Anti-overflow electroplating device

Abstract

The utility model relates to the field of electroplating devices, in particular to an anti-overflow electroplating device. According to the technical problems, tail gas generated during electroplating is concentrated through a pipeline conveying structure and then treated, after electroplating is finished, a part of tail gas still remains in an electroplating pool, the tail gas overflows when the electroplating pool is opened, the environment is damaged by tail gas overflowing, and the health of workers is affected; according to the technical scheme, the electroplating device capable of preventing gas overflow comprises a gas extraction assembly, a gas exhaust assembly and a treatment assembly; compared with the prior art that tail gas generated during electroplating is concentrated by adopting a pipeline conveying structure, a part of tail gas still remains in the electroplating tank, and the tail gas overflows when the electroplating tank is opened; according to the electroplating device, by arranging the exhaust structure, tail gas in the electroplating pool can be extruded out after electroplating is finished, so that the residual tail gas in the electroplating pool can be completely exhausted, and harmful gas generated during electroplating is effectively prevented from overflowing.

Description

Technical Field

[0001] The utility model relates to the field of electroplating devices, in particular to an electroplating device capable of preventing gas overflow. Background Art

[0002] An electroplating device is a device used to attach a metal coating to the surface of an object; it uses the principle of electrolysis to deposit metal ions on the surface of an object to form a protective layer or an aesthetically pleasing coating; an electroplating device consists of many components; first, there is an electrolytic cell for holding an electrolyte; the electrolytic cell is a container containing metal salts and solvents, which provides a source of metal ions; second, there are electrodes, which are inserted into the electrolytic cell and connected to a power source; one of the electrodes is the object to be plated and the other is made of metal; an electric current passes through the electrolyte, depositing the metal ions from the solution onto the object to be plated; finally, there is a control system for adjusting the current and time to control the thickness and quality of the coating; the working principle of the electroplating device is achieved through electrochemical reactions; when an electric current passes through the electrolyte, the metal ions are reduced to metal on the object to be plated , forming a uniform coating; the surface of the plated object must be cleaned and treated in advance to ensure the adhesion and uniformity of the coating; in addition, different combinations of metals and solutions can produce different coating effects, such as providing corrosion resistance, decorativeness or conductivity; electroplating equipment is widely used in many fields; for example, it can be used to manufacture products such as electronic devices, auto parts, jewelry and kitchenware; at the same time, electroplating equipment also contributes to environmental protection because it can effectively utilize and recycle metals and reduce waste generation; when treating the exhaust gas generated during electroplating, a pipeline conveying structure is used to concentrate the exhaust gas generated during electroplating and then treat it. After the electroplating is completed, a part of the exhaust gas will still remain in the electroplating pool. Opening the electroplating pool will cause the exhaust gas to overflow, which will damage the environment and affect the health of the staff. Utility Model Content

[0003] In order to overcome the problem of exhaust gas generated during electroplating, a pipeline conveying structure is used to concentrate the exhaust gas generated during electroplating and then treat it. After the electroplating is completed, some exhaust gas will still remain in the electroplating pool. Opening the electroplating pool will cause the exhaust gas to overflow, which will damage the environment and affect the health of the workers.

[0004] The technical solution of the utility model is: an anti-overflow electroplating device, including an electroplating pool, a sealing component, an air suction component, an exhaust component, a processing component, a filter component and a support component, the sealing component is arranged above the electroplating pool, the air suction component is connected to the sealing component, one end of the exhaust component is connected to the sealing component, the other end of the exhaust component is connected to the processing component, the filter component is arranged on one side of the electroplating pool, and the support component is arranged below the electroplating pool.

[0005] Preferably, the electroplating pool can be sealed by providing a sealing component to prevent the gas generated in the electroplating pool from overflowing, the gas in the electroplating pool can be extracted by providing a vacuum component, the gas in the electroplating pool can be completely removed by providing an exhaust component, the gas in the electroplating pool can be treated by providing a treatment component to prevent air pollution, the plating liquid in the electroplating pool can be filtered and impurities can be removed by providing a filter component, and the electroplating pool can be supported by providing a support component.

[0006] Preferably, the sealing assembly includes a sealing cover and a connecting pipe. The sealing cover is arranged on the top surface of the electroplating pool. One end of the sealing cover is rotatably connected to the top surface of the electroplating pool by a hinge, and the other end of the sealing cover is connected to the top surface of the electroplating pool by a snap. When in use, the electroplating pool can be sealed by setting the sealing cover to prevent the gas generated during electroplating in the electroplating pool from overflowing. The gas generated by electroplating in the electroplating pool can be discharged by setting the connecting pipe.

[0007] Preferably, the exhaust assembly includes an exhaust pipe, an exhaust pump and a gas storage tank. One end of the exhaust pipe is connected to the top surface of the sealing cover, and the other end of the exhaust pipe is connected to the connecting pipe. The exhaust pump is arranged on the exhaust pipe. An electric valve is arranged on the exhaust pipe. A one-way valve is arranged on the exhaust pipe. When in use, the gas storage tank can be connected to the connecting pipe by arranging the exhaust pipe. By arranging the exhaust pump, a negative pressure can be generated in the exhaust pipe. Therefore, under the action of the exhaust pump, the gas in the electroplating pool can be extracted and transported to the gas storage tank through the exhaust pipe for storage, so that it can be recycled as an industrial raw material. Moreover, harmful gases generated during electroplating can be prevented from overflowing to pollute the environment or affect the health of the staff.

[0008] Preferably, the exhaust assembly includes an air intake pump and an air intake pipe, and the air intake pipe is arranged in multiple groups. One end of the air intake pipe is connected to the electroplating pool, and the other end of the air intake pipe is connected to the air intake pump. The air intake pipe is provided with an electric valve and a one-way valve. When in use, the air intake pump can be provided to transport harmless air into the air intake pipe, thereby transporting fresh air into the electroplating pool through the air intake pipe, and completely eliminating harmful gases in the electroplating pool for transportation using the connecting pipe.

[0009] Preferably, the processing component includes a processing pipe and a processing box. One end of the processing pipe is connected to the connecting pipe, and the other end of the processing pipe is connected to the processing box. An electric valve is provided on the processing pipe. When in use, harmful gases mixed with a large amount of air can be transported to the interior of the processing box by setting the processing pipe. The processing box can be used to store the processing liquid, so that the processing liquid can be used to absorb or neutralize the harmful gases, thereby effectively preventing the harmful gases generated during electroplating from overflowing, causing pollution to the environment or affecting the health of the workers.

[0010] Preferably, the filtering assembly includes a circulation pipe, a filter box and a circulation pump. One end of the circulation pipe is through-connected to the bottom surface of the electroplating pool, and the other end of the circulation pipe is through-connected to the side wall of the electroplating pool. The filter box is arranged on the circulation pipe. A filter layer is arranged inside the filter box. The circulation pump is arranged on the circulation pipe. When in use, the circulation pipe can be arranged so that the plating liquid in the electroplating pool can circulate in the circulation pipe under the action of the circulation pump, thereby circulating through the filter box, so that the plating liquid in the electroplating pool can be filtered.

[0011] Preferably, the support assembly includes support legs and support seats. The support legs are arranged in multiple groups, the support legs are arranged under the electroplating pool, the support legs are fixedly connected to the bottom surface of the electroplating pool, and the support seats are arranged in multiple groups, the support seats are fixedly connected to the bottom surface of the support legs. When in use, the electroplating pool can be supported and fixed by setting the support legs and the support seats.

[0012] Beneficial effects of the utility model:

[0013] 1. Compared with the prior art, when treating the tail gas generated during electroplating, a pipeline conveying structure is used to concentrate the tail gas generated during electroplating and then treat it. After the electroplating is completed, a part of the tail gas will still remain in the electroplating pool. Opening the electroplating pool will cause the tail gas to overflow, which will damage the environment and affect the health of the workers. The electroplating device is provided with an exhaust structure, which can squeeze out the tail gas in the electroplating pool after the electroplating is completed, so that the remaining tail gas in the electroplating pool can be completely discharged, thereby effectively preventing the harmful gas generated during electroplating from overflowing, causing pollution to the environment or affecting the health of the workers.

[0014] 2. By setting up an air intake pump, harmless air can be transported into the air intake pipe, thereby transporting fresh air into the electroplating pool through the air intake pipe, completely eliminating harmful gases in the electroplating pool, and using connecting pipes for transportation. By setting up a treatment pipe, harmful gases mixed with a large amount of air can be transported to the inside of the treatment box. By setting up a treatment box, the treatment liquid can be stored, so that the treatment liquid can be used to absorb or neutralize the harmful gases, effectively preventing the harmful gases generated during electroplating from overflowing, causing pollution to the environment or affecting the health of the workers;

[0015] 3. The gas storage tank can be connected to the connecting pipe by setting up an exhaust pipe, and negative pressure can be generated in the exhaust pipe by setting up an exhaust pump. Therefore, the gas in the electroplating pool can be extracted by the exhaust pump and transported to the gas storage tank through the exhaust pipe for storage, so that it can be recycled as an industrial raw material. It can also prevent the harmful gas generated during electroplating from overflowing, causing pollution to the environment or affecting the health of the workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The three-dimensional structure schematic diagram of the anti-overflow electroplating device of the utility model is shown;

[0017] Figure 2 The figure shows a schematic diagram of the three-dimensional structure of the electroplating device for preventing gas overflow according to the utility model;

[0018] Figure 3 Shown is a schematic diagram of the three-dimensional structure of another side of the anti-overflow electroplating device of the utility model;

[0019] Figure 4 The figure shows a schematic diagram of the bottom three-dimensional structure of the anti-overflow electroplating device of the utility model;

[0020] Explanation of the reference numerals: 1. electroplating cell; 2. sealing assembly; 3. exhaust assembly; 4. exhaust assembly; 5. treatment assembly; 6. filter assembly; 7. support assembly; 201. sealing cover; 202. connecting pipe; 301. exhaust pipe; 302. exhaust pump; 303. gas storage tank; 401. air intake pump; 402. air intake pipe; 501. treatment pipe; 502. treatment box; 601. circulation pipe; 602. filter box; 603. circulation pump; 701. support leg; 702. support seat. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] See also Figure 1 The utility model provides an embodiment: an anti-overflow electroplating device, including an electroplating pool 1, a sealing component 2, an exhaust component 3, an exhaust component 4, a processing component 5, a filter component 6 and a support component 7, the sealing component 2 is arranged above the electroplating pool 1, the exhaust component 3 is connected to the sealing component 2, one end of the exhaust component 4 is connected to the sealing component 2, and the other end of the exhaust component 4 is connected to the processing component 5, the filter component 6 is arranged on one side of the electroplating pool 1, and the support component 7 is arranged below the electroplating pool 1.

[0023] See also Figure 2-3In this embodiment, the sealing component 2 includes a sealing cover 201 and a connecting pipe 202. The sealing cover 201 is arranged on the top surface of the electroplating tank 1. One end of the sealing cover 201 is rotatably connected to the top surface of the electroplating tank 1 through a hinge, and the other end of the sealing cover 201 is connected to the top surface of the electroplating tank 1 through a buckle. When in use, the electroplating tank 1 can be sealed by setting the sealing cover 201 to prevent the gas generated in the electroplating tank 1 during electroplating from overflowing, and the electroplating in the electroplating tank 1 can be sealed by setting the connecting pipe 202. The generated gas is discharged, and the exhaust component 3 includes an exhaust pipe 301, an exhaust pump 302 and an air storage tank 303. One end of the exhaust pipe 301 is connected to the top surface of the sealing cover 201, and the other end of the exhaust pipe 301 is connected to the connecting pipe 202. The exhaust pump 302 is arranged on the exhaust pipe 301, and an electric valve is arranged on the exhaust pipe 301. A one-way valve is arranged on the exhaust pipe 301. When in use, the exhaust pipe 301 can be set to connect the air storage tank 303 with the connecting pipe 2 02 is connected, and a negative pressure can be generated in the exhaust pipe 301 by setting an exhaust pump 302, so that the gas in the electroplating pool 1 can be extracted under the action of the exhaust pump 302, and transported to the gas storage tank 303 through the exhaust pipe 301 for storage, so that it can be recycled as an industrial raw material, and harmful gases generated during electroplating can be prevented from overflowing, causing pollution to the environment or affecting the health of workers. The exhaust component 4 includes an intake pump 401 and an intake pipe 402. The intake pipe 40 2 is arranged into multiple groups, one end of the air intake pipe 402 is connected with the electroplating pool 1, and the other end of the air intake pipe 402 is connected with the air intake pump 401. The air intake pipe 402 is provided with an electric valve, and the air intake pipe 402 is provided with a one-way valve. When in use, the air intake pump 401 is provided to transport harmless air into the air intake pipe 402, thereby transporting fresh air into the electroplating pool 1 through the air intake pipe 402, and completely eliminating the harmful gas in the electroplating pool 1, and transporting it by using the connecting pipe 202.

[0024] See also Figure 4In this embodiment, the processing component 5 includes a processing pipeline 501 and a processing box 502. One end of the processing pipeline 501 is connected to the connecting pipeline 202, and the other end of the processing pipeline 501 is connected to the processing box 502. The processing pipeline 501 is provided with an electric valve. When in use, the harmful gas mixed with a large amount of air can be transported to the inside of the processing box 502 by setting the processing pipeline 501. The processing box 502 can store the processing liquid, so that the harmful gas can be absorbed or neutralized by the processing liquid, which effectively prevents the harmful gas generated during electroplating from overflowing, causing pollution to the environment or affecting the health of the staff. The filtering component 6 includes a circulation pipeline 601, a filtering box 602 and a circulation pump 603. One end of the circulation pipeline 601 is connected to the bottom surface of the electroplating pool 1, and the other end of the circulation pipeline 601 is connected to the bottom surface of the electroplating pool 1. The side walls are through-connected, the filter box 602 is arranged on the circulation pipe 601, a filter layer is arranged inside the filter box 602, and a circulation pump 603 is arranged on the circulation pipe 601. When in use, by arranging the circulation pipe 601, the plating liquid in the electroplating pool 1 can circulate in the circulation pipe 601 under the action of the circulation pump 603, thereby circulating through the filter box 602, so as to achieve filtering of the plating liquid in the electroplating pool 1. The support assembly 7 includes support legs 701 and a support seat 702. The support legs 701 are arranged in multiple groups, and the support legs 701 are arranged under the electroplating pool 1. The support legs 701 are fixedly connected to the bottom surface of the electroplating pool 1, and the support seats 702 are arranged in multiple groups. The support seats 702 are fixedly connected to the bottom surface of the support legs 701. When in use, the electroplating pool 1 can be supported and fixed by arranging the support legs 701 and the support seat 702.

[0025] During operation, the electroplating pool 1 is sealed by the sealing cover 201 to prevent the gas generated during electroplating in the electroplating pool 1 from escaping, and the gas generated during electroplating in the electroplating pool 1 is discharged by the connecting pipe 202;

[0026] The gas storage tank 303 is connected to the connecting pipe 202 by using the exhaust pipe 301, and the exhaust pump 302 is used to generate negative pressure in the exhaust pipe 301, so that the gas in the electroplating pool 1 is extracted by the exhaust pump 302, and transported to the inside of the gas storage tank 303 through the exhaust pipe 301 for storage, so as to be recycled as industrial raw materials, and to prevent the harmful gas generated during electroplating from overflowing, causing pollution to the environment or affecting the health of the workers;

[0027] The air intake pump 401 is used to deliver harmless air into the air intake pipe 402, thereby delivering fresh air into the electroplating pool 1 through the air intake pipe 402, completely removing harmful gases in the electroplating pool 1, and delivering them through the connecting pipe 202;

[0028] The harmful gas mixed with a large amount of air is transported to the inside of the processing box 502 by using the processing pipeline 501, and the processing liquid is stored in the processing box 502, so that the harmful gas is absorbed or neutralized by the processing liquid, which effectively prevents the harmful gas generated during electroplating from overflowing, causing pollution to the environment or affecting the health of the workers;

[0029] The circulating pipe 601 is used to circulate the electroplating liquid in the electroplating pool 1 under the action of the circulating pump 603, so as to circulate through the filter box 602, thereby filtering the electroplating liquid in the electroplating pool 1.

[0030] Through the above steps, the electroplating pool 1 is sealed by the sealing component 2 to prevent the gas generated in the electroplating pool 1 from overflowing, the gas in the electroplating pool 1 is extracted by the exhaust component 3, the gas in the electroplating pool 1 is completely exhausted by the exhaust component 4, the gas in the electroplating pool 1 is processed by the processing component 5 to prevent air pollution, the electroplating liquid in the electroplating pool 1 is filtered and impurities are removed by the filter component 6, and the electroplating pool 1 is supported by the support component 7;

[0031] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. An anti-overflow electroplating device, comprising an electroplating pool (1); characterized in that: The electroplating tank (1) further comprises a sealing component (2), an air extraction component (3), an exhaust component (4), a processing component (5), a filter component (6) and a support component (7); the sealing component (2) is arranged above the electroplating tank (1); the air extraction component (3) is connected to the sealing component (2); one end of the exhaust component (4) is connected to the sealing component (2); the other end of the exhaust component (4) is connected to the processing component (5); the filter component (6) is arranged on one side of the electroplating tank (1); and the support component (7) is arranged below the electroplating tank (1).

2. The anti-overflow electroplating device according to claim 1, characterized in that: The sealing assembly (2) comprises a sealing cover (201) and a connecting pipe (202); the sealing cover (201) is arranged on the top surface of the electroplating tank (1); one end of the sealing cover (201) is rotatably connected to the top surface of the electroplating tank (1) via a hinge; and the other end of the sealing cover (201) is connected to the top surface of the electroplating tank (1) via a buckle.

3. The anti-overflow electroplating device according to claim 2, characterized in that: The air extraction component (3) comprises an air extraction pipeline (301), an air extraction pump (302) and an air storage tank (303); one end of the air extraction pipeline (301) is connected to the top surface of the sealing cover (201); the other end of the air extraction pipeline (301) is connected to the connecting pipeline (202); the air extraction pump (302) is arranged on the air extraction pipeline (301); an electric valve is arranged on the air extraction pipeline (301); and a one-way valve is arranged on the air extraction pipeline (301).

4. The anti-overflow electroplating device according to claim 3, characterized in that: The exhaust assembly (4) comprises an air intake pump (401) and an air intake pipe (402), wherein the air intake pipe (402) is arranged in a plurality of groups, one end of the air intake pipe (402) is connected to the electroplating pool (1), and the other end of the air intake pipe (402) is connected to the air intake pump (401), an electric valve is arranged on the air intake pipe (402), and a one-way valve is arranged on the air intake pipe (402).

5. The anti-overflow electroplating device according to claim 4, characterized in that: The processing assembly (5) comprises a processing pipeline (501) and a processing box (502). One end of the processing pipeline (501) is connected to the connecting pipeline (202), and the other end of the processing pipeline (501) is connected to the processing box (502). An electric valve is provided on the processing pipeline (501).

6. The anti-overflow electroplating device according to claim 5, characterized in that: The filter assembly (6) comprises a circulation pipeline (601), a filter box (602) and a circulation pump (603); one end of the circulation pipeline (601) is connected to the bottom surface of the electroplating pool (1); the other end of the circulation pipeline (601) is connected to the side wall of the electroplating pool (1); the filter box (602) is arranged on the circulation pipeline (601); a filter layer is arranged inside the filter box (602); and the circulation pump (603) is arranged on the circulation pipeline (601).

7. The anti-overflow electroplating device according to claim 6, characterized in that: The support assembly (7) comprises support legs (701) and support seats (702); the support legs (701) are arranged in a plurality of groups; the support legs (701) are arranged below the electroplating pool (1); the support legs (701) are fixedly connected to the bottom surface of the electroplating pool (1); the support seats (702) are arranged in a plurality of groups; the support seats (702) are fixedly connected to the bottom surface of the support legs (701).

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