Display panel and tiled display device

Abstract

The utility model discloses a display panel and a tiled display device. The display panel comprises a substrate and a wiring layer, the substrate comprises a first surface, a second surface and a third surface, and the third surface is provided with a groove; the wiring layer comprises a first wire, a second wire and a third wire, and the third wire comprises a first sub-segment, a second sub-segment and a third sub-segment; the side wall of the first wire is not flush with the side wall of the first sub-section; and / or the side wall of the second wire is not flush with the side wall of the third sub-section. The side wall of the first wire is not flush with the side wall of the first sub-section, and / or the side wall of the second wire is not flush with the side wall of the third sub-section, so that the third wire can be manufactured by adopting a patterning process, meanwhile, the groove is formed in the third surface, and in the patterning process, the material of the third wire is deposited in the groove, so that the thickness of the third wire is reduced. And redundant materials are removed through edge grinding, namely, the third wiring can be formed by adopting the same photomask, so that the processing efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a spliced ​​display device. Background Art

[0002] The splicing display device is composed of several display panels, which can meet the needs of large-screen display. Splicing display devices are widely used in commercial media, cultural performances, sports stadiums, information dissemination and other application fields. The seamless splicing technology can reduce the impact of the splicing seam on the display and improve the display effect of the splicing display device, becoming the development direction of splicing display technology.

[0003] In the related art, the driver chip of the display panel is manufactured by the side-binding process. The side-binding process forms interconnected wiring on the front, side, and back of the display panel, thereby transmitting the signal of the display panel from the front to the back. The driver chip is bound and connected on the back. Since the driver chip is set on the back of the display panel, the border width of the display panel can be reduced, and the width of the seam can be reduced. However, when the side-binding process is adopted, the front wiring, side wiring, and back wiring need to be engraved separately by laser, which has low processing efficiency and high cost.

[0004] Therefore, it is urgent to solve the above technical problems. Utility Model Content

[0005] The present application provides a display panel and a spliced ​​display device to solve the technical problem that the display panel uses laser to produce front wiring, side wiring, and back wiring, which has low processing efficiency and high cost.

[0006] To solve the above technical problems, the technical solutions provided by this application are as follows:

[0007] The present application provides a display panel, the display panel comprising:

[0008] A substrate, the substrate comprising a first surface and a second surface opposite to each other, and a third surface connecting the first surface and the second surface, wherein the third surface is provided with at least one groove, and the groove connects the first surface and the second surface;

[0009] A routing layer is arranged on the substrate, the routing layer includes at least one first routing, at least one second routing and at least one third routing, the first routing is arranged on the first surface, the second routing is arranged on the second surface, the third routing includes a first sub-segment, a second sub-segment and a third sub-segment connected in sequence, the first sub-segment covers a portion of the first routing, the second sub-segment is arranged in the groove, and the third sub-segment covers a portion of the second routing;

[0010] Wherein, the side wall of the first routing line is not flush with the side wall of the first sub-segment; and / or the side wall of the second routing line is not flush with the side wall of the third sub-segment.

[0011] In the display panel of the present application, the orthographic projection of the first subsegment on the first routing line is located within the first routing line, and the orthographic projection of the third subsegment on the second routing line is located within the second routing line.

[0012] In the display panel of the present application, the side wall of the first routing line forms a first angle with the bottom wall of the first routing line, the side wall of the first sub-segment forms a second angle with the bottom wall of the first sub-segment, and / or the side wall of the second routing line forms a third angle with the bottom wall of the second routing line, and the side wall of the third sub-segment forms a fourth angle with the bottom wall of the third sub-segment; the first angle is smaller than the second angle, and the third angle is smaller than the fourth angle.

[0013] In the display panel of the present application, the first angle and the third angle are both acute angles, and the second angle and the fourth angle are both obtuse angles.

[0014] In the display panel of the present application, the orthographic projection of the first subsegment on the third subsegment overlaps with the third subsegment, and the extension direction of the second subsegment is perpendicular to the first surface.

[0015] In the display panel of the present application, the first routing line intersects with the third surface, and the intersection line of the first routing line and the third surface is located on the groove, and the second routing line intersects with the third surface, and the intersection line of the second routing line and the third surface is located on the groove.

[0016] In the display panel of the present application, the material of the first wiring and the second wiring is copper, and the material of the third wiring is an alloy of one or more of titanium, aluminum, molybdenum, and copper.

[0017] In the display panel of the present application, the display panel also includes a display layer and a driving chip, the display layer is arranged on one side of the first surface, the driving chip is arranged on one side of the second surface, the display layer is electrically connected to the first wiring, and the driving chip is electrically connected to the second wiring.

[0018] In the display panel of the present application, the groove is any one of a semicircular hole, a semi-elliptical hole, a triangular hole, and a square hole.

[0019] The present application also provides a spliced ​​display device, which includes the above-mentioned display panel.

[0020] Beneficial effects: The present application discloses a display panel and a spliced ​​display device. The display panel includes a substrate and a wiring layer, wherein the substrate includes a first surface and a second surface opposite to each other, and a third surface connecting the first surface and the second surface, wherein the third surface is provided with at least one groove, and the groove connects the first surface and the second surface; the wiring layer is provided on the substrate, and the wiring layer includes at least one first wiring, at least one second wiring and at least one third wiring, wherein the first wiring is provided on the first surface, and the second wiring is provided on the second surface, and the third wiring includes a first sub-segment, a second sub-segment and a third sub-segment connected in sequence, wherein the first sub-segment covers part of the first wiring, the second sub-segment is provided in the groove, and the third sub-segment covers part of the second wiring; wherein the side wall of the first wiring is not flush with the side wall of the first sub-segment; and / or the side wall of the second wiring is not flush with the side wall of the third sub-segment. In the present application, the first sub-segment of the third routing covers the first routing, and the third sub-segment of the third routing covers the second routing, thereby achieving conduction between the first routing and the second routing. By making the side wall of the first routing uneven with the side wall of the first sub-segment, and / or the side wall of the second routing uneven with the side wall of the third sub-segment, the third routing can be manufactured by a patterning process. At the same time, a groove is provided on the third surface. In the patterning process, the material of the third routing will be deposited in the groove, and then the excess material on the third surface is removed by grinding. That is, the same mask can be used to form the third routing, which can improve processing efficiency and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0022] Figure 1 A schematic diagram of a three-dimensional structure of a display panel provided in an embodiment of the present application;

[0023] Figure 2 for Figure 1 AA cross-sectional structural diagram of the display panel;

[0024] Figure 3 for Figure 1 BB cross-sectional structural diagram of the display panel;

[0025] Figure 4 A schematic cross-sectional structure diagram of a spliced ​​display device provided in an embodiment of the present application;

[0026] Figure 5 A first process flow chart of a display panel provided in an embodiment of the present application;

[0027] Figure 6A second process flow chart of a display panel provided in an embodiment of the present application;

[0028] Figure 7 A third process flow chart of a display panel provided in an embodiment of the present application.

[0029] Description of reference numerals:

[0030] Display panel 1, substrate 10, first surface 11, second surface 12, third surface 13, groove 131, wiring layer 20, first wiring 21, second wiring 22, third wiring 23, first sub-segment 231, second sub-segment 232, third sub-segment 233, first angle A, second angle B, third angle C, fourth angle B, display layer 30, driving chip 40, flexible circuit board 50, double-sided tape 60, spliced ​​display device 2, frame 25, negative photoresist 71, metal film layer 72, through hole 73. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; and "inside" and "outside" refer to the outline of the device.

[0032] The present application provides a display panel 1, such as Figures 1 to 3As shown, the display panel 1 includes a substrate 10 and a wiring layer 20. The substrate 10 includes a first surface 11 and a second surface 12 opposite to each other, and a third surface 13 connecting the first surface 11 and the second surface 12. The third surface 13 is provided with at least one groove 131, and the groove 131 connects the first surface 11 and the second surface 12. The wiring layer 20 is provided on the substrate 10, and the wiring layer 20 includes at least one first wiring 21, at least one second wiring 22 and at least one third wiring 23. The first wiring 21 is provided with The first surface 11 is disposed, the second routing line 22 is disposed on the second surface 12, the third routing line 23 includes a first sub-segment 231, a second sub-segment 232, and a third sub-segment 233 which are sequentially connected, the first sub-segment 231 covers a portion of the first routing line 21, the second sub-segment 232 is disposed in the groove 131, and the third sub-segment 233 covers a portion of the second routing line 22; wherein the side wall of the first routing line 21 is not flush with the side wall of the first sub-segment 231; and / or the side wall of the second routing line 22 is not flush with the side wall of the third sub-segment 233.

[0033] In this embodiment, the display panel 1 may be an OLED panel, a Mini-LED panel, a Micro-LED panel, etc.

[0034] In this embodiment, the material of the substrate 10 may be glass or the like. The substrate 10 is in the shape of a flat plate, the first surface 11 and the second surface 12 are two planes with larger areas of the substrate 10, and the other planes connect the first surface 11 and the second surface 12. The third surface 13 is one of the planes connecting the first surface 11 and the second surface 12. The shape of the substrate 10 may be rectangular or the like, but is not limited thereto. The shape of the substrate 10 may be set as required.

[0035] In this embodiment, if Figure 1 As shown, the third surface 13 is provided with a groove 131, and the groove 131 connects the first surface 11 and the second surface 12, that is, the groove 131 passes through the substrate 10. The second sub-segment 232 is arranged in the groove 131, and the cross-sectional shape of the second sub-segment 232 matches the cross-sectional shape of the groove 131. For example, when the groove 131 is a semicircular hole, the cross-sectional shape of the second sub-segment 232 is a semicircular. The surface of the second sub-segment 232 is flush with the third surface 13, so that the second sub-segment 232 can be formed by an edge grinding process.

[0036] The cross-sectional shape of the first sub-segment 231 and the cross-sectional shape of the third sub-segment 233 are different from the cross-sectional shape of the second sub-segment 232 .

[0037] In this embodiment, the wiring layer 20 can be used to transmit driving signals. The wiring layer 20 is made of a conductive material, for example, the material of the wiring layer 20 can be an alloy of one or more of titanium, aluminum, molybdenum, and copper.

[0038] The thickness of the routing layer 20 can be set as required. When the routing layer 20 is thicker, it is beneficial to reduce the impedance of the routing layer 20. The thicknesses of the first routing line 21, the second routing line 22, and the third routing line 23 can be the same or different.

[0039] The first routing line 21 is arranged on the first surface 11, the second routing line 22 is arranged on the second surface 12, and the third routing line 23 is arranged on the third surface 13. The first sub-segment 231 of the third routing line 23 is electrically connected to the first routing line 21, and the third sub-segment 233 is electrically connected to the second routing line 22. Through the above arrangement, a driving signal can be transmitted between the first surface 11 and the second surface 12.

[0040] In this embodiment, if Figure 2 As shown, the side wall of the first routing line 21 is not flush with the side wall of the first sub-segment 231, and / or the side wall of the second routing line 22 is not flush with the side wall of the third sub-segment 233. The routing layer 20 can be manufactured by a patterning process, and the upper surface and the lower surface of the routing layer 20 are substantially flat surfaces, and the upper surface and the lower surface are substantially parallel to one of the first surface 11 and the second surface 12. The side wall refers to a side surface of the routing layer 20 connecting the upper surface and the lower surface, and the side wall is at an angle to the first surface 11.

[0041] It should be understood that the side wall of the first routing 21 is not flush with the side wall of the first sub-segment 231, which means that the side wall of the first routing 21 is parallel to the side wall of the first sub-segment 231 and is staggered, or the inclination angle of the side wall of the first routing 21 relative to the first surface 11 is different from the inclination angle of the side wall of the first sub-segment 231 relative to the first surface 11.

[0042] The side wall of the second routing 22 is not flush with the side wall of the third sub-segment 233, which means that the side wall of the second routing 22 is parallel to and staggered with the side wall of the third sub-segment 233, or the inclination angle of the side wall of the second routing 22 relative to the second surface 12 is different from the inclination angle of the side wall of the third sub-segment 233 relative to the second surface 12.

[0043] Through the above arrangement, the present embodiment can adopt a patterning process to manufacture the third wiring 23, thereby avoiding the use of laser engraving to form the third wiring 23. The yield and efficiency of laser engraving are low, and three engravings are required to respectively form the first sub-segment 231, the second sub-segment 232, and the third sub-segment 233. Since the processing efficiency of the patterning process is higher than the processing efficiency of laser engraving, and the yield of the patterning process is higher than the yield of laser engraving, the processing efficiency of the display panel 1 can be improved and the cost can be reduced.

[0044] In the display panel 1 of the present application, Figure 1 and Figure 2As shown, the orthographic projection of the first sub-segment 231 on the first routing line 21 is located within the first routing line 21, and the orthographic projection of the third sub-segment 233 on the second routing line 22 is located within the second routing line 22. Through the above configuration, the distance between two adjacent first sub-segments 231 can be increased to avoid short circuit of the first sub-segments 231; and the distance between two adjacent second sub-segments 232 can be increased to avoid short circuit of the second sub-segments 232.

[0045] In the display panel 1 of the present application, Figure 2 As shown, the side wall of the first routing line 21 and the bottom wall of the first routing line 21 form a first angle A, the side wall of the first sub-segment 231 and the bottom wall of the first sub-segment 231 form a second angle B, and / or the side wall of the second routing line 22 and the bottom wall of the second routing line 22 form a third angle C, and the side wall of the third sub-segment 233 and the bottom wall of the third sub-segment 233 form a fourth angle B; the first angle A is smaller than the second angle B, and the third angle C is smaller than the fourth angle B.

[0046] In this embodiment, the bottom wall of the first routing line 21 refers to the side surface of the first routing line 21 close to the first surface 11, the surface opposite to the bottom wall of the first routing line 21 is the top wall of the first routing line 21, and the side wall of the first routing line 21 refers to the surface connecting the top wall of the first routing line 21 and the bottom wall of the first routing line 21.

[0047] The bottom wall of the first sub-segment 231 refers to a side surface of the first sub-segment 231 close to the first surface 11, the surface opposite to the bottom wall of the first sub-segment 231 is the top wall of the first sub-segment 231, and the side wall of the first sub-segment 231 refers to a surface connecting the top wall of the first sub-segment 231 and the bottom wall of the first sub-segment 231.

[0048] The bottom wall of the second routing line 22 refers to the side surface of the second routing line 22 close to the second surface 12, the surface opposite to the bottom wall of the second routing line 22 is the top wall of the second routing line 22, and the side wall of the second routing line 22 refers to the surface connecting the top wall of the second routing line 22 and the bottom wall of the second routing line 22.

[0049] The bottom wall of the third sub-segment 233 refers to a side surface of the third sub-segment 233 close to the second surface 12, the surface opposite to the bottom wall of the third sub-segment 233 is the top wall of the third sub-segment 233, and the side wall of the third sub-segment 233 refers to a surface connecting the top wall of the third sub-segment 233 and the bottom wall of the third sub-segment 233.

[0050] The first wiring 21 and the second wiring 22 can be formed by a first patterning process, which includes coating positive photoresist, exposure, development, and etching. The angle between the side wall and the bottom wall of the wiring formed by the first patterning process is relatively small.

[0051] The first sub-segment 231 and the third sub-segment 233 can be formed by a second patterning process, and the second patterning process includes coating a negative photoresist, exposing, developing, and etching. The angle between the side wall of the line formed by the second patterning process and the bottom wall of the line is relatively large. Therefore, the first angle A formed by the above patterning process is smaller than the second angle B, and the third angle is smaller than the fourth angle B.

[0052] Furthermore, the first angle A and the third angle C are both acute angles, and the second angle B and the fourth angle B are both obtuse angles.

[0053] That is to say, the cross-sectional shape of the first trace 21 may be a trapezoid, and the long side of the trapezoid is located on the side of the short side of the trapezoid close to the first surface 11. The cross-sectional shape of the first sub-segment 231 may be a trapezoid, and the long side of the trapezoid is located on the side of the short side of the trapezoid away from the first surface 11. The cross-sectional shape of the second trace 22 may be a trapezoid, and the long side of the trapezoid is located on the side of the short side of the trapezoid close to the second surface 12. The cross-sectional shape of the third sub-segment 233 may be a trapezoid, and the long side of the trapezoid is located on the side of the short side of the trapezoid away from the second surface 12.

[0054] In the display panel 1 of the present application, Figure 1 and Figure 2 As shown, the orthographic projection of the first subsegment 231 on the third subsegment 233 overlaps with the third subsegment 233, and the extension direction of the second subsegment 232 is perpendicular to the first surface 11. Through the above arrangement, the patterns of the first subsegment 231 and the third subsegment 233 can be the same, so that the patterning of the first subsegment 231 and the third subsegment 233 can be completed by using the same photomask, further reducing the manufacturing cost of the display panel 1.

[0055] Specifically, the patterning process of the first subsection 231 of the first surface 11 may be completed first, and then the patterning process of the third subsection 233 of the second surface 12 may be completed. Alternatively, the patterning process of the first subsection 231 of the first surface 11 and the patterning process of the third subsection 233 of the second surface may be performed alternately.

[0056] In the display panel 1 of the present application, Figure 1 and Figure 3 As shown, the first wiring 21 intersects the third surface 13 , and the intersection line of the first wiring 21 and the third surface 13 is located on the groove 131 ; the second wiring 22 intersects the third surface 13 , and the intersection line of the second wiring 22 and the third surface 13 is located on the groove 131 .

[0057] That is to say, the first trace 21 extends to the edge of the substrate 10 and is connected to the second subsection 232 in the groove 131 , and the second trace 22 extends to the edge of the substrate 10 and is connected to the second subsection 232 in the groove 131 .

[0058] In the display panel 1 of the present application, the materials of the first wiring 21 and the second wiring 22 are copper, and the material of the third wiring 23 is an alloy of one or more of titanium, aluminum, molybdenum, and copper, but is not limited thereto.

[0059] In the display panel 1 of the present application, Figure 3 As shown, the display panel 1 also includes a display layer 30 and a driving chip 40. The display layer 30 is arranged on one side of the first surface 11, and the driving chip 40 is arranged on one side of the second surface 12. The display layer 30 is electrically connected to the first wiring 21, and the driving chip 40 is electrically connected to the second wiring 22.

[0060] In this embodiment, the display layer 30 is provided with a plurality of light emitting units, which may include a red light emitting unit, a green light emitting unit, and a blue light emitting unit, and the display layer 30 may be used to display images. The side of the display layer 30 away from the first surface 11 is a light emitting surface.

[0061] In this embodiment, the driving chip 40 is disposed on a side surface of the substrate 10 away from the display layer 30, that is, the driving chip 40 is disposed on the side of the second surface 12, and the second surface 12 is the backlight surface of the display panel 1. The driving chip 40 can provide a driving signal for the display layer 30, and the driving signal can be transmitted to the third wiring 23 through the second wiring 22, and then transmitted to the first wiring 21 through the third wiring 23, and then transmitted to the display layer 30. Through the above configuration, the driving signal of the driving chip 40 on the second surface 12 of the substrate 10 can be transmitted to the display layer 30 on the first surface 11 of the substrate 10.

[0062] It should be understood that the first surface 11 is provided with a plurality of light-emitting units, a driving circuit, etc., and there is less free space. When the driving chip 40 is provided on the first surface 11, a certain amount of additional space needs to be reserved for the driver chip 40, which requires increasing the area of ​​the first surface 11. The second surface 12 is the backlight surface, and the backlight surface does not need to be provided with a light-emitting unit, etc., so there is more free space on the second surface 12. When the driving chip 40 is provided on the second surface 12, it is not necessary to increase the area of ​​the first surface 11, so that the frame of the display panel 1 can be reduced, which is conducive to achieving seamless stitching.

[0063] Optionally, the driving chip 40 is disposed on the flexible circuit board 50, and the flexible circuit board 50 is bound and connected to the second trace 22. A double-sided adhesive tape 60 may be disposed between the flexible circuit board 50 and the second surface 12, and the double-sided adhesive tape 60 is used to adhere and fix the flexible circuit board 50 to the substrate 10. The double-sided adhesive tape 60 may be foam adhesive, etc., but is not limited thereto.

[0064] In the display panel 1 of the present application, along Figure 1When viewed from a direction C in the middle, the groove 131 is any one of a semicircular hole, a semi-elliptical hole, a triangular hole, and a square hole. The direction C is perpendicular to the first surface 11.

[0065] In this embodiment, the groove 131 can be formed by forming a through hole on the substrate 10 and then grinding the substrate 10 to remove redundant half holes.

[0066] Specifically, the first patterning process can be used to form the first wiring 21 and the second wiring 22 respectively. Then, a through hole is formed on the first wiring 21, and the through hole passes through the first wiring 21, the substrate 10, and the second wiring 22. Then, a metal material is deposited on the first surface 11 and the second surface 12 of the substrate 10. The metal material will be deposited in the through hole, and then the first sub-segment 231 and the third sub-segment 233 are formed by the second patterning process. The side wall of the substrate 10 is further edged, and half of the through hole is removed to form a groove 131 and a second sub-segment 232 located in the groove 131. Through the above-mentioned configuration, this embodiment can simplify the manufacturing process of the display panel 1 and reduce the production cost of the display panel 1.

[0067] like Figures 5 to 7 As shown, three process flow charts of the display panel 1 provided in the embodiments of the present application are shown. Figure 5 As shown, in the first process flow, the method for manufacturing the display panel 1 includes:

[0068] S10 , forming the first wiring 21 and the second wiring 22 by using a first patterning process, and coating a negative photoresist 71 on the substrate 10 formed with the first wiring 21 and the second wiring 22 .

[0069] S11 , drilling a hole on the substrate 10 to form a through hole 73 , wherein the through hole 73 passes through the first wiring 21 and the second wiring 22 .

[0070] S12 , grinding the substrate 10 to transform the through hole 73 into the groove 131 .

[0071] S13 , forming a metal film layer 72 on the substrate 10 , wherein the metal film layer 72 is deposited on the first surface 11 , the second surface 12 and the groove 131 .

[0072] S14, stripping the negative photoresist 71.

[0073] S15 , grinding the side surface of the substrate 10 to remove the metal film layer 72 between the grooves 131 , and forming the second sub-segment 232 of the third wiring 23 .

[0074] Optionally, after step S13, step S16 may be adopted.

[0075] S16 , grinding the side surface of the substrate 10 to remove the metal film layer 72 between the grooves 131 , and forming the second sub-segment 232 of the third wiring 23 .

[0076] S17, stripping off the negative photoresist 71.

[0077] like Figure 6 As shown, in the second process flow, the method for manufacturing the display panel 1 includes:

[0078] S20 , forming the first wiring 21 and the second wiring 22 by using the first patterning process, and punching holes on the substrate 10 formed with the first wiring 21 and the second wiring 22 to form through holes 73 , wherein the through holes 73 penetrate the first wiring 21 and the second wiring 22 .

[0079] S21 , forming a metal film layer 72 on the substrate 10 , coating a negative photoresist 71 on the metal film layer 72 , and exposing the negative photoresist 71 .

[0080] S22, developing the substrate 10 in S21.

[0081] S23 , grinding the side surface of the substrate 10 to transform the through hole 73 into the groove 131 , and removing the metal film layer 72 between the grooves 131 to form the second sub-segment 232 of the third wiring 23 .

[0082] S24 , etching the substrate 10 in step S23 to form the first sub-segment 231 and the third sub-segment 233 of the third wiring 23 , and stripping the negative photoresist 71 .

[0083] like Figure 7 As shown, in the third process flow, the method for manufacturing the display panel 1 includes:

[0084] S30 , forming the first wiring 21 and the second wiring 22 by using the first patterning process, and punching holes on the substrate 10 formed with the first wiring 21 and the second wiring 22 to form through holes 73 , wherein the through holes 73 penetrate the first wiring 21 and the second wiring 22 .

[0085] S31 , forming a metal film layer 72 on the substrate 10 , coating a negative photoresist 71 on the metal film layer 72 , and exposing the negative photoresist 71 .

[0086] S32 , grinding the side surface of the substrate 10 to transform the through hole 73 into the groove 131 , and removing the metal film layer 72 between the grooves 131 to form the second sub-segment 232 of the third wiring 23 .

[0087] S33 , etching the substrate 10 in step S32 to form the first sub-segment 231 and the third sub-segment 233 of the third wiring 23 , and stripping the negative photoresist 71 .

[0088] The present application also provides a splicing display device 2, such as Figure 4 As shown, the spliced ​​display device 2 includes the above-mentioned display panel 1.

[0089] In this embodiment, the spliced ​​display device 2 may include at least two display panels 1, which are spliced ​​together. The spliced ​​display device may include a frame 25, on which the display panel 1 is disposed, and the frame 25 is used to support and fix the display panel 1.

[0090] In this embodiment, the spliced ​​display device 2 can be any spliced ​​large screen, for example, a spliced ​​display large screen used in application fields such as commercial media, cultural performances, sports stadiums, information dissemination, etc.

[0091] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0092] The display panel 1 and the spliced ​​display device 2 provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: include: A substrate, the substrate comprising a first surface and a second surface opposite to each other, and a third surface connecting the first surface and the second surface, wherein the third surface is provided with at least one groove, and the groove connects the first surface and the second surface; A routing layer is arranged on the substrate, the routing layer includes at least one first routing, at least one second routing and at least one third routing, the first routing is arranged on the first surface, the second routing is arranged on the second surface, the third routing includes a first sub-segment, a second sub-segment and a third sub-segment connected in sequence, the first sub-segment covers a portion of the first routing, the second sub-segment is arranged in the groove, and the third sub-segment covers a portion of the second routing; Wherein, the side wall of the first routing line is not flush with the side wall of the first sub-segment; and / or the side wall of the second routing line is not flush with the side wall of the third sub-segment.

2. The display panel according to claim 1, characterized in that: The orthographic projection of the first subsegment on the first routing line is located within the first routing line, and the orthographic projection of the third subsegment on the second routing line is located within the second routing line.

3. The display panel according to claim 2, characterized in that: The side wall of the first routing line forms a first angle with the bottom wall of the first routing line, the side wall of the first sub-segment forms a second angle with the bottom wall of the first sub-segment, and / or the side wall of the second routing line forms a third angle with the bottom wall of the second routing line, and the side wall of the third sub-segment forms a fourth angle with the bottom wall of the third sub-segment; the first angle is smaller than the second angle, and the third angle is smaller than the fourth angle.

4. The display panel according to claim 3, characterized in that: The first angle and the third angle are both acute angles, and the second angle and the fourth angle are both obtuse angles.

5. The display panel according to claim 3, characterized in that: The orthographic projection of the first subsegment on the third subsegment overlaps with the third subsegment, and an extension direction of the second subsegment is perpendicular to the first surface.

6. The display panel according to claim 1, characterized in that: The first routing line intersects the third surface, and an intersection line between the first routing line and the third surface is located on the groove; the second routing line intersects the third surface, and an intersection line between the second routing line and the third surface is located on the groove.

7. The display panel according to claim 1, characterized in that: The material of the first wiring and the second wiring is copper, and the material of the third wiring is one of titanium, aluminum, molybdenum and copper.

8. The display panel according to claim 1, characterized in that: The display panel further includes a display layer and a driving chip, wherein the display layer is disposed on one side of the first surface, and the driving chip is disposed on one side of the second surface, the display layer is electrically connected to the first wiring, and the driving chip is electrically connected to the second wiring.

9. The display panel according to claim 1, characterized in that: The groove is any one of a semicircular hole, a semi-elliptical hole, a triangular hole, and a square hole.

10. A splicing display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 9.

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