Lamp and vehicle

Abstract

The utility model discloses a lamp which comprises a carrier used for bearing a display component. The display component comprises a plurality of display light sources arranged in an array, and the display light sources are all arranged on the light facing side of the carrier; the fixing support is arranged on the backlight side of the carrier and used for fixing the carrier; the lens is arranged on the side, away from the carrier, of the display component, and the lens has a bending radian; the distance between the adjacent edges of the adjacent display light sources ranges from 0.3 mm to 1.0 mm. The carrier comprises 4-6 conducting layers which are sequentially stacked in the thickness direction, a supporting layer which is arranged between the adjacent conducting layers close to the middle of the thickness direction, and two surface layers which are arranged on the outermost side in the thickness direction; the thickness of the conductive layer ranges from 0.025 mm to 0.035 mm, and the thickness of the supporting layer ranges from 0.25 mm to 1.2 mm.

Description

Technical Field

[0001] The present application relates to the field of vehicle lighting technology, and in particular to a lamp and a vehicle. Background Art

[0002] In recent years, with the large-scale launch of new energy electric vehicles, new technologies related to vehicle-machine interaction have been derived and comprehensively upgraded. In addition to the interior ambient lights, central control screens, co-pilot screens, etc. that can interact, exterior decoration is also a focus of improvement, such as DLP, projection lights, and running signal lights, which can all interact according to different scenarios.

[0003] As cars enter the new energy and intelligent era, screens are not only placed inside the car, but can also be used outside the car to achieve human-vehicle interaction. At the same time, the observation distance is also farther. Based on monochrome optics, it is upgraded to a Micro RGB screen without affecting the deep feeling of the screen in a static state, which has become a new research and development trend.

[0004] There are already screens with white light and red light with large pitch values ​​on the market, which can be used for animation effects. Since each unit block is relatively large, the visual effect is refreshing to stay at the level of different pixel displays, but the large unit spacing makes the viewing experience poor, so we consider increasing the density of light source arrangement.

[0005] However, when the density of light sources is high, traditional circuit boards are difficult to bear and route, and have poor shielding capabilities. Moreover, since lampshades are usually designed in an arc shape, circuit boards also need to be bent in order to achieve better lighting effects. However, in actual products, when the density of light sources is high, the bending stress and resistance are greater, resulting in a significant increase in the difficulty of bending and design. Utility Model Content

[0006] In order to solve the above problems, the technical solutions adopted in the embodiments of the present application are as follows:

[0007] The present application discloses a lamp, comprising:

[0008] A carrier, used for carrying a display component;

[0009] A display component, comprising a plurality of display light sources arranged in an array, wherein the plurality of display light sources are all disposed on the light-facing side of the carrier;

[0010] A fixing bracket, disposed on the backlight side of the carrier, and used for fixing the carrier;

[0011] A light distribution mirror is arranged on a side of the display component away from the carrier, and the light distribution mirror has a curved arc;

[0012] Among them, the spacing between adjacent edges of adjacent display light sources is 0.3mm-1.0mm; the carrier includes 4-6 conductive layers stacked in sequence along the thickness direction, a support layer arranged between adjacent conductive layers near the middle of the thickness direction, and two outermost epidermal layers along the thickness direction; the thickness of the conductive layer is 0.025-0.035mm, and the thickness of the support layer is 0.25mm-1.2mm.

[0013] In some embodiments, the spacing between adjacent edges of the adjacent display light sources is 0.3 mm, and the carrier includes 6 conductive layers stacked in sequence along the thickness direction; the thickness of the support layer is 0.25 mm, and the thickness of the conductive layer is 0.03-0.033 mm.

[0014] In some embodiments, the support layer includes two support unit layers, the two support unit layers are sequentially spaced and distributed between three conductive layers near the middle of the thickness direction, and the thickness of each support unit layer is 0.1-0.15 mm.

[0015] In some embodiments, the spacing between adjacent edges of the adjacent display light sources is 1.0 mm, the carrier includes 4 conductive layers stacked in sequence along the thickness direction, and the thickness of the support layer is 1.2 mm.

[0016] In some embodiments, along the thickness direction, the thickness of the upper and lower conductive layers close to the epidermis layer are both 0.033-0.035 mm, and the thickness of other conductive layers is 0.03 mm or less.

[0017] In some embodiments, two adjacent conductive layers are bonded together by an insulating adhesive layer.

[0018] In some embodiments, the thickness of the insulating adhesive layer is between 0.06 mm and 0.08 mm.

[0019] In some embodiments, the carrier is curved with a radius of curvature R of 1500mm-2000mm and a thickness of 0.6mm-1.6mm.

[0020] In some embodiments, the display light source includes a substrate and three primary color chips disposed on the substrate, and the three primary color chips are arranged in a vertical direction;

[0021] Three negative poles and one positive pole are distributed at the four corners on the back side of the substrate. The three negative poles and one positive pole are respectively welded to a pad group on the surface of the carrier. The pad group includes four pads. The four pads correspond to the four poles and are distributed in an array on the surface of the carrier. The size L1 of the pad in the up and down direction is 0.54mm-0.56mm, and the size L2 in the left and right direction is 0.44mm-0.47mm.

[0022] A means of transport comprises the lamp mentioned above.

[0023] The spacing between the adjacent edges of the multiple display light sources used in this application is 0.3mm-1.0mm, which is very small. The light sources and other components on the carrier are very dense and the wiring density is high. 4-6 layers of conductive layers need to be arranged to meet the requirements of components and wiring. At the same time, the 4-6 layers of conductive layers stacked together have a larger metal surface area, stronger shielding ability, better heat dissipation, and the carrier can easily pass the EMC test. At the same time, the thickness of the conductive layer is designed to be 0.025-0.035mm, which is conducive to making the overall thickness thinner and reducing the weight of the carrier, which is beneficial for miniaturization; the thickness range of the support layer of 0.25mm-1.2mm can not only meet the product requirements of the carrier support, but also can be bent appropriately to match the shape of the curved lamp, which is more practical.

[0024] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A vertical cross-sectional schematic diagram of a lamp provided in an embodiment of the present application;

[0027] Figure 2 A schematic cross-sectional view of a lamp provided in one embodiment of the present application;

[0028] Figure 3 A layered exploded diagram of a carrier provided in an embodiment of the present application;

[0029] Figure 4 A layered exploded diagram of a carrier provided in another embodiment of the present application;

[0030] Figure 5 A layered exploded diagram of a carrier provided in yet another embodiment of the present application;

[0031] Figure 6 A schematic diagram of a display light source provided in an embodiment of the present application;

[0032] Figure 7 for Figure 6 The substrate structure diagram of the light source is shown in FIG.

[0033] Figure 8 A schematic diagram of a structure in which a pad is arranged on a surface of a carrier according to an embodiment of the present application;

[0034] In the figure:

[0035] 10. Carrier; 20. Display component; 30. Fixing bracket; 40. Photometric lens; 50. Control module; 60. Lamp housing;

[0036] 110, conductive layer; 120, support layer; 121, support unit layer; 130, skin layer; 140, insulating adhesive layer; 101, pad group; 101a, pad;

[0037] 210, substrate; 220, primary color chip; 230, negative electrode; 240, positive electrode. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0039] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0040] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0042] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0044] refer to Figure 1-Figure 3 , the present application provides a lamp, comprising:

[0045] A carrier 10, used for carrying a display component 20;

[0046] The display component 20 includes a plurality of display light sources arranged in an array, and the plurality of display light sources are all disposed on the light-facing side of the carrier 10;

[0047] A fixing bracket 30, disposed on the backlight side of the carrier 10, for fixing the carrier 10;

[0048] The light distribution mirror 40 is disposed on a side of the display component 20 away from the carrier 10, and the light distribution mirror 40 has a curved arc;

[0049] Among them, the spacing between adjacent edges of adjacent display light sources is 0.3mm-1.0mm; the carrier 10 includes 4-6 conductive layers 110 stacked in sequence along the thickness direction, a support layer 120 arranged between adjacent conductive layers 110 near the middle of the thickness direction, and two outermost epidermal layers 130 arranged along the thickness direction; the thickness of the conductive layer 110 is 0.025-0.035mm, and the thickness of the support layer 120 is 0.25mm-1.2mm.

[0050] Specifically, the side of the fixed bracket 30 away from the carrier 10 is a lamp housing 60, and the lamp housing 60 is sealed and connected to the edge of the light distribution mirror 40, and the control module 50 on the back of the fixed bracket 30 is electrically connected to the display light source to control the lighting of different display light sources. The number of layers of the carrier 10 is related to the number density of components arranged on the surface and the density of the wiring. Since the spacing between the adjacent edges of the multiple display light sources used in this application is 0.3mm-1.0mm, which is very small, the light sources and other components on the carrier 10 are very dense and the wiring density is high, and 4-6 layers of conductive layers 110 need to be arranged to meet the requirements of components and wiring. At the same time, the 4-6 layers of conductive layers 110 stacked together have a larger metal surface area and stronger shielding ability. The carrier 10 is easy to pass the EMC test (electromagnetic compatibility test, which refers to the comprehensive evaluation of the interference size (EMI) and anti-interference ability (EMS) of electronic products in the electromagnetic field), and the heat dissipation is also better.

[0051] Taking the conductive layer 110 as a six-layer structure as an example, the first and last layers in the thickness direction are used for placing components and routing signal lines, and the middle layers route GND, signal lines, power supplies, and the like.

[0052] Taking the conductive layer 110 as a four-layer structure, the first and last layers in the thickness direction are used to place components, and the middle two layers are used for GND+ signal lines on one layer and VCC+ signal lines on the other layer.

[0053] In the present application, the thickness of the conductive layer 110 is designed to be 0.025-0.035 mm, which is conducive to making the overall thickness thinner and reducing the weight of the carrier 10, which is beneficial for miniaturization; it has been verified that when the thickness is less than 0.025 mm, the conductive layer 110 is easily punctured during component layout or wire routing and welding, resulting in defective products.

[0054] Since there are many layers to be designed, in order to reduce the overall thickness of the carrier 10, the minimum thickness of the support layer 120 can be designed to be 0.25mm. When it is less than 0.25mm, the support of the carrier 10 is not enough and it is easy to deform, resulting in the luminous effect deviating from the expectation; when the thickness of the support layer 120 exceeds 1.2mm, the carrier 10 is difficult to bend and cannot be bent to match the shape of the curved light distribution lens 40. Therefore, the selected thickness range of 0.25mm-1.2mm can not only meet the support requirements, but also bend appropriately to match the shape of the curved lamp, which is more practical.

[0055] refer to Figure 3 In some embodiments, the spacing between adjacent edges of the adjacent display light sources is 0.3 mm, and the carrier 10 includes 6 conductive layers 110 stacked in sequence along the thickness direction; the thickness of the support layer 120 is 0.25 mm, and the thickness of the conductive layer 110 is 0.03-0.033 mm.

[0056] In this embodiment, the spacing between the adjacent edges of the adjacent display light sources is only 0.3mm, the spacing between the display light sources is extremely small, the number of components and the density of wiring are large, so 6 layers of conductive layer 110 are arranged. At the same time, when the number of surface components is large and the wiring density is large, the bending of the conductive layer 110 will produce large internal stress, and it is easy to restore to a straight state due to the reaction of the surface components after bending, and the bending resistance of the conductive layer 110 is large when there are many layers. For this reason, the present application starts from the perspective of changing the thickness of the support layer 120 and the conductive layer 110. The thickness of the support layer 120 is thinned to only 0.25mm, the thickness of the conductive layer 110 is 0.03-0.033mm, and the overall thickness is only 0.8mm. It has been verified that such a layered structure has reduced internal stress when the whole is bent, and it is not easy to restore to a straight state when properly bent; the bending resistance is small, which is suitable for the situation where the density of component arrangement is large and there are requirements for bending shape.

[0057] refer to Figure 4 In some embodiments, the support layer 120 includes two support unit layers 121, and the two support unit layers 121 are spaced in sequence and distributed between the three conductive layers 110 near the middle of the thickness direction, and the thickness of each support unit layer 121 is 0.1-0.15mm.

[0058] The two support unit layers 121 of this embodiment are arranged at intervals, and the thickness of the thinned single support unit layer 121 is smaller, which is more conducive to dispersing and reducing the bending resistance, avoiding the restoration of the straight state after bending, and having a better actual use effect.

[0059] It is worth noting that the support layer 120 may be a metal or non-metal support structure, and the conductive layer 110 may be a copper layer with high electrical conductivity.

[0060] refer to Figure 5 In some embodiments, the spacing between adjacent edges of the adjacent display light sources is 1.0 mm, the carrier 10 includes 4 conductive layers 110 stacked in sequence along the thickness direction, and the thickness of the support layer 120 is 1.2 mm.

[0061] In this embodiment, the spacing between the adjacent edges of the adjacent display light sources is 1.0mm, and the number of components and the density of wiring are relatively small, so it is sufficient to arrange 4 layers of conductive layer 110. Since the number of components and the density of wiring are small in this case, the internal stress generated by the bending of the conductive layer 110 is smaller. For this reason, the thickness of the support layer 120 designed in this application is 1.2mm, and the overall thickness is 1.6mm. It has been verified that when bending, due to the small number of components on its surface and the small deformation internal stress, it will not return to a straight state under the reaction of the components after bending. It is suitable for situations where the density of component arrangement is small and there are requirements for bending shape. In addition, since the number of layers of 4 is relatively small and the support is insufficient, a 1.2mm thick support layer 120 is designed. Such a layered structure is conducive to improving support.

[0062] refer to Figure 3 In some embodiments, along the thickness direction, the thickness of the upper and lower conductive layers 110 close to the epidermis layer 130 are both 0.033-0.035 mm, and the thickness of the other conductive layers 110 is 0.03 mm or less.

[0063] Specifically, the applicant found that the conductive layer 110 close to the epidermis layer 130 is routed and connected to components. Since the welding strength is greater when welding components, and the component distribution density is large, the pads 101a of different components will overlap and cause desoldering. Therefore, the design thickness is large to meet the demand for high welding strength. The thickness of the upper and lower conductive layers 110 close to the epidermis layer 130 is 0.033-0.035mm to avoid perforation during welding. When the pads 101a overlap, the welding depth can be increased and desoldering will not occur.

[0064] The conductive layer 110 near the middle has fewer wirings and does not need to be connected to components, so the thickness is designed to be thinner, with a thickness of 0.03 mm or less.

[0065] refer to Figure 3 In some embodiments, two adjacent conductive layers 110 are bonded to each other via an insulating adhesive layer 140. Specifically, the insulating adhesive layer 140 may be made of PP adhesive, which is not limited here.

[0066] In some embodiments, the thickness of the insulating adhesive layer 140 is between 0.06 mm and 0.08 mm. After curing, the insulating adhesive layer 140 hardens, has a large internal stress, and is easy to rebound to a straight state, so the thickness needs to be reduced to less than 0.08 mm; if the thickness of the insulating adhesive layer 140 is too thin, it will cause the adjacent conductive layer 110 to accidentally contact and short-circuit, so the thickness is selected to be between 0.06 mm and 0.08 mm.

[0067] refer to Figure 2In some embodiments, the carrier 10 is curved with a radius of curvature R1500mm-2000mm and a thickness of 0.6mm-1.6mm.

[0068] Specifically, the carrier 10 can be bent to match the arc-shaped lens 40 to present a three-dimensional appearance and light pattern. When the thickness of the carrier 10 is 0.6 mm, the curvature is greater.

[0069] refer to Figure 6-Figure 8 In some embodiments, the display light source includes a substrate 210 and three primary color chips 220 disposed on the substrate 210, and the three primary color chips 220 are arranged in a vertical direction;

[0070] Three negative poles 230 and one positive pole 240 are distributed at the four corners on the back side of the substrate 210. The three negative poles 230 and one positive pole 240 are respectively welded to the pad group 101 on the surface of the carrier 10. The pad group 101 includes four pads 101a. The four pads 101a correspond to the four poles and are distributed in an array on the surface of the carrier 10. The size L1 of the pad 101a in the up and down direction is 0.54mm-0.56mm, and the size L2 in the left and right direction is 0.44mm-0.47mm.

[0071] Specifically, the colors of the three primary color chips 220 are blue, green, and red, respectively. The negative pins of the three primary color chips 220 are respectively connected to one of the negative poles 230, and the positive pins are simultaneously connected to the positive pole 240, and white light is presented when emitting light at the same time. During daily driving, vehicles often experience bumps and vibrations in the up and down directions, while vibrations in the left and right directions are rare. The single display light source of the present application is miniaturized, with a size of less than 1.6mm*1.6mm. Bumps in the up and down directions are more likely to cause the display light source to loosen and fall off. Therefore, the size L1 of the pad 101a in the up and down directions is designed to be 0.54mm-0.56mm, and the size L2 in the left and right directions is 0.44mm-0.47mm. The size L1 of a single pad 101a in the up and down directions is significantly larger, and the connection length in the up and down directions is also longer. When bumps in the up and down directions occur, the probability of the display light source shaking up and down and welding loosening can be reduced, thereby reducing the maintenance frequency.

[0072] The present application also provides a vehicle, including any of the above-mentioned lamps. The vehicle lamps of the present application have the above-mentioned advantages. After being lit, the graininess is completely invisible when observed at close range; after being matched with a dark-colored light distribution lens, the appearance of the display light source is invisible when the light is not turned on, and various pictures can be customized after being lit to meet the interactive functions of various working conditions.

[0073] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0074] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A lamp, characterized in that: include: A carrier, used for carrying a display component; A display component, comprising a plurality of display light sources arranged in an array, wherein the plurality of display light sources are all disposed on the light-facing side of the carrier; A fixing bracket, disposed on the backlight side of the carrier, and used for fixing the carrier; A light distribution mirror is arranged on a side of the display component away from the carrier, and the light distribution mirror has a curved arc; Among them, the spacing between adjacent edges of adjacent display light sources is 0.3mm-1.0mm; the carrier includes 4-6 conductive layers stacked in sequence along the thickness direction, a support layer arranged between adjacent conductive layers near the middle of the thickness direction, and two outermost epidermal layers along the thickness direction; the thickness of the conductive layer is 0.025-0.035mm, and the thickness of the support layer is 0.25mm-1.2mm.

2. The lamp according to claim 1, characterized in that: The spacing between adjacent edges of the adjacent display light sources is 0.3 mm. The carrier includes 6 conductive layers stacked in sequence along the thickness direction. The thickness of the support layer is 0.25 mm, and the thickness of the conductive layer is 0.03-0.033 mm.

3. The lamp according to claim 2, characterized in that: The support layer includes two support unit layers, which are spaced in sequence and distributed between three conductive layers near the middle of the thickness direction, and the thickness of each support unit layer is 0.1-0.15 mm.

4. The lamp according to claim 1, characterized in that: The spacing between adjacent edges of the adjacent display light sources is 1.0 mm. The carrier includes 4 conductive layers stacked in sequence along the thickness direction. The thickness of the support layer is 1.2 mm.

5. The lamp according to claim 1, characterized in that: In the thickness direction, the thickness of the upper and lower conductive layers close to the epidermis is 0.033-0.035 mm, and the thickness of other conductive layers is 0.03 mm or less.

6. The lamp according to claim 1, characterized in that: Two adjacent conductive layers are bonded together by an insulating adhesive layer.

7. The lamp according to claim 6, characterized in that: The thickness of the insulating rubber layer is 0.06mm-0.08mm.

8. The lamp according to claim 1, characterized in that: The carrier is curved, with a curvature radius R1500mm-2000mm and a thickness of 0.6mm-1.6mm.

9. The lamp according to claim 1, characterized in that: The display light source comprises a substrate and three primary color chips arranged on the substrate, wherein the three primary color chips are arranged vertically; Three negative poles and one positive pole are distributed at the four corners on the back side of the substrate. The three negative poles and one positive pole are respectively welded to a pad group on the surface of the carrier. The pad group includes four pads. The four pads correspond to the four poles and are distributed in an array on the surface of the carrier. The size L1 of the pad in the up and down direction is 0.54mm-0.56mm, and the size L2 in the left and right direction is 0.44mm-0.47mm.

10. A means of transport, characterized in that: Comprising a lamp as described in any one of claims 1-9.

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