Mixed-voltage high-frequency double-layer circuit board with heat insulation structure

Abstract

The utility model discloses a mixed-voltage high-frequency double-layer circuit board with a heat insulation structure, relates to the technical field of double-layer circuit boards, and solves the problems that an existing mixed-voltage high-frequency double-layer circuit board is not provided with a heat insulation structure and is easy to be subjected to heat conduction by an external environment when being used. Not only is the use effect of the double-layer circuit board affected, but also the connection stability between the circuit boards is affected. Comprising a circuit board body. A mounting groove is formed in the protective seat, a circle of heat insulation plate is arranged on the inner wall of the mounting groove, a heat dissipation groove is formed in the heat insulation plate, and a groove opening of the heat dissipation groove is located in one side; the heat dissipation channel is arranged on the side face of the protection base, a port of the heat dissipation channel is communicated with a notch of the heat dissipation groove, and a heat dissipation device is arranged in the heat dissipation channel; according to the utility model, through the design of the heat insulation plate, the heat radiation groove and the heat radiator, the situation of heat conduction during use of the double-layer circuit board can be effectively avoided, and the connection stability between the circuit boards is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of double-layer circuit boards, and in particular relates to a mixed-pressure high-frequency double-layer circuit board with a heat insulation structure. Background Art

[0002] The hybrid high-frequency double-layer circuit board is a circuit board composed of two circuit boards and a connecting board. Because the circuit board has two layers, the area is twice as large as that of a single-layer panel. It is not only convenient and simple in wiring, but also has less labor intensity and shorter wiring. The double-layer panel solves the difficulty of wiring interlacing in the single-layer panel.

[0003] At present, the inventor has found during the use of the mixed-pressure high-frequency double-layer circuit board that the mixed-pressure high-frequency double-layer circuit board in the prior art does not have a heat insulation structure. When the double-layer circuit board is in use, it is easy to be affected by the external environment and conduct heat to the double-layer circuit board, which not only affects the use effect of the double-layer circuit board, but also affects the connection stability between the circuit boards.

[0004] Therefore, based on the above problems, we designed a hybrid high-frequency double-layer circuit board with a thermal insulation structure. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a hybrid high-frequency double-layer circuit board with a heat insulation structure, which solves the technical problem that the existing hybrid high-frequency double-layer circuit board does not have a heat insulation structure and is easily affected by the external environment when the double-layer circuit board is used, which not only affects the use effect of the double-layer circuit board, but also affects the connection stability between the circuit boards.

[0006] To achieve the above-mentioned purpose, according to an embodiment of the first aspect of the utility model, a hybrid high-frequency double-layer circuit board with a heat insulation structure is provided, comprising a circuit board body;

[0007] It also includes: a protective seat, the protective seat is provided with a mounting groove, the inner wall of the mounting groove is provided with a circle of heat insulation board, the heat insulation board is provided with a heat dissipation groove, and the notch of the heat dissipation groove is located on one side;

[0008] A heat dissipation channel is arranged on the side of the protective seat, a port of the heat dissipation channel is connected with a notch of the heat dissipation slot, a radiator is arranged in the heat dissipation channel, and the radiator is divided into several heat dissipation fans;

[0009] The cover frame is arranged at the notch of the installation groove, the circuit board body is arranged in the heat insulation board, and the cover frame is clamped on the circuit board body.

[0010] A further improvement is that limit slots are provided at the four corners of the bottom surface of the installation slot, and the size of each limit slot is the same.

[0011] A further improvement is that the circuit board body comprises an upper board body and a lower board body, and a limit card block is provided on the bottom surface of the lower board body at a position corresponding to each limit card opening, and the limit card block is used to limit the circuit board body.

[0012] A further improvement is that the outer wall surface of the protective seat is provided with a plurality of reinforcing ribs, and the plurality of reinforcing ribs wrap the circuit board body to protect the circuit board body.

[0013] A further improvement is that a group of fixing screws are provided on the bottom surface of the protective seat, and a group of threaded holes are provided on the cover frame at positions corresponding to each fixing screw.

[0014] A further improvement is that a group of through grooves are provided through the circuit board body, and the protective seat is connected to the circuit board body and the cover frame through a group of fixing screws to achieve overall disassembly and assembly.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] (1) When the circuit board body is in use, the utility model uses a heat insulation board to insulate heat. At the same time, since a heat dissipation groove is provided in the heat insulation board, the heat generated by the circuit board body is introduced into the heat dissipation groove. Then, the radiator is started and several heat dissipation fans in the radiator are used to conduct the heat. This can effectively avoid the heat conduction when the double-layer circuit board is in use and ensure the connection stability between the circuit boards.

[0017] (2) The utility model wraps and protects the circuit board body through the protective seat, the cover frame and several external reinforcing ribs, which can effectively avoid damage to the edge of the circuit board body caused by accidents and increase the service life of the circuit board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the half-section structure of the utility model when viewed from the front;

[0020] Figure 3 It is a schematic diagram of the side structure of the protective seat and several reinforcing ribs of the utility model;

[0021] Figure 4 It is a schematic diagram of the cross-section top view of the structure of the utility model.

[0022] Markings in the figure:

[0023] 1. Protective seat; 11. Assembly hole; 12. Mounting slot; 121. Limiting bayonet; 122. Limiting block; 13. Heat insulation board; 131. Heat dissipation slot; 14. Reinforcement rib; 15. Fixing screw;

[0024] 2. Circuit board body; 21. Upper board body; 22. Lower board body; 23. Groove;

[0025] 3. Cover frame; 31. Threaded hole;

[0026] 4. Heat dissipation channel; 41. Radiator; 411. Cooling fan; 42. Dust screen. DETAILED DESCRIPTION

[0027] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] like Figure 1 As shown, a hybrid high-frequency double-layer circuit board with a heat insulation structure includes a circuit board body 2, and the circuit board body 2 includes an upper board body 21 and a lower board body 22;

[0029] like Figure 1 and Figure 2 As shown, the implementation includes: a protective seat 1, a mounting groove 12 is opened on the protective seat 1, a circle of heat insulation board 13 is arranged on the inner wall of the mounting groove 12, a heat dissipation groove 131 is arranged in the heat insulation board 13, and the notch of the heat dissipation groove 131 is located on one side, and the surface of the protective seat 1 is provided with assembly holes 11 at four corners;

[0030] Among them, the four corners of the bottom surface of the installation groove 12 are provided with limit slots 121, and the size of each limit slot 121 is the same. The bottom surface of the lower plate body 22 is provided with a limit card block 122 at a position corresponding to each limit slot 121, and the limit card block 122 is used for the limited installation of the circuit board body 2;

[0031] like Figure 2 and Figure 4As shown, when implemented, it includes: a heat dissipation channel 4, which is arranged on the side of the protective seat 1, and the port of the heat dissipation channel 4 is connected to the notch of the heat dissipation groove 131. A heat sink 41 is arranged in the heat dissipation channel 4, and the heat sink 41 is divided into several heat dissipation fans 411. A dustproof net 42 is arranged in the port of the heat dissipation channel 4. When the circuit board body 2 is in use, heat insulation is performed by utilizing the provided heat insulation board 13. At the same time, since the heat insulation board 13 is provided with the heat dissipation groove 131, the heat generated by the circuit board body 2 is introduced into the heat dissipation groove 131, and then the heat sink 41 is started, and the heat is conducted out by utilizing several heat dissipation fans 411 in the heat sink 41, which can effectively avoid the heat conduction when the double-layer circuit board is in use, and ensure the connection stability between the circuit board bodies 2;

[0032] like Figure 1 and Figure 2 As shown, the implementation includes: a cover frame 3, which is arranged at the notch of the installation groove 12, and the circuit board body 2 is arranged in the insulation board 13. The cross-section of the cover frame 3 is U-shaped. After the cover frame 3 is installed, the cover frame 3 is clamped on the circuit board body 2.

[0033] Among them, a group of fixing screws 15 are arranged on the bottom surface of the protection seat 1, a group of threaded holes 31 are arranged at the position corresponding to each fixing screw 15 of the cover frame 3, a group of through slots 23 are arranged through the circuit board body 2, and the protection seat 1 is connected with the circuit board body 2 and the cover frame 3 through the group of fixing screws 15 to realize the overall disassembly and assembly;

[0034] like Figures 1 to 4 As shown, in this embodiment, a plurality of reinforcing ribs 14 are additionally provided on the outer wall surface of the protective seat 1, and the plurality of reinforcing ribs 14 wrap the circuit board body 2. Through the protective seat 1, the cover frame 3 and the plurality of external reinforcing ribs 14, the circuit board body 2 is wrapped and protected, which can effectively avoid damage to the edge of the circuit board body 2 due to accidents and improve the service life of the circuit board body 2.

[0035] like Figures 1 to 4 As shown, in this embodiment, the actual size of each component in the application document is selected and installed according to the actual needs on site. Before implementation, the protective seat 1 and the cover frame 3 are selected according to the size of the circuit board body 2. In addition, it should be noted that this application document only targets the existing mixed-pressure high-frequency double-layer circuit board, which does not have a heat insulation structure. When the double-layer circuit board is used, it is easy to be affected by the external environment to conduct heat to the double-layer circuit board, which not only affects the use effect of the double-layer circuit board, but also affects the connection stability between the circuit boards. Improvements are made, and other aspects are not involved; the working principle of this mixed-pressure high-frequency double-layer circuit board with a heat insulation structure is introduced as follows:

[0036] During installation, the upper plate body 21 and the lower plate body 22 are combined into the circuit board body 2, and then the circuit board body 2 is placed in the installation groove 12, and the bottom limit block 122 of the lower plate body 22 is respectively inserted into each limit slot 121 to achieve the limit of the circuit board body 2;

[0037] Then, the cover frame 3 is installed at the notch of the installation groove 12, and is clamped on the circuit board body 2, and the bottom surface of the cover frame 3 is in contact with the surface of the circuit board body 2, and then a set of fixing screws 15 on the bottom surface of the protection seat 1 are used to connect the protection seat 1, the circuit board body 2, and the cover frame 3 to achieve overall disassembly and assembly;

[0038] When the circuit board body 2 is in use, the heat insulation is performed by using the provided heat insulation board 13. At the same time, since the heat insulation board 13 is provided with a heat dissipation slot 131, the heat generated by the circuit board body 2 is introduced into the heat dissipation slot 131, and then the radiator 41 is started, and the heat is discharged by using several heat dissipation fans 411 in the radiator 41, which can effectively avoid the heat conduction when the double-layer circuit board is in use, and ensure the connection stability between the circuit board bodies 2;

[0039] Through the protective seat 1, the cover frame 3 and the external reinforcement ribs 14, the circuit board body 2 is wrapped and protected, which can effectively avoid damage to the edge of the circuit board body 2 due to accidents and increase the service life of the circuit board body 2.

[0040] The above embodiments are only used to illustrate the technical method of the utility model rather than to limit it. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical method of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the utility model.

Claims

1. A hybrid high-frequency double-layer circuit board with a heat insulation structure, comprising a circuit board body (2); It is characterized in that Also includes: A protection seat (1), wherein a mounting groove (12) is provided on the protection seat (1), a circle of heat insulation board (13) is provided on the inner wall of the mounting groove (12), a heat dissipation groove (131) is provided inside the heat insulation board (13), and a notch of the heat dissipation groove (131) is located on one side; A heat dissipation channel (4) is arranged on a side of the protective seat (1), a port of the heat dissipation channel (4) is connected to a notch of the heat dissipation slot (131), a heat sink (41) is arranged in the heat dissipation channel (4), and the heat sink (41) is divided into a plurality of heat dissipation fans (411); The cover frame (3) is arranged at the notch of the installation groove (12); the circuit board body (2) is arranged in the heat insulation board (13); and the cover frame (3) is clamped on the circuit board body (2).

2. A hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: The four corners of the bottom surface of the installation groove (12) are provided with limit snap-in openings (121), and the size of each limit snap-in opening (121) is the same.

3. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 2, characterized in that: The circuit board body (2) comprises an upper board body (21) and a lower board body (22), and a limit block (122) is provided on the bottom surface of the lower board body (22) at a position corresponding to each limit slot (121).

4. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: The outer wall surface of the protection seat (1) is provided with a plurality of reinforcing ribs (14), and the plurality of reinforcing ribs (14) wrap the circuit board body (2).

5. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: A group of fixing screws (15) are arranged on the bottom surface of the protection seat (1), and a group of threaded holes (31) are arranged at positions corresponding to each fixing screw (15) of the cover frame (3).

6. The hybrid high-frequency double-layer circuit board with a heat insulation structure according to claim 1, characterized in that: A group of through slots (23) are provided through the circuit board body (2), and the protective seat (1) is connected to the circuit board body (2) and the cover frame (3) via a group of fixing screws (15).

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