the carrier to achieve the effect of fixing and sealing, while the ceramic block is matched with talcum powder by axial compression to complete the chip packaging.

[0003] The design of this cylindrical ceramic block mainly concentrates the force in the axial direction when crushing the powder, which can easily cause the chip to break due to uneven force during assembly. At the same time, the radial force on the chip is small, resulting in insufficient pull-off force, which may cause it to loosen or even break during use. In addition, since there is a gap between the ceramic block and the carrier, it is difficult for the cylindrical ceramic block to allow talcum powder to completely fill these gaps, which affects the airtightness and does not meet the requirements of sealing performance. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a ceramic chip packaging structure and a nitrogen oxide sensor, which improves the reliability and stability of the ceramic chip packaging and achieves improvement in airtightness through structural optimization.

[0005] In the first aspect, the utility model provides a ceramic chip, which adopts the following technical solution:

[0006] A ceramic chip packaging structure comprises a packaging sleeve, wherein a supporting ceramic block is coaxially arranged in the packaging sleeve, a press-fit ceramic block is coaxially arranged at the sleeve opening of the packaging sleeve, the ceramic chip is inserted and fixed in the supporting ceramic block and the press-fit ceramic block, and a filling medium is also filled between the supporting ceramic block and the press-fit ceramic block;

[0007] Wherein, the end surface of the supporting ceramic block close to the filling medium is provided with a first chamfer for releasing axial pressure.

[0008] In a possible implementation manner of the present invention, the end surface of the supporting ceramic block away from the filling medium is provided with a second chamfer for dispersing stress to the packaging sleeve and maintaining coaxiality with the packaging sleeve.

[0009] In a possible implementation of the utility model, the packaging structure further includes a pressure-equalizing ceramic block coaxially disposed in the packaging sleeve for uniformly applying force to the filling medium, and the pressure-equalizing ceramic block is disposed between the supporting ceramic block and the press-fit ceramic block.

[0010] In a possible implementation manner of the present invention, both end surfaces of the pressure-equalizing ceramic block are configured as arc surfaces.

[0011] In a possible implementation manner of the present utility model, the arc surface is an outward convex surface.

[0012] In a possible implementation manner of the present invention, the length of the press-fit ceramic block is greater than the length of the supporting ceramic block, and the length of the press-fit ceramic block is greater than the length of the equalizing ceramic block.

[0013] In a possible implementation manner of the present invention, the end surface of the press-fitted ceramic block close to the filling medium is configured as a curved surface.

[0014] In a possible implementation manner of the present invention, the end surface of the press-fit ceramic block away from the filling medium is configured as a plane.

[0015] In a possible implementation manner of the present invention, the opening angles of the first chamfer and the second chamfer are both set to 45°.

[0016] In the second aspect, the utility model provides a nitrogen oxygen sensor, which adopts the following technical solution:

[0017] A nitrogen oxygen sensor, the nitrogen oxygen sensor at least comprising the ceramic chip packaging structure as described in any one of the first aspects above.

[0018] In summary, compared with the prior art, the present invention has at least one of the following beneficial technical effects:

[0019] The ceramic chip packaging structure described in the utility model can effectively release stress during packaging by designing a first chamfer on the end surface of the supporting ceramic block close to the filling medium, avoiding direct action on the chip and causing damage; at the same time, the chamfer structure helps to guide the filling medium to be more evenly distributed in the gap between the supporting ceramic block and the press-fit ceramic block, thereby improving the sealing and stability of the packaging. In addition, the design optimizes the release and dispersion of axial pressure, thereby enhancing the radial force of the chip during the packaging process, thereby improving the pull-off force and vibration resistance of the chip, and significantly improving the reliability and service life of the packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 It is a cross-sectional view of a specific embodiment of a ceramic chip packaging structure of the utility model.

[0022] Figure 2 The utility model discloses a force conduction diagram of a ceramic chip packaging structure during packaging.

[0023] Description of reference numerals:

[0024] 1. Ceramic chip; 2. Packaging sleeve; 3. Supporting ceramic block; 4. Press-fitting ceramic block; 5. Filling medium; 6. First chamfer; 7. Second chamfer; 8. Pressure-equalizing ceramic block. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application.

[0026] It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments of the present application. In addition, in the following embodiments, the description of each embodiment has its own emphasis, and for parts not described in detail in one embodiment, reference can be made to the relevant description of other embodiments.

[0027] The method steps described in the embodiments of the present invention may be executed in the order described in the specific implementation manner, or the execution order of each step may be adjusted according to actual needs on the premise of being able to solve technical problems, which will not be listed here one by one.

[0028] Reference Figure 1 A ceramic chip packaging structure described in an embodiment of the utility model includes a packaging sleeve 2, a supporting ceramic block 3 is coaxially arranged inside the packaging sleeve 2, a press-fit ceramic block 4 is coaxially arranged at the barrel mouth of the packaging sleeve 2, the ceramic chip 1 is penetrated and fixed in the supporting ceramic block 3 and the press-fit ceramic block 4, and a filling medium 5 is also filled between the supporting ceramic block 3 and the press-fit ceramic block 4.

[0029] Specifically, the packaging sleeve 2 is a shell component of the ceramic chip packaging structure, which is mainly used to provide mechanical support and protection for the overall packaging. The packaging sleeve 2 is usually coaxially designed to accommodate components such as the supporting ceramic block 3, the press-fit ceramic block 4 and the ceramic chip 1 to ensure the precise alignment of the positions of the components.

[0030] In some embodiments, the packaging sleeve 2 may be in the shape of a cylinder, a square column, or other polygonal cross-section structures suitable for packaging to meet the requirements of different chip shapes.

[0031] In some embodiments, the packaging sleeve 2 may be made of metal, ceramic or high-strength plastic, wherein a metal sleeve such as aluminum alloy or stainless steel has high mechanical strength and thermal conductivity, and a ceramic sleeve can provide good insulation performance and high temperature resistance.

[0032] In some embodiments, the inner surface of the packaging sleeve 2 can be designed to be a smooth surface, a grooved surface, or coated with a wear-resistant coating to enhance the positioning stability of the supporting ceramic block 3.

[0033] In some embodiments, the outer surface of the packaging sleeve 2 may also be designed to have a structure with heat dissipation fins, mounting holes or connection interfaces to meet the multifunctional requirements of heat dissipation, fixing or electrical connection.

[0034] The supporting ceramic block 3 is precisely machined to ensure that its shape matches the inner wall of the packaging sleeve 2 to achieve coaxial positioning; the supporting ceramic block 3 and the inner wall of the packaging sleeve 2 can be installed by interference fit, elastic snap fit, adhesive fixation or threaded connection to ensure its stability and position accuracy.

[0035] In some embodiments, the material of the supporting ceramic block 3 is selected from high-strength ceramics to provide excellent compression resistance and thermal stability.

[0036] In addition, the size, shape and surface treatment of the supporting ceramic block 3 can be adjusted according to the chip and packaging requirements to ensure that the coaxial setting meets the mechanical strength and airtightness requirements of the package.

[0037] Correspondingly, the specific implementation of the press-fit ceramic block 4 is similar to that of the supporting ceramic block 3, and will not be described in detail herein.

[0038] The supporting ceramic block 3 and the press-fit ceramic block 4 are provided with through holes or grooves matching the size of the ceramic chip 1 at the axial positions to ensure that the chip can be accurately inserted. The ceramic chip 1 is fixed between the two ceramic blocks by a filling medium 5 (such as high-strength powder). The press-fit ceramic block 4 further compacts the filling medium 5 by axial compression to enhance the pull-off force of the chip and the mechanical stability of the overall structure.

[0039] In addition, in some embodiments, the ceramic chip 1 may be coated with a buffer layer or an insulating coating to avoid damage caused by direct contact during the fixing process, and a directional mark of the chip may be designed as required to ensure the accuracy of installation.

[0040] The filling medium 5 described in the embodiment of the utility model can be made of high-strength powder. In some other embodiments, the filling medium 5 can also be made of epoxy resin, silicone, ceramic powder or metal powder. The specific filling medium 5 can be adjusted according to the application scenario. For example, high-strength powder can be used to improve the pull-off force and compression resistance, while epoxy resin or silicone can provide higher sealing and shock resistance.

[0041] The filling medium 5 may be filled by direct filling, injection filling or vacuum-assisted filling to ensure that the filling material can completely cover the gap between the supporting ceramic block 3 and the press-fitting ceramic block 4 .

[0042] Furthermore, as an embodiment of the present invention, the end surface of the supporting ceramic block 3 close to the filling medium 5 is provided with a first chamfer 6 for releasing axial pressure.

[0043] Specifically, the first chamfer 6 is located adjacent to the contact area of ​​the filling medium 5. This structure guides the filling medium 5 to distribute to the surrounding gaps when subjected to axial pressure, while converting part of the axial pressure into radial pressure to avoid direct action on the chip and prevent damage.

[0044] By providing the first chamfer 6 on the supporting ceramic block 3, the axial stress of the filling medium 5 can be released to protect the integrity of the chip. At the same time, during the packaging process, the filling medium 5 is guided to evenly fill the gap between the supporting ceramic block 3 and the packaging sleeve 2, thereby improving the air tightness and sealing performance of the packaging, and then by optimizing the pressure distribution, the pull-off force and anti-seismic performance of the ceramic chip 1 are increased, thereby significantly improving the stability and reliability of the packaging structure.

[0045] Furthermore, as an embodiment of the present invention, the end surface of the supporting ceramic block 3 away from the filling medium 5 is provided with a second chamfer 7 for dispersing stress to the packaging sleeve 2 and maintaining coaxiality with the packaging sleeve 2 .

[0046] Specifically, the second chamfer 7 is located at the end face of the supporting ceramic block 3 away from the filling medium 5, and cooperates with the inner wall of the packaging sleeve 2 to form a force conduction path. The chamfer structure can effectively disperse the stress to the inner wall of the packaging sleeve 2 when the ceramic block is subjected to axial compression, thereby avoiding concentrated stress from damaging the ceramic chip 1 or other components; at the same time, the chamfer design also enhances the coaxial positioning of the supporting ceramic block 3 in the packaging sleeve 2 through geometric constraints, ensuring that the supporting ceramic block 3 maintains an accurate position during the packaging process.

[0047] Furthermore, the opening angles of the first chamfer 6 and the second chamfer 7 are both set to 45°.

[0048] Specifically, the design of setting the opening angle of the first chamfer 6 and the second chamfer 7 to 45° is mainly aimed at optimizing and balancing the mechanical properties during the packaging process. Specifically, the 45° angle is a universal and proven mechanical design angle that can effectively disperse the axial pressure and avoid concentrated stress from damaging the ceramic chip 1 or each ceramic block.

[0049] The first chamfer 6 is located at the end face of the supporting ceramic block 3 close to the filling medium 5. This angle guides the filling medium 5 to be evenly distributed, and at the same time partially converts the axial force into radial force, thereby improving the pull-off force of the ceramic chip 1 and the sealing performance of the package; the second chamfer 7 is located at the end face away from the filling medium 5, and disperses the extrusion force to the inner wall of the packaging sleeve 2 at a 45° angle, thereby enhancing the coaxial positioning stability of the ceramic block. The consistent design of the two chamfers ensures the rationality of the force distribution and conduction path, further improving the reliability and overall mechanical performance of the packaging structure.

[0050] Furthermore, as an embodiment of the present utility model, the ceramic chip packaging structure also includes a pressure-equalizing ceramic block 8 coaxially arranged in the packaging sleeve 2 for uniformly applying force to the filling medium 5, and the pressure-equalizing ceramic block 8 is arranged between the supporting ceramic block 3 and the pressed ceramic block 4.

[0051] Correspondingly, the specific implementation of the pressure-equalizing ceramic block 8 is similar to that of the supporting ceramic block 3 , which will not be described in detail herein.

[0052] Providing the equalizing ceramic block 8 between the supporting ceramic block 3 and the pressed ceramic block 4 can optimize the force distribution of the filling medium 5, thereby further improving the sealing of the package, increasing the pull-off force of the ceramic chip 1, dispersing external impact force, and enhancing the vibration resistance of the entire packaging system, thereby providing the ceramic chip 1 with more reliable mechanical protection and long-term use stability.

[0053] Furthermore, as an implementation mode of the present invention, both end surfaces of the pressure-equalizing ceramic block 8 are configured as arc surfaces.

[0054] Specifically, the arc design at both ends of the pressure-equalizing ceramic block 8 can guide the filling medium 5 to diffuse evenly from the axis to the outside during the extrusion process, ensuring that the filling medium 5 is evenly distributed around the supporting ceramic block 3, the press-fitting ceramic block 4 and the chip, reducing the gaps or local stress concentration caused by uneven force. At the same time, the arc design can also guide the debris generated during the extrusion process to be discharged outward to avoid damage to the ceramic chip 1.

[0055] Furthermore, as an implementation mode of the present utility model, the arc surface is an outward convex surface.

[0056] Specifically, the arc surface is designed as an outward convex surface, and its shape can be formed into a smooth arc through precision processing technology, presenting a curved structure protruding outward. Figure 2 As shown, the oblique arrow in the figure is the force direction of the filling medium 5, and the design of the convex surface can optimize the force effect: during the extrusion process, the convex surface can guide the filling medium 5 to diffuse evenly from the axis to the outside, thereby effectively avoiding material breakage or uneven distribution caused by force concentration. In addition, the convex surface can change the discharge direction of the debris of the filling medium 5, and guide it outward from the center of the package to avoid the accumulation of debris around the ceramic chip 1 or other key components and causing damage. The effect of this design not only improves the uniformity and sealing of the filling process, but also further improves the stability and reliability of the packaging structure by improving pressure distribution and debris management.

[0057] Furthermore, as an embodiment of the present invention, the length of the press-fit ceramic block 4 is greater than the length of the supporting ceramic block 3 , and the length of the press-fit ceramic block 4 is greater than the length of the equalizing ceramic block 8 .

[0058] Specifically, the design that the length of the press-fit ceramic block 4 is greater than the length of the supporting ceramic block 3 and the isostatic ceramic block 8 is mainly intended to provide stronger structural stability and material constraint effect during the packaging process. In some embodiments, the length of the press-fit ceramic block 4 may be more than twice that of the supporting ceramic block 3 and / or the isostatic ceramic block 8.

[0059] Specifically, the greater length of the pressed ceramic block 4 enables it to cover a longer axial range in the packaging sleeve 2, thereby effectively preventing the filling medium 5 from leaking through the central channel or edge gaps during the extrusion process, thereby ensuring the integrity of the filling process.

[0060] At the same time, the longer press-fit ceramic block 4 can also provide a larger contact area to disperse the extrusion force, avoid excessive concentration on the supporting ceramic block 3 and the equalizing ceramic block 8, and protect the ceramic chip 1 from damage.

[0061] This design can improve the overall mechanical strength of the package, enhance the sealing and uniformity of the filling medium 5, and improve the stability and shock resistance of the ceramic chip 1 in the packaging structure, thereby improving the reliability and service life of the packaging system.

[0062] Furthermore, as an embodiment of the present invention, the end surface of the press-fitted ceramic block 4 close to the filling medium 5 is set to be a curved surface.

[0063] Correspondingly, the effect of the arc surface setting of the end surface of the press-fitted ceramic block 4 is similar to the arc surface setting of the end surface of the equalizing pressure ceramic block 8 described in the above embodiment, and will not be repeated here.

[0064] Further, as an embodiment of the present invention, the end surface of the press-fitted ceramic block 4 away from the filling medium 5 is set to be a plane.

[0065] Specifically, the plane of the outer end surface of the press-fit ceramic block 4 is set to form an area that can form a good contact with the force-applying device (such as a pressure head) to avoid uneven force distribution or deviation caused by an irregular surface. Figure 2 As shown, the vertical arrow in the figure is the axial force direction of the press-fit ceramic block 4. The plane design can also effectively transmit the axial pressure, so that the ceramic block moves stably along the axial direction, thereby ensuring the uniform distribution of the filling medium 5 between the supporting ceramic block 3 and the equalizing ceramic block 8.

[0066] In addition, the flat structure of the pressed ceramic block 4 is easier to process and calibrate than a curved surface or other complex shapes, further improving the accuracy of installation and packaging. Through this design, it is possible to effectively control the force during the extrusion process, avoid chip damage or leakage of the filling medium 5, and improve the sealing, stability and overall reliability of the packaging system.

[0067] The embodiment of the utility model further discloses a nitrogen oxygen sensor, which at least includes a ceramic chip packaging structure as described in any of the above embodiments.

[0068] Specifically, the ceramic chip packaging structure described in any of the above embodiments can provide excellent mechanical protection and airtight packaging for the key chip in the nitrogen oxygen sensor, ensuring its stable operation under high temperature, high pressure and harsh environment. The supporting ceramic block 3 and the press-fit ceramic block 4 fix the chip position through precise matching, and at the same time use the equalizing ceramic block 8 to evenly distribute the force of the filling medium 5 to avoid uneven force on the chip or malfunction caused by incomplete filling. In addition, the structure releases stress, disperses external force, and improves the sealing effect of the filling medium 5 through chamfer design, thereby effectively improving the sensor's shock resistance, pull-off force and stability for long-term use. This integrated design further enhances the accuracy and durability of nitrogen oxygen sensors in the fields of automobile exhaust treatment, industrial emission monitoring, etc.

[0069] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A ceramic chip packaging structure, characterized in that: It comprises a packaging sleeve, a supporting ceramic block is coaxially arranged in the packaging sleeve, a press-fit ceramic block is coaxially arranged at the barrel mouth of the packaging sleeve, the ceramic chip is inserted and fixed in the supporting ceramic block and the press-fit ceramic block, and a filling medium is also filled between the supporting ceramic block and the press-fit ceramic block; Wherein, the end surface of the supporting ceramic block close to the filling medium is provided with a first chamfer for releasing axial pressure.

2. The ceramic chip packaging structure according to claim 1, characterized in that: The end surface of the supporting ceramic block away from the filling medium is provided with a second chamfer for dispersing stress to the packaging sleeve and maintaining coaxiality with the packaging sleeve.

3. The ceramic chip packaging structure according to claim 1, characterized in that: It also includes a pressure-equalizing ceramic block coaxially disposed in the packaging sleeve for evenly applying force to the filling medium, wherein the pressure-equalizing ceramic block is disposed between the supporting ceramic block and the press-fitting ceramic block.

4. The ceramic chip packaging structure according to claim 3, characterized in that: The two end surfaces of the pressure-equalizing ceramic block are configured as arc surfaces.

5. The ceramic chip packaging structure according to claim 4, characterized in that: The arc surface is an outwardly convex curved surface.

6. The ceramic chip packaging structure according to claim 3, characterized in that: The length of the press-fit ceramic block is greater than the length of the supporting ceramic block, and the length of the press-fit ceramic block is greater than the length of the equalizing ceramic block.

7. The ceramic chip packaging structure according to claim 1, characterized in that: The end surface of the press-fit ceramic block close to the filling medium is configured as a curved surface.

8. The ceramic chip packaging structure according to claim 1, characterized in that: The end surface of the press-packed ceramic block away from the filling medium is arranged to be a plane.

9. The ceramic chip packaging structure according to claim 2, characterized in that: The opening angles of the first chamfer and the second chamfer are both set to 45°.

10. A nitrogen oxygen sensor, characterized in that: The nitrogen oxygen sensor at least includes the ceramic chip packaging structure as described in any one of claims 1-9.

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