Anti-sinking wafer packaging box

By designing the protective structure and limit structure in the wafer packaging box, the problem of the packaging box being prone to depression under external pressure is solved, achieving higher compressive resistance and a more stable wafer protection effect.

CN222474919UActive Publication Date: 2025-02-14EPAK TECHNOLOGIES (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202421358919.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-13
Publication Date
2025-02-14
Estimated Expiration
2034-06-13

AI Technical Summary

Technical Problem

Wafer packaging boxes are prone to depression when they are under external pressure, resulting in damage to the packaging boxes and damage to the wafer.

Method used

An anti-depressed wafer packaging box was designed, adopting a protective structure and a limit structure. The protective structure includes a engaging block, a reserved groove, a compression sheet and a reinforcement sheet. Through the engaging structure and a limiting structure, the compression sheet and the reinforcement sheet are symmetrically limited to the outer side wall of the box, thereby enhancing the compression resistance of the box. . The limit structure includes a limit spring, a limit plate and protective pads to stabilize the wafer and avoid extrusion damage to the wafer by the limit plate.

Benefits of technology

By setting up a protective structure and a limit structure, the compressive resistance of the packaging box is significantly improved, the depression phenomenon is avoided, the protection effect of the wafer is enhanced, and the packaging box is stronger and more stable when used.

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Abstract

The utility model is suitable for the technical field of wafer packaging, and provides an anti-sinking type wafer packaging box which comprises a box body, a box cover is arranged at the top end of the box body, connecting columns are fixed to the two sides of the bottom end of the box cover, clamping grooves are formed in the two sides of the interior of the box body, reserved grooves are formed in the clamping blocks, and the reserved grooves are communicated with the box body. A compression-resistant piece is fixed to the outer side wall of the reserved groove, and a reinforcing piece is fixed to the outer side wall of the compression-resistant piece. Through the arrangement of the protection structure, a plurality of reserved grooves are fixed to one sides of the compression-resistant pieces at equal intervals, the reserved grooves are correspondingly limited in clamping blocks through the clamping structures of the clamping blocks and the reserved grooves, and the two sets of compression-resistant pieces can be symmetrically limited to the outer side wall of the box body; the reinforcing pieces can be symmetrically limited on the outer side wall of the box body, and the outer side wall of the box body is protected through the reinforcing pieces and the compression-resistant pieces, so that the packaging box is firmer during use, and recesses are avoided.
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Description

Technical Field

[0001] The utility model belongs to the field of wafer packaging, and in particular relates to an anti-sag type wafer packaging box. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. The silicon crystal rod is ground, polished, and sliced ​​to form a silicon wafer, or wafer. After the wafer is produced, it needs to be packaged, so a wafer packaging box is involved.

[0003] When the wafer packaging box is used to package wafers for transportation, damage to the packaging will cause damage to the wafers inside the packaging box. Therefore, the protective structure is designed to improve the pressure resistance of the wafer packaging box, prevent the packaging box from being dented, and avoid external pressure from damaging the packaging box and affecting the wafers inside the packaging box. Utility Model Content

[0004] The utility model provides an anti-sag type wafer packaging box, aiming to solve the problem that the wafer packaging box is prone to be dented when subjected to external pressure during use.

[0005] The utility model is implemented as follows: an anti-sag type wafer packaging box comprises a box body, a box cover is arranged at the top of the box body, connecting columns are fixed on both sides of the bottom of the box cover, engaging grooves are arranged on both sides of the inside of the box body, a protective structure is arranged on the outer side wall of the box body, a limiting structure is arranged at the bottom of the box cover, and a placement groove is arranged inside the top of the box body;

[0006] The protective structure comprises a snap-fit ​​block, which is arranged inside the outer wall of the box body, a reserved groove is arranged inside the snap-fit ​​block, an anti-compression sheet is fixed on the outer wall of the reserved groove, and a reinforcement sheet is fixed on the outer wall of the anti-compression sheet.

[0007] Preferably, the inner diameter of the engaging block is larger than the outer diameter of the reserved groove, and the engaging block and the reserved groove form an engaging structure.

[0008] Preferably, a plurality of the engaging blocks are provided, and the plurality of the engaging blocks are distributed at equal intervals on the outer side wall of the box body.

[0009] Preferably, the limiting structure comprises a limiting spring, the limiting spring is fixed to the bottom end of the box cover, a limiting plate is fixed to the bottom end of the limiting spring, and a protective cushion is fixed to the bottom end of the limiting plate.

[0010] Preferably, a plurality of the limit springs are provided, and the plurality of limit springs are evenly distributed at the bottom end of the box cover.

[0011] Preferably, two groups of the limiting plates are provided, and the two groups of the limiting plates are symmetrically distributed about the central axis of the box cover.

[0012] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0013] By setting up a protective structure, a number of reserved grooves are provided and fixed at equal intervals on one side of the anti-compression sheet. Through the clamping structure of the clamping block and the reserved grooves, the corresponding limits of the several reserved grooves are inside the clamping block, so that the two groups of anti-compression sheets can be symmetrically limited on the outer wall of the box body, and the reinforcement sheet can be symmetrically limited on the outer wall of the box body. The outer wall of the box body is protected by the reinforcement sheet and the anti-compression sheet, so that the packaging box is more sturdy when in use to avoid dents.

[0014] By setting a limiting structure and fixing it evenly at the bottom end of the box cover through a limiting spring, the two sets of limiting plates can be symmetrically limited at the bottom end of the box cover, and the protective pad is fixed at the bottom end of the limiting plate, so that when the limiting plate is pressed against the wafer placed in the placement slot, the protective pad can protect the wafer, avoiding damage to the wafer caused by squeezing by the limiting plate, making the wafer more stable when placed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 3 The utility model Figure 1 The enlarged structural diagram at A in the middle;

[0018] Figure 4 This is a partial upward structural schematic diagram of the utility model.

[0019] In the figure: 1. box body; 2. snap-fit ​​groove; 3. connecting column; 4. box cover; 5. limiting structure; 501. limiting spring; 502. limiting plate; 503. protective cushion; 6. protective structure; 601. reinforcing plate; 602. anti-pressure plate; 603. snap-fit ​​block; 604. reserved groove; 7. placement groove. DETAILED DESCRIPTION

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] The utility model embodiment provides an anti-sag type wafer packaging box, such as Figure 1-4 As shown, it includes a box body 1, a box cover 4 is arranged on the top of the box body 1, connecting columns 3 are fixed on both sides of the bottom of the box cover 4, locking grooves 2 are arranged on both sides of the inside of the box body 1, a protective structure 6 is arranged on the outer wall of the box body 1, and a limiting structure 5 is arranged at the bottom of the box cover 4.

[0023] It should be noted that since the wafer packaging box is prone to dents when subjected to external pressure during use, the present solution provides a protective structure 6, with a number of reserved grooves 604 being equally spaced and fixed on one side of the anti-compression sheet 602. Through the snap-fit ​​structure between the snap block 603 and the reserved grooves 604, the corresponding positions of the number of reserved grooves 604 are limited inside the snap block 603, so that the two groups of anti-compression sheets 602 can be symmetrically limited on the outer wall of the box body 1, and the reinforcement sheet 601 can be symmetrically limited on the outer wall of the box body 1. The outer wall of the box body 1 is protected by the reinforcement sheet 601 and the anti-compression sheet 602, so that the packaging box is more sturdy during use to avoid dents.

[0024] Specifically, in this embodiment, this scheme mainly includes a protective structure 6, and the protective structure 6 includes a snap-fit ​​block 603. The snap-fit ​​block 603 is arranged inside the outer wall of the box body 1. A reserved groove 604 is arranged inside the snap-fit ​​block 603. An anti-compression sheet 602 is fixed on the outer wall of the reserved groove 604. A reinforcing sheet 601 is fixed on the outer wall of the anti-compression sheet 602. First, the snap-fit ​​blocks 603 are evenly opened on the outer wall of the box body 1, and then the reserved grooves 604 are fixed on one side of the anti-compression sheet 602 at equal intervals, and then the reinforcing sheet 601 is fixed on the other side of the anti-compression sheet 602. Then, several reserved grooves 604 are correspondingly limited inside the snap-fit ​​block 603, so that two groups of anti-compression sheets 602 are symmetrically limited on the outer wall of the box body 1, so as to protect the outer wall of the box body 1 and prevent the packaging box from being dented when subjected to external pressure.

[0025] In a further preferred embodiment of the present invention, Figure 1 , Figure 2 and Figure 3 As shown, the inner diameter of the snap-fit ​​block 603 is larger than the outer diameter of the reserved groove 604, and the snap-fit ​​block 603 and the reserved groove 604 form a snap-fit ​​structure. A plurality of snap-fit ​​blocks 603 are provided, and the plurality of snap-fit ​​blocks 603 are evenly spaced on the outer wall of the box body 1. Through the snap-fit ​​structure between the snap-fit ​​block 603 and the reserved groove 604, the anti-compression sheet 602 can be limited on the outer wall of the box body 1. The evenly spaced distribution of the snap-fit ​​blocks 603 facilitates the corresponding limitation of the plurality of reserved grooves 604 inside the snap-fit ​​block 603.

[0026] Specifically, in this embodiment, this scheme mainly includes a limiting structure 5, and the limiting structure 5 includes a limiting spring 501, and the limiting spring 501 is fixed to the bottom end of the box cover 4, and the bottom end of the limiting spring 501 is fixed with a limiting plate 502, and the bottom end of the limiting plate 502 is fixed with a protective cushion 503. First, the protective cushion 503 is fixed to the bottom end of the limiting plate 502, and then the limiting spring 501 is evenly fixed to the bottom end of the box cover 4, and then the top end of the limiting plate 502 is fixed to the bottom end of the limiting spring 501, so that the two groups of limiting plates 502 can be symmetrically limited at the bottom end of the box cover 4, so that when the box cover 4 is limited at the top end of the box body 1, the limiting plate 502 can press and limit the wafer inside the placement slot 7 to prevent the wafer from shaking inside the placement slot 7.

[0027] In a further preferred embodiment of the present invention, Figure 1 and Figure 4As shown, a plurality of limit springs 501 are provided, and the plurality of limit springs 501 are evenly distributed at the bottom end of the box cover 4. Two groups of limit plates 502 are provided, and the two groups of limit plates 502 are symmetrically distributed about the central axis of the box cover 4. The even distribution of the limit springs 501 enables the limit plates 502 to be stably limited at the bottom end of the box cover 4, and the symmetrical distribution of the two groups of limit plates 502 enables the limit plates 502 to limit the wafer inside the placement slot 7 more stably.

[0028] It should be noted that, for the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the utility model is not limited by the described action sequence, because according to the utility model, some steps may be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the utility model.

[0029] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely schematic, such as the division of the above-mentioned units. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunication or other forms.

[0030] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0031] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. An anti-sag type wafer packaging box, characterized in that: The box body (1) comprises a box cover (4) at the top end of the box body (1), connecting columns (3) are fixed on both sides of the bottom end of the box cover (4), engaging grooves (2) are arranged on both sides of the inside of the box body (1), a protective structure (6) is arranged on the outer wall of the box body (1), a limiting structure (5) is arranged at the bottom end of the box cover (4), and a placement groove (7) is arranged inside the top end of the box body (1); The protective structure (6) comprises a snap-fit ​​block (603), wherein the snap-fit ​​block (603) is arranged inside the outer wall of the box body (1), a reserved groove (604) is arranged inside the snap-fit ​​block (603), an anti-compression sheet (602) is fixed on the outer wall of the reserved groove (604), and a reinforcing sheet (601) is fixed on the outer wall of the anti-compression sheet (602).

2. The anti-sag type wafer packaging box according to claim 1, characterized in that: The inner diameter of the locking block (603) is greater than the outer diameter of the reserved groove (604), and the locking block (603) and the reserved groove (604) form a locking structure.

3. The anti-sag type wafer packaging box according to claim 1, characterized in that: A plurality of the locking blocks (603) are provided, and the plurality of the locking blocks (603) are distributed at equal intervals on the outer side wall of the box body (1).

4. The anti-sag type wafer packaging box according to claim 1, characterized in that: The limiting structure (5) comprises a limiting spring (501), wherein the limiting spring (501) is fixed to the bottom end of the box cover (4), a limiting plate (502) is fixed to the bottom end of the limiting spring (501), and a protective cushion (503) is fixed to the bottom end of the limiting plate (502).

5. The anti-sag type wafer packaging box according to claim 4, characterized in that: A plurality of the limit springs (501) are provided, and the plurality of limit springs (501) are evenly distributed at the bottom end of the box cover (4).

6. The anti-sag type wafer packaging box according to claim 4, characterized in that: Two groups of the limiting plates (502) are provided, and the two groups of the limiting plates (502) are symmetrically distributed about the central axis of the box cover (4).

Citation Information

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