Nanochip silicon wafer cleaning device

Abstract

The utility model discloses a nanometer chip silicon wafer cleaning device which comprises a cleaning box, a movable plate is arranged on one side of the cleaning box in a penetrating and inserting mode, a pushing assembly for driving the movable plate to move is installed on the side wall of the cleaning box, and a fixed stand column is fixedly connected to the upper surface of the movable plate. A lifting strip is slidably connected to one side of the fixed stand column, and a first power assembly for driving the lifting strip to ascend and descend is installed at the top of the fixed stand column. According to the cleaning device, a first servo motor is started, so that a placing frame ascends to the position above a cleaning box, then a second servo motor is started, an output shaft of the second servo motor drives a second threaded rod to rotate, two movable frames drive a water receiving shell to move to the position below the placing frame, and then a water suction pump is started to suck clean water; clean water enters the mounting pipe and then flows onto the silicon wafer through the plurality of spraying pipes, and the placing frame continuously shakes to wash the silicon wafer, so that the cleaning is convenient, the operation is simple, and the cleaning efficiency of the silicon wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a nano-chip silicon wafer cleaning device. Background Art

[0002] During the manufacturing process of nanochip silicon wafers, various organic compounds, metal impurities and particles will adhere to the surface of the silicon wafer. The cleanliness of the silicon wafer surface is one of the important factors affecting the reliability of semiconductor devices. If it is not cleaned, the performance and pass rate of the semiconductor devices will be greatly reduced.

[0003] At present, after the existing cleaning device uses the cleaning liquid to clean the silicon wafer, it is necessary to take out the silicon wafer and rinse it with clean water. This method not only increases the cleaning cost of the silicon wafer, but also reduces the cleaning efficiency of the silicon wafer. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a nano-chip silicon wafer cleaning device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a nanochip silicon wafer cleaning device comprises a cleaning box, a movable plate is inserted through one side of the cleaning box, a pushing component for driving the movable plate to move is installed on the side wall of the cleaning box, a fixed column is fixedly connected to the upper surface of the movable plate, a lifting bar is slidably connected to one side of the fixed column, a first power component for driving the lifting bar to lift is installed on the top of the fixed column, a mounting column is fixedly connected to the lower surface of the lifting bar, a placing frame is fixedly connected to the bottom of the mounting column, a cleaning component is installed on the other side of the fixed column, a water receiving shell is arranged above the cleaning box, a moving frame is fixedly connected to both sides of the water receiving shell, and a second power component for driving the moving frame to move is arranged on both sides of the cleaning box.

[0006] As a further description of the above technical solution:

[0007] The pushing assembly comprises a driving cylinder fixedly connected to one side of the cleaning box, a piston end of the driving cylinder is fixedly connected to a connecting shaft, a terminal end of the connecting shaft is fixedly connected to a connecting plate, and the connecting plate is fixedly connected to the movable plate.

[0008] As a further description of the above technical solution:

[0009] The first power assembly includes a first servo motor fixedly connected to the top of the fixed column, the output shaft of the first servo motor extends into the interior of the fixed column and is fixedly connected to a first threaded rod, and the lifting bar is threadedly connected to the outer surface of the first threaded rod.

[0010] As a further description of the above technical solution:

[0011] The cleaning assembly includes a water pump fixedly connected to the side wall of the fixed column, the inlet of the water pump is fixedly connected to a connecting hose, the outlet of the water pump is fixedly connected to a fixed pipe, the end of the fixed pipe is fixedly connected to a mounting pipe, and the lower surface of the mounting pipe is fixedly connected to a plurality of spray pipes.

[0012] As a further description of the above technical solution:

[0013] The second power assembly includes two rectangular blocks fixedly connected to one side of the cleaning box, a second threaded rod is rotatably connected between the two rectangular blocks, a second servo motor is fixedly connected to the side wall of one of the rectangular blocks, the output shaft of the second servo motor is fixedly connected to the second threaded rod, and the movable frame is threadedly connected to the outer surface of the corresponding second threaded rod.

[0014] As a further description of the above technical solution:

[0015] An isolation plate is fixedly connected to the interior of the cleaning box, and the isolation plate divides the interior of the cleaning box into a cleaning liquid area and a water receiving area. The placement frame is located above the cleaning liquid area, and the water receiving shell is located above the water receiving area.

[0016] The utility model has the following beneficial effects:

[0017] 1. Compared with the prior art, the nanochip silicon wafer cleaning device starts the first servo motor to make the placement frame rise to the top of the cleaning box, and then starts the second servo motor. The output shaft of the second servo motor rotates with the second threaded rod, so that the two movable frames move with the water receiving shell to the bottom of the placement frame, and then starts the water pump to extract clean water. After the clean water enters the inside of the installation pipe, it flows out to the silicon wafer through multiple spray pipes, and is rinsed with the continuous shaking of the placement frame. The cleaning is convenient, the operation is simple, and the cleaning efficiency of the silicon wafer is improved.

[0018] 2. Compared with the prior art, the nano-chip silicon wafer cleaning device starts the first servo motor, and the output shaft of the first servo motor rotates with the first threaded rod, so that the lifting bar brings the placement frame down to the inside of the cleaning box and is placed in the cleaning liquid, and then starts the driving cylinder, so that the movable plate brings the fixed column to reciprocate, and the fixed column brings the placement frame to reciprocate horizontally, so that the placement frame is shaken and cleaned inside the cleaning liquid, and the cleaning is cleaner. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a three-dimensional diagram of a nano-chip silicon wafer cleaning device proposed by the utility model;

[0020] Figure 2This is a front view of a nano-chip silicon wafer cleaning device proposed by the utility model;

[0021] Figure 3 This is a schematic diagram of a placement frame of a nano-chip silicon wafer cleaning device proposed by the utility model.

[0022] Legend:

[0023] 1. Cleaning box; 2. Isolation plate; 3. Movable plate; 4. Fixed column; 5. Lifting strip; 6. First servo motor; 7. First threaded rod; 8. Placement frame; 9. Driving cylinder; 10. Water pump; 11. Fixed pipe; 12. Mounting pipe; 13. Spray pipe; 14. Connecting hose; 15. Moving frame; 16. Water receiving shell; 17. Second threaded rod; 18. Second servo motor. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Reference Figures 1 to 3 The utility model provides a nano-chip silicon wafer cleaning device: comprising a cleaning box 1, a movable plate 3 is inserted through one side of the cleaning box 1, a pushing component for driving the movable plate 3 to move is installed on the side wall of the cleaning box 1, and the pushing component comprises a driving cylinder 9 fixedly connected to one side of the cleaning box 1, a connecting shaft is fixedly connected to the piston end of the driving cylinder 9, a connecting plate is fixedly connected to the end of the connecting shaft, and the connecting plate is fixedly connected to the movable plate 3;

[0026] Reference Figure 1 and Figure 3 In order to achieve the purpose of driving the lifting bar 5 to move up and down, the upper surface of the movable plate 3 is fixedly connected with a fixed column 4, one side of the fixed column 4 is slidably connected with the lifting bar 5, and the top of the fixed column 4 is installed with a first power assembly that drives the lifting bar 5 to move up and down. The first power assembly includes a first servo motor 6 fixedly connected to the top of the fixed column 4, and the output shaft of the first servo motor 6 extends to the inside of the fixed column 4 and is fixedly connected with a first threaded rod 7, and the lifting bar 5 is threadedly connected to the outer surface of the first threaded rod 7;

[0027] Reference Figure 1 and Figure 3In order to achieve the purpose of extracting clean water, the lower surface of the lifting bar 5 is fixedly connected with a mounting column, the bottom of the mounting column is fixedly connected with a placement frame 8, and a cleaning component is installed on the other side of the fixed column 4. The cleaning component includes a water pump 10 fixedly connected to the side wall of the fixed column 4, and the inlet of the water pump 10 is fixedly connected with a connecting hose 14, and the connecting hose 14 is connected to the clean water pipeline outside. Only the connecting hose 14 is shown in the figure. The outlet of the water pump 10 is fixedly connected with a fixed pipe 11, and the end of the fixed pipe 11 is fixedly connected with a mounting pipe 12, and the lower surface of the mounting pipe 12 is fixedly connected with a plurality of spray pipes 13;

[0028] Reference Figure 1 and Figure 2 In order to achieve the purpose of horizontal movement of the water receiving shell 16, a water receiving shell 16 is arranged above the cleaning box 1, and a moving frame 15 is fixedly connected to both sides of the water receiving shell 16. A second power assembly that drives the moving frame 15 to move is arranged on both sides of the cleaning box 1. The second power assembly includes two rectangular blocks fixedly connected to one side of the cleaning box 1, and a second threaded rod 17 is rotatably connected between the two rectangular blocks. A second servo motor 18 is fixedly connected to the side wall of one of the rectangular blocks, and the output shaft of the second servo motor 18 is fixedly connected to the second threaded rod 17. The moving frame 15 is threadedly connected to the outer surface of the corresponding second threaded rod 17. An isolation plate 2 is fixedly connected to the inside of the cleaning box 1. The isolation plate 2 divides the inside of the cleaning box 1 into a cleaning liquid area and a water receiving area. The placement frame 8 is located above the cleaning liquid area, and the water receiving shell 16 is located above the water receiving area. The second servo motor 18 is started, and the output shaft of the second servo motor 18 rotates with the second threaded rod 17, so that the two moving frames 15 move the water receiving shell 16 to the bottom of the placement frame 8.

[0029] Working principle:

[0030] When in use, the silicon wafer to be cleaned is placed inside the placement frame 8, and then the first servo motor 6 is started, and the output shaft of the first servo motor 6 drives the first threaded rod 7 to rotate, so that the lifting bar 5 drives the placement frame 8 to descend into the inside of the cleaning box 1 and is placed in the cleaning liquid, and then the driving cylinder 9 is started, so that the movable plate 3 drives the fixed column 4 to move back and forth, so that the fixed column 4 drives the placement frame 8 to move back and forth horizontally, so that the placement frame 8 is shaken and cleaned inside the cleaning liquid;

[0031] After the silicon wafer is cleaned, the first servo motor 6 is started to make the placement frame 8 rise to the top of the cleaning box 1, and then the second servo motor 18 is started. The output shaft of the second servo motor 18 rotates with the second threaded rod 17, so that the two movable frames 15 move with the water receiving shell 16 to the bottom of the placement frame 8, and then the water pump 10 is started to extract clean water. After the clean water enters the interior of the installation pipe 12, it flows out to the silicon wafer through multiple spray pipes 13, and is rinsed with the continuous shaking of the placement frame 8. The water after rinsing flows to the water receiving shell 16 and finally flows into the water receiving area.

[0032] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A nanochip silicon wafer cleaning device, comprising a cleaning box (1), characterized in that: A movable plate (3) is inserted through one side of the cleaning box (1); a pushing component for driving the movable plate (3) to move is installed on the side wall of the cleaning box (1); a fixed column (4) is fixedly connected to the upper surface of the movable plate (3); a lifting bar (5) is slidably connected to one side of the fixed column (4); a first power component for driving the lifting bar (5) to move is installed on the top of the fixed column (4); a mounting column is fixedly connected to the lower surface of the lifting bar (5); a placement frame (8) is fixedly connected to the bottom of the mounting column; a cleaning component is installed on the other side of the fixed column (4); a water receiving shell (16) is arranged above the cleaning box (1); a movable frame (15) is fixedly connected to both sides of the water receiving shell (16); and a second power component for driving the movable frame (15) to move is arranged on both sides of the cleaning box (1).

2. A nanochip silicon wafer cleaning device according to claim 1, characterized in that: The pushing assembly comprises a driving cylinder (9) fixedly connected to one side of the cleaning box (1), the piston end of the driving cylinder (9) being fixedly connected to a connecting shaft, the end of the connecting shaft being fixedly connected to a connecting plate, and the connecting plate being fixedly connected to the movable plate (3).

3. A nanochip silicon wafer cleaning device according to claim 1, characterized in that: The first power assembly comprises a first servo motor (6) fixedly connected to the top of the fixed column (4), the output shaft of the first servo motor (6) extending into the interior of the fixed column (4) and fixedly connected to a first threaded rod (7), and the lifting bar (5) is threadedly connected to the outer surface of the first threaded rod (7).

4. A nanochip silicon wafer cleaning device according to claim 1, characterized in that: The cleaning assembly comprises a water pump (10) fixedly connected to the side wall of a fixed column (4); the inlet of the water pump (10) is fixedly connected to a connecting hose (14); the outlet of the water pump (10) is fixedly connected to a fixed pipe (11); the end of the fixed pipe (11) is fixedly connected to a mounting pipe (12); and the lower surface of the mounting pipe (12) is fixedly connected to a plurality of spray pipes (13).

5. The nano-chip silicon wafer cleaning device according to claim 1, characterized in that: The second power assembly comprises two rectangular blocks fixedly connected to one side of the cleaning box (1), a second threaded rod (17) being rotatably connected between the two rectangular blocks, a second servo motor (18) being fixedly connected to the side wall of one of the rectangular blocks, an output shaft of the second servo motor (18) being fixedly connected to the second threaded rod (17), and the movable frame (15) being threadedly connected to the outer surface of the corresponding second threaded rod (17).

6. The nanochip silicon wafer cleaning device according to claim 1, characterized in that: An isolation plate (2) is fixedly connected to the interior of the cleaning box (1), and the isolation plate (2) divides the interior of the cleaning box (1) into a cleaning liquid area and a water receiving area. The placement frame (8) is located above the cleaning liquid area, and the water receiving shell (16) is located above the water receiving area.

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