Radiator, circuit board module and electronic equipment

Abstract

The utility model provides a radiator, a circuit board module and electronic equipment. The radiator is applied to the circuit board and comprises a radiating body and at least one connecting assembly, wherein the heat dissipation body is provided with a first surface and a second surface which are opposite to each other, and a connecting hole penetrating through the first surface and the second surface is formed in the heat dissipation body; each connecting assembly comprises a connecting piece, an elastic piece and a clamping piece; the connecting piece penetrates through the connecting hole from the first surface of the heat dissipation body and extends to the side where the second surface is located. The elastic piece is arranged between the first surface of the heat dissipation body and the connecting piece in the extending direction of the connecting piece. The clamping piece is connected with the connecting piece and located on the side where the second surface of the heat dissipation body is located, and the maximum transverse size of the clamping piece is larger than the maximum hole diameter of the connecting hole. The pressing force of the radiator on the circuit board is relatively uniform; a heat-conducting silicone grease material can be adopted, so that the heat-conducting efficiency is improved; and the assembly with the circuit board is more convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board heat dissipation, in particular to a radiator, a circuit board module and an electronic device. Background Art

[0002] Electronic devices include a large number of circuit boards, which are equipped with a large number of electronic components, such as chips. Highly integrated chips, especially as core processing units, need to perform multiple tasks and generate a lot of heat when working. If the heat cannot be dissipated in time, a large amount of heat will accumulate inside the device, causing the internal ambient temperature of the device to rise sharply, which may cause a crash at the least and damage the chips and other electronic components at the worst. Therefore, a radiator is needed to dissipate the heat from the chip.

[0003] However, the existing heat sink has extremely high requirements on the processing error of electronic components and the installation error of electronic components on the circuit board. The existing processing technology of electronic components cannot meet the requirements, resulting in inconsistent pressing force of the heat sink on the electronic components. Utility Model Content

[0004] The heat sink, circuit board module and electronic device provided in the present application are intended to solve the problem that the existing heat sink has extremely high requirements on the processing error of electronic components and the installation error of electronic components on the circuit board, and the existing processing technology of electronic components cannot meet the requirements, resulting in inconsistent pressing force of the heat sink on the electronic components.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a heat sink, applied to a circuit board, the heat sink comprising: a heat sink body and at least one connecting component; wherein the heat sink body has a first surface and a second surface opposite to each other, and a connecting hole penetrating the first surface and the second surface is provided on the heat sink body; at least one connecting component, each of the connecting components comprising a connecting piece, an elastic piece and a clip; wherein the connecting piece passes through the connecting hole from the first surface of the heat sink body and extends to the side where the second surface is located; the elastic piece is arranged between the first surface of the heat sink body and the connecting piece along the extension direction of the connecting piece; the clip is connected to the connecting piece and is located on the side where the second surface of the heat sink body is located, and the maximum lateral dimension of the clip is greater than the maximum aperture of the connecting hole.

[0006] The above-mentioned heat sink is provided with at least one connecting component, so that the heat sink can connect the heat sink body with the circuit board through the at least one connecting component to dissipate heat for the circuit board. At the same time, each connecting component includes a connecting member and an elastic member, and the elastic member is arranged between the first surface of the heat sink body and the connecting member along the extension direction of the connecting member; in this way, when the connecting member is fixed to the circuit board, the elastic member can be in an elastic compression state under the action of the connecting member and the heat sink body, so that when the second surface of the heat sink body contacts the electronic components in the circuit board, the heat sink body can apply a pressing force to the electronic components under the elastic force of the elastic member to ensure that the two are in close contact and the pressing force is relatively uniform. Moreover, since the elastic force of the elastic member can be adjusted according to the actual contact position between the heat sink body and the electronic components, there is no requirement for the installation error of the electronic components, and the heat sink body will not damage the electronic components due to the large installation error of the electronic components. Therefore, the heat sink can be made of thermal conductive silicone grease to improve the thermal conductivity efficiency. In addition, by making each connecting component also include a snap connector, the snap connector is connected to the corresponding connecting component and is located on the side where the second surface of the heat dissipation body is located, and the maximum lateral dimension of the snap connector is greater than the maximum aperture of the connecting hole; in this way, the connecting component and the elastic component can be fixed on the heat dissipation body by using the snap connector to prevent the connecting component and the elastic component from falling off the heat dissipation body, and then combined into a whole; in this way, during the assembly process of the integral heat sink and the circuit board, each connecting component of at least one connecting component can first pass through the mounting hole of the circuit board and then be fixed; compared with the solution of assembling the heat dissipation body and the connecting components and elastic components of multiple connecting components on the circuit board one by one, it is more convenient to assemble the heat sink and the circuit board, and the assembly efficiency is higher. Moreover, it can prevent the heat sink from tilting relative to the circuit board during the assembly process because some connecting components have been fixed to the circuit board, while other connecting components have not been connected and fixed to the circuit board, and the connecting components that have not been installed cannot be accurately aligned with the mounting holes on the circuit board, which can save the labor cost of multiple people working together to install the heat dissipation body and the circuit board.

[0007] In one embodiment, the elastic member is spirally wound around the outer side of the connecting member; and two ends of the elastic member along the axial direction of the connecting member are respectively in contact with the connecting member and the first surface of the heat dissipation body.

[0008] The above scheme can prevent the elastic part from falling off the connecting part; at the same time, during the assembly process of the heat sink and the circuit board, the elastic part can be elastically compressed along the axial direction of the connecting part to drive the heat dissipation body to provide elastic clamping force to the electronic components on the circuit board, thereby achieving uniform clamping force.

[0009] In one embodiment, a clamping groove is formed on the outer side surface of the connecting member, and parts of the clamping member are embedded in the clamping groove from both sides of the connecting member.

[0010] The above solution can not only fix the connector to the heat dissipation body through the clamping member, but also embed the clamping grooves from both sides to facilitate installation and disassembly.

[0011] In one embodiment, the connecting member includes a first extension portion and a second extension portion connected to each other along its axial direction; the positive projection of the second extension portion along its axial direction falls within the first extension portion; and the snap-in groove is formed at a position of the first extension portion close to the second extension portion.

[0012] The above scheme forms a step at the connection between the first extension part and the second extension part. In this way, during the assembly process of the heat sink and the circuit board, the second extension part can pass through the circuit board to be fixed to the circuit board, and the first extension part is overlapped on the surface of the circuit board to stop the connecting member from moving further downward relative to the circuit board. In this way, it can be ensured that the downward pressing distance of the elastic member of each connecting component is the same, that is, each connecting component has the same elastic force after being assembled with the circuit board, so as to apply a uniform pressing force to the circuit board, so that the heat sink is in good contact with the electronic components on the circuit board and the heat dissipation effect is better.

[0013] In one embodiment, an outer side surface of an end of the second extension portion facing away from the first extension portion has an external thread.

[0014] The above solution can fix the heat sink and the circuit board by screwing together, which is easy to install and disassemble and convenient to clean.

[0015] In one embodiment, there are multiple connection components, and the multiple connection components are evenly distributed along the circumferential direction of the heat dissipation body.

[0016] The above scheme can ensure that after the heat sink is assembled with the circuit board, the heat dissipation body of the heat sink can be in close contact with the electronic components on the circuit board at all positions along its circumferential direction, so as to improve the heat dissipation effect and ensure good heat dissipation.

[0017] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a circuit board module, which includes: a heat sink and a circuit board; wherein the heat sink is the heat sink involved above; the circuit board includes a circuit board and electronic components arranged on the circuit board; wherein the circuit board is arranged on the side of the heat sink's clip-on part away from the heat sink body, and is connected to the heat sink's connecting part; wherein the elastic part of the heat sink is in an elastically compressed state; the electronic components are located between the circuit board and the heat sink body, and are in contact with the heat sink body.

[0018] In one embodiment, a mounting hole is provided on the circuit board; wherein the maximum lateral dimension of the first extension portion of the heat sink is greater than the maximum aperture of the mounting hole; the second extension portion of the heat sink passes through the mounting hole and extends to the side of the circuit board away from the heat dissipation body to be connected to the circuit board.

[0019] The above scheme can make the first extension part abut against the surface of the circuit board to limit the downward movement distance of the connector of the heat sink, thereby ensuring that the downward pressing distance of the elastic parts of the corresponding connecting components is the same, that is, each connecting component has the same elastic force after being assembled with the circuit board, so as to apply a uniform pressing force to the circuit board, avoiding the situation that each connecting component is too loose due to inconsistent tightening torque with the circuit board, resulting in poor contact between the heat sink body and the electronic components, and too tight damage to the electronic components and the circuit board; effectively ensuring good contact between the heat sink and the electronic components on the circuit board, and better heat dissipation effect. At the same time, a clamping part and a side wall forming a clamping groove are provided between the circuit board and the heat sink body, avoiding the situation that there is no supporting structure between the circuit board and the heat sink body, which damages the electronic components and the circuit board.

[0020] In one embodiment, the circuit board module further includes: a reinforcement member, which is disposed on a side surface of the circuit board facing away from the heat sink and connected to each connecting component of the heat sink; wherein the orthographic projection of a first area formed by the connecting components of the heat sink on the circuit board falls within the orthographic projection of a second area formed by the reinforcement member on the circuit board.

[0021] The above solution can reduce the risk of bending of the circuit board.

[0022] In one embodiment, the circuit board module further includes:

[0023] At least one fixing member, one of the fixing members corresponds to a connecting component of the heat sink, the fixing member and the corresponding connecting member extend to connect to a portion of the circuit board away from the heat sink body, so as to fix the relative position of the circuit board and the heat sink body;

[0024] At least one elastic pad, one elastic pad corresponds to one fixing member, and the elastic pad is arranged between the fixing member and the circuit board along the axial direction of the connecting member.

[0025] The above solution can not only fix the heat sink and the circuit board, but also reduce the risk of damaging the circuit board due to over-tightening of the fixing member and the connecting member by arranging an elastic member between the fixing member and the circuit board.

[0026] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide an electronic device, which includes the circuit board module involved above.

[0027] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0029] Figure 1 A schematic diagram of the overall structure of a radiator provided in one embodiment of the present application;

[0030] Figure 2a-2b ,for Figure 1 Schematic diagram of disassembly of the heat sink shown in different viewing angles;

[0031] Figure 3 A schematic diagram of the overall structure of a connector provided in one embodiment of the present application;

[0032] Figure 4 A schematic diagram of the overall structure of a circuit board module provided in one embodiment of the present application;

[0033] Figures 5 to 7 ,for Figure 4 Schematic diagram of disassembly of the circuit board module shown at different viewing angles;

[0034] Figure 8 A schematic diagram of a disassembled circuit board module provided in another embodiment of the present application;

[0035] Fig. 9 A simplified structural diagram of an electronic device provided in one embodiment of the present application.

[0036] Description of Reference Numerals

[0037] 100-circuit board module; 10-heat sink; 1-heat sink body; 11-bottom plate; 111-connection hole; 12-heat conducting plate; 13-heat sink fin; 2-connection assembly; 21-connector; 211-clamping groove; 212-cover; 213-first extension; 214-second extension; 22-elastic member; 23-clamping member; 20-circuit board; 3-circuit board; 31-mounting hole; 4-electronic component; 5-reinforcement member; 51-assembly hole; 6-fixing member; 7-elastic pad; 71-flat pad; 72-elastic pad. DETAILED DESCRIPTION

[0038] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0040] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0041] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0042] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0043] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0044] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0045] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0046] In the related art, heat sinks usually use thermal grease to dissipate heat in order to improve the thermal conductivity. However, thermal grease has extremely high requirements on the processing error of electronic components and the soldering error of electronic components on circuit boards, and usually requires the error to be controlled within 0.15mm. However, under the existing technology, the error of electronic components soldered on circuit boards has exceeded 0.2mm, which exceeds the error range required by thermal grease, so the existing installation method of electronic components cannot meet actual needs.

[0047] Therefore, in order to ensure that the electronic components can work normally, a heat sink with high precision and uniform pressure needs to be installed on the circuit board to cover the surface of the electronic components and play a better heat dissipation role.

[0048] Based on this, the heat sink provided in the embodiment of the present application has no requirements on the processing and installation errors of the electronic components by making the heat dissipation body elastically contact with the electronic components, and can apply a uniform pressing force to the electronic components, thereby achieving a better heat dissipation effect.

[0049] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0050] See also Figure 1 to Figure 2b , Figure 1 A schematic diagram of the overall structure of a radiator provided in one embodiment of the present application; Figure 2a-2b ,for Figure 1Schematic diagrams of disassembly of the heat sink at different viewing angles. In this embodiment, a heat sink 10 is provided, which is applied to a circuit board to dissipate heat from the circuit board. The heat sink 10 includes a heat sink body 1 and at least one connecting component 2.

[0051] The heat dissipation body 1 has a first surface and a second surface opposite to each other, and a connection hole 111 penetrating through the first surface and the second surface is formed on the heat dissipation body 1. Figure 1 to Figure 2b Each connecting component 2 includes a connecting piece 21, an elastic piece 22 and a clamping piece 23; wherein the connecting piece 21 passes through the connecting hole 111 from the first surface of the heat dissipation body 1 and extends to the side where the second surface is located; the elastic piece 22 is arranged between the first surface of the heat dissipation body 1 and the connecting piece 21 along the extension direction of the connecting piece 21; the clamping piece 23 is connected to the connecting piece 21 and is located on the side where the second surface of the heat dissipation body 1 is located, and the maximum lateral dimension of the clamping piece 23 is greater than the maximum aperture of the connecting hole 111.

[0052] Among them, Figure 2b As shown, the heat dissipation body 1 includes a bottom plate 11, a heat conducting plate 12 and a plurality of heat dissipation fins 13. The bottom plate 11 has a top surface and a bottom surface facing each other, and the heat conducting plate 12 is attached to the bottom surface of the bottom plate 11 for contacting with a circuit board 20 (see below). Figure 4 ) on the electronic components 4 (see below Figure 6 ) to contact and dissipate heat. Each heat dissipation fin 13 is arranged side by side on the top surface of the bottom plate 11. The connection hole 111 is specifically opened on the bottom plate 11 and passes through the top surface and the bottom surface of the bottom plate 11.

[0053] The heat conducting plate 12 is a silver paste plate, thermal grease, thermal gel, thermal mud, thermal silicone pad, etc. In this way, the heat conducting plate 12 has very good thermal conductivity, thereby ensuring that the radiator 10 has very good heat dissipation performance. Specifically, the bottom plate 11 and each heat dissipation fin 13 are an integrated aluminum profile structure or a copper profile structure. This not only facilitates manufacturing, but also has a better heat dissipation effect, which helps to further improve the reliability and applicability of the radiator 10.

[0054] The connecting assembly 2 is used to connect and fix with the circuit board 20, so that the heat conducting plate 12 contacts with the surface of the electronic component 4 and dissipates heat from the electronic component 4. The connecting member 21 can be in the shape of a long strip, and is used to pass through the connecting hole 111 and the circuit board 20 in sequence, so as to realize the installation and fixation of the heat sink 10 and the circuit board 20. Figure 3 , Figure 3Schematic diagram of the overall structure of a connector provided in one embodiment of the present application; the connector 21 has a cover portion 212 and an extension portion, the extension portion is connected to a side surface of the cover portion 212, and extends in a long strip in a direction away from the cover portion 212. The connector 21 can specifically be a screw or a pin. The elastic member 22 can be elastically deformed under the action of an external force; it can specifically be a spring or a coil spring. The clamping member 23 is used to clamp and fix the connector 21 to the base plate 11, so that the connector 21, the elastic member 22 and the heat dissipation body 1 form a whole.

[0055] It should be noted that the transverse dimension refers to the dimension along the axial direction Y perpendicular to the connecting member 21. The maximum transverse dimension of the clamping member 23 refers to the distance between the two farthest points on the clamping member 23. The maximum aperture of the connecting hole 111 refers to the distance between the two farthest points on the hole wall of the connecting hole 111.

[0056] As described above, by providing at least one connecting component 2, the heat sink 10 can connect the heat dissipation body 1 with the circuit board 20 through the at least one connecting component 2, so as to dissipate heat from the circuit board 20. At the same time, by making each connecting component 2 include a connecting member 21 and an elastic member 22, and by providing the elastic member 22 between the first surface of the heat dissipation body 1 and the connecting member 21 along the extension direction of the connecting member 21; in this way, when the connecting member 21 is fixed to the circuit board 20, the elastic member 22 can be in an elastically compressed state under the action of the connecting member 21 and the heat dissipation body 1, so that when the second surface of the heat dissipation body 1 contacts the electronic components 4 in the circuit board 20, the heat dissipation body 1 can apply a pressing force to the electronic components 4 under the elastic force of the elastic member 22, so as to ensure that the two are in close contact and the pressing force is relatively uniform. Moreover, since the elastic force of the elastic member 22 can be adjusted according to the actual contact position between the heat dissipation body 1 and the electronic component 4, there is no requirement for the installation error of the electronic component 4. The heat dissipation body 1 will not damage the electronic component 4 due to the large installation error of the electronic component 4. Therefore, the heat sink 10 can use thermal conductive silicone grease to improve the thermal conductivity efficiency. In addition, by making each connecting component 2 also include a snap connector 23, the snap connector 23 is connected to the corresponding connecting component 21 and is located on the side where the second surface of the heat dissipation body 1 is located, and the maximum lateral dimension of the snap connector 23 is greater than the maximum aperture of the connecting hole 111; in this way, the connecting component 21 and the elastic component 22 can be fixed to the heat dissipation body 1 by using the snap connector 23 to prevent the connecting component 21 and the elastic component 22 from falling off the heat dissipation body 1, and then combined into a whole; in this way, during the assembly process of the integral heat sink 10 and the circuit board 20, each connecting component 21 of at least one connecting component 2 can first pass through the mounting hole 31 of the circuit board 20 and then be fixed; compared with the solution of assembling the heat dissipation body 1 and the connecting components 21 and the elastic components 22 of multiple connecting components 2 one by one on the circuit board 20, it is more convenient to assemble the heat sink 10 and the circuit board 20, and the assembly efficiency is higher. Furthermore, it can prevent the heat sink 10 from tilting relative to the circuit board 20 during the assembly process because some connecting components 2 have been fixed to the circuit board 20 while other connecting components 2 have not yet been connected and fixed to the circuit board 20, and the connecting components 2 that have not yet been installed cannot be accurately aligned with the mounting holes 31 on the circuit board 20, thereby saving the labor cost of multiple people working together to install the heat sink body 1 and the circuit board 20.

[0057] In one embodiment, please refer to Figure 1 The elastic member 22 is spirally wound around the outer side of the connecting member 21 ; and the two ends of the elastic member 22 along the axial direction Y of the connecting member 21 are respectively in contact with the connecting member 21 and the first surface of the heat dissipation body 1 .

[0058] The spiral shape refers to a twisted curve shape similar to a spiral or a screw. The axial direction Y of the connector 21 is consistent with the length direction of the connector 21. The first end of the elastic member 22 along the axial direction Y of the connector 21 abuts against a surface of the cover 212 of the connector 21 facing the heat dissipation body 1, and the second end of the elastic member 22 opposite to the first end abuts against a surface of the heat dissipation body 1 facing the cover 212 of the connector 21.

[0059] Among them, before the radiator 10 is assembled with the circuit board 20, the elastic member 22 can be in a free extension state, and the two ends of the elastic member 22 along the axial direction Y of the connecting member 21 are respectively in contact with the connecting member 21 and the heat dissipation body 1, but there is no elastic force; in this way, it can be avoided that when the elastic member 22 is idle, the elastic member 22 is in a state of elastic deformation for a long time, which affects the service life of the elastic member 22.

[0060] Of course, before the radiator 10 is assembled with the circuit board 20, the elastic member 22 may also be in a compressed state, and the elastic member 22 has a relatively small elastic restoring force; in this way, the heat dissipation body 1 and the clip 23 can be driven to fit tightly under the action of the elastic restoring force, thereby reducing the risk of the clip 23 falling off.

[0061] In the above solution, the elastic member 22 is spirally wound around the outside of the connecting member 21; compared with the solution in which the elastic member 22 and the extension portion are arranged side by side, the risk of the elastic member 22 falling off the connecting member 21 can be reduced. At the same time, during the assembly process of the heat sink 10 and the circuit board 20, the elastic member 22 can be elastically compressed along the axial direction Y of the connecting member 21 to drive the heat dissipation body 1 to provide an elastic pressing force to the electronic components 4 on the circuit board 20, thereby achieving uniform pressing force.

[0062] In one embodiment, please refer to Figure 3 A clamping groove 211 is formed on the outer side of the connecting member 21 , and parts of the clamping member 23 are embedded in the clamping groove 211 from both sides of the connecting member 21 .

[0063] Among them, the clamping groove 211 can extend along the circumferential direction of the connecting member 21 and be in a closed loop shape. The clamping member 23 can be E-shaped, and the two ends of the E-shaped clamping member 23 can be far away from each other. When it is necessary to embed the clamping member 23 into the clamping groove 211 to fix it with the connecting member 21, the two ends of the E-shaped clamping member 23 can be far away from each other to embed the clamping groove 211 from both sides of the connecting member 21 along its radial direction. After the clamping member 23 is embedded in the clamping groove 211, the two ends of the clamping member 23 automatically return to the initial position, that is, return to a state close to each other, so as to be clamped in the clamping groove 211, so as to prevent the connecting member 21 from falling from the first surface of the heat dissipation body 1 from the connecting hole 111. Specifically, the clamping member 23 can be an E-shaped retaining spring.

[0064] The above solution can not only fix the connector 21 to the heat dissipation body 1 through the clamping member 23, but also embed the clamping grooves 211 from both sides, which has a simple structure and is easy to assemble, disassemble and maintain.

[0065] In one embodiment, the connecting member 21 includes a first extension portion 213 and a second extension portion 214 that are interconnected along its axial direction Y; the orthographic projection of the second extension portion 214 along its axial direction Y falls within the first extension portion 213; and the snap-in groove 211 is specifically formed at a position of the first extension portion 213 close to the second extension portion 214.

[0066] The first extension portion 213 and the second extension portion 214 are both in the shape of a strip, such as a cylinder. The second extension portion 214 is located on the side of the first extension portion 213 away from the cover portion 212, and is used to pass through the circuit board 20 and be fixed thereto. The clamping groove 211 is an annular groove opened on the outer side wall of the first extension portion 213.

[0067] In the above scheme, a step is formed at the connection between the first extension portion 213 and the second extension portion 214. In this way, during the assembly process of the heat sink 10 and the circuit board 20, the second extension portion 214 can pass through the circuit board 20 to be fixed to the circuit board 20, and the first extension portion 213 is overlapped on the surface of the circuit board 20 to stop the connecting member 21 from moving further downward relative to the circuit board 20; in this way, it can be ensured that the downward pressing distance of the elastic member 22 of each connecting component 2 is the same, that is, each connecting component 2 has the same elastic force after being assembled with the circuit board 20, so as to apply a uniform clamping force to the circuit board 20, so that the heat sink 10 is in good contact with the electronic components 4 on the circuit board 20, and the heat dissipation effect is better.

[0068] In one embodiment, an outer side surface of an end of the second extending portion 214 facing away from the first extending portion 213 has an external thread.

[0069] The above scheme can fix the heat sink 10 and the circuit board 20 by screwing, which is convenient for installation and removal of the heat sink 10 and the circuit board 20 and easy to clean; and can prevent thermal expansion and contraction from affecting the connection between the heat sink 10 and the circuit board 20.

[0070] In one embodiment, in combination Figure 1 and Figure 2a There are multiple connection components 2, and the multiple connection components 2 are evenly distributed along the circumferential direction of the heat dissipation body 1.

[0071] The specific structure of each connection component 2 is the same. The number of connection components 2 can be four, the bottom plate 11 can be rectangular, and each of the four ends of the bottom plate 11 is provided with a connection hole 111, and a connection component 2 is correspondingly arranged in each connection hole 111. Uniform distribution can mean that each end of the bottom plate 11 is provided with a connection component 2; or it can mean that the connection components 2 are evenly distributed along the circumferential direction of the heat dissipation body 1.

[0072] The above scheme can ensure that after the heat sink 10 and the circuit board 20 are assembled, the heat dissipation body 1 of the heat sink 10 can be in close contact with the electronic components 4 on the circuit board 20 at all positions along its circumferential direction, so as to improve the heat dissipation effect and ensure good heat dissipation.

[0073] The specific assembly process of the above-mentioned radiator 10 is as follows: the elastic member 22 is sleeved on the connecting member 21; then the connecting member 21 is passed through the connecting hole 111 from the first surface of the heat dissipation body 1; thereafter, the clamping member 23 is clamped into the clamping groove 211 from both sides of the clamping groove 211 to assemble and form the above-mentioned radiator 10.

[0074] In one embodiment, see Figures 4 to 7 , Figure 4 A schematic diagram of the overall structure of a circuit board module provided in one embodiment of the present application; Figures 5 to 7 ,for Figure 4 The schematic diagrams of disassembly of the circuit board module shown are at different viewing angles; a circuit board module 100 is provided, and the circuit board module 100 includes the heat sink 10 and the circuit board 20 involved in the above embodiment.

[0075] Among them, Figure 6 As shown, the circuit board 20 includes a circuit board 3 and an electronic component 4 arranged on the circuit board 3. The circuit board 3 is arranged on the side of the clamping member 23 of the heat sink 10 away from the heat sink body 1, and is connected to the connecting member 21 of the heat sink 10. The elastic member 22 of the heat sink 10 is in an elastically compressed state; the electronic component 4 is located between the circuit board 3 and the heat sink body 1, and is in contact with the heat sink body 1.

[0076] Among them, a conductive circuit is formed on the circuit board 3. The electronic component 4 is arranged on the circuit board 3 and is electrically connected to the conductive circuit. The electronic component 4 can be a chip, a resistor, a diode, etc. The heat sink 10 is arranged on the side of the electronic component 4 away from the circuit board 3, and contacts with the surface of the side of the electronic component 4 away from the circuit board 3, and is used to dissipate heat for the electronic component 4.

[0077] In the above scheme, a compressed elastic member 22 is arranged between the heat dissipation body 1 and the connecting member 21. In this way, the heat dissipation body 1 can be always in a downwardly compressed state by virtue of the rebound force of the elastic member 22, and the flatness requirement of the electronic component 4 can be met within 0.15mm. In this way, the heat sink 10 can always be close to the upper surface of the electronic component 4, so that the heat conducting plate 12 can be evenly compressed and evenly distributed between the heat sink 10 and the electronic component 4, ensuring the close contact between the heat sink 10 and the electronic component 4, maximizing the heat dissipation area, and achieving a good heat dissipation effect. In other words, a compressed elastic member 22 is arranged between the heat dissipation body 1 and the connecting member 21. In the process of tightening the fixing member 6 and the connecting member 21, the elastic force of the elastic member 22 can be adjusted, so that the heat dissipation body 1 applies a pressing force to the electronic component 4 under the elastic force of the elastic member 22, the electronic component 4 is always compressed and the pressing force is uniform, and the contact between the heat sink 10 and the electronic component 4 is good. Moreover, since the elastic force of the elastic member 22 can be adjusted according to the actual contact position between the heat dissipation body 1 and the electronic component 4, there is no requirement for the installation error of the electronic component 4. The heat dissipation body 1 will not damage the electronic component 4 due to the large installation error of the electronic component 4. Therefore, the heat conduction plate 12 of the radiator 10 can be made of thermal conductive silicone grease, which has a better heat dissipation effect and ensures the reliability of heat dissipation.

[0078] In one embodiment, Figure 6 As shown, a mounting hole 31 is opened on the circuit board 3; the maximum lateral dimension of the first extension portion 213 of the heat sink 10 is larger than the maximum aperture of the mounting hole 31; the second extension portion 214 of the heat sink 10 passes through the mounting hole 31 and extends to the side of the circuit board 3 away from the heat dissipation body 1 to be connected to the circuit board 3.

[0079] Among them, the first extension portion 213 and the second extension portion 214 can be a columnar body, such as a cylinder. The maximum transverse dimension of the first extension portion 213 refers to the distance between the two farthest points on the first extension portion 213. The maximum aperture of the mounting hole 31 refers to the distance between the two farthest points on the hole wall of the mounting hole 31. Specifically, when the first extension portion 213 is a cylinder, the maximum transverse dimension of the first extension portion 213 is the diameter of the cylinder. When the first extension portion 213 is an irregular columnar body, the maximum transverse dimension of the first extension portion 213 is the maximum radial dimension passing through the central axis of the columnar body. When the mounting hole 31 is a circular hole, the maximum aperture of the mounting hole 31 is the diameter of the corresponding circle; when the mounting hole 31 is an irregular hole, the maximum aperture of the mounting hole 31 is the maximum radial dimension of the corresponding figure passing through the central axis of the mounting hole 31.

[0080] The above scheme can make the first extension part 213 abut against the surface of the circuit board 3 to limit the downward movement distance of the connection member 21 of the heat sink 10, thereby ensuring that the downward pressing distance of the elastic member 22 of each connection component 2 is the same, that is, each connection component 2 has the same elastic force after being assembled with the circuit board 20, so as to apply a uniform pressing force to the circuit board 20, thereby avoiding that after each connection component 2 is fixed to the circuit board 20 by the fixing member 6, each connection component 2 applies different forces to the circuit board 3, resulting in bending of the circuit board 3, or due to inconsistent tightening torque with the circuit board 3, the heat dissipation body 1 and the electronic components 4 are too loose, and the electronic components 4 and the circuit board 3 are damaged if they are too tight. At the same time, a clamping member 23 and a side wall forming a clamping groove 211 are provided between the circuit board 3 and the heat dissipation body 1, thereby avoiding that there is no supporting structure between the circuit board 3 and the heat dissipation body 1, thereby damaging the electronic components 4 and the circuit board 3.

[0081] In one embodiment, see Figure 8 , Figure 8 This is a schematic diagram of the disassembled structure of a circuit board module provided in another embodiment of the present application. The circuit board module 100 further includes a reinforcing member 5, which is disposed on a surface of the circuit board 3 facing away from the heat sink 10 and is connected to each connecting component 2 of the heat sink 10; wherein the orthographic projection of the first area formed by the connecting component 2 of the heat sink 10 on the circuit board 3 falls within the orthographic projection of the second area formed by the reinforcing member 5 on the circuit board 3.

[0082] The reinforcement member 5 may be a metal member, such as a metal frame or a metal plate. The reinforcement member 5 is relatively strong and is not easy to bend. The reinforcement member 5 is provided with an assembly hole 51 at a position corresponding to the mounting hole 31. The connection member 21 of the connection component 2 further passes through the assembly hole 51, so as to fix the reinforcement member 5 to the circuit board 20 while fixing the heat dissipation body 1 to the circuit board 20. The first area formed by the connection component 2 refers to the area formed by the connection line of each adjacent two connection components 2 on the heat sink 10; for example, the first area formed by the connection component 2 is the area formed by the connection line of each adjacent two connection components 2 on the heat sink 10; for example, the first area formed by the connection component 2 is the area formed by the connection component 2 ... of each adjacent two connection components 2 on the heat sink 10; for example, the first area formed by the connection component 2 of each adjacent two connection components 2 on the heat sink 10; for example, the first area formed by the connection component 2 of each adjacent two connection components 2 on the heat sink 1 Figure 4 There are four connecting components 2, and the four connecting components 2 are respectively arranged at the positions where the four ends of the bottom plate 11 are located, then the first area is Figure 4 The second area formed by the reinforcement member 5 refers to the area formed by the outermost edge of the reinforcement member 5. Figure 8 Taking the reinforcement member 5 as an example of a hollow frame structure, the second area refers to Figure 8 The B area is formed by the outer edge of the middle frame.

[0083] The above solution can reduce the risk of bending of the circuit board 20 after the circuit board 20 is assembled with the heat sink 10. Moreover, by making the reinforcing member 5 a frame structure, consumables can be saved, and the cost and product quality can be reduced.

[0084] In one embodiment, please refer back to Figure 5 The circuit board module 100 further includes: at least one fixing member 6 and at least one elastic pad 7. One fixing member 6 corresponds to one connecting component 2 of the heat sink 10, and the fixing member 6 and the corresponding connecting member 21 extend to the portion of the circuit board 20 away from the heat dissipation body 1 to connect, so as to fix the relative position of the circuit board 20 and the heat dissipation body 1. One elastic pad 7 corresponds to one fixing member 6, and the elastic pad 7 is arranged between the fixing member 6 and the circuit board 20 along the axial direction Y of the connecting member 21.

[0085] Among them, a fixing member 6 is connected to a connecting member 21, and the fixing member 6 can be a nut that matches the thread of the connecting member 21. When the circuit board module 100 does not include the reinforcing member 5, the reinforcing member 5 is connected to the connecting member 21. Figure 4 and Figure 5 The fixing member 6 is screwed onto the connecting member 21 and abuts against the side surface of the elastic pad 7 facing away from the heat dissipation body 1. At this time, the side surface of the first extension portion 213 facing the circuit board 3 is in contact with the side surface of the circuit board 3 facing the heat dissipation body 1. Figure 8 When the circuit board module 100 includes a reinforcing member 5 , the elastic pad 7 can be disposed between the reinforcing member 5 and the fixing member 6 . The fixing member 6 is screwed onto the connecting member 21 and abuts against a surface of the elastic pad 7 on one side facing away from the reinforcing member 5 .

[0086] The elastic pad 7 may be annular and sleeved on the outer side of the connecting member 21. The elastic pad 7 may include a flat pad 71 and / or an elastic pad 72.

[0087] The above solution can not only fix the heat sink 10 and the circuit board 20, but also reduce the risk of damaging the circuit board 20 due to over-tightening of the fixing member 6 and the connecting member 21 by arranging the elastic member 22 between the fixing member 6 and the circuit board 20.

[0088] The specific assembly process of the above-mentioned circuit board module 100 is as follows: align the connectors 21 of the four connecting components 2 of the heat sink 10 with the mounting holes 31 on the circuit board 3 respectively, and insert them into the corresponding mounting holes 31; then install the flat washer 71, the spring washer 72 and the nut in sequence, and tighten the nut with the same torque to assemble the heat sink 10 and the circuit board 20 together.

[0089] In one embodiment, see Fig. 9 , Fig. 9 A simplified structural diagram of an electronic device provided in one embodiment of the present application. An electronic device is provided, which may be a mobile phone, a computer, a television, etc. The electronic device includes a circuit board module 100 provided in any of the above embodiments, and the specific structure and function of the circuit board module 100 can be found in the above description.

[0090] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A heat sink, applied to a circuit board, characterized in that: The radiator comprises: A heat dissipation body having a first surface and a second surface opposite to each other, and a connection hole penetrating through the first surface and the second surface is formed on the heat dissipation body; At least one connecting component, each of which includes a connecting piece, an elastic piece and a clamping piece; wherein the connecting piece passes through the connecting hole from the first surface of the heat dissipation body and extends to the side where the second surface is located; the elastic piece is arranged between the first surface of the heat dissipation body and the connecting piece along the extension direction of the connecting piece; the clamping piece is connected to the connecting piece and is located on the side where the second surface of the heat dissipation body is located, and the maximum lateral dimension of the clamping piece is greater than the maximum aperture of the connecting hole.

2. The heat sink according to claim 1, characterized in that: The elastic member is spirally wound around the outer side of the connecting member; and two ends of the elastic member along the axial direction of the connecting member are respectively in contact with the connecting member and the first surface of the heat dissipation body.

3. The heat sink according to claim 1, characterized in that: A clamping groove is formed on the outer side of the connecting piece, and parts of the clamping piece are embedded in the clamping groove from both sides of the connecting piece.

4. The heat sink according to claim 3, characterized in that: The connecting member includes a first extension portion and a second extension portion connected to each other along its axial direction; the positive projection of the second extension portion along its axial direction falls within the first extension portion; and the snap-in groove is formed at a position of the first extension portion close to the second extension portion.

5. The heat sink according to claim 4, characterized in that: An outer side surface of an end of the second extending portion facing away from the first extending portion has an external thread.

6. The radiator according to any one of claims 1 to 5, characterized in that: There are multiple connection components, and the multiple connection components are evenly distributed along the circumferential direction of the heat dissipation body.

7. A circuit board module, characterized in that: include: A radiator, which is a radiator as claimed in any one of claims 1 to 6; A circuit board, comprising a circuit board and electronic components arranged on the circuit board; Wherein, the circuit board is arranged on the side of the radiator's clamping part away from the heat dissipation body, and is connected to the connecting part of the radiator; wherein the elastic part of the radiator is in an elastic compression state; the electronic components are located between the circuit board and the heat dissipation body, and are in contact with the heat dissipation body.

8. The circuit board module according to claim 7, characterized in that: The circuit board is provided with a mounting hole; Among them, the maximum lateral dimension of the first extension portion of the heat sink is greater than the maximum aperture of the mounting hole; the second extension portion of the heat sink passes through the mounting hole and extends to the side of the circuit board away from the heat dissipation body to be connected to the circuit board.

9. The circuit board module according to claim 7, characterized in that: Also includes: A reinforcement member is arranged on a side surface of the circuit board facing away from the heat sink and connected to each connecting component of the heat sink; wherein the orthographic projection of a first area formed by the connecting components of the heat sink on the circuit board falls within the orthographic projection of a second area formed by the reinforcement member on the circuit board.

10. The circuit board module according to claim 7, characterized in that: Also includes: At least one fixing member, one of the fixing members corresponds to a connecting component of the heat sink, the fixing member and the corresponding connecting member extend to connect to a portion of the circuit board away from the heat sink body, so as to fix the relative position of the circuit board and the heat sink body; At least one elastic pad, one elastic pad corresponds to one fixing member, and the elastic pad is arranged between the fixing member and the circuit board along the axial direction of the connecting member.

11. An electronic device, characterized in that: Comprising a circuit board module as described in any one of claims 7-10.

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