Sealed installation device for immersed liquid cooling and server

Abstract

The utility model relates to a sealed installation device for immersed liquid cooling and a server. The sealing installation device used for immersed liquid cooling comprises an installation plate used for fixing a circuit board on one side of the thickness direction of the installation plate, and the installation plate is provided with a hollow part used for exposing an electric connection area on the circuit board; the mounting assembly is provided with a hollow mounting part, the mounting part is used for fixing an electronic element, and the mounting assembly is arranged on the side, away from the circuit board, of the mounting plate and fixed to the mounting plate; the sealing cover is located on the side, away from the mounting plate, of the mounting assembly and fixedly connected with the mounting plate so as to abut against the circuit board, the mounting assembly and the mounting plate can be covered with the sealing cover, and the sealing cover is provided with a through groove used for exposing the electronic element; the first sealing film is arranged at one end, close to the circuit board, of the sealing cover; the second sealing film is arranged around the outer side of the through groove. According to the sealing installation device for immersed liquid cooling, the electric connection area of the circuit board can be isolated from a refrigerant, so that the refrigerant is not easy to contact with the areas.

Description

Technical Field

[0001] The present application relates to the technical field of server liquid cooling, and in particular to a sealing installation device and a server for immersion liquid cooling. Background Art

[0002] As the power consumption of server equipment increases, the requirements for heat dissipation are becoming more stringent. Servers are gradually evolving from traditional air-cooling to liquid-cooling. In liquid cooling, immersion cooling is to directly immerse the heat dissipation device in a cold medium, and transfer heat through the heat capacity or phase change process of the cold medium itself. The emergence of immersion cooling makes it possible to design servers with multiple components, high density, and high power consumption, making the PUE value of data centers lower and lower.

[0003] Although the performance of servers has achieved leaps and bounds, the accompanying stability, reliability and other issues are becoming increasingly severe. Among them, the cleanliness of the immersion environment is one of the keys to the long-term and stable operation of immersion servers. The presence of pollutants in the refrigerant can block the liquid propagation path at best, or even cause damage and failure of components at worst. In related technologies, some mounting structures have poor sealing performance, resulting in that after being immersed in the refrigerant, the refrigerant may reach the area on the circuit board used for electrical connection with other electronic components, causing short circuits and other faults, affecting the normal use of the server. Utility Model Content

[0004] Based on this, it is necessary to provide a sealed installation device and server for immersion liquid cooling, which can better isolate the areas on the circuit board installed thereon for electrical connection with other electronic components from the refrigerant, making it difficult for the refrigerant to contact these areas, thereby reducing the failure rate.

[0005] A sealing installation device for immersion liquid cooling, the sealing installation device for immersion liquid cooling comprising:

[0006] A mounting plate, used to fix the circuit board on one side in the thickness direction thereof, and the mounting plate is provided with a hollow portion for exposing the electrical connection area of ​​the circuit board;

[0007] A mounting assembly having a hollow mounting portion, the mounting portion being used for fixing and mounting electronic components, the mounting assembly being arranged on a side of the mounting plate away from the circuit board and fixed to the mounting plate so that the electronic components are in contact with the electrical connection area;

[0008] A sealing cover, located on a side of the mounting assembly away from the mounting plate, and fixedly connected to the mounting plate to abut against the circuit board and to hold the mounting assembly and the mounting plate cover therein, wherein the sealing cover is provided with a through slot for exposing the electronic component; and

[0009] The sealing assembly includes a first sealing film and a second sealing film. The first sealing film is arranged at one end of the sealing cover close to the circuit board; the second sealing film is arranged around the outer side of the through groove to be clamped between the sealing cover and the edge of the electronic component.

[0010] In the above-mentioned sealed installation device for immersion liquid cooling, the circuit board is installed through the installation plate, and the hollow part on the installation plate can expose the electrical connection area on the circuit board so that it can contact with the electronic components to achieve electrical connection. The electronic components are installed through the installation assembly, and the installation assembly is fixed to the installation plate, so that the electronic components and the electrical connection area on the circuit board are in contact to achieve electrical connection between the two. A through groove is provided on the sealing cover to expose the electronic components so that they can contact with the refrigerant for heat exchange, ensuring that the electronic components can dissipate heat normally. The sealing cover can abut against the circuit board, and the installation assembly and the installation plate cover are arranged therein, so as to isolate the refrigerant from entering therein, thereby inhibiting the refrigerant from reaching the electrical connection area on the circuit board. In addition, a first sealing film is arranged at one end of the sealing cover close to the circuit board, and the first sealing film will be clamped between the sealing cover and the circuit board, thereby enhancing the sealing between the two, and further inhibiting the refrigerant from entering the sealing cover from between the two and reaching the electrical connection area on the circuit board. At the same time, a second sealing film is arranged around the outer side of the through slot, and the second sealing film can be clamped between the sealing cover and the edge of the electronic component, thereby preventing the refrigerant from entering through the through slot through the gap between the sealing cover and the edge of the electronic component and reaching the electrical connection area on the circuit board. In summary, through the isolation of the sealing cover and the further sealing of the first sealing film and the second sealing film, the electrical connection area on the circuit board and the refrigerant can be better isolated, making it difficult for the refrigerant to contact these areas, thereby reducing the failure rate.

[0011] In some embodiments, the sealing cover includes a top plate and a side panel extending from the outer edge of the top plate toward the circuit board, the top plate is provided with a through groove, and the first sealing film is arranged at one end of the side panel facing away from the top plate.

[0012] The side panels extend from the outer edge of the top panel toward the circuit board, thereby forming an enveloping structure to protect its internal structure and prevent the refrigerant from entering the electrical connection area on the circuit board. At the same time, the first sealing film is arranged at the end of the side panel away from the top panel, that is, between the side panel and the circuit board, thereby enhancing the sealing between the two and further preventing the refrigerant from entering the inner side of the sealing cover through the gap between the two.

[0013] In some embodiments, the second sealing film is disposed on an inner edge of one end of the top panel close to the side panel.

[0014] The second sealing film is set on the inner edge of one end of the top plate close to the side panel, so that the second sealing film surrounds the outside of the through groove. After the installation is completed, the second sealing film will be clamped between the electronic component and the top plate, thereby enhancing the sealing between the two and inhibiting the refrigerant from reaching the outside of the electronic component from the through groove and then reaching the electrical connection area of ​​the circuit board.

[0015] In some embodiments, the sealing installation device for immersion liquid cooling further includes a fastener, and a fixing hole is provided on the sealing cover, and the fastener passing through the fixing hole is fixedly connected to the mounting plate.

[0016] The sealing cover is fixed to the mounting plate by a fastener passing through the sealing cover and fixing it to the mounting plate. This fixing structure is simple, low in cost, and easy to disassemble and assemble.

[0017] In some embodiments, the sealing assembly further includes a third sealing film disposed between the fastener and the sealing cover.

[0018] By providing a third sealing film between the fastener and the sealing cover, the sealing performance between the two can be enhanced, and the refrigerant can be prevented from entering the sealing cover through the gap between the two.

[0019] In some embodiments, sealant is provided between the fastener and the sealing cover.

[0020] By providing sealant between the fastener and the sealing cover, the sealing performance between the two can be enhanced, and the refrigerant can be prevented from entering the sealing cover through the gap between the two.

[0021] In some embodiments, a sealant is arranged between the sealing cover and the circuit board;

[0022] And / or, a sealant is arranged between the sealing cover and the edge of the electronic component.

[0023] By providing sealant between the circuit board and the sealing cover, the sealing between the two can be enhanced, and the refrigerant can be prevented from entering the sealing cover from the gap between the two. By providing sealant between the edge of the electronic component and the sealing cover, the sealing between the two can be enhanced, and the refrigerant can be prevented from entering the sealing cover from the through groove.

[0024] In some embodiments, the mounting assembly includes a clamping member and a fixing cover, wherein the fixing cover is fixed to the mounting plate to clamp the clamping member therebetween;

[0025] The mounting portion includes a fixing groove arranged on the clamping member, and an exposed groove arranged on the fixing cover, wherein the fixing groove, the exposed groove and the through groove are connected in sequence, the fixing groove is used for fixing and mounting the electronic component, and the exposed groove is used for exposing the electronic component.

[0026] The fixing cover is fixed to the mounting plate, and the clamping member is clamped and fixed between the two, and then the electronic component fixed in the fixing groove is fixedly mounted on the mounting plate, so that the electrical connection area on the circuit board installed on the mounting plate and the electronic component can contact for electrical connection. By providing the fixing groove, the exposed groove and the through groove connected in sequence, the electronic component fixed in the fixing groove can be exposed to the through groove through the exposed groove, so as to contact with the refrigerant for heat exchange, and maintain good heat dissipation performance.

[0027] In some embodiments, the sealed installation device for immersion liquid cooling further includes a support plate, which is disposed on a side of the installation plate facing away from the installation assembly and fixedly connected thereto to clamp the circuit board therebetween.

[0028] By fixing the mounting plate and the support plate, the circuit board between the two is clamped and fixed, thereby achieving fixed installation of the circuit board. The support plate and the mounting plate can support and protect both sides of the circuit board to prevent it from being damaged.

[0029] A server comprises the above-mentioned sealed installation device for immersion liquid cooling, and also comprises the electronic component and the circuit board, wherein the circuit board is fixed to a side of the installation plate away from the installation assembly, and the electronic component is fixedly installed in the installation portion.

[0030] The above-mentioned server, by applying the aforementioned sealing installation device for immersion liquid cooling, can better isolate the electrical connection area on the circuit board from the refrigerant, making it difficult for the refrigerant to contact these areas, thereby reducing the failure rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG. 1 is a schematic diagram of a circuit board and electronic components installed in a sealed installation device for immersion liquid cooling in one embodiment of the present application.

[0032] FIG. 2 is a schematic diagram of the structure shown in FIG. 1 with the sealing cover omitted.

[0033] FIG. 3 is a cross-sectional view of the structure shown in FIG. 1 .

[0034] FIG. 4 is an exploded view of the structure shown in FIG. 1 .

[0035] FIG. 5 is a cross-sectional view of the electronic component after being installed in the mounting assembly.

[0036] Reference numerals:

[0037] 110, mounting plate; 111, hollow portion; 112, positioning column; 120, supporting plate;

[0038] 200, mounting assembly; 210, clamping member; 211, fixing groove; 212, positioning hole; 220, fixing cover; 221, exposed groove; 230, mounting portion;

[0039] 300, sealing cover; 310, top plate; 311, through groove; 312, fixing hole; 320, side panel;

[0040] 410, a first sealing film; 420, a second sealing film;

[0041] 500. Fasteners;

[0042] 610, circuit board; 611, electrical connection area; 620, electronic component. DETAILED DESCRIPTION

[0043] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0044] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0045] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0046] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0047] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0048] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0049] Referring to FIGS. 1 to 4 , a sealing installation device for immersion liquid cooling provided in an embodiment of the present application includes a mounting plate 110, a mounting assembly 200, a sealing cover 300, and a sealing assembly. The mounting plate 110 is used to fix the circuit board 610 on one side in the thickness direction thereof, and the mounting plate 110 is provided with a hollow portion 111 for exposing the electrical connection area 611 on the circuit board 610. The mounting assembly 200 has a hollow mounting portion 230, and the mounting portion 230 is used to fix and install the electronic component 620. The mounting assembly 200 is arranged on the side of the mounting plate 110 away from the circuit board 610, and is fixed to the mounting plate 110 so that the electronic component 620 is in contact with the electrical connection area 611. The sealing cover 300 is located on the side of the mounting assembly 200 away from the mounting board 110, and is fixedly connected to the mounting board 110 to abut against the circuit board 610 and cover the mounting assembly 200 and the mounting board 110 therein. The sealing cover 300 is provided with a through groove 311 for exposing the electronic component 620. The sealing assembly includes a first sealing film 410 and a second sealing film 420. The first sealing film 410 is arranged at one end of the sealing cover 300 close to the circuit board 610; the second sealing film 420 is arranged around the outside of the through groove 311 to be clamped between the sealing cover 300 and the edge of the electronic component 620.

[0050] The sealed installation device for immersion liquid cooling in the embodiment of the present application can realize the installation of the circuit board 610 and the electronic component 620, wherein the electronic component 620 can be a CPU. After the circuit board 610 and the electronic component 620 are installed, the entire structure is immersed in the refrigerant to realize the immersion liquid cooling of the CPU.

[0051] In the above-mentioned sealed installation device for immersion liquid cooling, the circuit board 610 is installed through the installation plate 110, and the hollow portion 111 on the installation plate 110 can expose the electrical connection area 611 on the circuit board 610, so that it can contact and connect with the electronic component 620. The electronic component 620 is installed through the installation component 200, and is fixed to the installation plate 110 through the installation component 200, so that the electronic component 620 and the electrical connection area 611 on the circuit board 610 are in contact to achieve electrical connection between the two. The sealing cover 300 is provided with a through groove 311, so that the electronic component 620 is exposed, so that it can contact with the refrigerant for heat exchange, and ensure that the electronic component 620 can dissipate heat normally. The sealing cover 300 can abut against the circuit board 610, and the installation component 200 and the installation plate 110 are covered therein, so as to isolate the refrigerant from entering therein, thereby inhibiting the refrigerant from reaching the electrical connection area 611 on the circuit board 610. In addition, a first sealing film 410 is provided at one end of the sealing cover 300 close to the circuit board 610, and the first sealing film 410 will be clamped between the sealing cover 300 and the circuit board 610, thereby enhancing the sealing between the two, and further inhibiting the refrigerant from entering the sealing cover 300 from between the two and reaching the electrical connection area 611 on the circuit board 610. At the same time, a second sealing film 420 is provided around the outer side of the through groove 311, and the second sealing film 420 can be clamped between the sealing cover 300 and the edge of the electronic component 620, thereby inhibiting the refrigerant from entering from the through groove 311 through the gap between the sealing cover 300 and the edge of the electronic component 620 and reaching the electrical connection area 611 on the circuit board 610. In summary, through the isolation of the sealing cover 300, and the further sealing of the first sealing film 410 and the second sealing film 420, the electrical connection area 611 on the circuit board 610 can be better isolated from the refrigerant, so that the refrigerant is not easy to contact these areas, thereby reducing the failure rate.

[0052] Referring to Figures 1 to 4, in some embodiments, the sealing cover 300 includes a top plate 310 and a side panel 320 extending from the outer edge of the top plate 310 toward the circuit board 610, and a through groove 311 is provided on the top plate 310, and the first sealing film 410 is arranged at one end of the side panel 320 away from the top plate 310.

[0053] Specifically, the top plate 310 is rectangular, and correspondingly, the side panels 320 extend from the four side edges of the top plate 310 toward the circuit board 610. In other embodiments, the top plate 310 can also be set to other shapes, such as circular, elliptical, etc. The through groove 311 is rectangular, opened in the central area of ​​the top plate 310, and penetrates the top plate 310 along the thickness direction. The shape of the through groove 311 can also be set to circular, elliptical, irregular polygonal, etc. The first sealing film 410 is annular and connected end to end, which is surrounded by the outer side of the mounting plate 110. After the installation is completed, it is clamped by the end of the side panel 320 away from the top plate 310 and the circuit board 610. The side panel 320, the top plate 310 and the circuit board 610 enclose a closed cavity, and the mounting assembly 200, the mounting plate 110 and other components are covered in the cavity.

[0054] In the above embodiment, the side panel 320 extends from the outer edge of the top panel 310 toward the circuit board 610, thereby forming an enveloping structure to protect its internal structure and prevent the refrigerant from entering the electrical connection area 611 on the circuit board 610. At the same time, the first sealing film 410 is disposed at one end of the side panel 320 away from the top panel 310, that is, between the side panel 320 and the circuit board 610, thereby enhancing the sealing between the two and further preventing the refrigerant from entering the inner side of the sealing cover 300 through the gap between the two.

[0055] 1 to 4 , in some embodiments, the second sealing film 420 is disposed on the inner edge of one end of the top plate 310 close to the side panel 320 .

[0056] Specifically, from the perspective of FIG4 , the second sealing film 420 is disposed at the bottom of the top plate 310 and is disposed around its inner edge. After installation, the second sealing film 420 will be clamped between the electronic component 620 and the top plate 310, thereby enhancing the sealing between the two, preventing the refrigerant from reaching the outside of the electronic component 620 from the through groove 311, and further preventing the refrigerant from reaching the electrical connection area 611 of the circuit board 610.

[0057] 1 to 4 , in some embodiments, the sealing installation device for immersion liquid cooling further includes a fastener 500 , a fixing hole 312 is provided on the sealing cover 300 , and the fastener 500 passing through the fixing hole 312 is fixedly connected to the mounting plate 110 .

[0058] Specifically, the fastener 500 can be a screw or a bolt. The fixing hole 312 is provided on the top plate 310 and passes through the top plate 310. After the fastener 500 passes through the fixing hole 312, it is threadedly connected to the mounting plate 110, so that the sealing cover 300 is fixedly mounted on the mounting plate 110.

[0059] In the above embodiment, the sealing cover 300 is fixed to the mounting plate 110 by the fastener 500 passing through the sealing cover 300 and then fixed to the mounting plate 110. This fixing structure is simple, low in cost, and easy to assemble and disassemble.

[0060] Preferably, the top plate 310 is provided with a plurality of fixing holes 312 arranged evenly at intervals, and a fastener 500 passes through each fixing hole 312. In this way, the installation firmness can be further increased and it is not easy to get loose.

[0061] In other embodiments, the sealing cover 300 may also be fixed to the mounting plate 110 by conventional means such as clamping, bonding or welding.

[0062] 1 to 4 , in some embodiments, the sealing assembly further includes a third sealing film, which is disposed between the fastener 500 and the sealing cover 300 .

[0063] Specifically, the third sealing film is disposed in the fixing hole 312 and is clamped between the nut of the fastener 500 and the step surface of the fixing hole 312 to enhance the sealing performance there and inhibit the refrigerant from entering the sealing cover 300 through the gap there.

[0064] 1 to 4 , in some embodiments, a sealant is disposed between the fastener 500 and the sealing cover 300 .

[0065] Specifically, a sealant can be added on the basis of the third sealing film, and after the sealant is cured and formed, the gap is filled, which can further enhance the sealing performance here and better prevent the refrigerant from entering the sealing cover 300 from the gap. Alternatively, the third sealing film sealing method can be directly replaced with a sealant sealing method.

[0066] 1 to 4 , in some embodiments, a sealant is disposed between the sealing cover 300 and the circuit board 610 ; and / or a sealant is disposed between the sealing cover 300 and the edge of the electronic component 620 .

[0067] Similar to the above-mentioned embodiment, the sealing performance can be further enhanced by using sealant at the position where the first sealing film 410 and the second sealing film 420 are provided. By providing sealant between the circuit board 610 and the sealing cover 300, the sealing performance between the two can be further enhanced, and the refrigerant can be prevented from entering the sealing cover 300 from the gap between the two. By providing sealant between the edge of the electronic component 620 and the sealing cover 300, the sealing performance between the two can be further enhanced, and the refrigerant can be prevented from entering the sealing cover 300 from the through groove 311.

[0068] Referring to FIGS. 2 to 5 , in some embodiments, the mounting assembly 200 includes a clamping member 210 and a fixing cover 220, and the fixing cover 220 is fixed to the mounting plate 110 to clamp the clamping member 210 therebetween. The mounting portion 230 includes a fixing groove 211 disposed on the clamping member 210, and an exposed groove 221 disposed on the fixing cover 220, wherein the fixing groove 211, the exposed groove 221 and the through groove 311 are sequentially connected, and the fixing groove 211 is used to fix and install the electronic component 620, and the exposed groove 221 is used to expose the electronic component 620.

[0069] Specifically, the fixing groove 211 is arranged in the central area of ​​the clamping member 210, and the exposed groove 221 is arranged in the central area of ​​the fixing cover 220, and the shapes of the two grooves match the shape of the electronic component 620. The electronic component 620 can be fixed in the fixing groove 211 by means of clamping or bonding, and the top part of the electronic component 620 extends into the exposed groove 221, so that it can be exposed through the through groove 311 and contact with the refrigerant for heat exchange. The fixing cover 220 can be fixed to the mounting plate 110 by threaded fasteners, so as to press the clamping member 210 tightly, so that the electronic component 620 can contact the electrical connection area 611 on the circuit board 610.

[0070] In the above embodiment, the fixing cover 220 is fixed to the mounting plate 110, and the clamping member 210 is clamped and fixed therebetween, and the electronic component 620 fixed in the fixing groove 211 is fixedly mounted on the mounting plate 110, so that the electrical connection area 611 on the circuit board 610 mounted on the mounting plate 110 and the electronic component 620 can contact each other for electrical connection. By providing the fixing groove 211, the exposed groove 221 and the through groove 311 that are connected in sequence, the electronic component 620 fixed in the fixing groove 211 can be exposed at the through groove 311 through the exposed groove 221, so as to contact and exchange heat with the refrigerant, and maintain good heat dissipation performance.

[0071] 2 to 5 , in some embodiments, one of the clamping member 210 and the mounting plate 110 is provided with a positioning hole 212 , and the other is provided with a positioning column 112 , and the positioning column 112 and the positioning hole 212 can be plugged and matched.

[0072] In the above embodiment, the positioning column 112 cooperates with the positioning hole 212 to position the clamp 210 during installation so that it can be accurately installed in the correct position, thereby ensuring that the electronic component 620 can contact the electrical connection area 611 on the circuit board 610.

[0073] 2 to 5 , in some embodiments, the sealed installation device for immersion liquid cooling further includes a support plate 120 , which is disposed on a side of the installation plate 110 away from the installation assembly 200 and is fixedly connected thereto to clamp the circuit board 610 therebetween.

[0074] Specifically, the mounting plate 110 and the support plate 120 may be fixed by threaded fasteners to clamp and fix the circuit board 610. For example, a bolt passes through the mounting plate 110 and the circuit board 610 in sequence and is then threadedly connected to the support plate 120.

[0075] In the above embodiment, the circuit board 610 is clamped and fixed between the mounting plate 110 and the support plate 120 to achieve fixed installation of the circuit board 610. The support plate 120 and the mounting plate 110 can support and protect both sides of the circuit board 610 to prevent it from being damaged.

[0076] Referring to Figures 1 to 4, a server provided in an embodiment of the present application includes a sealed installation device for immersion liquid cooling in any one of the above-mentioned embodiments, and also includes an electronic component 620 and a circuit board 610. The circuit board 610 is fixed to a side of the mounting plate 110 away from the mounting assembly 200, and the electronic component 620 is fixedly installed in the mounting portion 230.

[0077] The above-mentioned server, by applying the aforementioned sealing installation device for immersion liquid cooling, can better isolate the electrical connection area 611 on the circuit board 610 from the refrigerant, making it difficult for the refrigerant to contact these areas, thereby reducing the failure rate.

[0078] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A sealing installation device for immersion liquid cooling, characterized in that: The sealing installation device for immersion liquid cooling comprises: A mounting plate, used to fix the circuit board on one side in the thickness direction thereof, and the mounting plate is provided with a hollow portion for exposing the electrical connection area of ​​the circuit board; A mounting assembly having a hollow mounting portion, the mounting portion being used for fixing and mounting electronic components, the mounting assembly being arranged on a side of the mounting plate away from the circuit board and fixed to the mounting plate so that the electronic components are in contact with the electrical connection area; A sealing cover, located on a side of the mounting assembly away from the mounting plate, and fixedly connected to the mounting plate to abut against the circuit board and to hold the mounting assembly and the mounting plate cover therein, wherein the sealing cover is provided with a through slot for exposing the electronic component; and The sealing assembly includes a first sealing film and a second sealing film. The first sealing film is arranged at one end of the sealing cover close to the circuit board; the second sealing film is arranged around the outer side of the through groove to be clamped between the sealing cover and the edge of the electronic component.

2. The sealing installation device for immersion liquid cooling according to claim 1, characterized in that: The sealing cover includes a top plate and a side panel extending from an outer edge of the top plate toward the circuit board. The top plate is provided with a through groove, and the first sealing film is arranged at one end of the side panel away from the top plate.

3. The sealing installation device for immersion liquid cooling according to claim 2, characterized in that: The second sealing film is arranged on the inner edge of one end of the top plate close to the side panel.

4. The sealing installation device for immersion liquid cooling according to claim 1, characterized in that: The sealing installation device for immersion liquid cooling also includes a fastener, and a fixing hole is provided on the sealing cover. The fastener passing through the fixing hole is fixedly connected to the mounting plate.

5. The sealing installation device for immersion liquid cooling according to claim 4, characterized in that: The sealing assembly further includes a third sealing film disposed between the fastener and the sealing cover.

6. The sealing installation device for immersion liquid cooling according to claim 4 or 5, characterized in that: Sealant is arranged between the fastener and the sealing cover.

7. The sealing installation device for immersion liquid cooling according to any one of claims 1 to 5, characterized in that: A sealant is arranged between the sealing cover and the circuit board; And / or, a sealant is arranged between the sealing cover and the edge of the electronic component.

8. The sealing installation device for immersion liquid cooling according to any one of claims 1 to 5, characterized in that: The mounting assembly includes a clamping member and a fixing cover, wherein the fixing cover is fixed to the mounting plate to clamp the clamping member therebetween; The mounting portion includes a fixing groove arranged on the clamping member, and an exposed groove arranged on the fixing cover, wherein the fixing groove, the exposed groove and the through groove are connected in sequence, the fixing groove is used for fixing and mounting the electronic component, and the exposed groove is used for exposing the electronic component.

9. The sealing installation device for immersion liquid cooling according to any one of claims 1 to 5, characterized in that: The sealed installation device for immersion liquid cooling also includes a support plate, which is arranged on a side of the installation plate away from the installation assembly and is fixedly connected thereto to clamp the circuit board therebetween.

10. A server, characterized in that: The server includes the sealed installation device for immersion liquid cooling according to any one of claims 1 to 9, and also includes the electronic component and the circuit board, the circuit board is fixed to a side of the installation plate away from the installation assembly, and the electronic component is fixedly installed in the installation portion.

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