Manipulator device for improving dry film hole breaking and automatic exposure machine

By adopting a combination design of a small suction nozzle and a suction box in the robotic device of the automatic exposure machine, the dry film rupture and chip loss caused by the unreasonable suction nozzle design in the prior art is solved, and better plate stress is achieved and production efficiency reduces the occurrence and inspection workload of defective products.

CN222472542UActive Publication Date: 2025-02-14江西景旺精密电路有限公司
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Patent Information

Application Number
CN202420331163.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-22
Publication Date
2025-02-14
Estimated Expiration
2034-02-22

AI Technical Summary

Technical Problem

The nozzle design of the existing automatic exposure machine robot device is unreasonable, which leads to excessive local suction force when producing thick copper large-hole plates, and the nozzle can easily fall into the production plate unit, causing notches to open circuits. Bad problems.

Method used

A plurality of small suction nozzles are arranged in two rows, respectively arranged at both ends of the robot device, for grabbing the edge of the plate, and a suction box is arranged in the middle to enter the production plate unit and grab the production plate unit. The suction box includes a gas pressure entry tube, a sponge and other structures, and outputs the air pressure of the suction plate through multiple through holes to increase the stress area on the plate surface.

Benefits of technology

Reduces the risk of sucking and breaking dry film into the production board unit, reduces the problem of scrubbing and removing chips into the production board unit, improves the problem of squeezing dry film on the edge of the plate when grasping large plate thick copper plates, and reduces the problem of The frequency of copper-free holes occurs, thus reducing the workload of employees.

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Abstract

The utility model discloses a manipulator device for improving dry film hole breaking and an automatic exposure machine, and belongs to the technical field of printed circuit boards. The manipulator device comprises a plurality of small suction nozzles, the small suction nozzles are divided into two rows and are arranged at the two ends of the manipulator device respectively, and the small suction nozzles are used for grabbing the edge of the plate; and the suction box is arranged in the middle of the manipulator device and is used for feeding the production board unit and grabbing the production board unit. According to the manipulator device for improving dry film hole breaking and the automatic exposure machine provided by the embodiment of the invention, the small suction nozzle does not enter the production board unit, so that the risk that the small suction nozzle enters the production board unit to suck and break the dry film is reduced, and meanwhile, the problem that the small suction nozzle rubs to fall off and enters the production board unit is reduced; a suction nozzle entering a production plate unit is changed into a suction box, so that the stress area of a plate surface can be increased, and the problem of wrinkling of a plate edge dry film caused by only grabbing two ends when a large-plate thick copper plate is grabbed is solved; bad occurrence of copper-free holes is reduced, and the inspection workload of field staff is reduced.
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Description

Technical Field

[0001] The present application belongs to the technical field of printed circuit boards, and in particular to a robot device and an automatic exposure machine for improving dry film hole breaking. Background Art

[0002] In the printed circuit board industry, customers often use automatic exposure machines for online production to improve production efficiency and reduce labor costs. However, with the increasing number of thick copper and large hole boards in automobiles, the nozzle design of the existing automatic exposure machine's manipulator device is unreasonable, and copper-free holes often occur, which has seriously affected product quality and the subsequent increase in employee inspection workload and equipment investment costs for picking out defects. For example, Figure 1 As shown, the suction nozzles 11 of the robot device of the existing automatic exposure machine are evenly distributed throughout the production board. If a single suction nozzle 11 faces a large hole, the local suction force is too large, which can easily cause the dry film to break. In addition, the two ends of the suction nozzle 11 are arranged to grab the edge of the board, which can easily cause wrinkles in the dry film at the edge of the board. Utility Model Content

[0003] The present application provides a robot device and an automatic exposure machine for improving dry film hole breaking, which are used to solve the above-mentioned technical problems.

[0004] In order to achieve the above application purpose, the technical solution adopted in this application is as follows:

[0005] In a first aspect, an embodiment of the present application provides a robot device for improving dry film puncture, comprising:

[0006] A plurality of small suction nozzles, which are divided into two rows and respectively arranged at both ends of the manipulator device, and are used to grasp the edge of the board;

[0007] A suction box is arranged in the middle of the manipulator device and is used for entering the production board unit and grasping the production board unit.

[0008] In some embodiments, the suction box includes:

[0009] The box body has an air pressure inlet pipe on the top and a plurality of first through holes on the bottom, and the air pressure inlet pipe is used to introduce air pressure into the suction plate;

[0010] The sponge is padded at the bottom of the box body, and a plurality of second through holes are opened on the sponge, and the plurality of second through holes correspond to the plurality of first through holes one by one.

[0011] In some embodiments, the second through hole has a larger aperture size than the first through hole.

[0012] In some embodiments, the plurality of first through holes are evenly distributed on the bottom of the box body.

[0013] In a second aspect, an embodiment of the present application provides an automatic exposure machine, including a robot device for improving dry film puncture provided in the first aspect.

[0014] Compared with the prior art, the beneficial effects of the embodiments of the present application are:

[0015] The embodiments of the present application provide a robot device and an automatic exposure machine for improving dry film hole breaking. The small suction nozzle does not enter the production board unit, reducing the risk of the small suction nozzle entering the production board unit to suck and break the dry film, while reducing the problem of the small suction nozzle rubbing and dropping debris into the production board unit. The suction nozzle entering the production board unit is changed to a suction box, which can increase the force-bearing area of ​​the board surface, improve the problem of wrinkling of the dry film on the edge of the board caused by only grabbing the two ends when grabbing a thick copper plate, reduce the occurrence of defects due to no copper in the hole, and reduce the inspection workload of on-site employees. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic diagram showing the layout of the nozzles of the robot device of the automatic exposure machine provided by the related art is shown;

[0018] Figure 2 A schematic diagram showing the layout of a small suction nozzle and a suction box of a manipulator device for improving dry film puncture provided in an embodiment of the present application is shown;

[0019] Figure 3 A schematic structural diagram of a suction box of a manipulator device for improving dry film puncture provided in an embodiment of the present application is shown;

[0020] Figure 4 A schematic structural diagram of a sponge provided in an embodiment of the present application is shown.

[0021] Illustration Description:

[0022] 11. Suction nozzle; 21. Small suction nozzle; 31. Suction box; 32. Air pressure inlet tube; 33. First through hole; 34. Sponge; 35. Second through hole; 36. Box body. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0026] Figure 1 The schematic diagram of the layout of the nozzle of the robot device of the automatic exposure machine provided by the related technology is shown. Such a setting has the following technical problems:

[0027] (1) The suction nozzles 11 of the robot device of the automatic exposure machine are all over the board surface. When producing thick copper large-hole boards, a single suction nozzle 11 is facing the large hole, resulting in a large force on the local area, and the dry film on the hole of the board is easily broken by suction.

[0028] (2) The nozzle 11 is prone to dropping chips into the production board unit, causing the problem of notch opening defects.

[0029] (3) The two ends of the suction nozzle 11 are arranged to grab the edge of the board. When producing thick copper plates, it is easy to suck the dry film on the edge of the board.

[0030] In view of this, the embodiment of the present application provides a robot device and automatic exposure machine for improving the hole breaking of dry film, the original suction nozzle is changed into a smaller suction nozzle, and then all the small suction nozzles are arranged into two rows, one row is arranged at each end, and the small suction nozzles at the two ends grasp the edge of the board during production, and the small suction nozzles do not enter the production board unit, reducing the risk of the small suction nozzles entering the production board unit to suck and break the dry film, and at the same time reducing the problem of small suction nozzles rubbing and dropping debris into the production board unit; all the original suction nozzles entering the production board unit are cancelled and replaced with a suction box. Changing the suction nozzle to a suction box can increase the force points on the board surface and improve the problem of wrinkling of the dry film on the edge of the board caused by only grasping the two ends when grasping a thick copper plate.

[0031] In order to illustrate the technical solution described in this application, a specific embodiment is provided below for illustration.

[0032] Figure 2 A schematic diagram of the layout of a small suction nozzle and a suction box of a robot device for improving dry film puncture provided in an embodiment of the present application is shown.

[0033] like Figure 2As shown, the robot device for improving dry film puncture provided by the embodiment of the present application includes two rows of small suction nozzles 21 located at both ends of the robot and a suction box 31 located in the middle.

[0034] The embodiment of the present application does not specifically limit the size of the small suction nozzle 21. The technicians can adjust the size of the small suction nozzle 21 as needed to reduce the risk of large force on the local area and reduce the risk of rupturing the dry mouth membrane on the panel surface.

[0035] Figure 3 A schematic structural diagram of a suction box of a robot device for improving dry film puncture provided in an embodiment of the present application is shown. Figure 4 A schematic structural diagram of a sponge provided in an embodiment of the present application is shown.

[0036] like Figure 3 and Figure 4 As shown, the top of the suction box 31 is provided with an air pressure inlet pipe 32, and the bottom is provided with a plurality of first through holes 33. For example, the suction box 31 includes a box body 36, the top of the box body 36 is provided with an air pressure inlet pipe 32, and the bottom of the box body 36 is provided with a plurality of first through holes 33. For example, the plurality of first through holes 33 are evenly distributed at the bottom of the box body 36.

[0037] The bottom of the box body 36 is also padded with a sponge 34, and a plurality of second through holes 35 corresponding to the first through holes 33 are provided on the sponge 34, and the aperture size of the second through holes 35 is larger than the aperture size of the first through holes 33. When in use, the suction plate air pressure enters the box body 36 from the air pressure inlet tube 32 of the suction box 31, and then the air pressure is dispersed by the plurality of first through holes 33 to increase the force-bearing area; and then the plate is sucked through the second through holes 35 with a larger size on the sponge 34, which increases the force-bearing area of ​​the plate surface again, and further reduces the risk of excessive local single-point air pressure. In this way, the suction plate air pressure can be output through the plurality of first through holes 33 and the plurality of second through holes 35 to act in the production plate unit. Suctioning the plate through multiple through holes can reduce the problem of excessive local single-point air pressure.

[0038] The above-mentioned robot device for improving dry film puncture has the following advantages:

[0039] (1) The small suction nozzle 21 does not enter the production board unit, reducing the risk of the small suction nozzle 21 entering the production board unit to suck and break the dry film, and at the same time reducing the problem of the small suction nozzle 21 rubbing and dropping chips into the production board unit.

[0040] (2) The suction nozzle of the production board unit is changed to a suction box 21, which can increase the force points on the board surface and improve the wrinkling problem of the dry film on the board edge caused by only grabbing the two ends when grabbing a thick copper plate.

[0041] (3) Reduce the occurrence of defects caused by lack of copper in holes and reduce the inspection workload of on-site employees.

[0042] In some embodiments of the present application, an automatic exposure machine is also provided, including a robot device for improving dry film puncture provided by any of the above embodiments, which also has the above beneficial effects.

[0043] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A robot device for improving dry film puncture, characterized in that: include: A plurality of small suction nozzles, which are divided into two rows and respectively arranged at two ends of the manipulator device, and are used to grasp the edge of the board; A suction box is arranged in the middle of the manipulator device and is used for entering the production board unit and grasping the production board unit.

2. The robot device according to claim 1, characterized in that: The suction box comprises: A box body, wherein an air pressure inlet pipe is arranged on the top of the box body, and a plurality of first through holes are opened on the bottom, wherein the air pressure inlet pipe is used to introduce air pressure into the suction plate; The sponge is padded at the bottom of the box body, and a plurality of second through holes are opened on the sponge, and the plurality of second through holes correspond to the plurality of first through holes one by one.

3. The robot device according to claim 2, characterized in that: The aperture size of the second through hole is larger than the aperture size of the first through hole.

4. The robot device according to claim 2, characterized in that: The plurality of first through holes are evenly distributed on the bottom of the box body.

5. An automatic exposure machine, characterized in that: A robot device for improving dry film puncture according to any one of claims 1 to 4.