Circuit board electro-coppering device capable of uniformly coppering

Abstract

The utility model is applicable to the technical field of circuit board processing, and provides a circuit board electro-coppering device with uniform copper plating, which comprises a processing table, an electro-coppering box is fixedly mounted at the top of the processing table, and the electro-coppering box is used for containing copper liquid for circuit board copper plating; the aeration pipe is fixedly arranged in the electroplating copper box; the mounting frame is fixedly mounted at the top of the processing table; the rotating shaft is rotationally mounted on the mounting frame; the electric telescopic rod is fixedly mounted at the bottom end of the rotating shaft; and the mounting plate is fixedly mounted at the top end of an output rod of the electric telescopic rod. The circuit board electro-coppering device capable of uniformly plating copper solves the problems that the thickness of a copper plating layer is inconsistent due to non-uniform distribution of copper liquid in the existing electro-coppering process, and the conductivity and the stability are further influenced.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board processing, and particularly relates to a circuit board copper electroplating device with uniform copper plating. Background Art

[0002] In the electronics manufacturing industry, circuit boards are one of the core components of electronic products. Their conductivity and stability directly determine the performance and service life of electronic products. With the continuous upgrading of electronic products, the requirements for circuit boards are getting higher and higher, especially in terms of conductivity and stability. In order to meet these requirements, copper plating technology is widely used in the manufacturing process of circuit boards.

[0003] At present, the traditional copper plating technology of circuit boards usually adopts the method of electroplating copper. Although this method can achieve the coverage of the copper layer on the substrate, it exposes some problems in practical applications. For example, during the electroplating copper process, the copper liquid is unevenly distributed, which easily leads to inconsistent thickness of the copper plating layer, affecting the conductive performance and stability. Utility Model Content

[0004] The utility model provides a circuit board copper electroplating device with uniform copper plating, aiming to solve the problem that the copper liquid is unevenly distributed in the current copper electroplating process, resulting in inconsistent copper plating layer thickness, thereby affecting the conductive performance and stability.

[0005] The utility model is achieved as follows: a copper electroplating device for circuit boards with uniform copper plating comprises: a processing table, a copper electroplating box is fixedly installed on the top of the processing table, and the copper electroplating box is used to hold copper liquid for copper plating of circuit boards; an aeration pipe, the aeration pipe is fixedly installed in the copper electroplating box; a mounting frame, the mounting frame is fixedly installed on the top of the processing table; a rotating shaft, the rotating shaft is rotatably installed on the mounting frame; an electric telescopic rod, the electric telescopic rod is fixedly installed on the bottom end of the rotating shaft; a mounting plate, the mounting plate is fixedly installed on the top end of the output rod of the electric telescopic rod; a cover plate, the cover plate is fixedly installed on the bottom of the mounting plate; a placement frame for placing the circuit board to be copper-plated, the placement frame is fixedly installed on the bottom of the cover plate; an air supply mechanism for supplying air to the aeration pipe, the air supply mechanism is arranged on the processing table; a driving mechanism for driving the rotating shaft to rotate, the driving mechanism is arranged on the mounting frame and the rotating shaft.

[0006] Preferably, the air supply mechanism includes: a fan fixedly installed on the processing table for air supply; a first connecting pipe fixedly installed on the air outlet end of the fan, the air outlet end of the first connecting pipe is fixedly connected to the aeration pipe; a filter box fixedly installed on the bottom of the processing table for filtering air, a plurality of removable filter plates are arranged in the filter box; a second connecting pipe fixedly connected to the air inlet end of the fan, the air inlet end of the second connecting pipe is fixedly connected to the filter box; an air inlet pipe fixedly connected to the filter box.

[0007] Preferably, the driving mechanism comprises: a motor fixedly mounted on the mounting frame; a first bevel gear fixedly mounted on the output shaft of the motor for transmission; and a second bevel gear fixedly mounted on the top end of the rotating shaft, the second bevel gear meshing with the first bevel gear.

[0008] Preferably, a plurality of slide slot plates are symmetrically fixedly mounted on the top and bottom inner walls of the placement frame, a plurality of through holes are opened on the placement frame, and a placement slot for placing the circuit board is fixedly mounted on the processing table.

[0009] Preferably, a check valve is provided on the first connecting pipe, and an openable and closable sealing door is provided on one side of the filter box. The sealing door is provided with a hinge and a door lock, and the hinge is fixedly connected to the filter box.

[0010] Preferably, one side of the copper electroplating box is fixedly connected with a drain pipe, a valve is provided on the drain pipe, and an air hole is opened on the cover plate.

[0011] Preferably, a shielding shell is fixedly mounted on the mounting frame, and the shielding shell is used to shield and protect the motor, the first bevel gear and the second bevel gear.

[0012] Compared with the related art, the circuit board copper electroplating device with uniform copper plating provided by the utility model has the following beneficial effects:

[0013] The aeration effect of the aeration tube ensures that the circuit board can be evenly contacted with the copper liquid during the copper plating process, thereby significantly improving the uniformity of the copper plating layer; the depth and time of the circuit board being immersed in the copper liquid can be accurately controlled by the telescopic adjustment of the electric telescopic rod, thereby achieving precise control of the thickness of the copper plating layer; this precise control helps to improve product quality and consistency; the discharge pipe and valve are set to facilitate the discharge and treatment of waste liquid, in line with environmental protection requirements; at the same time, the design of the filter box and filter plate can effectively remove impurities and particulate matter in the air, reduce the impurity content in the copper liquid, and reduce energy consumption and environmental pollution in the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the main structure of a circuit board copper electroplating device with uniform copper plating provided by the utility model;

[0015] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0016] Figure 3 for Figure 2 An enlarged structural diagram of part A shown in FIG.

[0017] Figure 4 It is a structural schematic diagram of the placement frame and the slide plate in the utility model.

[0018] Figure numerals: 1. Processing table; 2. Electroplating copper box; 3. Aeration pipe; 4. Mounting frame; 5. Rotating shaft; 6. Electric telescopic rod; 7. Mounting plate; 8. Cover plate; 9. Placement frame; 10. Fan; 11. First connecting pipe; 12. Filter box; 13. Filter plate; 14. Second connecting pipe; 15. Inlet pipe; 16. Motor; 17. First bevel gear; 18. Second bevel gear; 19. Placement groove; 20. Slide plate. DETAILED DESCRIPTION

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0020] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0021] The utility model provides a circuit board copper electroplating device with uniform copper plating, such as Figure 1-4As shown, the copper electroplating device for circuit boards with uniform copper plating comprises: a processing table 1, a copper electroplating box 2 is fixedly installed on the top of the processing table 1, and the copper electroplating box 2 is used to hold copper liquid for copper plating of circuit boards; an aeration pipe 3, the aeration pipe 3 is fixedly installed in the copper electroplating box 2; a mounting frame 4, the mounting frame 4 is fixedly installed on the top of the processing table 1; a rotating shaft 5, the rotating shaft 5 is rotatably installed on the mounting frame 4; an electric telescopic rod 6, the electric telescopic rod 6 is fixedly installed on the bottom end of the rotating shaft 5; a mounting plate 7, the mounting plate 7 is fixedly installed on the top end of the output rod of the electric telescopic rod 6; a cover plate 8, the cover plate 8 is fixedly installed on the bottom of the mounting plate 7; a placement frame 9 for placing the circuit board to be copper-plated, the placement frame 9 is fixedly installed on the bottom of the cover plate 8; an air supply mechanism for supplying air to the aeration pipe 3, the air supply mechanism is arranged on the processing table 1; a driving mechanism for driving the rotating shaft 5 to rotate, the driving mechanism is arranged on the mounting frame 4 and the rotating shaft 5.

[0022] It should be noted that during the copper electroplating process, the copper liquid often cannot maintain a uniform distribution in the plating tank; this unevenness causes different positions on the substrate to receive different amounts of copper ions, which in turn causes differences in the thickness of the copper plating layer; in practical applications, this thickness inconsistency may reach several microns or even more, significantly affecting the quality and performance of the copper plating layer; the uneven distribution of the copper liquid directly leads to inconsistent thickness of the copper plating layer, and the unevenness of the copper plating layer may also cause signal distortion and increased noise, further affecting the performance of the circuit board;

[0023] In this embodiment, the processing table 1 serves as the supporting base of the entire copper plating structure. A copper plating box 2 is fixedly installed on the top of the processing table 1. The copper plating box 2 is used to hold copper liquid for copper plating of circuit boards. The quality, concentration and uniformity of the copper liquid are crucial to the copper plating effect. An aeration pipe 3 is fixedly installed in the copper plating box 2 and is used to stir the copper liquid by gas to ensure that the copper liquid is evenly distributed in the copper plating box 2. The aeration pipe 3 provides gas through a gas supply mechanism. The gas forms bubbles in the copper liquid and rises, driving the copper liquid to flow, thereby avoiding precipitation and uneven distribution of the copper liquid. A mounting frame 4 is fixedly installed on the top of the processing table 1 and is used to install a rotating shaft 5 and an electric telescopic rod 6. The rotating shaft 5 is rotatably installed on the mounting frame 4, and the electric telescopic rod 6 is fixedly installed on the bottom end of the rotating shaft 5, which is used to adjust the placement. The frame 9 and the cover plate 8 are lowered, and the frame 9 can be placed into the copper electroplating box 2, and the depth and time of the circuit board on the placement frame 9 being immersed in the copper liquid can be controlled accurately, so as to accurately control the thickness of the copper plating layer; the mounting plate 7 is fixedly mounted on the top of the output rod of the electric telescopic rod 6, and is used to connect the cover plate 8 and the electric telescopic rod 6; the cover plate 8 is fixedly mounted on the bottom of the mounting plate 7, and is used to close the placement frame 9 and prevent the copper liquid from splashing out; the design of the cover plate 8 should ensure that it fits tightly with the inner wall of the copper electroplating box 2 to reduce the leakage of the copper liquid; the placement frame 9 is fixedly mounted on the bottom of the cover plate 8, and is used to place the circuit board to be copper plated; the design of the placement frame 9 should ensure that the circuit boards can be evenly distributed on the cover plate 8, so as to evenly contact the copper liquid during the copper plating process; it is arranged on the processing table 1, and is used to supply air to the aeration pipe 3. The air supply mechanism can control the stirring effect of the aeration tube 3 by adjusting the gas flow and pressure, thereby ensuring the uniform distribution of the copper liquid in the copper electroplating box 2; it is arranged on the mounting frame 4 and the rotating shaft 5 to drive the rotating shaft 5 to rotate. The driving mechanism can realize precise control of the rotating shaft 5 through devices such as a motor and a reducer to ensure the uniform rotation of the circuit board during the copper plating process; through the stirring effect of the aeration tube 3 and the rotating movement of the circuit board, it can be ensured that the circuit board is in uniform contact with the copper liquid during the copper plating process, thereby significantly improving the uniformity of the copper plating layer; through the extension and retraction of the electric telescopic rod 6 and the adjustment of the air supply mechanism, the depth and time of the circuit board being immersed in the copper liquid can be accurately controlled, thereby achieving precise control of the thickness of the copper plating layer; the uniformity and precise control of the copper plating layer help to improve the conductivity and stability of the circuit board, reduce problems such as signal distortion and noise increase, and further improve the overall performance of the circuit board.

[0024] In a further preferred embodiment of the utility model, the air supply mechanism includes: a fan 10 fixedly installed on the processing table 1 for air supply; a first connecting pipe 11 fixedly installed on the air outlet end of the fan 10, the air outlet end of the first connecting pipe 11 is fixedly connected to the aeration pipe 3; a filter box 12 fixedly installed at the bottom of the processing table 1 for filtering air, and a plurality of removable filter plates 13 are arranged in the filter box 12; a second connecting pipe 14 fixedly connected to the air inlet end of the fan 10, the air inlet end of the second connecting pipe 14 is fixedly connected to the filter box 12; an air inlet pipe 15 fixedly connected to the filter box 12.

[0025] In this embodiment, the detailed design of the air supply mechanism significantly improves the uniformity of the copper liquid distribution and the quality of the copper plating layer during the copper plating process. The fan 10 is fixedly installed on the processing table 1 to provide a stable airflow for the aeration pipe 3. The selection and use of the fan 10 can ensure that sufficient air volume is provided for the aeration pipe 3 while maintaining the stability of the airflow, which is crucial for the uniform stirring of the copper liquid; the first connecting pipe 11 connects the air outlet of the fan 10 and the aeration pipe 3 to ensure that the airflow flows smoothly from the fan 10 to the aeration pipe 3. The design of the first connecting pipe 11 should take into account the resistance of the airflow to reduce energy loss and ensure the uniformity of the airflow; the filter box 12 is fixedly installed at the bottom of the processing table 1 to filter the air entering the fan 10. The design of the filter box 12 can effectively remove impurities and particulate matter in the air, protect the fan 10 from damage, and ensure that a clean airflow is provided for the aeration pipe 3 to reduce the impurity content in the copper liquid; the filter plate 13 is arranged in the filter box 12 to filter impurities in the air. The filter plate 13 is designed to be removable and easy to clean and replace, ensuring the durability and stability of the filtering effect; the second connecting pipe 14 connects the air inlet end of the fan 10 and the filter box 12 to ensure that clean air flows from the filter box 12 into the fan 10. The design of the second connecting pipe 14 should take into account the smoothness and sealing of the air flow to avoid air leakage and impurities entering; the air inlet pipe 15 is fixedly connected to the filter box 12 as the air inlet. The design of the air inlet pipe 15 should take into account the air circulation and filtering effect to ensure that the air entering the filter box 12 can be fully filtered and purified; through the filtering effect of the filter box 12 and the filter plate 13, impurities and particulate matter in the air can be removed, and the impurity content in the copper liquid can be reduced, thereby improving the quality and performance of the copper plating layer; the filtering effect of the filter box 12 and the filter plate 13 that protects the fan 10 can protect the fan 10 from damage by impurities and particulate matter in the air, and extend the service life of the fan 10; the stable airflow provided by the fan 10 forms a uniform bubble distribution in the electroplating copper box 2 through the aeration pipe 3, thereby driving the copper liquid to flow evenly and improving the uniformity of copper plating; the filter plate 13 adopts a removable design, which is easy to clean and replace, reducing the maintenance cost and difficulty.

[0026] In a further preferred embodiment of the utility model, the driving mechanism includes: a motor 16 fixedly mounted on the mounting frame 4; a first bevel gear 17 fixedly mounted on the output shaft of the motor 16 for transmission; and a second bevel gear 18 fixedly mounted on the top end of the rotating shaft 5, the second bevel gear 18 meshing with the first bevel gear 17.

[0027] In this embodiment, the design of the driving mechanism provides rotation control for the copper plating process, and the position of the placement frame 9 can be switched for continuous copper plating. The motor 16 is fixedly mounted on the mounting frame 4. As the source of driving force, the selection of the motor 16 should meet the requirements of rotation speed and stability during the copper plating process to ensure that the circuit board can rotate evenly in the copper electroplating box 2; the first bevel gear 17 is fixedly mounted on the output shaft of the motor 16 for transmitting the rotational power of the motor. The design of the first bevel gear 17 should ensure that it can be closely meshed with the second bevel gear 18 to reduce energy loss and wear; the second bevel gear 18 is fixedly mounted on the top of the rotating shaft 5 and meshes with the first bevel gear 17. Through the meshing of the first bevel gear 17 and the second bevel gear 18, the rotational power of the motor 16 is transmitted to the rotating shaft 5, thereby driving the placement frame 9 and the cover plate 8 to rotate in the copper electroplating box 2; the meshing of the first bevel gear 17 and the second bevel gear 18 driven by the motor 16 ensures the rotational stability of the rotating shaft 5 and the placement frame 9. This design avoids friction and wear in traditional mechanical transmission and improves the stability and reliability of the copper plating process.

[0028] In a further preferred embodiment of the utility model, a plurality of slide plates 20 are symmetrically fixedly installed on the top and bottom inner walls of the placement frame 9, a plurality of through holes are opened on the placement frame 9, and a placement groove 19 for placing the circuit board is fixedly installed on the processing table 1.

[0029] In this embodiment, regarding the improved design of the placement frame 9 and the processing table 1, a plurality of slide plates 20 are symmetrically fixedly installed on the top and bottom inner walls of the placement frame 9, and these slide plates 20 can be designed as grooves with appropriate width and depth to provide support and positioning for the circuit board placed therein; the slide plates 20 can ensure that the circuit board maintains a stable posture during the copper plating process to avoid displacement or tilting caused by the flow or rotation of the copper liquid. This stable posture helps to achieve a uniform copper plating effect; a plurality of through holes are opened on the placement frame 9 to ensure that the copper liquid can flow down along the placement frame 9 and reduce the retention of copper liquid.

[0030] In a further preferred embodiment of the utility model, a check valve is provided on the first connecting pipe 11, and an openable and closable sealing door is provided on one side of the filter box 12. The sealing door is provided with a hinge and a door lock, and the hinge is fixedly connected to the filter box 12.

[0031] In this embodiment, in view of the improved design of the air supply mechanism and the filter box 12, a check valve is arranged on the first connecting pipe 11, which can effectively prevent the airflow from flowing back when the fan 10 stops working, thereby preventing the residual gas or liquid in the fan 10 and the aeration pipe 3 from flowing back into the filter box 12 and causing pollution or damage; the setting of the check valve protects the fan 10 and the aeration pipe 3 and extends their service life; it prevents backflow pollution and keeps the air supply system clean and stable.

[0032] In a further preferred embodiment of the utility model, one side of the copper electroplating box 2 is fixedly connected to a drain pipe, and a valve is provided on the drain pipe.

[0033] In this embodiment, a drain pipe is fixedly connected to one side of the copper electroplating box 2, and a valve is arranged on the drain pipe. The drain pipe provides a convenient way to discharge waste liquid or excess copper liquid in the copper electroplating box 2; the valve is arranged on the drain pipe, and the discharge time and flow rate of the waste liquid can be accurately controlled. When the copper plating process is completed or the copper electroplating box 2 needs to be cleaned, the waste liquid can be discharged by opening the valve.

[0034] In a further preferred embodiment of the utility model, a shielding shell is fixedly mounted on the mounting frame 4 , and the shielding shell is used to shield and protect the motor 16 , the first bevel gear 17 and the second bevel gear 18 .

[0035] In this embodiment, a shielding shell is fixedly installed on the mounting frame 4, and the main function of the shielding shell is to shield and protect the motor 16, the first bevel gear 17 and the second bevel gear 18; the shielding shell can be designed to have a shape and size that closely matches the mounting frame 4 to ensure that it can effectively shield and protect the internal motor 16 and bevel gear transmission mechanism.

[0036] In summary, the copper electroplating device for circuit boards with uniform copper plating provided by the technical solution can effectively improve the uniform distribution of copper liquid in the plating tank, reduce the difference in the number of copper ions received by different positions on the substrate, thereby reducing the risk of inconsistent thickness of the copper plating layer, and solves the problem of uneven distribution of copper liquid in the current copper electroplating process, resulting in inconsistent thickness of the copper plating layer, which in turn affects the conductive performance and stability.

[0037] Compared with the related art, the aeration effect of the aeration pipe 3 ensures that the circuit board can be evenly contacted with the copper liquid during the copper plating process, thereby significantly improving the uniformity of the copper plating layer; through the telescopic adjustment of the electric telescopic rod 6, the depth and time of the circuit board being immersed in the copper liquid can be accurately controlled, thereby achieving precise control of the thickness of the copper plating layer; this precise control helps to improve product quality and consistency; by setting up a drain pipe and a valve, the discharge and treatment of waste liquid are convenient, meeting environmental protection requirements; at the same time, the design of the filter box 12 and the filter plate 13 can effectively remove impurities and particulate matter in the air, reduce the impurity content in the copper liquid, and reduce energy consumption and environmental pollution in the production process.

[0038] It is worth noting that the circuits, electronic components and modules involved in the present utility model are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by the present utility model does not involve improvements to software and methods.

[0039] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the above-mentioned units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunication or other forms.

[0040] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. A circuit board copper electroplating device with uniform copper plating, characterized in that: include: A processing table, a copper electroplating box is fixedly installed on the top of the processing table, and the copper electroplating box is used to hold copper liquid for copper plating of circuit boards; An aeration pipe, wherein the aeration pipe is fixedly installed in the copper electroplating box; A mounting frame, the mounting frame is fixedly mounted on the top of the processing table; A rotating shaft, the rotating shaft being rotatably mounted on the mounting frame; An electric telescopic rod, wherein the electric telescopic rod is fixedly mounted on the bottom end of the rotating shaft; A mounting plate, the mounting plate being fixedly mounted on the top end of the output rod of the electric telescopic rod; A cover plate, the cover plate is fixedly mounted on the bottom of the mounting plate; A placement frame for placing the circuit board to be copper plated, wherein the placement frame is fixedly mounted on the bottom of the cover plate; an air supply mechanism for supplying air into the aeration pipe, wherein the air supply mechanism is arranged on the processing table; A driving mechanism for driving the rotating shaft to rotate, wherein the driving mechanism is arranged on the mounting frame and the rotating shaft.

2. The circuit board copper electroplating device with uniform copper plating as claimed in claim 1, characterized in that: The gas supply mechanism comprises: A fan fixedly mounted on the processing table for air supply; A first connecting pipe fixedly mounted on the air outlet end of the fan, the air outlet end of the first connecting pipe being fixedly connected to the aeration pipe; A filter box fixedly mounted at the bottom of the processing table for filtering air, wherein a plurality of removable filter plates are arranged in the filter box; A second connecting pipe fixedly connected to the air inlet end of the fan, wherein the air inlet end of the second connecting pipe is fixedly connected to the filter box; An air intake pipe is fixedly connected to the filter box.

3. The circuit board copper electroplating device with uniform copper plating as claimed in claim 1, characterized in that: The driving mechanism comprises: A motor fixedly mounted on the mounting frame; A first bevel gear fixedly mounted on the output shaft of the motor for transmission; A second bevel gear is fixedly mounted on the top end of the rotating shaft, and the second bevel gear is meshed with the first bevel gear.

4. The circuit board copper electroplating device with uniform copper plating as claimed in claim 1, characterized in that: A plurality of slide slot plates are symmetrically fixedly installed on the top and bottom inner walls of the placement frame, a plurality of through holes are opened on the placement frame, and a placement slot for placing the circuit board is fixedly installed on the processing table.

5. The circuit board copper electroplating device with uniform copper plating as claimed in claim 2, characterized in that: A check valve is arranged on the first connecting pipe, and an openable and closable sealing door is arranged on one side of the filter box. A hinge and a door lock are arranged on the sealing door, and the hinge is fixedly connected to the filter box.

6. The circuit board copper electroplating device with uniform copper plating as claimed in claim 1, characterized in that: One side of the copper electroplating box is fixedly connected with a drain pipe, a valve is arranged on the drain pipe, and an air hole is opened on the cover plate.

7. The circuit board copper electroplating device with uniform copper plating as claimed in claim 3, characterized in that: A shielding shell is fixedly mounted on the mounting frame, and the shielding shell is used to shield and protect the motor, the first bevel gear and the second bevel gear.

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