Silicon wafer transmission detection device

Abstract

The utility model discloses a silicon wafer transmission detection device, which comprises a first transmission mechanism, a detection mechanism arranged above the first transmission mechanism and a wafer kicking mechanism arranged below the first transmission mechanism, and the detection mechanism and the wafer kicking mechanism are sequentially arranged along the first transmission direction of the first transmission mechanism; the wafer kicking mechanism comprises a second driving mechanism, a cam mechanism connected with the second driving mechanism and a second transmission mechanism connected with the cam mechanism, and the second transmission mechanism can penetrate through the first transmission mechanism under the action of the cam mechanism and jack up the silicon wafers on the first transmission mechanism. And the second transmission mechanism is used for transmitting the silicon wafers to the outside of the first transmission mechanism. The device can realize automatic detection of silicon wafers and rapid elimination of unqualified silicon wafers, thereby improving the wafer insertion efficiency.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer processing, in particular to a silicon wafer transmission detection device. Background Art

[0002] After the silicon wafers are debonded, cleaned and sliced, they are input to the inserting machine through the transmission device, and then the inserting machine inserts the silicon wafers into the flower basket for storage. This process can be completed by automated equipment to improve the efficiency of inserting. In order to ensure that the silicon wafers inserted into the flower basket are intact and inserted individually each time. A detection mechanism and a kicking mechanism are usually set on the existing conveying device. At present, the kicking mechanism mainly uses a cylinder to lift and kick out the silicon wafer. When this mechanism is in use, the kicking speed is slow, which easily causes the silicon wafers behind to collide with each other, resulting in waste. Summary of the invention

[0003] In order to overcome the defects in the prior art, an embodiment of the utility model provides a silicon wafer transmission detection device, which can realize automatic detection of silicon wafers and rapid removal of unqualified silicon wafers, thereby improving wafer insertion efficiency.

[0004] To achieve the above object, the technical solution adopted by the utility model is: a silicon wafer transmission and detection device, comprising a first transmission mechanism, a detection mechanism arranged above the first transmission mechanism and a kicking mechanism arranged below the first transmission mechanism, and the detection mechanism and the kicking mechanism are arranged in sequence along a first transmission direction of the first transmission mechanism;

[0005] The kicking mechanism includes a second driving mechanism, a cam mechanism connected to the second driving mechanism, and a second transmission mechanism connected to the cam mechanism. The second transmission mechanism can pass through the first transmission mechanism and lift up the silicon wafer on the first transmission mechanism under the action of the cam mechanism. The second transmission mechanism is used to transmit the silicon wafer to the outside of the first transmission mechanism.

[0006] By arranging a detection mechanism and a kicking mechanism on the first transmission mechanism, automatic detection of silicon wafer integrity, stacking phenomenon, etc. can be achieved, and unqualified silicon wafers can be automatically removed in conjunction with the kicking mechanism. The entire process can be automated to reduce labor costs and avoid transmission to the inserting machine, thereby improving the inserting efficiency.

[0007] The chip kicking mechanism is composed of a second driving mechanism, a cam mechanism, and a second transmission mechanism. When the silicon wafer being transmitted does not meet the requirements for inserting the wafer, the cam mechanism can stably lift the second transmission mechanism upward, so that the silicon wafer on the first transmission mechanism can be quickly taken away by the second transmission mechanism, thereby removing it from the transmission queue of the first transmission mechanism. The chip kicking mechanism has a simple structure, stable operation, and rapid response, and can avoid collision of silicon wafers caused by chip kicking operations, resulting in unnecessary waste.

[0008] As a further improvement, the second conveying mechanism is used to convey the silicon wafer along a second conveying direction, and the second conveying direction is perpendicular to the first conveying direction. The second conveying direction is perpendicular to the first conveying direction, so that the silicon wafer can quickly leave the first conveying mechanism when moving a short distance, thereby increasing the ejection speed.

[0009] As a further improvement, the second transmission mechanism includes a lifting plate connected to the cam mechanism, a support base arranged on the lifting plate, a driving wheel and a driven wheel arranged on the support base, a belt for transmitting silicon wafers connected to the driving wheel and the driven wheel, and a third driving mechanism connected to the driving wheel.

[0010] As a further improvement, the second transmission device includes a driving wheel and a plurality of driven wheels, the plurality of driven wheels are divided into two groups and arranged on both sides of the support seat, and each group is connected via a second belt.

[0011] Specifically, the second transmission device includes a driving wheel and eighteen driven wheels. The driving wheel is arranged on the rotating shaft of the second motor and is located on the first side of the support seat. The driven wheels include two first driven wheels, four second driven wheels, four third driven wheels, four fourth driven wheels and four fifth driven wheels. The two first driven wheels are located on the first side of the first support seat and are symmetrically arranged above the driving wheel. The four second driven wheels, four third driven wheels, four fourth driven wheels and four fifth driven wheels are symmetrically arranged on the first side and the second side of the support seat. The second driven wheel and the third driven wheel are arranged flush on the top of the support seat. The two second driven wheels symmetrically arranged on both sides are sleeved on the same transmission shaft. The fourth driven wheel is arranged near the bottom of the support seat. The fifth driven wheel is located between the third driven wheel and the fourth driven wheel in the vertical direction. On the first side of the support seat, the second belt is wound around the first driven wheel, the fourth driven wheel, the third driven wheel, the fifth driven wheel and the second driven wheel in sequence from the driving wheel to both sides. On the second side of the support seat, the second belt is wound from the two second driven wheels to both sides in sequence around the fifth driven wheel, the third driven wheel and the fourth driven wheel. The driving wheel has the same rotation direction as the second driven wheel, the third driven wheel and the fourth driven wheel, and the first driven wheel has the same rotation direction as the fifth driven wheel.

[0012] By arranging a plurality of second driven wheels and a plurality of third driven wheels on the surface of the support seat, the support for the silicon wafer is ensured and the moving speed of the silicon wafer is improved.

[0013] As a further improvement, the kicking plate mechanism also includes a bottom plate, a guide rod arranged on the bottom plate and extending in a vertical direction, and the lifting plate is sleeved on the guide rod and moves along the guide rod under the drive of the cam mechanism.

[0014] As a further improvement, the second driving mechanism and the third driving mechanism are both motors.

[0015] As a further improvement, the first transmission mechanism includes a detection position and a kicking position, which are arranged in sequence along the first transmission direction, the detection mechanism is located above the detection position, and the kicking mechanism is located below the kicking position.

[0016] As a further improvement, the detection mechanism includes a thickness detection mechanism, and the thickness detection mechanism includes a first sensor arranged on the first transmission mechanism, and the first sensor is used to obtain the distance between the first sensor and the silicon wafer.

[0017] As a further improvement, the detection mechanism includes a debris detection mechanism, which includes a plurality of second sensors arranged on the first transmission mechanism at intervals along a direction perpendicular to the first transmission direction, and the second sensors are used to obtain defects on the edge and surface of the silicon wafer.

[0018] As a further improvement, a guide plate is provided on one side of the first transmission mechanism, and the guide plate and the kick-off mechanism are arranged perpendicular to the first transmission direction. The guide plate is located on one side of the transmission direction of the second transmission mechanism and is used to receive the silicon wafers transmitted by the second transmission mechanism.

[0019] Due to the application of the above technical solution, the present invention has the following advantages over the prior art:

[0020] 1. By setting up a detection mechanism and a kicking mechanism on the first transmission mechanism, automatic detection of silicon wafer integrity, stacking phenomenon, etc. can be achieved, and the kicking mechanism can be used to automatically remove unqualified silicon wafers. The entire process can be automated, reducing labor costs, avoiding transmission to the inserting machine, and improving inserting efficiency.

[0021] 2. The chip kicking mechanism is composed of a second driving mechanism, a cam mechanism and a second transmission mechanism. When the silicon wafer being transmitted does not meet the requirements for inserting the wafer, the cam mechanism can stably lift the second transmission mechanism upward, so that the silicon wafer on the first transmission mechanism can be quickly taken away by the second transmission mechanism, thereby removing it from the transmission queue of the first transmission mechanism. The chip kicking mechanism has a simple structure, stable operation, and rapid response, and can avoid collision of silicon wafers caused by chip kicking operation, resulting in unnecessary waste.

[0022] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 This is a schematic diagram of the structure of the silicon wafer transmission detection device in the embodiment of the utility model. Figure 1 ;

[0025] Figure 2 This is a schematic diagram of the structure of the silicon wafer transmission detection device in the embodiment of the utility model. Figure 2 ;

[0026] Figure 3 It is a side view of the silicon wafer transmission detection device in the embodiment of the utility model;

[0027] Figure 4 This is a schematic diagram of the kicking mechanism in the embodiment of the utility model. Figure 1 ;

[0028] Figure 5 This is a schematic diagram of the kicking mechanism in the embodiment of the utility model. Figure 2 .

[0029] The figure marks of the above drawings are: 1. first transmission mechanism; 11. frame; 12. pulley; 13. first belt; 14. guide plate; 2. detection mechanism; 21. first support frame; 22. second sensor; 23. second support frame; 24. first sensor; 3. kick-off mechanism; 31. bottom plate; 32. guide rod; 33. second motor; 34. cam mechanism; 35. second transmission mechanism; 351. lifting plate; 352. driving wheel; 353. first driven wheel; 354. second driven wheel; 355. third driven wheel; 356. fourth driven wheel; 357. fifth driven wheel; 358. third motor; 359. second belt; 360. support seat; 4. third transmission mechanism; 5. silicon wafer. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Example 1: See Figures 1 to 3As shown, a silicon wafer 5 transmission and detection device includes a first transmission mechanism 1, on which a plurality of silicon wafer 5 positions are sequentially formed along its first transmission direction, wherein the plurality of silicon wafer 5 positions include a detection position and a wafer kicking position. The detection position and the wafer kicking position are sequentially arranged along the first transmission direction. A detection mechanism 2 is arranged above the first transmission mechanism 1 opposite to the detection position. A wafer kicking mechanism 3 is arranged below the first transmission mechanism 1 opposite to the wafer kicking position. A third transmission mechanism 4 for adsorbing and transmitting the silicon wafer 5 from the wafer splitter side to the first transmission mechanism 1 is arranged at the starting end of the first transmission direction of the first transmission mechanism 1. A control system connected to the first transmission mechanism 1, the detection mechanism 2, the wafer kicking mechanism 3 and the third transmission mechanism 4 is also included.

[0032] See also Figures 1-2 As shown, the first transmission mechanism 1 includes a frame 11, and a plurality of transmission components arranged in sequence along the length direction of the frame 11. The plurality of transmission components form a plurality of silicon wafers 5 on the frame 11. The transmission component includes a pulley 12, a first belt 13 sleeved on the pulley 12, and a first driving mechanism for driving the pulley 12 to rotate. The first driving mechanism can use a first motor.

[0033] A notch is provided on one side of the frame 11 opposite to the sheet kicking position, and a guide plate 14 is provided at the notch. The guide plate 14 is tilted downward from the side connected to the frame 11 to the side facing away from the frame 11, so that the silicon wafer 5 on the guide plate 14 can slide down quickly along the guide plate 14 and escape from the first transmission mechanism 1.

[0034] In a possible embodiment, the detection mechanism 2 includes a debris detection mechanism 2 and a thickness detection mechanism 2. The debris detection mechanism 2 includes a first support frame 21 arranged across the frame 11, and three second sensors 22 are arranged on the first support frame 21. The three second sensors 22 are arranged at intervals along the width direction of the frame 11. When the silicon wafer 5 is transported along the first transport direction by the first transport mechanism 1, the silicon wafer 5 is placed at the detection position and below the three second sensors 22. When the silicon wafer 5 is at the detection position, the second sensor 22 obtains the edge and surface shape of the silicon wafer 5 and transmits it to the control system to determine whether there are defects on the edge and surface of the silicon wafer 5. The thickness detection mechanism 2 includes a second support frame 23 arranged across the frame 11, and a first sensor 24 is arranged on the second support frame 23. The first sensor 24 is arranged perpendicular to the transport surface of the first transport mechanism 1. When the silicon wafer 5 is at the detection position and below the first sensor 24, the first sensor 24 obtains the distance from the silicon wafer 5 surface and transmits it to the control system to determine the thickness of the silicon wafer 5, and then determine whether the silicon wafer 5 has a stacking phenomenon.

[0035] In one possible implementation, see Figures 3 to 5 As shown, the kicking mechanism 3 includes a base, a second driving mechanism arranged on the base, a cam mechanism 34 connected to the second driving mechanism, and a second transmission mechanism 35 connected to the cam mechanism 34. The second transmission mechanism 35 can pass through the first transmission mechanism 1 and lift up the silicon wafer 5 on the first transmission mechanism 1 under the action of the cam mechanism 34. The second transmission mechanism 35 is used to transmit the silicon wafer 5 to the outside of the first transmission mechanism 1. The base includes a bottom plate 31, and guide rods 32 are arranged near both ends of the bottom plate 31. The lifting plate 351 of the second transmission mechanism 35 is sleeved on the guide rod 32, so that the second transmission mechanism 35 slides along the guide rod 32 under the action of the cam mechanism 34.

[0036] See also Figure 3 As shown, the second driving mechanism is a second motor 33, and the second motor 33 is connected to the control system. After the detection mechanism 2 detects that the silicon wafer 5 is unqualified, the control system controls the second motor 33 to operate to drive the cam mechanism 34 to lift the silicon wafer 5 transmitted to the kicking position by the first transmission mechanism 1 upward and disengage from the first belt 13 of the first transmission mechanism 1. The cam mechanism 34 can adopt a common structure on the market, as long as it can change the position of the connection block connected to the lifting plate 351 in the vertical direction under the drive of the first motor.

[0037] The second transmission mechanism 35 includes a lifting plate 351 connected to the cam mechanism 34, a support seat 360 disposed on the lifting plate 351, a driving wheel 352 and a driven wheel disposed on the support seat 360, a second belt 359 sleeved on the driving wheel 352 and the driven wheel for transmitting the silicon wafer 5, and a third driving mechanism connected to the driving wheel 352. The third drive can use a third motor 358. The second belt 359 is arranged perpendicular to the first belt 13, so that the second transmission mechanism 35 is used to transmit the silicon wafer 5 along a second transmission direction. The second transmission direction is perpendicular to the first transmission direction.

[0038] See also Figure 4 , 5As shown, in a possible embodiment, the second transmission device includes a driving wheel 352 and eighteen driven wheels. The driving wheel 352 is arranged on the rotating shaft of the third motor 358 and is located on the first side of the support seat 360. The driven wheels include two first driven wheels 353, four second driven wheels 354, four third driven wheels 355, four fourth driven wheels 356 and four fifth driven wheels 357. The two first driven wheels 353 are located on the first side of the first support seat 360 and are symmetrically arranged above the driving wheel 352. The four second driven wheels 354, the four third driven wheels 355, the four fourth driven wheels 356 and the four fifth driven wheels 357 are symmetrically arranged on the first side and the second side of the support seat 360. The second driven wheel 354 and the third driven wheel 355 are arranged flush with the top of the support seat 360. The two second driven wheels 354 symmetrically arranged on both sides are sleeved on the same transmission shaft. The fourth driven wheel 356 is arranged near the bottom of the support seat 360. The fifth driven wheel 357 is located between the third driven wheel 355 and the fourth driven wheel 356 in the vertical direction. On the first side of the support seat 360, the second belt 359 is wound from the driving wheel 352 to the sides in turn around the first driven wheel 353, the fourth driven wheel 356, the third driven wheel 355, the fifth driven wheel 357 and the second driven wheel 354. On the second side of the support seat 360, the second belt 359 is wound from the two second driven wheels 354 to the sides in turn around the fifth driven wheel 357, the third driven wheel 355 and the fourth driven wheel 356. The driving wheel 352 has the same rotation direction as the second driven wheel 354, the third driven wheel 355 and the fourth driven wheel 356, and the first driven wheel 353 and the fifth driven wheel 357 have the same rotation direction.

[0039] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A silicon wafer transmission detection device, characterized in that: It comprises a first transmission mechanism, a detection mechanism arranged above the first transmission mechanism and a kicking mechanism arranged below the first transmission mechanism, and the detection mechanism and the kicking mechanism are arranged in sequence along a first transmission direction of the first transmission mechanism; The kicking mechanism includes a second driving mechanism, a cam mechanism connected to the second driving mechanism, and a second transmission mechanism connected to the cam mechanism. The second transmission mechanism can pass through the first transmission mechanism and lift up the silicon wafer on the first transmission mechanism under the action of the cam mechanism. The second transmission mechanism is used to transmit the silicon wafer to the outside of the first transmission mechanism.

2. The silicon wafer transmission detection device according to claim 1, characterized in that: The second transmission mechanism is used to transmit the silicon wafer along a second transmission direction, and the second transmission direction is perpendicular to the first transmission direction.

3. The silicon wafer transmission detection device according to claim 2, characterized in that: The second transmission mechanism includes a lifting plate connected to the cam mechanism, a support base arranged on the lifting plate, a driving wheel and a driven wheel arranged on the support base, a belt sleeved on the driving wheel and the driven wheel for transmitting silicon wafers, and a third driving mechanism connected to the driving wheel.

4. The silicon wafer transmission detection device according to claim 3, characterized in that: The second transmission mechanism includes a driving wheel and a plurality of driven wheels. The plurality of driven wheels are divided into two groups and arranged on both sides of the support seat, and each group is connected via a second belt.

5. The silicon wafer transmission detection device according to claim 3, characterized in that: The kicking plate mechanism also includes a bottom plate, a guide rod arranged on the bottom plate and extending in a vertical direction, and the lifting plate is sleeved on the guide rod and moves along the guide rod under the drive of the cam mechanism.

6. The silicon wafer transmission detection device according to claim 3, characterized in that: The second driving mechanism and the third driving mechanism are both motors.

7. The silicon wafer transmission detection device according to claim 1, characterized in that: The first transmission mechanism comprises a detection position and a sheet kicking position, which are arranged in sequence along the first transmission direction. The detection mechanism is located above the detection position, and the sheet kicking mechanism is located below the sheet kicking position.

8. The silicon wafer transmission detection device according to claim 1, characterized in that: The detection mechanism includes a thickness detection mechanism, and the thickness detection mechanism includes a first sensor arranged on the first transmission mechanism, and the first sensor is used to obtain the distance between the first sensor and the silicon wafer.

9. The silicon wafer transmission detection device according to claim 1, characterized in that: The detection mechanism comprises a debris detection mechanism, and the debris detection mechanism comprises a plurality of second sensors arranged on the first transmission mechanism at intervals along a vertical first transmission direction, and the second sensors are used to obtain defects on the edge and surface of the silicon wafer.

10. The silicon wafer transmission detection device according to claim 1, characterized in that: A guide plate is provided on one side of the first transmission mechanism, and the guide plate and the kicking mechanism are arranged perpendicular to the first transmission direction. The guide plate is located on one side of the transmission direction of the second transmission mechanism and is used to receive the silicon wafers transmitted by the second transmission mechanism.

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