Wafer yield detection device

Abstract

The utility model provides a wafer yield detection device. The wafer yield detection device comprises a base; the N supporting stand columns are arranged on the base; the bearing table is arranged on the N supporting stand columns, and at least a first reflector is arranged on the bearing table; the wafer bearing stand column is arranged on the bearing table and is used for bearing a wafer; when a supporting stand column located under the circle center of the wafer rotates, the bearing table, the wafer bearing stand column and the wafer on the wafer bearing stand column are driven to rotate together. The supporting assembly comprises a transverse supporting frame and a longitudinal supporting frame, the transverse supporting frame is arranged above the wafer in parallel, and a second reflective mirror is arranged on the transverse supporting frame; the longitudinal support frame is arranged beside the base, and three groups of cameras are arranged on the longitudinal support frame; the first group of cameras are used for collecting images of the lower surface of the wafer through the first reflector, the second group of cameras are used for collecting images of the edge of the wafer, and the third group of cameras are used for collecting images of the upper surface of the wafer through the second reflector. According to the device, back detection and frontier detection images can be acquired simultaneously, and the wafer detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing and manufacturing, and in particular to a wafer yield detection device. Background Art

[0002] During the wafer production process, the wafer edge and wafer back usually face relatively harsh working conditions. If the production is not handled properly, debris or foreign matter may be generated, and the debris or foreign matter will be thrown onto the wafer surface when the wafer is at high temperature or high-speed rotation, causing process abnormalities and seriously affecting the product yield. In order to better monitor the defects of the wafer edge and wafer back, the wafer edge and wafer back are usually scanned at a fixed station to obtain defect information in a timely manner. At present, the scanning equipment will extract some wafers from a batch of wafers for scanning, so it is impossible to quickly and effectively obtain all the actual defects of a batch of wafers, and currently the wafer back and wafer edge need to be scanned separately, which takes a long time. Utility Model Content

[0003] The utility model aims to provide a wafer yield detection device to improve the problem that traditional wafer backside detection is time-consuming and has low detection efficiency.

[0004] The utility model provides a wafer yield detection device, comprising: a base; a supporting column, which is arranged on the base; a bearing platform, which is arranged on the supporting column, and a first reflector is provided on the bearing platform; a wafer bearing column, which is arranged on the bearing platform and used to support the wafer; when the supporting column rotates, the bearing platform and the wafer bearing column, as well as the wafer on the wafer bearing column, are driven to rotate together; a supporting assembly, comprising a transverse support frame and a longitudinal support frame, the transverse support frame is arranged parallel to the wafer and the transverse support frame is provided with a second reflector; the longitudinal support frame is arranged on the side of the base, and three groups of cameras are provided on the longitudinal support frame; the first group of cameras is used to collect images of the lower surface of the wafer through the first reflector, the second group of cameras is used to collect images of the edge of the wafer, and the third group of cameras is used to collect images of the upper surface of the wafer through the second reflector.

[0005] In a possible embodiment, a third reflector is further provided on the support platform, wherein the first reflector is arranged below the central area of ​​the lower surface of the wafer, and the third reflector is arranged below the peripheral area of ​​the lower surface of the wafer. In this embodiment, the third reflector is added to adapt to large-sized wafers.

[0006] In another possible embodiment, the support platform is further provided with at least one first slide rail, on which the first reflector and / or the third reflector are movably arranged. The transverse support frame is provided with a second slide rail, on which the second reflector is movably arranged.

[0007] In another possible embodiment, the first camera group and the third camera group are fixed on an angle-adjustable base, the shooting angle of the first camera group corresponds to the reflected light path of the first reflector and the third reflector, and the shooting angle of the third camera group corresponds to the reflected light path of the second reflector. That is, the first camera group and the third camera group can be adjusted according to the tilt angle of the corresponding reflector.

[0008] In other possible embodiments, a bottom of the second group of cameras is fixed on a retractable rod, and a shooting angle of the second group of cameras is perpendicular to the side wall of the wafer.

[0009] In a possible embodiment, the three groups of cameras are placed at the same location of the longitudinal support frame.

[0010] In another possible embodiment, the transverse support frame and the longitudinal support frame are combined together to form an inverted L shape.

[0011] In a possible embodiment, the top of the wafer supporting column supports the wafer by vacuum adsorption.

[0012] In other possible embodiments, the N supporting columns are evenly arranged below the supporting platform.

[0013] In other possible embodiments, the first reflector, the second reflector and the third reflector are one of a plane mirror, a convex mirror or a hyperbolic mirror.

[0014] The beneficial effect of the wafer yield detection device provided by the utility model is that the device can simultaneously collect images of the upper and lower surfaces and edges of the wafer with the help of three sets of cameras, reduce the number of wafer transfers, significantly reduce the wafer inspection time, and improve the wafer inspection efficiency. At the same time, the three sets of cameras can be set at the same place of the vertical support frame in this embodiment, which is convenient for maintenance and adjustment, and the top and bottom of the wafer are provided with reflectors, which can reduce the number of cameras used, making the device simpler and easier to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of the improved wafer yield detection device provided by the utility model;

[0016] Figure 2 This is a schematic structural diagram of a wafer yield detection device with a slide rail provided by the utility model;

[0017] Figure 3 A schematic structural diagram of another wafer yield detection device with a slide rail provided by the utility model;

[0018] Figure 4 This is a schematic structural diagram of a wafer yield detection device with a retractable rod provided by the utility model.

[0019] Description of figure markings:

[0020] Base 01; support column 02; bearing platform 03; wafer bearing column 04; wafer 05; support assembly 06; horizontal support frame 061 and vertical support frame 062;

[0021] A first reflector 11; a second reflector 22; a third reflector 33;

[0022] First slide rail L1; second slide rail L2;

[0023] The first group of cameras is A; the second group of cameras is B; the third group of cameras is C. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0025] Figure 1 The structure diagram of the improved wafer yield detection device provided by the utility model is shown, comprising: a base 01; a support column 02 arranged on the base 01, the device also includes a bearing platform 03 arranged on the support column 02, wherein the N support columns 02 are evenly arranged below the bearing platform 03, and the bearing platform 03 is provided with a first reflector 11; and a wafer bearing column 04 arranged on the bearing platform, the wafer bearing column 04 is used to support a wafer 05. Optionally, the bearing column 04 can carry the wafer 05 by vacuum adsorption. When the support column 02 located directly below the center of the wafer 05 rotates (it should be understood that the support column 02 located directly below the center of the wafer 05 is used to rotate around its own central axis, and the other support columns 02 are only used for support, for example, other support columns 02 have ball bearings on the top to facilitate the rotation of the support platform 03), it drives the support platform 03 and the wafer supporting column 04 to rotate, and drives the wafer 05 on the wafer supporting column 04 to rotate together.

[0026] The bottom of the wafer supporting column 04 and the top of the supporting platform 03 are vertically fixedly connected, and the center of the supporting column 04 can be hollow and provided with an air path. The supporting column 02 located at the bottom center of the supporting platform 03 can be hollow and provided with an air path, and a gas path is set inside the supporting platform 03 to connect the wafer supporting column 04 and the air path of the supporting column 02 corresponding to the center of the supporting platform 03. The bottom of the supporting column 02 located at the center leads to an external negative pressure gas source to provide negative pressure for adsorption to the wafer 05.

[0027] The support assembly 06 includes a transverse support frame 061 and a longitudinal support frame 062, wherein the transverse support frame 061 and the longitudinal support frame 062 are combined together to form an inverted L shape. The transverse support frame 061 is arranged parallel to the top of the wafer 05, and a second reflector 22 is provided on the transverse support frame 061. The longitudinal support frame 062 is arranged on the side of the base 01, and three groups of cameras are provided on the longitudinal support frame 062. Optionally, the three groups of cameras can be placed in the same place of the longitudinal support frame 062, which helps to save space and make the entire device more concise. Among them, the first group of cameras A is used to collect images of the lower surface of the wafer 05 through the first reflector 11, the second group of cameras B is used to collect images of the edge of the wafer 05, and the third group of cameras C is used to collect images of the upper surface of the wafer 05 through the second reflector 22.

[0028] In a possible embodiment, in addition to the first reflector 11, the carrier 03 may also be provided with a third reflector 33. The first reflector 11 may be provided below the central area of ​​the lower surface of the wafer 05, and the third reflector 33 may be provided below the peripheral area of ​​the lower surface of the wafer 05. A slide rail may be provided on the back of at least one of the first reflector 11, the second reflector 22 and the third reflector 33. The first reflector, the second reflector and the third reflector are one of a plane mirror, a convex mirror or a hyperbolic mirror.

[0029] For example, Figure 2 As shown, the first reflector 11 is fixed below the central area of ​​the lower surface of the wafer 05, and the carrier 03 is also provided with a first slide rail L1, and the third reflector 33 is movably provided on the first slide rail L1, and the third reflector 33 can slide horizontally along the first slide rail L1. In addition, a second slide rail L2 is provided on the cross support frame 061, and the second reflector 22 is movably provided on the second slide rail L2, and the second reflector 22 can slide horizontally along the second slide rail L2. In this embodiment, the first slide rail L1 and the second slide rail L2 are provided to help match and adapt to wafers of different sizes.

[0030] For example, Figure 3As shown, the first reflector 11 and the third reflector 33 are both movably disposed on the first slide rail L1, and the second reflector 22 is movably disposed on the second slide rail L2. In this embodiment, the first slide rail L1 and the second slide rail L2 are also disposed to help match and adapt to wafers of different sizes.

[0031] In another embodiment, the bottom of the second camera group B can be fixed on the telescopic rod L3, and the shooting angle of the second camera group B is perpendicular to the side wall of the wafer 05. Figure 4 As shown in (a) of FIG. 1 , the telescopic rod L3 is as follows after being extended. Figure 4 As shown in (b) in the figure, when the wafer size is small, the retractable rod L3 can be extended to make the second group of cameras B close to the edge of the wafer 05; and when the wafer size is large, the retractable rod L3 can be retracted to make the second group of cameras B always located at the edge of the wafer 05.

[0032] In another possible embodiment, the first camera group A and the third camera group C are fixed on an angle-adjustable base (not shown in the figure), and the shooting angle of the first camera group A corresponds to the reflected light path of the first reflector 11 and the third reflector 33, and the shooting angle of the third camera group C corresponds to the reflected light path of the second reflector 22. In this way, the camera can be adjusted accordingly according to the tilt angle of the reflector, so that the surface of the wafer can always be photographed, and the reflection angle, the angle of the second reflector 22 or the third reflector 33 can be adjusted according to the size of the wafer to obtain an image of the target position on the wafer.

[0033] In the utility model, the device can simultaneously collect images of the upper and lower surfaces and edges of the wafer with the help of three sets of cameras, reduce the number of wafer transfers, significantly reduce the length of wafer inspection, and improve wafer inspection efficiency. At the same time, the three sets of cameras can be set at the same location of the longitudinal support frame in this embodiment, which is convenient for maintenance and adjustment, and maximally simplifies the inspection structure. By setting reflectors at the top and bottom of the wafer, the number of cameras used can be reduced, making the device simpler and easier to use.

[0034] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A wafer yield detection device, characterized in that: include: Base; N supporting columns are arranged on the base, where N is a positive integer; A bearing platform, arranged on the N supporting columns, wherein at least a first reflector is provided on the bearing platform; A wafer supporting column is arranged on the supporting platform and is used to support the wafer; when a supporting column located directly below the center of the wafer rotates, the supporting platform and the wafer supporting column, as well as the wafer on the wafer supporting column, are driven to rotate together; The support assembly includes a transverse support frame and a longitudinal support frame, wherein the transverse support frame is arranged parallel to and above the wafer, and a second reflector is provided on the transverse support frame; the longitudinal support frame is arranged beside the base, and three groups of cameras are provided on the longitudinal support frame; the first group of cameras is used to collect images of the lower surface of the wafer through the first reflector, the second group of cameras is used to collect images of the edge of the wafer, and the third group of cameras is used to collect images of the upper surface of the wafer through the second reflector.

2. The device according to claim 1, characterized in that A third reflector is also provided on the support platform, wherein the first reflector is arranged below the central area of ​​the lower surface of the wafer, and the third reflector is arranged below the peripheral area of ​​the lower surface of the wafer.

3. The device according to claim 2, characterized in that The carrying platform is further provided with at least one first slide rail, and the first reflector and / or the third reflector are movably provided on the first slide rail; The transverse support frame is provided with a second slide rail, and the second reflector is movably arranged on the second slide rail.

4. The device according to claim 3, characterized in that The first camera group and the third camera group are fixed on an angle-adjustable base, the shooting angle of the first camera group corresponds to the reflected light path of the first reflector and the third reflector, and the shooting angle of the third camera group corresponds to the reflected light path of the second reflector.

5. The device according to any one of claims 1 to 3, characterized in that: The bottom of the second group of cameras is fixed on the telescopic rod, and the shooting angle of the second group of cameras is perpendicular to the edge side wall of the wafer.

6. The device according to any one of claims 1 to 3, characterized in that The three groups of cameras are all placed at the same location of the longitudinal support frame.

7. The device according to any one of claims 1 to 3, characterized in that: The transverse support frame and the longitudinal support frame are combined together to form an inverted L shape.

8. The device according to any one of claims 1 to 3, characterized in that The top of the wafer supporting column supports the wafer through vacuum adsorption.

9. The device according to any one of claims 1 to 3, characterized in that: The N supporting columns are evenly arranged below the supporting platform.

10. The device according to any one of claims 2 to 3, characterized in that The first reflector, the second reflector and the third reflector are one of a plane mirror, a convex mirror or a hyperbolic mirror.

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