Battery PACK box

Abstract

The utility model is suitable for the technical field of temperature control, and provides a battery PACK box. The battery PACK box comprises N batteries which are connected in series or in parallel, and further comprises N semiconductor cooling fins, a heat pipe, N driving circuit modules and a control module, wherein N is a positive integer; each semiconductor cooling fin corresponds to one battery, the input ends of the semiconductor cooling fins are connected in series and then connected with the output end of the driving circuit module, the input end of the driving circuit module is connected with the output end of the control module, and the input end of the control module is used for inputting a preset temperature; the N semiconductor cooling fins are connected through heat pipes, and the head ends and the tail ends of the heat pipes are connected with an externally-hung air conditioning unit. According to the utility model, the semiconductor radiating fins are adopted, so that the installation and maintenance are simple, the control module is adopted to control the temperature through the semiconductor radiating fins, the refrigeration time is short, and the temperature control precision is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of temperature control, in particular to a battery PACK box. Background Art

[0002] At this stage, due to the impact of the global climate crisis and environmental crisis, dual carbon and energy transformation are developing vigorously. New power generation methods with wind and solar power generation as the mainstream are gradually replacing traditional power generation. In order to improve the reliability of the overall power system and coordinate the flexible use and stable consumption of resources, the market has gradually given rise to the demand for distribution and storage. The battery capacity and power of the energy storage battery system are large, and the high-power and high-density battery cell stacking structure has high requirements for the heat dissipation of the battery cells. At the same time, the energy storage system is prone to problems such as battery heat generation and uneven temperature distribution. Therefore, temperature control is extremely important for the life and safety of the battery system.

[0003] The battery PACK box is made of multiple battery modules stacked in series or in parallel. The lithium-ion electrolyte inside the battery will release a lot of heat during the charging and discharging process. High temperature will destroy the chemical balance in the battery, leading to side reactions. The performance of the rechargeable battery material will degrade under high temperature, and the battery cycle life will be greatly shortened. This damage is also irreversible. At present, the heat dissipation system of the battery PACK box mostly adopts cold plate type, that is, cold plate radiator, to ensure the performance release efficiency and service life of the lithium battery.

[0004] However, when installing the cold plate radiator, it is necessary to correctly install the water pump, water pipe, radiator and other components to ensure the normal operation of the liquid cooling system. In addition, the coolant must be checked and replaced regularly to ensure the normal operation of the system. In addition, the temperature is controlled by the coolant, the cooling time is long, and the temperature control accuracy is low. Utility Model Content

[0005] In view of this, an embodiment of the utility model provides a battery PACK box to solve the problems of complex installation and maintenance, long cooling time, and low temperature control accuracy caused by using a cold plate radiator to dissipate heat for the battery PACK box.

[0006] The first aspect of the embodiment of the utility model provides a battery PACK box, wherein the battery PACK box includes N batteries connected in series or in parallel, and further includes: N semiconductor heat sinks, heat pipes, N drive circuit modules and control modules; wherein N is a positive integer;

[0007] Each semiconductor heat sink corresponds to a battery arrangement, and the input end of each semiconductor heat sink is connected to the output end of the corresponding drive circuit module, the input ends of the N drive circuit modules are connected in series and then connected to the output end of the control module, and the input end of the control module is used to input a preset temperature;

[0008] The N semiconductor heat sinks are connected by heat pipes, and the head end and the tail end of the heat pipe are connected to an external air conditioning unit.

[0009] In a possible implementation, the semiconductor heat sink includes: a first heat conducting sheet, a first metal conductor, an N-type semiconductor, a P-type semiconductor, a second metal conductor, a third metal conductor, and a second heat conducting sheet;

[0010] The first metal conductor is bonded to the bottom of the first heat conducting sheet, and the N-type semiconductor and the P-type semiconductor are respectively provided on both sides of the bottom of the first metal conductor; the second metal conductor is bonded to the bottom of the N-type semiconductor, and the third metal conductor is bonded to the bottom of the P-type semiconductor, and the second heat conducting sheet is bonded to the bottom of the second metal conductor and the bottom of the third metal conductor respectively, the second metal conductor is connected to the negative pole of the power supply, and the third metal conductor is connected to the positive pole of the power supply.

[0011] In a possible implementation manner, outer surfaces of the first heat conducting plate and the second heat conducting plate are respectively coated with heat dissipating silicone grease.

[0012] In a possible implementation manner, the first heat conducting plate and the second heat conducting plate are made of ceramic.

[0013] In a possible implementation, it further includes: N thermal insulation cottons;

[0014] Each heat insulation cotton is correspondingly sleeved around each semiconductor heat sink.

[0015] In a possible implementation, the driving circuit module includes:

[0016] Four transistors, four diodes and two inductors;

[0017] The gates of the first triode and the fourth triode are respectively connected to the output end of the control module, the source of the first triode is respectively connected to the cathode of the first diode, the source of the fourth triode and the cathode of the fourth diode and then connected to a power supply; the drain of the first triode is respectively connected to the anode of the first diode, one end of the first inductor, the drain of the third triode and the cathode of the third diode;

[0018] The other end of the first inductor is respectively connected to the ground and the positive electrode or the negative electrode of the power supply of the corresponding semiconductor heat sink;

[0019] The negative electrode or the positive electrode of the power supply of the semiconductor heat sink is connected to one end of the second inductor, and the other end of the second inductor is respectively connected to the drain of the fourth transistor, the drain of the second transistor, the anode of the fourth diode and the cathode of the second diode;

[0020] The source of the third triode is respectively connected to the anode of the third diode, the source of the second triode and the anode of the second diode and then grounded.

[0021] In a possible implementation manner, the driving circuit module further includes: a third inductor, a fourth inductor and four capacitors;

[0022] The third inductor is connected between the first inductor and the positive electrode or the negative electrode of the power supply of the semiconductor heat sink, and the fourth inductor is connected between the negative electrode or the positive electrode of the power supply of the semiconductor heat sink and the second inductor;

[0023] One end of the first capacitor is connected between the first inductor and the third inductor, and the other end is grounded;

[0024] One end of the second capacitor is connected between the third inductor and the positive electrode or negative electrode of the power supply of the semiconductor heat sink, and the other end is grounded;

[0025] One end of the third capacitor is connected between the negative electrode of the power supply or the positive electrode of the power supply of the semiconductor heat sink and the second inductor, and the other end is grounded;

[0026] One end of the fourth capacitor is connected between the second inductor and the fourth inductor, and the other end is grounded.

[0027] In a possible implementation, the control module includes: a PID controller and a pulse modulator;

[0028] The input end of the PID controller is used to input a preset temperature, the output end of the PID controller is connected to the input end of the pulse modulator, and the output end of the pulse modulator is connected to the input end of the driving circuit module.

[0029] In a possible implementation, the heat pipe includes a tube shell, a tube core and a working medium;

[0030] The tube shell is a closed metal tube, and the inside of the tube shell is in a vacuum state;

[0031] The tube core is a porous capillary structure disposed in the tube shell, and is used to perform a suction movement on the working medium;

[0032] The working medium is a liquid arranged in the tube shell for gasification and heat conduction.

[0033] In a possible implementation, the device further includes: M temperature sensors, where M is a positive integer and M is less than or equal to N;

[0034] The temperature sensor is arranged around the batteries in the battery PACK box.

[0035] Compared with the prior art, the embodiments of the utility model have the following beneficial effects: in the embodiments of the utility model, the heat sink provided in the battery PACK box is a semiconductor heat sink, which does not require any refrigerant and can work continuously. It does not require the installation of water pumps, water pipes and other equipment to ensure the operation of the liquid cooling system during installation. It is lighter in weight, has no sliding parts, is a solid piece, and is more convenient and simple to install, thereby improving the efficiency of battery charging, discharging and group assembly. While ensuring stability, it is smaller than the existing liquid cooling plate in terms of heat dissipation volume, thereby further improving the energy density of the battery PACK box and achieving a lightweight design. The semiconductor heat sink has no vibration or noise when working and has a long service life, reducing maintenance costs. The semiconductor heat sink automatically controls cooling and heating through a control module, with high temperature control efficiency and precision, effectively reducing the probability of thermal runaway and improving the safety and stability of the entire battery PACK box. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0037] Figure 1 It is a structural schematic diagram of a battery PACK box provided by an embodiment of the utility model;

[0038] Figure 2 It is a structural schematic diagram of a battery PACK box provided by another embodiment of the utility model;

[0039] Figure 3 It is a schematic diagram of the structure of a semiconductor heat sink provided by an embodiment of the utility model;

[0040] Figure 4 It is a structural schematic diagram of a semiconductor heat sink provided by another embodiment of the utility model;

[0041] Figure 5 It is a circuit diagram of a driving circuit module provided by an embodiment of the utility model;

[0042] Figure 6 It is a circuit diagram of a battery PACK box provided by an embodiment of the utility model;

[0043] Figure 7 It is a schematic diagram of the structure of the heat pipe provided by the embodiment of the utility model. DETAILED DESCRIPTION

[0044] In the following description, specific details such as specific system structures and technologies are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details that hinder the description of the present invention.

[0045] In order to illustrate the technical solution of the present invention, specific embodiments are provided below for illustration.

[0046] In the prior art, a battery PACK box is formed by stacking multiple battery modules in series or in parallel. The lithium ion electrolyte inside the battery cell will release a large amount of heat during the charging and discharging process. High temperature will destroy the chemical balance in the battery, leading to side reactions. The performance of the rechargeable battery material will degrade under high temperature, and the battery cycle life will be greatly shortened. This damage is also irreversible. Therefore, it is necessary to dissipate heat from the batteries in the battery PACK box.

[0047] At present, the heat dissipation system of the battery PACK box mostly adopts the cold plate type, that is, the cold plate radiator, to ensure the performance release efficiency and service life of the lithium battery, but this design has the following disadvantages:

[0048] 1) During installation, the water pump, water pipe, radiator and other components need to be installed correctly to ensure the normal operation of the liquid cooling system. In addition, the coolant must be checked and replaced regularly to ensure the normal operation of the system;

[0049] 2) Temperature control is performed by coolant, the cooling time is long, and the temperature control accuracy is low;

[0050] 3) Since the cold plate radiator uses perfluorocarbon liquid as the heat transfer medium, there is a certain risk of leakage. If the pipeline or connector fails or is damaged, it may cause liquid leakage, damage the electrical components in the energy storage box, cause a short circuit failure, and cause a fire;

[0051] 4) The coolant for cold plate heat dissipation mainly adopts perfluorocarbon compounds, which are mainly used abroad, resulting in limited use.

[0052] 5) The production process of cold plate heat dissipation has a long production cycle for enterprises, the progress of task execution is difficult to monitor, and the status of materials is difficult to track, which seriously hinders planning management.

[0053] The utility model provides a battery PACK box, in which the heat sink for heat dissipation of the battery is a semiconductor heat sink, which does not require any refrigerant and can work continuously. It does not require the installation of water pumps, water pipes and other equipment to ensure the operation of the liquid cooling system during installation. It has no sliding parts and is a solid piece, which is more convenient and simple to install. There is no vibration or noise during operation, and the service life is long, which reduces maintenance costs.

[0054] The semiconductor heat sink controls cooling and heating through electric current, with high temperature control efficiency and precision, which effectively reduces the probability of thermal runaway and improves the safety and stability of the entire battery PACK box.

[0055] The control module in the battery PACK box controls the drive circuit module, which in turn controls the cooling and heating of the semiconductor heat sink, achieving automatic temperature control and more efficient management.

[0056] Embodiment 1

[0057] Figure 1 A battery PACK box provided by the utility model includes N batteries connected in series or in parallel, including: N semiconductor heat sinks 1, heat pipes 2, N drive circuit modules 3 and control modules 4; wherein N is a positive integer;

[0058] Each semiconductor heat sink 1 corresponds to a battery setting, and the input end of each semiconductor heat sink is connected to the output end of the corresponding drive circuit module 3, the input ends of the N drive circuit modules 3 are connected in series and connected to the output end of the control module 4, and the input end of the control module 4 is used to input a preset temperature;

[0059] The N semiconductor heat sinks 1 are connected by heat pipes 2, and the head end and tail end of the heat pipe 2 are connected to an external air conditioning unit for discharging hot air or blowing hot air back into the battery PACK box.

[0060] It should be noted that each semiconductor heat sink 1 is connected to a corresponding drive circuit module 3, and all drive circuit modules 3 are connected to a control module 4. N semiconductor heat sinks 1 can also be connected in series to form a first semiconductor heat dissipation module, where the series connection is an electrical connection, so that N semiconductor heat sinks 1 can be driven by a drive circuit module 3 and controlled by a control module 4, so that the cost of the drive circuit module 3 is reduced. When the battery PACK box is working, all batteries heat up, and the semiconductor heat sink 1 set under the battery also works at the same time, and the control module 4 controls the semiconductor heat sink 1 to dissipate heat for the battery.

[0061] Optionally, each semiconductor heat sink 1 is arranged corresponding to a battery. In this case, the semiconductor heat sink 1 can be arranged on any side of the battery, such as above the battery, below the battery, around the battery, etc. For the stability of the semiconductor heat sink 1, the semiconductor heat sink 1 can be arranged below the corresponding battery.

[0062] Optionally, the heat pipe 2 disposed between the semiconductor heat sinks 1 may be disposed on the side of the semiconductor heat sink 1, see Figure 1 As shown, this can reduce the use of heat pipes and reduce costs. Figure 1 In the embodiment, a plurality of heat pipes 2 can be connected between every two semiconductor heat sinks 1 to improve the exhaust efficiency of hot air.

[0063] Optional, see Figure 2 As shown, the external air-conditioning unit can be a hot and cold dual-circuit air-conditioning unit. Therefore, when the semiconductor heat sink 1 dissipates heat for the battery, the hot air can be discharged through the external air-conditioning unit. In cold seasons, the hot air can also be blown back to the battery PACK box through the dual-wind path system to ensure the normal operation of the battery under low temperature conditions.

[0064] See also Figure 3 The schematic diagram of the structure of the semiconductor heat sink 1 is shown. The semiconductor heat sink 1 may include: a first heat conducting sheet 11, a first metal conductor 12, an N-type semiconductor 13, a P-type semiconductor 14, a second metal conductor 15, a third metal conductor 16 and a second heat conducting sheet 17;

[0065] The first metal conductor 12 is bonded to the bottom of the first heat conducting sheet 11, and the N-type semiconductor 13 and the P-type semiconductor 14 are respectively provided on both sides of the bottom of the first metal conductor 12; the second metal conductor 15 is bonded to the bottom of the N-type semiconductor 13, and the third metal conductor 16 is bonded to the bottom of the P-type semiconductor 14. The second heat conducting sheet 17 is respectively bonded to the bottom of the second metal conductor 15 and the bottom of the third metal conductor 16. The second metal conductor 15 is connected to the negative pole of the power supply, and the third metal conductor 16 is connected to the positive pole of the power supply.

[0066] Optionally, the first metal conductor 12 , the second metal conductor 15 and the third metal conductor may be copper (Cu) conductors.

[0067] Optionally, the first heat conductive sheet 11 and the second heat conductive sheet 17 are made of ceramic, which can be used for heat dissipation but is not conductive. Ceramics have high thermal conductivity and good high temperature resistance, and can effectively conduct and dissipate heat. Commonly used ceramic materials include alumina, silicon nitride, etc. Alumina has high thermal conductivity and good high temperature resistance, and is suitable for high-power semiconductor refrigeration sheets. In addition, ceramic sheets are relatively stable and suitable for the assembly and production of battery modules.

[0068] The semiconductor heat sink 1 uses the Peltier effect, that is, when a current passes through a loop composed of different conductors, in addition to generating irreversible Joule heat, heat absorption and heat release will occur at the joints of different conductors depending on the direction of the current. Since the charge carriers are at different energy levels in different materials, when they move from a high energy level to a low energy level, they release excess energy; on the contrary, when they move from a low energy level to a high energy level, they absorb energy from the outside. Energy is absorbed or released in the form of heat at the interface between the two materials.

[0069] See also Figure 3 As shown, the electron starts from the negative pole of the power supply and reaches the junction of the third metal conductor 16 and the P-type semiconductor 14. When the electron enters the P-type semiconductor 14 from the third metal conductor 16, it is equivalent to the energy of the electron entering the valence band of the semiconductor from the Fermi energy level. The energy of the electron in the valence band is lower than the Fermi energy, so heat is released at the second thermal conductive sheet 17, so the second thermal conductive sheet 17 can be called the hot end. The electron continues to move. When the electron enters the first metal conductor 12 from the P-type semiconductor 14, it is equivalent to the electron going from the valence band to the Fermi energy level, so heat is absorbed at the first thermal conductive sheet 11, so the first thermal conductive sheet 11 can be called the cold end. When the electron enters the N-type semiconductor 13 from the first metal conductor 12, it is equivalent to the electron entering the conduction band from the Fermi energy level. The energy of the electron in the conduction band is relatively high, and this process requires heat absorption. When the electron enters the second metal conductor 15 from the N-type semiconductor 13, the energy is reduced, so heat is released again at the second thermal conductive sheet 17, and finally returns to the positive pole of the power supply.

[0070] The N-type semiconductor 13 is made of Bi 2 Te 3 -Bi 2 Se 3 The P-type semiconductor 14 is made of Bi 2 Te 3 -Sb 2 Te 3 Made of material.

[0071] The semiconductor heat sink 1 achieves cooling effect through thermoelectric effect and Pulse electric effect, and has the advantages of miniaturization, no noise, no vibration, high efficiency and energy saving, and high reliability. It has a service life of up to 40 years.

[0072] In one embodiment, in order to increase the heat dissipation efficiency, the outer surfaces of the first heat conductive sheet 11 and the second heat conductive sheet 17 are respectively coated with heat dissipation silicone grease, which is a paste-like thermal interface material with good thermal conductivity. Its main function is to fill the pores in the interface part (i.e., the outer surfaces of the first heat conductive sheet 11 and the second heat conductive sheet 17), replace the air with low thermal conductivity, reduce thermal resistance, and increase thermal conductivity.

[0073] For further information, see Figure 4 The schematic diagram of the structure of the semiconductor heat sink 1 shown in another embodiment is shown, and the battery PACK box may also include: N thermal insulation cottons 5;

[0074] Each heat insulation cotton 5 is correspondingly sleeved around each semiconductor heat sink 1. In this way, the heat absorbed by each semiconductor heat sink 1 from the battery can be conducted through the heat pipe and then discharged through the external air conditioning unit, instead of dissipating heat from the semiconductor heat sink 1 to the battery PACK box, thereby achieving rapid cooling of the battery and reducing the temperature inside the battery PACK box.

[0075] The thermal inertia of the semiconductor heat sink 1 is very small, so the cooling time is very fast. When the hot end dissipates heat well and the cold end is unloaded, the semiconductor heat sink 1 can reach the maximum temperature difference in less than one minute after power is turned on, thereby effectively reducing the probability of thermal runaway and improving the safety and stability of the entire battery PACK box.

[0076] In one embodiment, if Figure 5 As shown, the driving circuit module 3 may include: four transistors, four diodes and two inductors;

[0077] The gate of the first transistor Q1 and the gate of the fourth transistor Q4 are respectively connected to the output end of the control module 4, the source of the first transistor Q1 is respectively connected to the cathode of the first diode D1, the source of the fourth transistor Q4 and the cathode of the fourth diode D4 and then connected to the power supply; the drain of the first transistor Q1 is respectively connected to the anode of the first diode D1, one end of the first inductor L1, the drain of the third transistor Q3 and the cathode of the third diode D3;

[0078] The other end of the first inductor L1 is respectively grounded and connected to the positive electrode or negative electrode of the power supply of the corresponding semiconductor heat sink 1;

[0079] The negative electrode or the positive electrode of the power supply of the semiconductor heat sink 1 is connected to one end of the second inductor L2, and the other end of the second inductor L2 is respectively connected to the drain of the fourth transistor Q4, the drain of the second transistor Q3, the anode of the fourth diode D4 and the cathode of the second diode D2;

[0080] The source of the third transistor Q3 is connected to the anode of the third diode D3, the source of the second transistor Q2 and the anode of the second diode D2 respectively and then grounded. Figure 5 As shown, a resistor can be connected before grounding.

[0081] Optionally, in order to more accurately control the cooling or heating of the semiconductor heat sink 1, four inductors and four capacitors may be used, such as Figure 5As shown, the driving circuit module 3 may further include: a third inductor L3, a fourth inductor L4 and four capacitors;

[0082] The third inductor L3 is connected between the first inductor L1 and the positive electrode or the negative electrode of the power supply of the semiconductor heat sink 1, and the fourth inductor L4 is connected between the negative electrode or the positive electrode of the power supply of the semiconductor heat sink 1 and the second inductor L2;

[0083] One end of the first capacitor C1 is connected between the first inductor L1 and the third inductor L3, and the other end is grounded;

[0084] One end of the second capacitor C2 is connected between the third inductor L3 and the positive electrode or negative electrode of the power supply of the semiconductor heat sink 1, and the other end is grounded;

[0085] One end of the third capacitor C3 is connected between the negative electrode of the power supply or the positive electrode of the power supply of the semiconductor heat sink 1 and the fourth inductor L4, and the other end is grounded;

[0086] One end of the fourth capacitor C4 is connected between the second inductor L2 and the fourth inductor L4 , and the other end is grounded.

[0087] Figure 5 The driving circuit shown is a driving circuit based on an H-bridge. When the gate of Q3 is set to a high level, the gate of Q4 is set to a low level, the gate of Q2 is set to a low level, and the gate of Q1 is set to a high level, Q3 and Q4 are disconnected, Q1 and Q2 are turned on, and the current flows from the left side to the right side of the semiconductor heat sink 1; conversely, when the gate of Q3 is set to a low level, the gate of Q4 is set to a high level, the gate of Q2 is set to a high level, and the gate of Q1 is set to a low level, Q3 and Q4 are turned on, Q1 and Q2 are disconnected, and the current flows from the left side to the right side of the semiconductor heat sink 1.

[0088] The PWM duty cycle of Q1 or Q4 is set by the control module 4 to generate different pulses. The control module 4 controls the on-time of Q1 or Q4 to control the working time of the semiconductor heat sink 1, thereby achieving a temperature control effect.

[0089] In one embodiment, see Figure 6 As shown, the control module 4 may include: a PID controller 41 and a pulse modulator 42;

[0090] The input end of the PID controller 41 is used to input a preset temperature, the output end of the PID controller 41 is connected to the input end of the pulse modulator 42 , and the output end of the pulse modulator 42 is connected to the input end of the driving circuit module 3 .

[0091] The Proportional-Integral-Differential (PID) controller 41 is composed of a proportional unit (P), an integral unit (I) and a differential unit (D). It is a relatively high-precision technology currently available and can be used to control the current of the semiconductor heat sink 1 to achieve a high-precision temperature control effect. Optionally, through a preset temperature input by the user, the PID controller 41 can calculate the frequency of the pulse modulation wave according to the preset temperature, and convert it into a pulse control drive circuit module 3 through a pulse modulator 42, so that the current in the drive circuit module 3 flows and controls the semiconductor heat sink 1 to absorb or release heat. Figure 3 It can be seen that the working state of the semiconductor heat sink 1 is determined by the direction and magnitude of the current flowing through the semiconductor heat sink 1. The direction of the current determines cooling or heating, and the magnitude of the current determines the degree and effect of cooling or heating.

[0092] In one embodiment, the battery PACK box may further include: a crystal, and the crystal is connected to the semiconductor heat sink 1 .

[0093] In one embodiment, see Figure 6 As shown, the battery PACK box may further include: M temperature sensors 6, where M is a positive integer and M is less than or equal to N;

[0094] The temperature sensor 6 is arranged around the batteries in the battery PACK box.

[0095] Optionally, when a temperature sensor is provided, the temperature sensor 6 may be provided in the middle of all the batteries in the battery PACK box so as to accurately measure the temperature of the batteries and provide a data basis for the user to set an accurate preset temperature.

[0096] Optionally, when two temperature sensors are provided, the temperature sensor 6 may be provided at a location with a higher temperature in the battery PACK box to prevent safety accidents caused by excessively high temperature in the battery PACK box or to reduce the battery life.

[0097] Optionally, when the number of temperature sensors is consistent with the number of batteries, a temperature sensor can be set near each battery to accurately measure the temperature of each battery, more accurately adjust the current flowing through the semiconductor heat sink 1, and achieve high-precision temperature control.

[0098] It should be noted that the temperature difference range of the semiconductor heat sink 1 can be achieved from a positive temperature of 90° C. to a negative temperature of 130° C., which can meet the different temperature values ​​required by different types of batteries.

[0099] By using the temperature sensor 6, the semiconductor heat sink 1 and the PID controller 41 in combination, the temperature control accuracy of the battery module in the battery PACK box can be effectively improved, and the temperature value can be accurately controlled within the range with the maximum charge and discharge efficiency.

[0100] Optionally, the battery PACK box is also provided with a display screen for displaying the temperature of the temperature sensor 6. It should be noted that the control module 4 is also provided with a digital-to-analog converter 43. The temperature detected by the temperature sensor 7 is converted by the digital-to-analog converter 43 to obtain temperature data, which is transmitted to the PID controller 41. The PID controller 41 sends the data to the display screen for display. Figure 6 shown.

[0101] In one embodiment, the heat pipe is an artificial component with excellent heat conductivity. Figure 7 As shown, the heat pipe 2 includes a tube shell 21, a tube core 22 and a working medium 23;

[0102] The tube shell 21 is a closed metal tube, and the tube shell 21 is in a vacuum state, that is, the air and other debris in the tube must be excluded;

[0103] The tube core 22 is a porous capillary structure disposed in the tube shell 21 and is used to perform a suction movement on the working medium 23;

[0104] The working medium 23 is a liquid disposed in the tube shell 21 for gasification and heat conduction. For example, the working medium 23 may be water.

[0105] The heat pipe 2 transfers heat by evaporating and condensing the working medium 23 in a fully enclosed tube shell, and has high heat transfer efficiency and fast speed.

[0106] The physical principles used when heat pipes work:

[0107] 1. Under vacuum, the boiling point of the liquid is lowered, so that the liquid can be vaporized when it reaches a lower boiling point through the heat dissipation of the semiconductor heat sink 1, and then move in the tube shell 21 to take away the heat.

[0108] 2. The suction force of the porous capillary structure on the liquid can make the liquid flow, increase the flow of the liquid, and facilitate heat transfer.

[0109] Figure 7 In the figure, the heat pipe 2 can be divided into three parts: the evaporation section, the insulation section and the cooling section. When the heat pipe 2 is in operation, after the evaporation section of the heat pipe 2 is heated, the working fluid absorbs heat and is converted into steam. The steam flow transfers the heat to the cooling section, releases heat in the cooling section, and condenses into liquid. The liquid returns to the evaporation section, and the heat transfer is repeated in this way.

[0110] In the battery PACK box, each semiconductor heat sink corresponds to a battery setting, and the N semiconductor heat sinks are connected in series to form a first semiconductor heat sink module; the input end of the first semiconductor heat sink module is connected to the output end of the drive circuit module, the input end of the drive circuit module is connected to the output end of the control module, and the input end of the control module is used to input a preset temperature; the N semiconductor heat sinks are connected by heat pipes, and the head and tail ends of the heat pipes are connected to an external air conditioning unit. The utility model can drive the semiconductor heat sink through the drive circuit module by the control module to achieve cooling and heating of the battery PACK box, realize automatic temperature control, and is easy to operate.

[0111] The heat sink installed in the battery PACK box is a semiconductor heat sink, which does not require any refrigerant and can work continuously. It does not need to install water pumps, water pipes and other equipment to ensure the operation of the liquid cooling system during installation. It is lighter in weight, has no sliding parts, is a solid piece, and is more convenient and simple to install, thereby improving the efficiency of battery charging and discharging and group assembly. While ensuring stability, the volume of heat dissipation is smaller than that of existing liquid cooling plates, thereby further improving the energy density of the battery PACK box and achieving a lightweight design. The semiconductor heat sink has no vibration or noise when working and has a long life, reducing maintenance costs.

[0112] The semiconductor heat sink performs cooling and heating through current control, with high temperature control efficiency and precision, which effectively reduces the probability of thermal runaway and improves the safety and stability of the entire battery PACK box.

[0113] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention.

Claims

1. A battery PACK box, comprising N batteries connected in series or in parallel, characterized in that: include: N semiconductor heat sinks, heat pipes, N drive circuit modules and control modules; Where N is a positive integer; Each semiconductor heat sink corresponds to a battery arrangement, and the input end of each semiconductor heat sink is connected to the output end of the corresponding drive circuit module, the input ends of the N drive circuit modules are connected in series and then connected to the output end of the control module, and the input end of the control module is used to input a preset temperature; The N semiconductor heat sinks are connected by heat pipes, and the head end and the tail end of the heat pipe are connected to an external air conditioning unit.

2. The battery PACK box according to claim 1, characterized in that: The semiconductor heat sink comprises: a first heat conducting sheet, a first metal conductor, an N-type semiconductor, a P-type semiconductor, a second metal conductor, a third metal conductor and a second heat conducting sheet; The first metal conductor is bonded to the bottom of the first heat conducting sheet, and the N-type semiconductor and the P-type semiconductor are respectively provided on both sides of the bottom of the first metal conductor; the second metal conductor is bonded to the bottom of the N-type semiconductor, and the third metal conductor is bonded to the bottom of the P-type semiconductor, and the second heat conducting sheet is bonded to the bottom of the second metal conductor and the bottom of the third metal conductor respectively, the second metal conductor is connected to the negative pole of the power supply, and the third metal conductor is connected to the positive pole of the power supply.

3. The battery PACK box according to claim 2, characterized in that: The outer surfaces of the first heat conducting sheet and the second heat conducting sheet are respectively coated with heat dissipating silicone grease.

4. The battery PACK box according to claim 2, characterized in that: The first heat conducting plate and the second heat conducting plate are made of ceramic.

5. The battery PACK box according to any one of claims 1 to 4, characterized in that: Also includes: N insulation cottons; Each heat insulation cotton is correspondingly sleeved around each semiconductor heat sink.

6. The battery PACK box according to claim 2, characterized in that: The driving circuit module includes: four triodes, four diodes and two inductors; The gate of the first triode and the gate of the fourth triode are respectively connected to the output end of the control module, the source of the first triode is respectively connected to the cathode of the first diode, the source of the fourth triode and the cathode of the fourth diode and then connected to a power supply; the drain of the first triode is respectively connected to the anode of the first diode, one end of the first inductor, the drain of the third triode and the cathode of the third diode; The other end of the first inductor is respectively connected to the ground and the positive electrode or the negative electrode of the power supply of the corresponding semiconductor heat sink; The negative electrode or the positive electrode of the power supply of the semiconductor heat sink is connected to one end of the second inductor, and the other end of the second inductor is respectively connected to the drain of the fourth transistor, the drain of the second transistor, the anode of the fourth diode and the cathode of the second diode; The source of the third triode is respectively connected to the anode of the third diode, the source of the second triode and the anode of the second diode and then grounded.

7. The battery PACK box according to claim 6, characterized in that: The driving circuit module further includes: a third inductor, a fourth inductor and four capacitors; The third inductor is connected between the first inductor and the positive electrode or the negative electrode of the power supply of the semiconductor heat sink, and the fourth inductor is connected between the negative electrode or the positive electrode of the power supply of the semiconductor heat sink and the second inductor; One end of the first capacitor is connected between the first inductor and the third inductor, and the other end is grounded; One end of the second capacitor is connected between the third inductor and the positive electrode or negative electrode of the power supply of the semiconductor heat sink, and the other end is grounded; One end of the third capacitor is connected between the negative electrode of the power supply or the positive electrode of the power supply of the semiconductor heat sink and the fourth inductor, and the other end is grounded; One end of the fourth capacitor is connected between the second inductor and the fourth inductor, and the other end is grounded.

8. The battery PACK box according to claim 1, characterized in that: The control module includes: PID controller and pulse modulator; The input end of the PID controller is used to input a preset temperature, the output end of the PID controller is connected to the input end of the pulse modulator, and the output end of the pulse modulator is connected to the input end of the driving circuit module.

9. The battery PACK box according to claim 1, characterized in that: The heat pipe comprises a tube shell, a tube core and a working medium; The tube shell is a closed metal tube, and the inside of the tube shell is in a vacuum state; The tube core is a porous capillary structure disposed in the tube shell, and is used to perform a suction movement on the working medium; The working medium is a liquid arranged in the tube shell for gasification and heat conduction.

10. The battery PACK box according to claim 1, characterized in that: Also included: M temperature sensors, where M is a positive integer and M is less than or equal to N; The temperature sensor is arranged around the batteries in the battery PACK box.

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