All-glass direct type miniled backlight module with heat dissipation effect
By using high specific heat capacity glass material, thermally conductive adhesive layer and brushed decorative aluminum film in the backlight module, the deformation problem of optical diaphragm and uniform light components caused by long-term high temperature of the backlight module is solved, and the temperature reduction and service life are achieved. extend.
Patent Information
- Application Number
- CN202421132308.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-05-22
AI Technical Summary
When the backlight module is in a long-term high temperature state, the plastic optical diaphragm and the uniform light components are prone to yellowing and deforming, which seriously affects its service life.
Use glass material with a larger heat capacity as the main part of the backlight module, and apply thermal glue and brushed decorative aluminum film on the back of the glass-based conductive circuit board to quickly dissipate the heat produced by the miniled lamp beads and keep the temperature of the entire machine structure at 35. Below ℃.
By reducing the temperature, the service life of the backlight module is extended and the safety of use is improved.
Smart Images
Figure CN222482564U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of backlight modules, and particularly relates to a full-glass direct-lit miniled backlight module with heat dissipation effect. Background Art
[0002] In high-brightness miniled direct-lit backlights, due to the large number of miniled lamp beads, when lit for a long time, heat is generated severely. The conventional conductive circuit board is made of aluminum. Aluminum is thin and light, and has good heat dissipation effect. However, when lit for a long time, the heat generation is still relatively serious, and the surface temperature of the aluminum can reach above 80 °C. When the backlight module is in a long-term high-temperature state, the plastic optical film and light homogenizing components are prone to yellowing and deformation, seriously affecting their service life. Summary of the Utility Model
[0003] The purpose of the utility model is to provide a full-glass direct-lit miniled backlight module with heat dissipation effect, so as to solve the technical problem that when the backlight module is in a long-term high-temperature state, the plastic optical film and light homogenizing components are prone to yellowing and deformation, seriously affecting their service life, and achieve the purpose of reducing temperature and improving service life.
[0004] In order to solve the above technical problems, the utility model provides a full-glass direct-lit miniled backlight module with heat dissipation effect, including:
[0005] A conductive circuit board and a number of miniled lamp beads arranged on the guiding circuit board. A support frame is arranged at the edge of the conductive circuit board on one side of the miniled lamp beads. A glass diffusion plate is arranged at the end of the support frame. The glass diffusion plate and the conductive circuit board are arranged in parallel.
[0006] On the side of the conductive circuit board away from the miniled lamp beads, a wire-drawing decorative aluminum film is arranged. On the outer side of the wire-drawing decorative aluminum film, a power supply board is arranged. An insulating film is arranged between the power supply board and the wire-drawing decorative aluminum film.
[0007] Furthermore, a thermal conductive adhesive layer is arranged between the conductive circuit board and the wire-drawing decorative aluminum film.
[0008] Furthermore, a fixed frame is arranged on the side of the conductive circuit board. The fixed frame is in a U shape and buckles on the outer sides of the glass diffusion plate and the wire-drawing decorative aluminum film.
[0009] The beneficial effects of the utility model are:
[0010] 1. By using glass material with large specific heat capacity as the main part of the backlight module, the whole machine structure is prevented from heating up too quickly when the miniled backlight module is turned on. Then, by attaching thermal conductive glue and brushed decorative aluminum film to the back of the glass-based conductive circuit board, the heat generated by the miniled lamp beads can be quickly dissipated, keeping the temperature of the whole machine structure below 35°C.
[0011] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0013] Figure 1 It is a structural schematic diagram of the utility model of a full-glass direct-type miniled backlight module with heat dissipation effect.
[0014] In the figure:
[0015] 1. Conductive circuit board; 11. minled lamp beads; 12. Thermal conductive adhesive layer;
[0016] 2. Support frame;
[0017] 3. Glass diffuser plate;
[0018] 4. Brushed decorative aluminum film;
[0019] 5. Power board; 51. Thermal insulation film;
[0020] 6. Fixed frame. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] Example:
[0023] like Figure 1As shown in the figure, a full-glass direct-lit miniLED backlight module with a heat dissipation effect includes: a conductive circuit board 1 and a number of miniLED lamp beads 11 disposed on the guiding circuit board. A support frame 2 is provided at the edge of the conductive circuit board 1 on one side of the miniLED lamp beads 11. A glass diffusion plate 3 is provided at the end of the support frame 2. The glass diffusion plate 3 is arranged in parallel with the conductive circuit board 1; on the side of the conductive circuit board 1 away from the miniLED lamp beads 11, a brushed decorative aluminum film 4 is provided. On the outer side of the brushed decorative aluminum film 4, a power supply board 5 is provided. An insulating film 51 is provided between the power supply board 5 and the brushed decorative aluminum film 4.
[0024] Among them, a thermal conductive adhesive layer 12 is provided between the conductive circuit board 1 and the brushed decorative aluminum film 4, so that the heat on the conductive circuit board 1 can be better introduced into the thermal conductive adhesive layer 12, and the heat can be better transferred out, further reducing the temperature on the conductive circuit board 1.
[0025] In this embodiment, a fixing frame 6 is provided on the side of the conductive circuit board 1. The fixing frame 6 is in a U shape and buckles on the outer sides of the glass diffusion plate 3 and the brushed decorative aluminum film 4, so as to be able to fix the overall structure of the backlight module, improve the stability of the overall structure, and also be able to prevent damage to the backlight module caused by external impact or accidental collision, improving the use safety and protection performance.
[0026] To sum up: By using a glass material with a large specific heat capacity as the main part of the backlight module, it is possible to prevent the overall machine structure from heating up too fast when the miniLED backlight module is lit. Then, by attaching a thermal conductive adhesive and a brushed decorative aluminum film 4 to the back of the glass-based conductive circuit board 1, the heat generated by the miniLED lamp beads can be quickly dissipated, keeping the temperature of the overall machine structure below 35°C, improving the use safety, and also being able to extend the service life of the backlight module through the low-temperature working state.
[0027] All the components selected in this application are common standard components or components known to those skilled in the art. Their structures and principles can all be known by those skilled in the art through technical manuals or through conventional experimental methods.
[0028] In the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0030] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.
Claims
1. A full-glass direct-lit mini-led backlight module with heat dissipation effect, characterized in that: Including: A conductive circuit board (1) and a plurality of mini-LED beads (11) arranged on the guiding circuit board. A support frame (2) is arranged at the edge of the conductive circuit board (1) on one side of the mini-LED beads (11). A glass diffusion plate (3) is arranged at the end of the support frame (2). The glass diffusion plate (3) is arranged in parallel with the conductive circuit board (1). A wire-drawing decorative aluminum film (4) is arranged on the side of the conductive circuit board (1) away from the mini-LED beads (11). A power supply board (5) is arranged on the outer side of the wire-drawing decorative aluminum film (4). A heat insulation film (51) is arranged between the power supply board (5) and the wire-drawing decorative aluminum film (4).
2. A full glass direct-lit mini-LED backlight module with a heat dissipation effect according to claim 1, characterized in that A thermal conductive adhesive layer (12) is arranged between the conductive circuit board (1) and the wire-drawing decorative aluminum film (4).
3. A full glass direct-lit mini-LED backlight module with a heat dissipation effect according to claim 2, characterized in that A fixing frame (6) is arranged on the side of the conductive circuit board (1). The fixing frame (6) is in a U shape and buckles on the outer sides of the glass diffusion plate (3) and the wire-drawing decorative aluminum film (4).