Shoe mold convenient for adjusting thickness of sole
By designing the adjustment mechanism in the shoe mold, flexible adjustment of the sole thickness is achieved, and the problem that existing shoe molds cannot adjust the thickness is solved, and production efficiency and processing efficiency are improved.
Patent Information
- Application Number
- CN202420707590.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-04-07
AI Technical Summary
Existing shoe molds cannot be adjusted according to different thicknesses of soles. Different shoe molds need to be replaced to change the thickness of the sole, which is time-consuming and labor-intensive, reduces the production efficiency of the shoe mold and increases processing costs.
A shoe mold including an upper mold seat and a lower mold seat is designed. The upper mold seat is equipped with a molding bump and an adjustment mechanism distributed left and right. The adjustment mechanism consists of an adjustment drive member, a lifting plate and a connecting block, and the adjustment drive member is adjusted. Drive the lifting plate and connecting block to move up or down, adjust the height of the forming bumps, thereby adjusting the thickness of the sole.
By setting up an adjustment mechanism, the adjustment operation of the sole thickness is simplified, the production efficiency is improved, and the molded sole is lifted through the material feeding mechanism, which is convenient for staff to collect materials and further improves production efficiency.
Smart Images

Figure CN222495184U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of shoe molds, in particular to a shoe mold which is convenient for adjusting the thickness of the sole. Background Art
[0002] Shoes are important daily necessities that facilitate walking and protect feet from injury. The sole is one of the main components of shoes. After the sole is produced, the upper is sewn or glued to the sole to form the shoe. The common properties of general sole materials should be wear resistance, water resistance, oil resistance, heat resistance, pressure resistance, impact resistance, good elasticity, easy to fit the foot shape, not easy to deform after shaping, heat preservation, easy to absorb moisture, etc. The most commonly used raw material for soles is rubber, and special molds are generally required for sole production.
[0003] The existing shoe mold usually includes an upper mold base, a lower mold base, a molding protrusion and a molding concave block, and has a relatively simple structure. The upper mold base and the lower mold base are molded together, and raw materials are injected between the molding protrusion and the molding concave block to obtain the sole by injection molding. However, during the processing of the existing shoe mold, it is impossible to adjust according to the thickness of the sole, and different shoe molds need to be replaced to change the thickness of the sole, which is time-consuming and labor-intensive, reduces the production efficiency of the shoe mold, and increases the processing cost. Utility Model Content
[0004] The utility model aims to provide a shoe mold that is convenient for adjusting the thickness of the sole, aiming to solve the technical problem that the existing shoe molds in the prior art cannot be adjusted according to the soles of different thicknesses, and different shoe molds need to be replaced to change the thickness of the soles, which is time-consuming and labor-intensive, reduces the production efficiency of the shoe molds, and increases the processing cost.
[0005] To achieve the above-mentioned purpose, an embodiment of the utility model provides a shoe mold that is convenient for adjusting the thickness of the sole, including an upper mold base and a lower mold base; the upper mold base is provided with left and right distributed molding protrusions and an adjustment mechanism; the adjustment mechanism is arranged above the molding protrusions, and the adjustment mechanism includes an adjustment drive, a lifting plate and a connecting block; the output end of the adjustment drive is connected to the lifting plate, the lifting plate is connected to the connecting block, and the connecting block is connected to the top of the molding protrusion; both ends of the lifting plate are provided with guide columns in sliding connection, and the lifting plate is provided with a buffer layer and a plurality of groups of buffer protrusions; the lower mold base is arranged below the upper mold base, and a ejection mechanism and a molding concave block corresponding to the molding protrusion are provided in the lower mold base; the ejection mechanism is connected to the molding concave block and is located below the molding concave block, and is used to eject the molded sole.
[0006] Optionally, the lower die base also includes a heat dissipation mechanism, which has two groups of heat dissipation components and temperature sensors distributed on the left and right; the heat dissipation component is arranged on the outside of the molding block to discharge the heat in the lower die base to the outside; the temperature sensor is arranged on the inside of the molding block to detect the temperature in the lower die base.
[0007] Furthermore, the heat dissipation assembly includes a heat conducting plate, a heat dissipation fan and a filter; the heat conducting plate is arranged on the outside of the molding concave block; the heat dissipation fan is arranged on the outside of the heat conducting plate; the filter is arranged on the lower mold base and is located on the outside of the heat dissipation fan.
[0008] Furthermore, a digital display is provided on the lower die base; the digital display is electrically connected to the temperature sensor and is used to display the temperature inside the lower die base.
[0009] Optionally, the lower mold base also includes a water cooling mechanism, which includes a cooling pipe and several groups of diverter pipes; the cooling pipe is arranged below the molding block; several groups of diverter pipes are equidistantly distributed on the cooling pipe, and the top end of the diverter pipe is connected to the cooling pipe.
[0010] Optionally, the ejection mechanism includes a fixed plate and a lifting assembly; the lifting assembly is divided into two groups and is distributed on the left and right sides of the bottom end of the forming block, and the lifting assembly includes a lifting drive, a connecting rod and a push plate; the lifting drive is arranged in the lower mold base and is located below the forming block; the output end of the lifting drive is connected to the connecting rod, and the connecting rod is connected to the push plate; the push plate is arranged in the forming block and is slidably connected to the forming block; the connecting rod is arranged on the fixed plate and is slidably connected to the fixed plate.
[0011] Optionally, the upper mold base includes a top plate and a mounting plate; the top plate is connected to the mounting plate; and a mounting cavity is provided in the mounting plate.
[0012] Furthermore, the adjusting driving members are in two groups, and the two groups of adjusting driving members are distributed on the left and right sides of the top plate; the lifting plate and the guide column are both arranged in the installation cavity, and the lifting plate is slidably connected to the installation cavity.
[0013] Optionally, the upper die base is provided with a plurality of groups of circumferentially arranged limiting columns; and the lower die base is provided with a plurality of groups of limiting grooves corresponding to the limiting columns.
[0014] The above one or more technical solutions in the shoe mold for facilitating adjustment of the sole thickness provided by the embodiment of the utility model have at least one of the following technical effects:
[0015] By setting up an adjustment mechanism, before the sole is formed, the lifting plate and the connecting block are driven to move upward or downward by adjusting the driving member, and the height position of the forming protrusion relative to the forming concave block is adjusted, thereby adjusting the thickness of the sole after forming, simplifying the adjustment operation steps. At the same time, a lifting mechanism is also set. After the sole is formed, the sole is lifted up from the forming concave block by the lifting mechanism, which is convenient for the staff to take the material and improves the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic diagram of the overall structure of a shoe mold that facilitates adjustment of the thickness of the sole provided by an embodiment of the utility model;
[0017] Figure 2 A schematic diagram of the internal structure of a shoe mold for facilitating adjustment of the thickness of the sole provided in an embodiment of the utility model;
[0018] Figure 3 A schematic diagram of the internal structure of the upper die base provided in an embodiment of the utility model;
[0019] Figure 4 for Figure 2 A is an enlarged schematic diagram;
[0020] Figure 5 A schematic diagram of the front structure of the upper die base provided in an embodiment of the utility model;
[0021] Figure 6 This is a front structural schematic diagram of the lower die base provided in an embodiment of the utility model.
[0022] Among them, the reference numerals in the figure are:
[0023] 10. Upper die seat; 11. Forming convex block; 12. Limiting column;
[0024] 13. Top plate; 14. Mounting plate; 15. Mounting cavity;
[0025] 20. Lower die base; 22. Forming concave block; 23. Digital display;
[0026] 24. Limiting groove; 30. Adjusting mechanism; 31. Adjusting driving member;
[0027] 32. Lifting plate; 33. Connecting block; 34. Buffer layer;
[0028] 35. Buffer bump; 36. Guide column; 41. Heat dissipation component;
[0029] 411. heat conducting plate; 412. cooling fan; 413. filter;
[0030] 42. Temperature sensor; 50. Water cooling mechanism; 51. Cooling pipe;
[0031] 52. Diverter pipe; 60. Ejector mechanism; 61. Fixed plate;
[0032] 62. Lifting assembly; 621. Lifting driving member; 622. Connecting rod;
[0033] 623. Push the board. DETAILED DESCRIPTION
[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.
[0035] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0037] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.
[0038] In one embodiment of the present invention, Figure 1-Figure 6As shown, a shoe mold for adjusting the thickness of the sole is provided, including an upper mold base 10 and a lower mold base 20. The upper mold base 10 is provided with molding protrusions 11 and an adjustment mechanism 30 distributed on the left and right. The adjustment mechanism 30 is arranged above the molding protrusion 11, and the adjustment mechanism 30 includes an adjustment drive 31, a lifting plate 32 and a connecting block 33. The adjustment drive 31 is a cylinder, and the output end of the adjustment drive 31 is connected to the lifting plate 32, the lifting plate 32 is connected to the connecting block 33, and the connecting block 33 is connected to the top of the molding protrusion 11. Both ends of the lifting plate 32 are provided with guide columns 36 for sliding connection, and the lifting plate 32 is provided with a buffer layer 34 and a plurality of groups of buffer protrusions 35. The lower mold base 20 is arranged below the upper mold base 10, and the lower mold base 20 is provided with a ejection mechanism 60 and a molding concave block 22 corresponding to the molding protrusion 11. The ejection mechanism 60 is connected to the molding concave block 22 and is located below the molding concave block 22, and is used to eject the molded sole.
[0039] In this embodiment, the buffer layer 34 and the buffer protrusion 35 are both made of rubber material. By providing the buffer layer 34 and the buffer protrusion 35, the lifting plate 32 is prevented from colliding with the upper mold base 10 when the adjustment mechanism 30 runs to the upper and lower limit positions, thereby improving the service life of the shoe mold.
[0040] Before the sole is formed, the lifting plate 32 and the connecting block 33 are driven upward or downward by adjusting the driving member 31, and the height position of the forming protrusion 11 relative to the forming recessed block 22 is adjusted, thereby adjusting the thickness of the sole after forming, simplifying the adjustment operation steps. At the same time, a lifting mechanism 60 is also provided. After the sole is formed, the lifting mechanism 60 is used to lift the sole from the forming recessed block 22, which is convenient for the staff to take the material and improves the production efficiency.
[0041] Specifically, in another embodiment of the present invention, Figure 1 , Figure 2 and Figure 4 As shown, the lower mold base 20 also includes a heat dissipation mechanism, which has two groups of heat dissipation components 41 and temperature sensors 42 distributed on the left and right. The heat dissipation component 41 is arranged on the outside of the molding concave block 22, and is used to discharge the heat in the lower mold base 20 to the outside. The temperature sensor 42 is arranged on the inside of the molding concave block 22, and is used to detect the temperature in the lower mold base 20. The temperature in the lower mold base 20 is detected by the temperature sensor 42. When the temperature exceeds the preset value, the heat dissipation component 41 is activated, which discharges the heat in the lower mold base 20 to the outside, thereby improving the heat dissipation effect of the shoe mold.
[0042] The heat dissipation assembly 41 includes a heat conducting plate 411, a heat dissipation fan 412 and a filter 413. The heat conducting plate 411 is arranged on the outside of the forming concave block 22. The heat dissipation fan 412 is arranged on the outside of the heat conducting plate 411. The filter 413 is arranged on the lower mold base 20 and is located on the outside of the heat dissipation fan 412. The temperature sensor 42 is electrically connected to the heat dissipation fan 412. The heat in the forming concave block 22 is quickly transferred to the heat dissipation fan 412 through the heat conducting plate 411, and the heat is discharged to the outside through the heat dissipation fan 412, thereby improving the heat dissipation effect of the shoe mold, and also by setting the filter 413, dust from the outside is prevented from entering the lower mold base 20, thereby preventing the accumulation of dust from affecting the heat dissipation effect of the heat dissipation assembly 41.
[0043] A digital display 23 is provided on the lower mold base 20. The digital display 23 is electrically connected to the temperature sensor 42 and is used to display the temperature inside the lower mold base 20. The digital display 23 displays the real-time temperature, which is convenient for the staff to timely understand the internal temperature of the shoe mold and make corresponding judgments and operations based on it, so that the quality of the injection molded sole is better and the defective rate of the sole is reduced.
[0044] Specifically, in another embodiment of the present invention, Figure 2 and Figure 4 As shown, the lower mold base 20 also includes a water cooling mechanism 50, which includes a cooling pipe 51 and a plurality of groups of manifolds 52. The cooling pipe 51 is arranged below the molding concave block 22. The plurality of groups of manifolds 52 are evenly distributed on the cooling pipe 51, and the top of the manifold 52 is connected to the cooling pipe 51. In this embodiment, the input end and the output end of the cooling pipe 51 are both connected to an external water tank, and the cooling water in the water tank is passed into the cooling pipe 51 and the manifold 52 to achieve water-cooled conduction heat dissipation and improve the heat dissipation effect of the shoe mold.
[0045] Specifically, in another embodiment of the present invention, Figure 2 As shown, the ejection mechanism 60 includes a fixed plate 61 and an ejection assembly 62. The ejection assembly 62 is divided into two groups and is distributed on the left and right sides at the bottom of the forming concave block 22. The ejection assembly 62 includes an ejection drive 621, a connecting rod 622 and a push plate 623. The ejection drive 621 is a cylinder, which is arranged in the lower die base 20 and is located below the forming concave block 22. The output end of the ejection drive 621 is connected to the connecting rod 622, and the connecting rod 622 is connected to the push plate 623. The push plate 623 is arranged in the forming concave block 22 and is slidably connected to the forming concave block 22. The connecting rod 622 is arranged on the fixed plate 61 and is slidably connected to the fixed plate 61. The lifting driving member 621 is started, and the output end of the lifting driving member 621 drives the push plate 623 to lift up relative to the forming concave block 22, so as to lift the sole in the forming concave block 22, making it easier for the staff to remove the sole from the shoe mold and simplifying the sole removal steps.
[0046] Specifically, in another embodiment of the present invention, Figure 1-Figure 2 As shown, the upper die base 10 includes a top plate 13 and a mounting plate 14. The top plate 13 is connected to the mounting plate 14. A mounting cavity 15 is provided in the mounting plate 14. There are two groups of adjustment drive members 31, and the two groups of adjustment drive members 31 are distributed in the top plate 13. The lifting plate 32 and the guide column 36 are both provided in the mounting cavity 15, and the lifting plate 32 is slidably connected to the mounting cavity 15. By providing the guide column 36 in the mounting cavity 15, the lifting plate 32 can stably move up and down during movement, preventing the lifting plate 32 from moving unstably, and improving the service life of the adjustment mechanism 30.
[0047] Specifically, in another embodiment of the present invention, Figure 5-Figure 6 As shown, the upper mold base 10 is provided with a plurality of groups of circumferentially arranged limiting columns 12. The lower mold base 20 is provided with a plurality of groups of limiting grooves 24 corresponding to the limiting columns 12. When the mold is closed, the limiting columns 12 and the limiting grooves 24 cooperate with each other to prevent the upper mold base 10 and the lower mold base 20 from having position deviation, thereby improving the position accuracy of the shoe mold and the production quality of the sole.
[0048] By setting up the adjustment mechanism 30, before the sole is formed, the lifting plate 32 and the connecting block 33 are driven to move upward or downward by adjusting the driving member 31, and the height position of the forming protrusion 11 relative to the forming recessed block 22 is adjusted, thereby adjusting the thickness of the sole after forming, simplifying the adjustment operation steps. At the same time, a lifting mechanism 60 is also set. After the sole is formed, the lifting mechanism 60 is used to lift the sole from the forming recessed block 22, which is convenient for the staff to take the material and improves the production efficiency.
[0049] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A shoe mold that facilitates adjustment of the thickness of the sole, characterized in that: It comprises an upper die base and a lower die base; the upper die base is provided with left and right distributed forming protrusions and an adjusting mechanism; the adjusting mechanism is arranged above the forming protrusions, and the adjusting mechanism comprises an adjusting driving member, a lifting plate and a connecting block; the output end of the adjusting driving member is connected to the lifting plate, the lifting plate is connected to the connecting block, and the connecting block is connected to the top of the forming protrusion; both ends of the lifting plate are provided with guide columns in sliding connection, and the lifting plate is provided with a buffer layer and a plurality of groups of buffer protrusions; the lower die base is arranged below the upper die base, and a material ejecting mechanism and a forming concave block corresponding to the forming protrusion are arranged in the lower die base; the material ejecting mechanism is connected to the forming concave block and is located below the forming concave block, and is used to eject the formed sole.
2. A shoe mold for facilitating adjustment of sole thickness according to claim 1, characterized in that: The lower die base also includes a heat dissipation mechanism, which has two groups of heat dissipation components and temperature sensors distributed on the left and right; the heat dissipation component is arranged on the outside of the forming concave block to discharge the heat in the lower die base to the outside; the temperature sensor is arranged on the inside of the forming concave block to detect the temperature in the lower die base.
3. A shoe mold for facilitating adjustment of sole thickness according to claim 2, characterized in that: The heat dissipation assembly includes a heat conduction plate, a heat dissipation fan and a filter; the heat conduction plate is arranged on the outside of the molding concave block; the heat dissipation fan is arranged on the outside of the heat conduction plate; the filter is arranged on the lower mold base and is located on the outside of the heat dissipation fan.
4. A shoe mold for facilitating adjustment of sole thickness according to claim 3, characterized in that: A digital display is provided on the lower die base; the digital display is electrically connected to the temperature sensor and is used to display the temperature inside the lower die base.
5. A shoe mold for facilitating adjustment of sole thickness according to claim 1, characterized in that: The lower mold base also includes a water cooling mechanism, which includes a cooling pipe and several groups of diverter pipes; the cooling pipe is arranged below the forming concave block; several groups of diverter pipes are equidistantly distributed on the cooling pipe, and the top end of the diverter pipe is connected to the cooling pipe.
6. A shoe mold for facilitating adjustment of sole thickness according to any one of claims 1 to 5, characterized in that: The ejection mechanism includes a fixed plate and an ejection assembly; the ejection assembly is divided into two groups and is distributed on the left and right sides of the bottom end of the forming concave block, and the ejection assembly includes an ejection driving member, a connecting rod and a push plate; the ejection driving member is arranged in the lower mold base and is located below the forming concave block; the output end of the ejection driving member is connected to the connecting rod, and the connecting rod is connected to the push plate; the push plate is arranged in the forming concave block and is slidably connected to the forming concave block; the connecting rod is arranged on the fixed plate and is slidably connected to the fixed plate.
7. A shoe mold for facilitating adjustment of sole thickness according to any one of claims 1 to 5, characterized in that: The upper die base comprises a top plate and a mounting plate; the top plate is connected to the mounting plate; a mounting cavity is arranged in the mounting plate.
8. A shoe mold for facilitating adjustment of sole thickness according to claim 7, characterized in that: There are two groups of adjusting driving members, and the two groups of adjusting driving members are distributed on the left and right sides of the top plate; the lifting plate and the guide column are both arranged in the installation cavity, and the lifting plate is slidably connected to the installation cavity.
9. A shoe mold for facilitating adjustment of sole thickness according to any one of claims 1 to 4, characterized in that: The upper die base is provided with a plurality of groups of circumferentially arranged limiting columns; the lower die base is provided with a plurality of groups of limiting grooves corresponding to the limiting columns.