Full-automatic single-chip cleaning machine

Abstract

The utility model relates to a full-automatic single-wafer cleaning machine, which aims to solve the technical problem that when a wafer is placed in ultrasonic cleaning equipment to be cleaned at present, the shielding area of a traditional wafer box on the wafer is too large, and the cleaning efficiency and effect of the wafer are affected. The bearing assembly comprises bearing boxes which are symmetrically arranged, limiting parts which are used for bearing and limiting the wafer body are arranged on the inner walls of the bearing boxes, and the limiting parts comprise limiting blocks which are connected to the inner walls of the bearing boxes. The outer surface of the limiting block is symmetrically provided with arc-shaped protruding parts used for limiting the two sides of the wafer body, the arc-shaped protruding parts are of arc-shaped block structures with the surfaces being curved surfaces, the center of the outer surface of the limiting block is provided with a V-shaped exposing groove penetrating through the arc-shaped protruding parts, and the V-shaped exposing groove is of a V-shaped groove body structure. The wafer cleaning device has the advantages that the shielding area is reduced, and the double-sided cleaning efficiency and effect of the wafer body are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a full-automatic single-wafer cleaning machine. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] Currently, wafers can be formed after grinding, polishing and slicing silicon crystal rods. However, impurities will remain on the surface of the wafer at this time, and it needs to be cleaned by a wafer cleaning machine. Most wafer cleaning machines are ultrasonic cleaning equipment. The wafers are generally placed in a wafer box before cleaning, and then the wafer box is placed in the ultrasonic cleaning equipment for cleaning. In order to ensure the stable placement of the wafer box, the wafer box is usually installed in a detachable manner inside the ultrasonic cleaning equipment. At present, when the wafer box is loaded with wafers and placed in the ultrasonic cleaning equipment for cleaning, the traditional wafer box has too large a blocking area for the wafer, so it is easy to affect the cleaning efficiency and effect of the wafer. In view of this, we propose a fully automatic single-wafer cleaning machine. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art, meet actual needs, and provide a fully automatic single-wafer cleaning machine to solve the technical problem that when the current wafer is placed in an ultrasonic cleaning device for cleaning, the traditional wafer box has a large shielding area for the wafer, which affects the cleaning efficiency and effect of the wafer.

[0005] In order to achieve the purpose of the utility model, the technical solution adopted by the utility model is: designing a fully automatic single-wafer cleaning machine, including a supporting component in which a wafer body is detachably placed;

[0006] The supporting assembly comprises a symmetrically arranged supporting box, and a limiting component for supporting and limiting the wafer body is arranged on the inner wall of the supporting box;

[0007] The limiting component includes a limiting block connected to the inner wall of the supporting box, the outer surface of the limiting block is symmetrically structured with arc-shaped protrusions for limiting the wafer body on both sides, the arc-shaped protrusions are in the form of an arc-shaped block structure with a curved surface, a V-shaped exposure groove is centrally provided on the outer surface of the limiting block and passes through the arc-shaped protrusion, the V-shaped exposure groove is in the form of a V-shaped groove body structure, and the V-shaped exposure groove is used to divide the arc-shaped protrusion into two limiting convex point structures that have a limiting effect on the wafer body and reduce the blocked area.

[0008] Preferably, an arcuate groove is formed on the outer surface of the limit block, the arc-shaped protrusion is arranged on the surface of the arcuate groove and is integrally connected to the limit block, and the end of the V-shaped exposed groove protrudes from the surface of the arcuate groove in the section direction and extends toward the limit block.

[0009] Preferably, the support box is a wrapped plate structure having an arc end and a straight end, and a support plate for providing a support effect is formed at the bottom structure of the arc end of the support box.

[0010] Preferably, a U-shaped connecting plate is provided between the supporting boxes, and both ends of the U-shaped connecting plate are integrally connected to the supporting boxes.

[0011] Preferably, an L-shaped member is provided on one side of the support box, the U-shaped connecting plate is integrally connected to the L-shaped member, and triangular ribs integrally connected to the L-shaped member and the support box are provided on both sides of the upper end surface of the U-shaped connecting plate.

[0012] Preferably, a connecting rod is provided between the L-shaped components, both ends of the connecting rod are integrally connected to the L-shaped components, and hooking grooves are equidistantly provided at the bottom of the outer edge surface of the connecting rod.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] By constructing a limiting component on the inner wall of the supporting box, the limiting component has a smaller blocking area compared to the limiting structure of the traditional wafer box, thereby ensuring the efficiency and effect of ultrasonic wave driving water to clean the wafer body, and an arc groove is formed on the surface of the limiting block, which is conducive to fitting the outer edge surface of the wafer body, thereby improving the limiting stability, and a V-shaped exposure groove is formed on the surface of the arc groove, and the V-shaped exposure groove divides the arc-shaped protruding part into two limiting convex point structures, which is conducive to further reducing the blocking area, and limiting the wafer body from both sides through a multi-point structure, which is conducive to providing a stable limiting effect, and at the same time, the end of the V-shaped exposure groove is designed to be a structure that protrudes from the surface of the arc groove in the direction of the section and extends toward the limiting block, and when the wafer body abuts the arc groove, a gap will be formed at the end of the V-shaped exposure groove, which is conducive to the conduction of ultrasonic waves, thereby improving the efficiency and effect of double-sided cleaning of the wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 For this utility model Figure 1 Schematic diagram of the structure of the wafer body in the split state;

[0017] Figure 3 For this utility model Figure 1 Schematic diagram of the back structure;

[0018] Figure 4 For this utility model Figure 1 A magnified schematic diagram of the structure at center A;

[0019] Figure 5 It is a structural schematic diagram of the limiting component of the utility model.

[0020] In the figure: 1. supporting assembly; 101. supporting box; 102. supporting plate; 103. U-shaped connecting plate; 104. triangular rib plate; 105. L-shaped member; 106. connecting rod; 2. wafer body; 3. limiting component; 301. limiting block; 302. arc groove; 303. arc-shaped protrusion; 304. V-shaped exposure groove. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0022] Example 1: A fully automatic single-chip cleaning machine, see Figure 1 , Figure 2 , Figure 4 and Figure 5 , including a supporting component 1 in which a wafer body 2 is detachably placed, the supporting component 1 includes a symmetrically arranged supporting box 101, the inner wall of the supporting box 101 is structured with a limiting component 3 for supporting and limiting the wafer body 2, the limiting component 3 includes a limiting block 301 structured and connected to the inner wall of the supporting box 101, the outer surface of the limiting block 301 is symmetrically structured with an arc-shaped protrusion 303 for limiting the wafer body 2 on both sides, the arc-shaped protrusion 303 is an arc-shaped block structure with a curved surface, a V-shaped exposure groove 304 penetrating the arc-shaped protrusion 303 is centrally opened on the outer surface of the limiting block 301, the V-shaped exposure groove 304 is a V-shaped groove body structure, and the V-shaped exposure groove 304 is used to divide the arc-shaped protrusion 303 into two limiting convex point structures that have a limiting effect on the wafer body 2 and reduce the shielding area.

[0023] See also Figure 5 An arc groove 302 is formed on the outer surface of the limit block 301, an arc-shaped protrusion 303 is arranged on the surface of the arc groove 302 and is integrally connected to the limit block 301, and the end of the V-shaped exposed groove 304 protrudes from the surface of the arc groove 302 in the section direction and extends toward the limit block 301.

[0024] See also Figure 2 and Figure 3The supporting box 101 is a wrapped plate structure with an arc end and a straight end, and the bottom structure of the arc end of the supporting box 101 is formed with a supporting plate 102 for supporting effect, a U-shaped connecting plate 103 is arranged between the supporting boxes 101, and both ends of the U-shaped connecting plate 103 are integrally connected to the supporting box 101, and one side of the supporting box 101 is arranged with an L-shaped member 105, the U-shaped connecting plate 103 is integrally connected to the L-shaped member 105, and both sides of the upper end surface of the U-shaped connecting plate 103 are provided with triangular ribs 104 integrally connected to the L-shaped member 105 and the supporting box 101, a connecting rod 106 is arranged between the L-shaped members 105, and both ends of the connecting rod 106 are integrally connected to the L-shaped member 105, and the outer edge surface bottom of the connecting rod 106 is equidistantly provided with hooking grooves. The utility model solves the technical problem that when the wafer is placed in the ultrasonic cleaning device for cleaning, the conventional wafer box has too large a shielding area for the wafer, thus affecting the cleaning efficiency and effect of the wafer, by providing the limiting component 3.

[0025] Working principle: When in use, first place the wafer body 2 into the supporting assembly 1, and make the outer edge of the wafer body 2 abut against the arc groove 302 opened on the surface of the limiting block 301, so that a multi-point limiting structure is formed on both sides of the wafer body 2 through the arc-shaped protrusion 303, so as to achieve stable loading of the wafer body 2, and then place the supporting assembly 1 with the wafer body 2 in the ultrasonic cleaning machine, and realize double-sided cleaning of the wafer body 2 by ultrasonic wave. Compared with the limiting structure of the traditional wafer box, the limiting component 3 has a smaller shielding area, so as to ensure that the ultrasonic wave drives the water to clean the wafer body. 2 improves the cleaning efficiency and effect, the V-shaped exposure groove 304 divides the arc-shaped protrusion 303 into two limiting convex point structures, which is beneficial to further reduce the blocked area, and limits the wafer body 2 from both sides through the multi-point structure, which is beneficial to provide a stable limiting effect, and the end of the V-shaped exposure groove 304 is designed to protrude from the surface of the arc surface groove 302 in the section direction and extend toward the limiting block 301. When the wafer body 2 abuts the arc surface groove 302, a gap will be formed at the end of the V-shaped exposure groove 304, which is beneficial to the conduction of ultrasonic waves and improves the efficiency and effect of double-sided cleaning of the wafer body 2.

[0026] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A fully automatic single-chip cleaning machine, characterized in that: It comprises a supporting assembly (1) in which a wafer body (2) is detachably placed; The supporting assembly (1) comprises a symmetrically arranged supporting box (101), and a limiting component (3) for supporting and limiting the wafer body (2) is arranged on the inner wall of the supporting box (101); The limiting component (3) comprises a limiting block (301) which is structurally connected to the inner wall of the supporting box (101); the outer surface of the limiting block (301) is symmetrically provided with arc-shaped protrusions (303) for limiting the wafer body (2) on both sides; the arc-shaped protrusions (303) are in the form of an arc-shaped block structure with a curved surface; a V-shaped exposure groove (304) penetrating the arc-shaped protrusions (303) is centrally provided on the outer surface of the limiting block (301); the V-shaped exposure groove (304) is in the form of a V-shaped groove body structure, and the V-shaped exposure groove (304) is used to divide the arc-shaped protrusions (303) into two limiting convex point structures which have a limiting effect on the wafer body (2) and reduce the shielding area.

2. A fully automatic single-chip cleaning machine as claimed in claim 1, characterized in that: The outer surface of the limit block (301) is provided with an arcuate groove (302), the arc-shaped protrusion (303) is arranged on the surface of the arcuate groove (302) and is integrally connected to the limit block (301), and the end of the V-shaped exposed groove (304) protrudes from the surface of the arcuate groove (302) in the section direction and extends toward the inside of the limit block (301).

3. A fully automatic single-chip cleaning machine as claimed in claim 1, characterized in that: The support box (101) is a wrap-around plate structure having an arc end and a straight end, and a support plate (102) for providing a supporting effect is formed at the bottom structure of the arc end of the support box (101).

4. A fully automatic single-chip cleaning machine as claimed in claim 3, characterized in that: A U-shaped connecting plate (103) is provided between the supporting boxes (101), and both ends of the U-shaped connecting plate (103) are integrally connected to the supporting boxes (101).

5. A fully automatic single-chip cleaning machine as claimed in claim 4, characterized in that: An L-shaped component (105) is provided on one side of the support box (101), the U-shaped connecting plate (103) is integrally connected to the L-shaped component (105), and triangular ribs (104) integrally connected to the L-shaped component (105) and the support box (101) are provided on both sides of the upper end surface of the U-shaped connecting plate (103).

6. A fully automatic single-chip cleaning machine as claimed in claim 5, characterized in that: A connecting rod (106) is arranged between the L-shaped components (105), both ends of the connecting rod (106) are integrally connected to the L-shaped components (105), and hooking grooves are equidistantly provided at the bottom of the outer edge surface of the connecting rod (106).

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