IGBT efficient heat dissipation structure for electric heater

Abstract

The utility model relates to the technical field of IGBT heat dissipation, and discloses an IGBT efficient heat dissipation structure for an electric heater, which comprises a main shell and IGBTs, a fixing plate is fixedly mounted in the main shell through screws, a plurality of profiling grooves for mounting the IGBTs are formed in the fixing plate, and the IGBTs are arranged in the profiling grooves. An insulating heat-conducting pad is attached to the bottom of the IGBT, the other side of the insulating heat-conducting pad is attached to the main shell, and the insulating heat-conducting pad plays a role of a medium for insulation and heat transfer; according to the IGBT efficient heat dissipation structure for the electric heater, through the combined installation design of the IGBT, the insulating heat conduction pad and the liquid cooling channel in the radiator, heat generated by the IGBT can be transmitted into the liquid cooling channel through the insulating heat conduction pad, the heat generated by the IGBT is taken away through circular flowing of cooling liquid in the liquid cooling channel, space and ventilation environment do not need to be considered, and the heat dissipation efficiency is improved. Meanwhile, the heat dissipation limitation of the IGBT can be avoided, and the heat dissipation efficiency of the IGBT can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT heat dissipation, in particular to an IGBT high-efficiency heat dissipation structure for an electric heater. Background Art

[0002] IGBT (Insulated Gate Bipolar Transistor) is a composite semiconductor device that combines the voltage control characteristics of MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) and the high current capability of bipolar transistor. IGBT controls its conduction and shutdown through the change of gate voltage, achieving efficient high current control. Since IGBT will lose energy during the conduction and shutdown process, the energy is mainly released in the form of heat, so a good heat dissipation design is necessary to maintain the normal operating temperature of the device and prevent overheating damage.

[0003] In the prior art, IGBTs generally dissipate heat through forced air cooling technology. The bottom of the IGBT is fixed to the housing through a thermal pad, and a heat sink is arranged on the outside of the housing. This solution is greatly affected by the environment and temperature, and also requires sufficient space and ventilation. This state generally requires an external fan or is often in motion to dissipate heat, which not only increases power consumption but also limits the motion state, which to a large extent leads to limitations and efficiency in IGBT heat dissipation. Utility Model Content

[0004] In order to solve the above existing IGBT heat dissipation through forced air cooling technology, sufficient space and ventilation environment are required; an external fan is required or it is often in motion to play a role in heat dissipation, which greatly leads to the limitation and efficiency of IGBT heat dissipation. The utility model is implemented through the following technical solutions: an IGBT high-efficiency heat dissipation structure for an electric heater, comprising a main housing and an IGBT, a fixing plate is fixedly installed inside the main housing, the fixing plate is fixedly installed inside the main housing by screws, a plurality of profiling grooves for installing the IGBT are opened inside the fixing plate, an insulating thermal pad is fitted on the bottom of the IGBT, the other side of the insulating thermal pad is fitted on the main housing, and the insulating thermal pad plays the role of a medium for insulation and heat transfer;

[0005] A radiator is installed in the main shell, and a liquid cooling channel is arranged inside the radiator. The liquid cooling channel corresponds to the insulating thermal pad. After the coolant is passed into the liquid cooling channel, the water circulation formed by the coolant takes away the heat transferred through the insulating thermal pad.

[0006] Furthermore, a water channel is formed in the liquid cooling channel, and the water channel covers the insulating thermal pad, thereby increasing the contact area between the liquid cooling channel and the insulating thermal pad and improving the heat transfer effect of the insulating thermal pad. A water inlet and a water outlet are respectively provided at both ends of the liquid cooling channel.

[0007] Furthermore, a pressure strip is provided on one side of the IGBT away from the insulating thermal pad, the pressure strip is assembled inside the fixing plate, a spring sheet is installed between the pressure strip and the IGBT, and the pressure strip, fixing plate and screws constitute a clamping assembly for fixing the IGBT.

[0008] Furthermore, the radiator is fixedly connected to the main shell by screws, and a sealing ring is installed at the connection between the corresponding side of the liquid cooling channel inside the radiator and the main shell.

[0009] Furthermore, a plurality of heat sink fins are installed on the outer surface of the main shell, and the plurality of heat sink fins are arranged on one side of the main shell surface close to the insulating thermal pad. The air cooling method of the heat sink fins is combined with the liquid cooling method of the liquid cooling channel to improve the heat dissipation effect of the IGBT.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] The electric heater uses an IGBT efficient heat dissipation structure. Through the combined installation design of the IGBT, the insulating thermal pad and the liquid cooling channel in the radiator, the insulating thermal pad can be used to transfer the heat generated by the IGBT to the liquid cooling channel, and the circulating flow of the coolant in the liquid cooling channel can be used to take away the heat generated by the IGBT. There is no need to consider the space and ventilation environment. At the same time, the limitations of the IGBT heat dissipation can be avoided, which is beneficial to improving the heat dissipation efficiency of the IGBT. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the three-dimensional structure of the heat dissipation structure of the utility model;

[0013] Figure 2 This is an internal cross-sectional view of the heat dissipation structure of the utility model;

[0014] Figure 3 For this utility model Figure 2 Schematic diagram of the enlarged structure at point A in the middle.

[0015] In the figure: 1. Main housing; 2. Fixing plate; 3. Pressure strip; 4. IGBT; 5. Insulating thermal pad; 6. Sealing ring; 7. Screws; 8. Radiator; 9. Liquid cooling channel; 10. Heat sink fins. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] The embodiment of the IGBT high-efficiency heat dissipation structure for the electric heater is as follows:

[0018] See also Figure 1-Figure 3 , an IGBT high-efficiency heat dissipation structure for an electric heater, comprising a main shell 1, a fixing plate 2, a pressure strip 3, an IGBT4, an insulating thermal pad 5, a heat sink 8, a sealing ring 6 and a screw 7. The top and surrounding of the IGBT4 of the utility model are provided with a pressure strip 3 and a fixing plate 2, and the pressure strip 3 is fixedly assembled in the fixing plate 2 by screws 7; a plurality of IGBT4 profiling grooves are provided in the fixing plate 2, and a plurality of spring sheets are provided on each pressure strip 3 for interference fit to press the IGBT4; the pressure strip 3, the fixing plate 2 and the screws 7 constitute a clamping assembly for fixing the IGBT4.

[0019] An insulating thermal pad 5 is attached to the bottom of the IGBT 4 through interference fit, and the other side of the insulating thermal pad 5 is attached to the main housing 1 to play the role of a medium for insulation and heat transfer.

[0020] The main housing 1, the radiator 8 and the sealing ring 6 are fixed by screws 7 to form a liquid cooling channel 9. A water inlet and a water outlet are provided at both ends of the liquid cooling channel 9. The water inlet and the water outlet are respectively connected to the input and output devices of the coolant. The water channel in the liquid cooling channel 9 flows through the side surface of the main housing 1 corresponding to the insulating thermal pad 5. There are multiple heat dissipation fins 10 on the outside of the main housing 1, and the heat dissipation fins 10 are distributed on the outside of the main housing 1 close to the IGBT4.

[0021] Working principle of IGBT efficient heat dissipation structure: the pressure strip 3, the fixing plate 2 and the screw 7 fix and press the IGBT 4 to ensure that the IGBT 4 is firmly fixed and tightly fitted; the heat generated by the IGBT 4 is transferred to the main housing 1 through the insulating thermal pad 5; after the coolant is introduced into the liquid cooling channel 9, the water circulation formed by the coolant will take away the heat transferred through the insulating thermal pad 5, and the heat dissipation fins 10 on the main housing 1 can also take away part of the heat again through the external natural wind, which greatly accelerates the heat dissipation efficiency.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An IGBT high-efficiency heat dissipation structure for an electric heater, comprising a main housing (1) and an IGBT (4), characterized in that: A fixing plate (2) is fixedly mounted inside the main housing (1), a plurality of profiled grooves for mounting the IGBT (4) are provided inside the fixing plate (2), an insulating thermal pad (5) is fitted on the bottom of the IGBT (4), and the other side of the insulating thermal pad (5) is fitted on the main housing (1); A radiator (8) is installed in the main housing (1), a liquid cooling channel (9) is provided inside the radiator (8), and the liquid cooling channel (9) corresponds to the insulating thermal pad (5).

2. The IGBT high-efficiency heat dissipation structure for an electric heater according to claim 1, characterized in that: A water channel is formed in the liquid cooling channel (9), the water channel covers the insulating thermal pad (5), and a water inlet and a water outlet are respectively provided at two ends of the liquid cooling channel (9).

3. An IGBT high-efficiency heat dissipation structure for an electric heater according to claim 1 or 2, characterized in that: A pressure strip (3) is provided on a side of the IGBT (4) away from the insulating thermal pad (5); the pressure strip (3) is mounted inside the fixing plate (2); and a spring sheet is installed between the pressure strip (3) and the IGBT (4).

4. The IGBT high-efficiency heat dissipation structure for an electric heater according to claim 2, characterized in that: The radiator (8) is fixedly connected to the main housing (1) via screws (7), and a sealing ring (6) is installed at the connection between the corresponding side of the liquid cooling channel (9) inside the radiator (8) and the main housing (1).

5. The IGBT high-efficiency heat dissipation structure for an electric heater according to claim 4, characterized in that: A plurality of heat dissipation fins (10) are installed on the outer surface of the main housing (1), and the plurality of heat dissipation fins (10) are arranged on a side of the surface of the main housing (1) close to the insulating thermal pad (5).

Images