Wafer weight sticking device

Abstract

The utility model particularly relates to a wafer weight adhering device, which belongs to the technical field of wafer weight adhering and comprises a carrier conveying belt, lifting sliding tables are fixedly mounted on the upper surface of the carrier conveying belt, a weight adhering operation plate is mounted between the lifting sliding tables, a balance pressure box is mounted in the center of the weight adhering operation plate, and gluing structures are mounted on two sides of the balance pressure box. Each gluing structure comprises a limiting connecting box, an electric output plate and a capillary gluing brush, the electric output plate is slidably clamped to one side of the limiting connecting box, the capillary gluing brush is mounted at the lower end of the limiting connecting box, a wafer storage box is mounted on one side of each gluing structure, and a wafer output structure is mounted at the lower end of each wafer storage box. The wafer carrier can be quickly and automatically transported and positioned, the wafer storage box and other structures are used, automatic moving and positioning of wafers are achieved, the wafers are mutually extruded and bonded through the balance pressure box, automatic wafer bonding machining is achieved, and wafer bonding efficiency is improved.

Description

Technical Field

[0001] The utility model specifically relates to a wafer sticking device, belonging to the technical field of wafer sticking. Background Art

[0002] Wafers refer to small pieces of crystal materials processed into certain shapes and sizes, which are usually used to make integrated circuits, sensors, optical devices and other electronic components. Wafers are an indispensable and important part of electronic devices, and their quality and performance directly affect the performance and stability of the entire electronic device. Wafer bonding (or "bonding") is an important part of the wafer manufacturing process, which involves adhering the wafer to a specific carrier or substrate for subsequent processing, testing or packaging operations.

[0003] The existing device with publication number CN217144439U is a quartz wafer gluing device, comprising a bottom plate and a side top plate arranged at one end of the bottom plate, a slideway is arranged on the bottom plate, a pressure block is slidably arranged in the slideway, a movable pressure plate is arranged at one end of the pressure block, and the movable pressure plate is arranged opposite to the side top plate; a pressure-maintaining mechanism for pushing and tightening the pressure block is arranged in the slideway in a flippable manner. The quartz wafer gluing device can ensure that the crystal block is always subjected to stable and uniform pressure during the gluing process by arranging a pressure block on one side of the crystal block and a pressure-maintaining mechanism capable of tightening and maintaining pressure on the pressure block, thereby improving the quality of the crystal block.

[0004] The above device can provide uniform pressure to the crystal ingot and improve the crystal ingot sticking effect. However, during the operation, the material is manually loaded and positioned, which takes up a lot of manpower and reduces work efficiency and processing effect. Utility Model Content

[0005] The utility model aims to provide a wafer sticking device to improve the sticking efficiency of the device in view of the shortcomings of the prior art.

[0006] The utility model achieves the above-mentioned purpose through the following technical scheme: a toilet seat for dynamic defecation radiography, including a carrier conveyor belt, a lifting slide is fixedly installed on the upper surface of the carrier conveyor belt, a sticking weight operation plate is installed between the lifting slides, an equalizing pressure box is installed at the center position of the sticking weight operation plate, glue coating structures are installed on both sides of the equalizing pressure box, a chip storage box is installed on one side of the glue coating structure, and a chip output structure is installed at the lower end of the chip storage box.

[0007] Preferably, in order to steplessly control the working height of the sticking weight operating plate, an electric lifting threaded rod is installed inside the lifting slide, the two ends of the sticking weight operating plate are slidably engaged with the lifting slide, and the electric lifting threaded rod and the sticking weight operating plate are threadedly connected to each other.

[0008] Preferably, in order to provide pressure to the wafer, a pressure cylinder is fixedly installed on the upper inner end of the equalizing pressure box, a equalizing pressure plate is fixedly installed on the output end of the pressure cylinder, input holes are opened on both sides of the lower end of the equalizing pressure box, and the input holes are interconnected with the glue coating structure.

[0009] Preferably, in order to quickly apply glue on the lower surface of the crystal, the glue applying structure includes a limit connection box, an electric output plate and a capillary glue brush, one side of the limit connection box is interconnected with the input holes, the electric output plate is slidably connected to the other side of the limit connection box, and the capillary glue brush is installed at the lower end of the limit connection box.

[0010] Preferably, in order to push the crystal to move to the output position, a limit slide bar is fixedly installed on the outer side of the electric output plate, an output electric threaded rod is fixedly installed on the other end of the limit slide bar, an output threaded hole is opened on one side of the limit connection box, and the output threaded hole and the output electric threaded rod are rotated to engage with each other.

[0011] Preferably, in order to control the glue smeared on the lower surface of the crystal, the upper surface of the capillary glue brush and the lower surface of the input hole are in the same horizontal plane, a mounting slot is opened on one side of the stick operation panel, a control glue pump is embedded and installed inside the mounting slot, a glue storage bottle is fixedly installed on the upper surface of the control glue pump, the input end of the control glue pump and the lower end of the glue storage bottle are fixedly connected to each other, and the output end of the control glue pump and the capillary glue brush are connected to each other.

[0012] Preferably, in order to push the chip out of the chip storage box, the chip output structure includes a push plate and a push electric threaded rod, a retractable slide hole is opened on one side of the lower end of the chip storage box, the push plate is slidably engaged in the inside of the retractable slide hole, and the push electric threaded rod is installed at the lower end of the chip storage box.

[0013] Preferably, in order to push the push plate to move, output mounting grooves are opened at both ends of the sticky weight operating plate, the push electric threaded rod is fixedly installed inside the output mounting groove, the lower end of the push plate is slidably engaged inside the output mounting groove, and the push plate and the push electric threaded rod are threadedly connected to each other.

[0014] The beneficial effects of the utility model are as follows: through the carrier conveyor belt, the chip carrier can be quickly and automatically transported and positioned, and the chip storage box and other structures are used to realize the automatic movement and positioning of the chip, and the equalizing pressure box is used to make them squeeze each other to bond, thereby realizing the automatic bonding process of the chip and improving the bonding efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 It is a side sectional structural schematic diagram of the utility model;

[0017] Figure 3 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0018] Figure 4 It is a bottom view structural diagram of the sticking weight operation panel in the utility model;

[0019] Figure 5 It is a structural connection diagram of the sticking weight operation panel part in the utility model.

[0020] In the figure: 1. Carrier conveyor belt; 2. Lifting slide; 201. Electric lifting threaded rod; 3. Glue weight operation panel; 4. Balanced pressure box; 401. Pressure cylinder; 402. Balanced pressure plate; 5. Gluing structure; 501. Limit connection box; 502. Electric output plate; 5021. Limit slide; 5022. Output electric threaded rod; 503. Capillary glue brush; 5031. Control glue output pump; 5032. Glue storage bottle; 6. Wafer storage box; 7. Wafer output structure; 701. Push plate; 702. Push electric threaded rod. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-5 As shown, a chip sticking device includes a carrier conveyor belt 1, a lifting slide 2 is fixedly installed on the upper surface of the carrier conveyor belt 1, a sticking operation board 3 is installed between the lifting slides 2, an equalizing pressure box 4 is installed at the center position of the sticking operation board 3, a glue coating structure 5 is installed on both sides of the equalizing pressure box 4, a chip storage box 6 is installed on one side of the glue coating structure 5, and a chip output structure 7 is installed at the lower end of the chip storage box 6.

[0023] An electric lifting threaded rod 201 is installed inside the lifting slide 2, and the two ends of the sticking weight operating plate 3 are slidably connected to the lifting slide 2. The electric lifting threaded rod 201 and the sticking weight operating plate 3 are threadedly connected to each other to facilitate stepless control of the working height of the sticking weight operating plate 3.

[0024] A pressure cylinder 401 is fixedly installed at the upper end of the equalizing pressure box 4, and a equalizing pressure plate 402 is fixedly installed at the output end of the pressure cylinder 401. Input holes are opened on both sides of the lower end of the equalizing pressure box 4, and the input holes are interconnected with the glue coating structure 5 to facilitate the promotion of pressure to the chip.

[0025] The glue coating structure 5 includes a limit connection box 501, an electric output plate 502 and a capillary glue coating brush 503. One side of the limit connection box 501 is connected to the input hole, the electric output plate 502 is slidably connected to the other side of the limit connection box 501, and the capillary glue coating brush 503 is installed at the lower end of the limit connection box 501. A limit slide bar 5021 is fixedly installed on the outer side of the electric output plate 502, and an output electric threaded rod 5022 is fixedly installed on the other end of the limit slide bar 5021. An output threaded hole is opened on one side of the limit connection box 501, and the output threaded hole is connected to the output electric threaded rod 5022. The rods 5022 are rotated to engage with each other, the upper surface of the capillary glue brush 503 and the lower surface of the input hole are in the same horizontal plane, a mounting slot is provided on one side of the sticking weight operation panel 3, a glue control pump 5031 is embedded and installed inside the mounting slot, a glue storage bottle 5032 is fixedly installed on the upper surface of the glue control pump 5031, the input end of the glue control pump 5031 and the lower end of the glue storage bottle 5032 are fixedly connected to each other, and the output end of the glue control pump 5031 is connected to the capillary glue brush 503, so as to push the crystal to the output position and quickly apply glue on the lower surface of the crystal.

[0026] The chip output structure 7 includes a push plate 701 and a push electric threaded rod 702. A retracting slide hole is provided on one side of the lower end of the chip storage box 6. The push plate 701 is slidably engaged in the inside of the retracting slide hole. The push electric threaded rod 702 is installed at the lower end of the chip storage box 6. Output mounting grooves are provided at both ends of the sticking operation panel 3. The push electric threaded rod 702 is fixedly installed in the inside of the output mounting groove. The lower end of the push plate 701 is slidably engaged in the inside of the output mounting groove. The push plate 701 and the push electric threaded rod 702 are threadedly connected to each other to facilitate pushing the push plate 701 to move, thereby pushing the chip out of the chip storage box 6.

[0027] When the utility model is in use: the user places the device at an appropriate position and electrically connects it to an external power source, fills a sufficient amount of chip material in the chip storage box 6, pours an appropriate amount of glue into the glue storage bottle 5032, and turns on the electric lifting threaded rod 201 through the lifting slide 2 to push the gluing weight operating plate 3 up and down until the gluing weight operating plate 3 moves to an appropriate height, and then turns on the device to work.

[0028] The carrier raw material is placed on the upper surface of the carrier conveyor belt 1, and the carrier is moved to the bottom of the equalizing pressure box 4 through the carrier conveyor belt 1. The chip output structure 7 works, and the push electric threaded rod 702 pushes the push plate 701 to push the chip material at the bottom to the upper surface of the capillary glue brush 503. The glue pump 5031 is controlled to transport glue to the inside of the capillary glue brush 503, and the upper surface of the capillary glue brush 503 and the lower surface of the chip material are in contact with each other. The output electric threaded rod 5022 rotates and generates a spiral force between the output threaded hole to push the output electric threaded rod 5022 to move. The output electric threaded rod 5022 pushes the electric output plate 502 to move, thereby pushing the chip material from the upper surface of the capillary glue brush 503 to the inside of the equalizing pressure box 4, and falls on the upper surface of the carrier under the action of the middle road. The pressure cylinder 401 is opened to push the equalizing pressure plate 402 to push the chip and the carrier to be in close contact with each other, thereby realizing the automation of chip sticking and improving the efficiency of chip processing.

[0029] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0030] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer bonding device, comprising a carrier conveyor belt (1), characterized in that: A lifting slide (2) is fixedly mounted on the upper surface of the carrier conveyor belt (1), a gluing weight operating panel (3) is mounted between the lifting slides (2), a balancing pressure box (4) is mounted at the center of the gluing weight operating panel (3), a gluing structure (5) is mounted on both sides of the balancing pressure box (4), a chip storage box (6) is mounted on one side of the gluing structure (5), and a chip output structure (7) is mounted at the lower end of the chip storage box (6).

2. A wafer bonding device as claimed in claim 1, characterized in that: An electric lifting threaded rod (201) is installed inside the lifting slide (2), and the two ends of the sticking weight operating plate (3) are slidably engaged with the lifting slide (2), and the electric lifting threaded rod (201) and the sticking weight operating plate (3) are threadedly connected to each other.

3. A wafer bonding device as claimed in claim 1, characterized in that: A pressure cylinder (401) is fixedly mounted on the upper inner end of the equalizing pressure box (4), and an equalizing pressure plate (402) is fixedly mounted on the output end of the pressure cylinder (401). Input holes are provided on both sides of the lower end of the equalizing pressure box (4), and the input holes are interconnected with the glue coating structure (5).

4. A wafer bonding device as claimed in claim 3, characterized in that: The glue coating structure (5) comprises a limit connection box (501), an electric output plate (502) and a capillary glue coating brush (503); one side of the limit connection box (501) is mutually connected with the input holes; the electric output plate (502) is slidably engaged with the other side of the limit connection box (501); and the capillary glue coating brush (503) is mounted on the lower end of the limit connection box (501).

5. A wafer bonding device as claimed in claim 4, characterized in that: A limit slide bar (5021) is fixedly mounted on the outer side of the electric output plate (502); an output electric threaded rod (5022) is fixedly mounted on the other end of the limit slide bar (5021); an output threaded hole is provided on one side of the limit connection box (501); the output threaded hole and the output electric threaded rod (5022) are meshed with each other.

6. A wafer bonding device as claimed in claim 4, characterized in that: The upper surface of the capillary glue brush (503) and the lower surface of the input hole are in the same horizontal plane, a mounting slot is provided on one side of the sticking wheel operation panel (3), a glue control pump (5031) is embedded and installed inside the mounting slot, a glue storage bottle (5032) is fixedly installed on the upper surface of the glue control pump (5031), the input end of the glue control pump (5031) and the lower end of the glue storage bottle (5032) are fixedly connected to each other, and the output end of the glue control pump (5031) and the capillary glue brush (503) are connected to each other.

7. A wafer bonding device as claimed in claim 1, characterized in that: The wafer output structure (7) comprises a push plate (701) and a push electric threaded rod (702); a contraction slide hole is provided on one side of the lower end of the wafer storage box (6); the push plate (701) is slidably engaged in the interior of the contraction slide hole; and the push electric threaded rod (702) is mounted on the lower end of the wafer storage box (6).

8. A wafer bonding device as claimed in claim 7, characterized in that: Output mounting grooves are provided at both ends of the sticking weight operation panel (3), the horizontal push electric threaded rod (702) is fixedly mounted inside the output mounting groove, the lower end of the horizontal push plate (701) is slidably engaged inside the output mounting groove, and the horizontal push plate (701) and the horizontal push electric threaded rod (702) are threadedly connected to each other.

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