Wafer laser cutting machine with protection mechanism
By designing a wafer laser cutting machine with a protective mechanism, including components such as rotary table, glass cover and storage table, the safety hazards caused by the lack of protection mechanism in the prior art are solved, and safe fixation and laser cutting of the wafer are achieved. Automatic debris collection of the process improves the safety and efficiency of the cutting process.
Patent Information
- Application Number
- CN202420259985.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-02
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-02-02
AI Technical Summary
The existing wafer laser cutting machines lack protection mechanisms, which leads to the risk of injuring human hands during the cutting process.
A wafer laser cutting machine with a protective mechanism is designed, including components such as substrate, rotary table, glass cover and storage table. The in-situ rotation of the rotary table and the clamping of the glass cover can be achieved to fix and protect the wafer. The laser cutter is installed on the upper right side of the glass cover to avoid contact with the laser by hand. At the same time, through the coordination of the material pump and the hose, the collection and storage of cutting debris is achieved.
It realizes safe fixation and protection of the wafer, avoids the risk of manual contact with laser, and improves the safety and efficiency of the cutting process through the automatic collection of debris.
Smart Images
Figure CN222471150U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser cutting machines, in particular to a wafer laser cutting machine with a protection mechanism. Background Art
[0002] Wafer is another name for a silicon chip, which is pulled from polysilicon. The finished product needs to be ground, polished and other operations before it can be implanted in semiconductors. With the update and advancement of technology, wafers are also required to be processed into accessories of different sizes. In order to ensure that the cutting is of sufficient standard, a laser cutting machine is required. This object is often manually loaded and unloaded. Under the premise of maintaining speed, laser cutting and other operations are often carried out as soon as the silicon wafer is placed. It is very dangerous and lacks protective mechanisms. There is a risk of laser beams injuring people's hands.
[0003] Now, a new type of wafer laser cutting machine with a protection mechanism is proposed to solve the above problems. Utility Model Content
[0004] The utility model aims to provide a wafer laser cutting machine with a protection mechanism to solve the problem of lack of protection mechanism in the above-mentioned background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer laser cutting machine with a protective mechanism, comprising a base plate and a turntable, the turntable is movably connected to the center of the top of the base plate, a motor is installed at the center of the inside of the base plate, a hanging plate is installed on the right side of the top of the base plate, and a connecting pipe is installed on the left side of the bottom of the hanging plate, a glass cover is welded to the bottom of the connecting pipe, and bead grooves are provided on both sides of the bottom of the glass cover, and balls are movably embedded in the bead grooves, an annular slideway is opened around the top edge of the turntable, four sets of storage tables are fixed on the top of the turntable, a notch is opened in the center behind the glass cover, and a laser cutter is installed on the upper right side of the inside of the glass cover.
[0006] Preferably, the glass cover is clamped on the top of the turntable, and the glass cover and the turntable are in the same vertical plane.
[0007] Preferably, the output end of the motor is fixedly connected to the bottom of the turntable, and the turntable can rotate in situ below the glass cover.
[0008] Preferably, a motor is fixed on one side of the outside of the storage table, a bidirectional screw rod is movably connected between the two sides inside the storage table, and shaft sleeves are sleeved on both sides of the outside of the bidirectional screw rod, a vertical rod is welded on the top of the shaft sleeve, and a frosting pad is pasted on one side of the vertical rod.
[0009] Preferably, the output shaft of the motor is fixedly connected to the bidirectional screw rod, and the shaft sleeve is provided with a thread matching the bidirectional screw rod.
[0010] Preferably, the bottom of the vertical rod passes through the storage platform and is connected to the shaft sleeve, and the sanding pad and the vertical rod can move horizontally with the shaft sleeve.
[0011] Preferably, a sleeve is welded to the left side of the top of the hanging plate, and a cannula is longitudinally inserted in the sleeve, a bolt is threadedly connected to the front of the sleeve, a circular groove is arranged between the connecting tube and the glass cover, a storage box is welded to the right side of the top of the hanging plate, and positioning sleeves are welded on both sides of the inside of the storage box, a net bag is longitudinally inserted between the positioning sleeves, a sealing cover is inserted above the storage box, and a material pump is installed on the upper left of the sealing cover, and a hose is fixed between the input end of the material pump and the cannula.
[0012] Preferably, the insert tube can slide longitudinally along the inner wall of the sleeve, and the bolt can lock the position of the insert tube inside the sleeve.
[0013] Compared with the prior art, the utility model has the following beneficial effects: the wafer laser cutting machine with the protection mechanism not only realizes the added protection operation and the rapid locking of the wafer, but also realizes the collection of cutting debris;
[0014] (1) A glass cover is welded at the bottom of the connecting tube, and the motor controls the top rotary table to rotate in place. The glass cover is clamped on the top of the rotary table under the connection of the hanging plate. The laser cutter is also installed on the upper right side of the glass cover, corresponding to the storage table on the right side of the top of the rotary table. When the rotary table rotates, the four sets of storage tables can be fitted with the glass cover by means of an annular slide, so that the accessories installed on the surface of the storage table can be operated by the laser cutter in turn. The slot at the rear is specially used for placing and taking wafer accessories, which can avoid human hands from contacting the laser working area;
[0015] (2) By fixing four sets of storage tables on the top of the rotating table, the wafer is placed on the rotating table at the slot, and the motor installed on the surface is immediately started, which can guide the shaft sleeve of the bidirectional screw rod to slide along the internal chamber of the storage table, and then synchronously retract the vertical rod and the grinding pad, which can clamp and fix the wafer from both sides to prevent it from shaking. After the end, it will automatically open for people to take the object;
[0016] (3) A storage box is welded on the right side of the top of the hanging plate. The insert tube is pulled vertically along the sleeve to move back and forth between the connecting tube and the circular groove below. The height of the insert tube is adjusted according to the size of the wafer and the bolts are tightened to fix it. The storage box is connected to the net bag by means of the positioning sleeves on both sides and the top is also covered with a sealing cover. The hose is connected through a material pump. When the storage table is rotated to the bottom of the insert tube, the debris generated by the laser cutter can be sucked and stored in the storage box through the hose and the material pump. Residues of different sizes can also be separated. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;
[0018] Figure 2 For the utility model Figure 1 A schematic diagram of the enlarged structure of the local section at point A in the middle;
[0019] Figure 3 This is a schematic diagram of the front cross-sectional structure of the storage table of the utility model;
[0020] Figure 4 It is a schematic diagram of the front cross-sectional structure of the storage box of the present utility model.
[0021] In the figure: 1. base plate; 2. rotating table; 3. glass cover; 4. storage table; 5. motor; 6. hanging plate; 7. sleeve; 8. cannula; 9. hose; 10. material pump; 11. sealing cover; 12. storage box; 13. laser cutter; 14. notch; 15. motor; 16. connecting pipe; 17. round groove; 18. net bag; 19. positioning sleeve; 20. bolt; 21. frosted pad; 22. bidirectional screw rod; 23. vertical rod; 24. bushing; 25. ball groove; 26. ball bearing; 27. annular slide. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] Example 1: Please refer to Figure 1-4 , a wafer laser cutting machine with a protective mechanism, comprising a substrate 1 and a rotary table 2, the rotary table 2 is movably connected at the center of the top of the substrate 1, a motor 15 is installed at the center of the inside of the substrate 1, a hanging plate 6 is installed on the right side of the top of the substrate 1, and a connecting pipe 16 is installed on the left side of the bottom of the hanging plate 6, a glass cover 3 is welded to the bottom of the connecting pipe 16, and bead grooves 25 are provided on both sides of the bottom of the glass cover 3, and balls 26 are movably embedded in the bead grooves 25, an annular slideway 27 is excavated around the top edge of the rotary table 2, four sets of storage tables 4 are fixed on the top of the rotary table 2, a notch 14 is provided at the center of the rear of the glass cover 3, and a laser cutter 13 is installed on the upper right side of the inside of the glass cover 3;
[0024] The glass cover 3 is clamped on the top of the rotating platform 2, the glass cover 3 and the rotating platform 2 are in the same vertical plane, the output end of the motor 15 is fixedly connected to the bottom of the rotating platform 2, and the rotating platform 2 can rotate in situ below the glass cover 3;
[0025] Specifically, Figure 1 and Figure 2 As shown, the motor 5 controls the top turntable to rotate in situ, and the glass cover 3 is clamped on the top of the turntable 2 under the connection of the hanging plate 6. The laser cutter 13 is also installed on the upper right side of the glass cover 3, corresponding to the storage table 4 on the right side of the top of the turntable 2. When the turntable 2 rotates, the four sets of storage tables 4 can be fitted with the glass cover 3 by means of the annular slide 27, so that the accessories installed on the surface of the storage table 4 can be operated by the laser cutter 13 in sequence.
[0026] Embodiment 2: A motor 5 is fixed to one side of the outside of the storage table 4, a bidirectional screw rod 22 is movably connected between the two sides of the inside of the storage table 4, and a shaft sleeve 24 is sleeved on both sides of the outside of the bidirectional screw rod 22, a vertical rod 23 is welded to the top of the shaft sleeve 24, and a frosting pad 21 is pasted on one side of the vertical rod 23;
[0027] The output shaft of the motor 5 is fixedly connected to the bidirectional screw 22, and the sleeve 24 is provided with a thread matching the bidirectional screw 22. The bottom of the vertical rod 23 passes through the storage table 4 and is connected to the sleeve 24. The sanding pad 21 and the vertical rod 23 can move horizontally with the sleeve 24.
[0028] Specifically, Figure 1 and Figure 3 As shown, the wafer is placed on the rotary table 2 at the slot 14, and the motor 5 mounted on the surface is immediately started, which can guide the shaft sleeve 24 on the outside of the bidirectional screw rod 22 to slide along the internal chamber of the storage table 4, and then synchronously retract the vertical rod 23 and the grinding pad 21, which can be clamped and fixed from both sides of the wafer to prevent it from shaking.
[0029] Embodiment 3: A sleeve 7 is welded to the left side of the top of the hanging plate 6, and a cannula 8 is longitudinally inserted in the sleeve 7, a bolt 20 is threadedly connected to the front of the sleeve 7, a circular groove 17 is provided between the connecting pipe 16 and the glass cover 3, a storage box 12 is welded to the right side of the top of the hanging plate 6, and positioning sleeves 19 are welded on both sides of the inside of the storage box 12, a net bag 18 is longitudinally inserted between the positioning sleeves 19, a sealing cover 11 is inserted above the storage box 12, and a material pump 10 is installed on the upper left of the sealing cover 11, a hose 9 is fixed between the input end of the material pump 10 and the cannula 8, the cannula 8 can slide longitudinally along the inner wall of the sleeve 7, and the bolt 20 can lock the position of the cannula 8 inside the sleeve 7;
[0030] Specifically, Figure 1 and Figure 4As shown, the insert tube 8 is pulled vertically along the sleeve 7 to move back and forth between the connecting tube 16 and the circular groove 17 below. The height of the insert tube 8 is adjusted according to the size of the wafer, and the bolts 20 are turned to fix it. The net bag 18 is connected to the storage box 12 by means of the positioning sleeves 19 on both sides, and the top is also covered with a sealing cover 11. The hose 9 is connected through the material pump 10. When the storage table 4 is rotated to the bottom of the insert tube 8, the debris generated by the laser cutter 13 can be sucked and stored in the storage box 12 through the hose 9 and the material pump 10.
[0031] Working principle: When the utility model is in use, firstly, the wafer is placed on the rotary table 2 at the slot 14, and the motor 5 installed on the surface is immediately started, which can guide the shaft sleeve 24 of the outer sleeve of the bidirectional screw rod 22 to slide along the internal chamber of the storage table 4, and then synchronously retract the vertical rod 23 and the frosting pad 21, which can be clamped and fixed from both sides of the wafer to prevent it from shaking. After that, the motor 5 controls the top rotary table to rotate in situ, and the glass cover 3 is clamped on the top of the rotary table 2 under the connection of the hanging plate 6. The laser cutter 13 is also installed on the upper right side of the glass cover 3, corresponding to the storage table 4 on the right side of the top of the rotary table 2. When the rotary table 2 rotates, the four sets of storage tables 4 can be fitted with the glass cover 3 by means of the annular slide 27, so that The accessories installed on the surface of the storage table 4 are operated by the laser cutter 13 in turn, and the slot 14 at the rear is specifically used to place and take wafer accessories to avoid human hands from touching the working area of the laser. The insert tube 8 is pulled vertically along the sleeve 7 in advance to move back and forth between the connecting tube 16 and the circular groove 17 below. The height of the insert tube 8 is adjusted according to the size of the wafer, and the bolt 20 is tightened to fix it. The net bag 18 is connected to the storage box 12 by the positioning sleeves 19 on both sides, and the top is also covered with a sealing cover 11. The hose 9 is connected through the material pump 10. When the storage table 4 is rotated to the bottom of the insert tube 8, the debris generated by the laser cutter 13 can be absorbed and stored in the storage box 12 through the hose 9 and the material pump 10.
[0032] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
Claims
1. A wafer laser cutting machine with a protection mechanism, comprising a base plate (1) and a rotary table (2), characterized in that: A rotary table (2) is movably connected at the center of the top of the base plate (1), a motor (15) is installed at the center of the inside of the base plate (1), a hanging plate (6) is installed on the right side of the top of the base plate (1), and a connecting pipe (16) is installed on the left side of the bottom of the hanging plate (6), a glass cover (3) is welded to the bottom of the connecting pipe (16), and both sides of the bottom of the glass cover (3) are provided with bead grooves (25), and balls (26) are movably embedded in the bead grooves (25), an annular slideway (27) is excavated around the top edge of the rotary table (2), four sets of storage tables (4) are fixed on the top of the rotary table (2), a notch (14) is opened at the center of the rear of the glass cover (3), and a laser cutter (13) is installed on the upper right side of the inside of the glass cover (3).
2. A wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: The glass cover (3) is clamped on the top of the rotating platform (2), and the glass cover (3) and the rotating platform (2) are located in the same vertical plane.
3. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: The output end of the motor (15) is fixedly connected to the bottom of the rotary table (2), and the rotary table (2) can rotate in situ below the glass cover (3).
4. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: A motor (5) is fixed to one side of the outside of the storage platform (4), a bidirectional screw rod (22) is movably connected between the two sides inside the storage platform (4), and shaft sleeves (24) are sleeved on both sides of the outside of the bidirectional screw rod (22), a vertical rod (23) is welded to the top of the shaft sleeve (24), and a grinding pad (21) is attached to one side of the vertical rod (23).
5. The wafer laser cutting machine with a protection mechanism according to claim 4, characterized in that: The output shaft of the motor (5) is fixedly connected to the bidirectional screw rod (22), and the shaft sleeve (24) is provided with a thread matching the bidirectional screw rod (22).
6. The wafer laser cutting machine with a protection mechanism according to claim 4, characterized in that: The bottom of the vertical rod (23) passes through the storage platform (4) and is connected to the shaft sleeve (24), and the sanding pad (21) and the vertical rod (23) can move horizontally along with the shaft sleeve (24).
7. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: A sleeve (7) is welded to the left side of the top of the hanging plate (6), and a cannula (8) is longitudinally inserted in the sleeve (7), a bolt (20) is threadedly connected to the front of the sleeve (7), a circular groove (17) is arranged between the connecting pipe (16) and the glass cover (3), a storage box (12) is welded to the right side of the top of the hanging plate (6), and positioning sleeves (19) are welded to both sides of the storage box (12), a net bag (18) is longitudinally inserted between the positioning sleeves (19), a sealing cover (11) is inserted above the storage box (12), and a material pump (10) is installed on the upper left of the sealing cover (11), and a hose (9) is fixed between the input end of the material pump (10) and the cannula (8).
8. The wafer laser cutting machine with a protection mechanism according to claim 7, characterized in that: The insert tube (8) can slide longitudinally along the inner wall of the sleeve (7), and the bolt (20) can lock the position of the insert tube (8) inside the sleeve (7).