Semiconductor refrigeration structure for glue valve

Abstract

The utility model relates to the technical field of rubber valve heat dissipation, in particular to a semiconductor refrigeration structure for a rubber valve, which comprises a rubber valve body, and a heat dissipation assembly is arranged on the surface of the rubber valve body. The heat dissipation assembly comprises a heat dissipation block fixedly connected to the surface of the rubber valve body, and a connecting channel is formed in the heat dissipation block. By arranging the heat dissipation assembly and the heat dissipation module, water can be matched with the semiconductor chilling plate for cooling, the cooled water is used for cooling the heat dissipation block through the water pump, the water outlet pipe, the flow channel, the connecting channel and the water return pipe, and the distance between the semiconductor chilling plate and the rubber valve body can be increased; the situation that heat generated by the hot face of the semiconductor chilling plate is dissipated to the periphery of the rubber valve body to affect the heat dissipation effect is avoided, meanwhile, the heat dissipation effect is more uniform in the mode that a heat dissipation channel formed by a flow channel and a connecting channel is used for conducting heat dissipation and cooling through cooled water, and cold energy generated by the semiconductor chilling plate can be effectively utilized; and the heat dissipation and cooling effects are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of glue valves, in particular to a semiconductor refrigeration structure for glue valves. Background Art

[0002] In the past, glue mixing machines all used traditional refrigeration methods. Traditional refrigeration methods generally use strong winds, which can easily cause bacteria and dust in the air to adhere to the surface of the glue, and the cooling time is too long and the noise is loud.

[0003] After searching, a Chinese patent discloses a piezoelectric dispensing valve refrigeration device (publication number CN213468453U). This patented technology can reduce the glue temperature in the flow channel and nozzle through a semiconductor refrigeration plate, thereby slowing down its curing speed and ensuring that the flow channel and nozzle will not be blocked. However, the distance between the glue valve and the semiconductor refrigeration plate is small. The heat generated by the hot surface of the semiconductor refrigeration plate will cause the temperature around the glue valve to rise significantly after dissipation, affecting the heat dissipation effect. Therefore, a technician in this field provides a semiconductor refrigeration structure for a glue valve to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor refrigeration structure for a glue valve in order to solve the above problems, thereby improving the problem that the heat generated by the hot surface of the semiconductor refrigeration plate will cause the temperature around the glue valve to rise significantly after dissipation, thus affecting the heat dissipation effect.

[0005] The utility model achieves the above-mentioned purpose through the following technical scheme, a semiconductor refrigeration structure for a rubber valve, comprising: a rubber valve body, a heat dissipation component is arranged on the surface of the rubber valve body; the heat dissipation component comprises a heat dissipation block fixedly connected to the surface of the rubber valve body, a connecting channel is arranged inside the heat dissipation block, and two flow channels connected to the connecting channel are arranged on one side of the heat dissipation block; a refrigeration module, the refrigeration module is arranged on one side of the rubber valve body, and the refrigeration module is used to cooperate with the heat dissipation component to enhance the heat dissipation effect of the rubber valve body;

[0006] Among them, the refrigeration module includes an integrated water tank, a water pump is provided at the bottom of the integrated water tank, a cover body is fixedly connected to the top of the integrated water tank, a water hole connected to the integrated water tank is provided inside the cover body, a semiconductor refrigeration plate is provided on one side of the integrated water tank, a heat sink is provided on the other side of the semiconductor refrigeration plate, and a fan is provided on the other side of the heat sink; the hot surface of the semiconductor refrigeration plate is in contact with the heat sink, and the cold surface of the semiconductor refrigeration plate is in contact with the surface of the integrated water tank.

[0007] Preferably, the liquid inlet of the water pump is connected to the integrated water tank, the liquid outlet of the water pump is connected to a water outlet pipe, and the other end of the water outlet pipe is connected to one of the flow channels.

[0008] Preferably, a water return pipe connected to the water through hole is provided on the surface of the cover body, and the other end of the water return pipe is connected to another of the flow channels.

[0009] Preferably, evenly distributed heat exchange plates are fixedly connected to the inner wall of the integrated water tank, and the cross-section of the heat exchange plates is wavy.

[0010] Preferably, evenly distributed heat sinks are fixedly connected to the surface of the water return pipe, the cross-section of the heat sink is in the shape of a circular ring, and the heat sink is an aluminum metal material component.

[0011] Preferably, a temperature sensor is provided on one side of the heat dissipation block, a mounting hole connected to the connecting channel is opened on one side of the heat dissipation block, and a detection end of the temperature sensor passes through the mounting hole and extends to the inside of the connecting channel.

[0012] Preferably, an approximately "U"-shaped heat dissipation channel is formed between the two flow channels and the connecting channel, and a blocking block for sealing the upper end opening of the connecting channel is provided on the top of the heat dissipation block.

[0013] The beneficial effects of the utility model are as follows: by arranging a heat dissipation component and a heat dissipation module, water can be used in combination with a semiconductor refrigeration sheet for cooling, and the cooled water is passed through a water pump, a water outlet pipe, a flow channel, a connecting channel and a return pipe to dissipate heat and cool the heat dissipation block, which can increase the distance between the semiconductor refrigeration sheet and the rubber valve body, and avoid the heat generated by the hot surface of the semiconductor refrigeration sheet to be dissipated to the surrounding of the rubber valve body and affect the heat dissipation effect. At the same time, the heat dissipation channel formed by the flow channel and the connecting channel is used to dissipate heat and cool down the body through the cooled water, so that the heat dissipation effect is more uniform, and the cold energy generated by the semiconductor refrigeration sheet can be effectively utilized, thereby improving the heat dissipation and cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a partial explosion schematic diagram of the utility model;

[0016] Figure 3 This is a schematic diagram of the distribution of the flow channels and connecting channels of the utility model;

[0017] Figure 4 This is a distribution diagram of the heat exchange plate of the utility model.

[0018] In the figure: 1. Valve body; 2. Heat dissipation assembly; 201. Heat dissipation block; 202. Flow channel; 203. Block; 204. Connecting channel; 205. Mounting hole; 206. Temperature sensor; 3. Refrigeration module; 301. Integrated water tank; 302. Water pump; 303. Cover; 304. Return pipe; 305. Heat sink; 306. Water outlet pipe; 307. Semiconductor refrigeration sheet; 308. Heat dissipation rack; 309. Fan; 310. Heat exchange plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] When implementing: Figure 1-4 As shown, a semiconductor refrigeration structure for a rubber valve comprises: a rubber valve body 1, a heat dissipation component 2 is arranged on the surface of the rubber valve body 1; the heat dissipation component 2 comprises a heat dissipation block 201 fixedly connected to the surface of the rubber valve body 1, a connecting channel 204 is provided inside the heat dissipation block 201, and two flow channels 202 connected to the connecting channel 204 are provided on one side of the heat dissipation block 201; a refrigeration module 3 is arranged on one side of the rubber valve body 1, and the refrigeration module 3 is used to cooperate with the heat dissipation component 2 to enhance the heat dissipation effect of the rubber valve body 1;

[0021] The heat dissipation block 201 can absorb the heat of the rubber valve body 1 and contact with the outside air, thereby increasing the heat exchange area to achieve the effect of cooling and dissipating the rubber valve body 1;

[0022] The refrigeration module 3 includes an integrated water tank 301, a water pump 302 is provided at the bottom of the integrated water tank 301, a cover 303 is fixedly connected to the top of the integrated water tank 301, a water hole connected to the integrated water tank 301 is provided inside the cover 303, a semiconductor refrigeration sheet 307 is provided on one side of the integrated water tank 301, a heat sink 308 is provided on the other side of the semiconductor refrigeration sheet 307, and a fan 309 is provided on the other side of the heat sink 308; the hot surface of the semiconductor refrigeration sheet 307 is bonded to the heat sink 308, and the cold surface of the semiconductor refrigeration sheet 307 is bonded to the surface of the integrated water tank 301;

[0023] The integrated water tank 301 is cooled by the semiconductor cooling sheet 307, so that the water inside the integrated water tank 301 is cooled by the semiconductor cooling sheet 307 and then discharged by the water pump 302;

[0024] The heat sink 308 can absorb the heat generated by the hot surface of the semiconductor cooling plate 307. The heat absorbed by the heat sink 308 is dissipated in time by guiding the air flow through the fan 309, so as to prevent the heat generated by the hot surface of the semiconductor cooling plate 307 from being transferred to the integrated water tank 301.

[0025] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the liquid inlet of the water pump 302 is connected to the integrated water tank 301, and the liquid outlet of the water pump 302 is connected to the outlet pipe 306, and the other end of the outlet pipe 306 is connected to one of the flow channels 202; the surface of the cover body 303 is provided with a return pipe 304 connected to the water through hole, and the other end of the return pipe 304 is connected to another flow channel 202; the inner wall of the integrated water tank 301 is fixedly connected with uniformly distributed heat exchange plates 310, and the cross-sectional shape of the heat exchange plates 310 is wavy; the surface of the return pipe 304 is fixedly connected with uniformly distributed heat sinks 305, and the cross-sectional shape of the heat sink 305 is circular, and the heat sink 305 is an aluminum metal material component; a heat dissipation channel approximately in the shape of a "U" is formed between the two flow channels 202 and the connecting channel 204, and a blocking block 203 for blocking the upper end opening of the connecting channel 204 is provided on the top of the heat dissipation block 201;

[0026] The water pump 302 can guide the cooled water inside the integrated water tank 301 into the flow channel 202 connected thereto through the water outlet pipe 306, and guide the water inside the connecting channel 204 under the guidance of the flow channel 202, and guide the water inside the return pipe 304 through another flow channel 202. In this process, the cooled water can dissipate heat and cool the heat sink 201, thereby enhancing the heat dissipation effect on the glue valve body 1, and prolonging the solidification time of the glue after the glue is mixed;

[0027] The water entering the return pipe 304 absorbs the heat of the heat sink 201 and its temperature rises. In the process of being guided back to the integrated water tank 301 through the return pipe 304 for re-cooling, the heat sink 305 can increase the contact area with the outside air, so that the heat can be initially dissipated during the return process, thereby reducing the temperature when it is introduced into the integrated water tank 301, thereby improving the cooling effect of the semiconductor refrigeration plate 307 on it. The wavy heat exchange plate 310 can increase the contact area with the water inside the integrated water tank 301, thereby cooperating with the semiconductor refrigeration plate 307 to enhance the cooling effect on the internal water.

[0028] like Figure 2 and Figure 4As shown, a temperature sensor 206 is disposed on one side of the heat sink 201, and a mounting hole 205 connected to the connecting channel 204 is opened on one side of the heat sink 201, and a detection end of the temperature sensor 206 passes through the mounting hole 205 and extends to the inside of the connecting channel 204;

[0029] The temperature sensor 206 can monitor the temperature of the water flowing into the connecting channel 204 and can provide timely feedback of the temperature data so that the staff can adjust the temperature according to actual needs.

[0030] When the utility model is in use, the integrated water tank 301 is cooled by the semiconductor refrigeration sheet 307, so that the water inside the integrated water tank 301 is cooled under the action of the semiconductor refrigeration sheet 307, and then the cooled water inside the integrated water tank 301 can be introduced into the interior of the flow channel 202 connected thereto through the water outlet pipe 306 through the water pump 302, and introduced into the interior of the connecting channel 204 under the guidance of the flow channel 202, and introduced into the interior of the return pipe 304 through another flow channel 202. In this process, the cooled water can be used to dissipate heat and cool the heat dissipation block 201, thereby enhancing the heat dissipation effect on the glue valve body 1, and can prolong the solidification time of the glue after mixing.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor refrigeration structure for a glue valve, characterized in that: include: A rubber valve body (1), wherein a heat dissipation component (2) is provided on the surface of the rubber valve body (1); The heat dissipation assembly (2) comprises a heat dissipation block (201) fixedly connected to the surface of the rubber valve body (1); a connecting channel (204) is provided inside the heat dissipation block (201); and two flow channels (202) are provided on one side of the heat dissipation block (201) and are connected to the connecting channel (204); A refrigeration module (3), the refrigeration module (3) being arranged on one side of the rubber valve body (1), the refrigeration module (3) being used to cooperate with the heat dissipation component (2) to enhance the heat dissipation effect of the rubber valve body (1); The refrigeration module (3) comprises an integrated water tank (301), a water pump (302) is arranged at the bottom of the integrated water tank (301), a cover (303) is fixedly connected to the top of the integrated water tank (301), a water hole connected to the integrated water tank (301) is arranged inside the cover (303), a semiconductor refrigeration sheet (307) is arranged on one side of the integrated water tank (301), a heat sink (308) is arranged on the other side of the semiconductor refrigeration sheet (307), and a fan (309) is arranged on the other side of the heat sink (308); The hot surface of the semiconductor refrigeration sheet (307) is in contact with the heat dissipation frame (308), and the cold surface of the semiconductor refrigeration sheet (307) is in contact with the surface of the integrated water tank (301).

2. The semiconductor refrigeration structure for a glue valve according to claim 1, characterized in that: The liquid inlet of the water pump (302) is connected to the integrated water tank (301), the liquid outlet of the water pump (302) is connected to a water outlet pipe (306), and the other end of the water outlet pipe (306) is connected to one of the flow channels (202).

3. The semiconductor refrigeration structure for a glue valve according to claim 1, characterized in that: A water return pipe (304) connected to the water through hole is provided on the surface of the cover body (303), and the other end of the water return pipe (304) is connected to another flow channel (202).

4. The semiconductor refrigeration structure for a glue valve according to claim 1, characterized in that: The inner wall of the integrated water tank (301) is fixedly connected with evenly distributed heat exchange plates (310), and the cross-section of the heat exchange plates (310) is wavy.

5. The semiconductor refrigeration structure for a glue valve according to claim 3, characterized in that: The surface of the water return pipe (304) is fixedly connected with evenly distributed heat sinks (305), the cross-section of the heat sink (305) is in a circular ring shape, and the heat sink (305) is an aluminum metal material component.

6. The semiconductor refrigeration structure for a glue valve according to claim 1, characterized in that: A temperature sensor (206) is provided on one side of the heat dissipation block (201); a mounting hole (205) connected to the connection channel (204) is provided on one side of the heat dissipation block (201); a detection end of the temperature sensor (206) passes through the mounting hole (205) and extends to the interior of the connection channel (204).

7. The semiconductor refrigeration structure for a glue valve according to claim 1, characterized in that: An approximately "U"-shaped heat dissipation channel is formed between the two flow channels (202) and the connecting channel (204), and a blocking block (203) for blocking the upper opening of the connecting channel (204) is provided on the top of the heat dissipation block (201).

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