Image signal generator

Abstract

The utility model discloses an image signal generator, and belongs to the field of image signal generators. The image signal generator comprises a box body, a plurality of PCBs and a heat dissipation assembly. The plurality of PCBs and the heat dissipation assembly are located in the inner cavity of the box body, and each PCB is provided with a component; the heat dissipation assembly comprises a plurality of heat pipes capable of being bent and deformed, a radiator and a fan, one end of each heat pipe is connected with the radiator, cooling liquid is arranged in each heat pipe, and the outer wall of the other end of each heat pipe is used for being connected with a corresponding component; an air inlet of the radiator and an air outlet of the fan are oppositely arranged, and the radiator and the fan are located among the PCBs. According to the image signal generator provided by the embodiment of the utility model, the other end of each heat pipe can be correspondingly bent or flattened and then connected with a corresponding component, so that the image signal generator is suitable for heat dissipation of a plurality of components of image signal generators of different models, and the influence of the arrangement positions of the components is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of image signal generators, and in particular relates to an image signal generator. Background Art

[0002] In the field of display panel production, it is necessary to perform a dot screen test on the display panel through a pattern generator (PG for short). The dot screen test stage is very important for the quality control of the display panel. In this stage, it can be detected whether the display panel has bad points, such as bright spots or dark spots. As the pattern generator develops towards miniaturization and intelligence, the electronic components (such as chips) inside it develop towards high power and high density, and the heat flux density of the components is greatly increased. If the heat cannot be released in a timely and effective manner, it will affect the working performance, thereby reducing the reliability and stability of the system, and even damaging the equipment.

[0003] In the related art, components in the image signal generator are cooled by a heat sink to control the temperature of the components. However, the locations (height or angle, etc.) of the components in different types of image signal generators are different. The existing heat sink is relatively fixed in its installation location due to its size and cannot adapt to the heat dissipation of multiple components in different types of image signal generators. Utility Model Content

[0004] In view of the above defects or improvement needs of the prior art, the utility model provides an image signal generator, the purpose of which is to connect the other end of each heat pipe to the corresponding component after corresponding bending or flattening, so as to adapt to the heat dissipation of multiple components of image signal generators of different models and avoid being affected by the setting position of the components.

[0005] The utility model provides an image signal generator, which comprises a box, a plurality of PCB boards and a heat dissipation component;

[0006] The plurality of PCB boards and the heat dissipation assembly are all located in the inner cavity of the box, and each of the PCB boards has components;

[0007] The heat dissipation assembly includes a plurality of bendable and deformable heat pipes, a radiator and a fan, one end of each of the heat pipes is connected to the radiator, each of the heat pipes is provided with a coolant, and the outer wall of the other end of each of the heat pipes is used to be connected to the corresponding components; the air inlet of the radiator is arranged opposite to the air outlet of the fan, and the radiator and the fan are located between the plurality of PCB boards.

[0008] Optionally, the heat dissipation assembly further includes a fixing plate, and the heat sink and the fan are both located on the fixing plate.

[0009] Optionally, the fixing plate includes a first plate body and a second plate body, the first plate body and the second plate body are vertically connected, the first plate body is fixed on the inner wall of the box body, and the radiator and the fan are both located on the second plate body.

[0010] Optionally, a plurality of connecting bolts are inserted on the fixing plate to connect the fan, and shock-absorbing cotton is sandwiched between the fan and the fixing plate.

[0011] Optionally, the box body includes a box cover and a box shell, and the box cover is detachably inserted into an opening of the box shell to form the inner cavity.

[0012] Optionally, the box cover includes a top plate and a first side plate, the top plate and the first side plate are vertically connected, the box shell includes a bottom plate and a plurality of second side plates, each of the second side plates is vertically connected to the bottom plate, and the top plate and the bottom plate are spaced in parallel.

[0013] Optionally, a plurality of the PCB boards are arranged in parallel and at intervals, and a plurality of slide grooves arranged at intervals are provided on the inner wall of the box shell, and each of the PCB boards is inserted into a corresponding slide groove.

[0014] Optionally, the heat dissipation assembly further includes a plurality of heat conducting plates, the outer wall of the other end of each heat pipe is connected to the first surface of the corresponding heat conducting plate, and the second surface of each heat conducting plate is fixed on the corresponding component.

[0015] Optionally, a heat conducting medium is provided on the second surface of each of the heat conducting plates.

[0016] Optionally, the box body has a plurality of heat dissipation holes arranged at intervals.

[0017] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0018] In general, compared with the prior art, the above technical solutions conceived by the utility model have the following beneficial effects:

[0019] For an image signal generator provided by the embodiment of the utility model, each PCB board can realize the installation and conduction of corresponding components, thereby realizing the signal input and output of each component through the PCB board. In addition, the box body realizes sealing protection for the PCB board and the heat dissipation component.

[0020] Furthermore, since one end of each heat pipe is connected to the radiator, each heat pipe is provided with a coolant, and the other end of each heat pipe is connected to the corresponding component, the other end of each heat pipe can be connected to the corresponding component by bending or flattening according to the position of the component in the corresponding image signal generator model, so as to adapt to the heat dissipation of components of different models of image signal generators and avoid being affected by the position of the component setting. When the component is heated, the other end (hot end) of the heat pipe is heated, and the coolant absorbs the heat of the component at the other end of the heat pipe and vaporizes to form hot steam, and flows to one end (cold end) of the heat pipe through the pressure difference. One end of the heat pipe is fixed on the radiator, and after the radiator is cooled by the fan, the heat can be dissipated to one end of the heat pipe through the radiator, and the hot steam will condense to form liquid and flow to the other end of the heat pipe, so that efficient heat dissipation is achieved in this cycle. In addition, since the radiator and the fan are located between multiple PCB boards, the wiring length of the heat pipe can be reduced, and the convenient installation of the heat pipe can be realized.

[0021] That is to say, an image signal generator provided by an embodiment of the utility model can connect the other end of each heat pipe to the corresponding component by corresponding bending or flattening, thereby adapting to the heat dissipation of multiple components of image signal generators of different models and avoiding being affected by the setting position of the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of an image signal generator provided by an embodiment of the utility model;

[0023] Figure 2 It is an exploded schematic diagram of an image signal generator provided by an embodiment of the utility model;

[0024] Figure 3 It is a structural schematic diagram of a heat dissipation assembly provided by an embodiment of the utility model;

[0025] Figure 4 It is an exploded schematic diagram of the heat dissipation assembly provided in an embodiment of the utility model.

[0026] In all the drawings, the same reference numerals represent the same technical features, specifically:

[0027] 1. Box body; 11. Box cover; 111. Top plate; 112. First side plate; 12. Box shell; 121. Bottom plate; 122. Second side plate; 13. Heat dissipation holes; 2. PCB board; 21. Components; 3. Heat dissipation assembly; 31. Heat pipe; 32. Radiator; 33. Fan; 34. Fixing plate; 341. First plate body; 342. Second plate body; 35. Heat conduction plate; 36. Shock-absorbing cotton. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] Example:

[0034] Figure 1 is a structural schematic diagram of an image signal generator provided by an embodiment of the utility model, Figure 2 This is an exploded schematic diagram of an image signal generator provided by an embodiment of the utility model, combined with Figure 1 and Figure 2 As shown, the image signal generator includes a box body 1, a plurality of PCB boards 2 and a heat dissipation component 3.

[0035] A plurality of PCB boards 2 and a heat dissipation assembly 3 are all located in the inner cavity of the box body 1 , and each PCB board 2 has a component 21 .

[0036] Figure 3 is a schematic diagram of the structure of the heat dissipation assembly provided by an embodiment of the utility model, Figure 4 is an exploded schematic diagram of a heat dissipation assembly provided by an embodiment of the utility model, combined with Figure 3 and Figure 4 As shown, the heat dissipation assembly 3 includes a plurality of bendable and deformable heat pipes 31, a radiator 32 and a fan 33, one end of each heat pipe is connected to the radiator, a coolant is arranged in each heat pipe, and the outer wall of the other end of each heat pipe is used to connect with the corresponding components; the air inlet of the radiator and the air outlet of the fan are arranged opposite to each other, and the radiator and the fan are located between a plurality of PCB boards.

[0037] For an image signal generator provided by the embodiment of the utility model, each PCB board 2 can realize the installation and conduction of the corresponding components 21, so as to realize the signal input and output of each component 21 through the PCB board 2. In addition, the box body 1 realizes sealing protection for the PCB board 2 and the heat dissipation component 3.

[0038] Furthermore, since one end of each heat pipe 31 is connected to the radiator 32, each heat pipe 31 is provided with a cooling liquid, and the other end of each heat pipe 31 is connected to the corresponding component 21, the other end of each heat pipe 31 can be connected to the corresponding component 21 after being bent or flattened according to the position of the component 21 in the corresponding image signal generator model, thereby adapting to the heat dissipation of the components 21 of different models of image signal generators and avoiding the influence of the setting position of the component 21. When the component 21 is heated, the other end (hot end) of the heat pipe 31 is heated, and the cooling liquid absorbs the heat of the component 21 at the other end of the heat pipe 31 and vaporizes to form hot steam, and flows to one end (cold end) of the heat pipe 31 through the pressure difference. One end of the heat pipe 31 is fixed on the radiator 32, and after the radiator 32 is cooled by the fan 33, the heat dissipation of one end of the heat pipe 31 can be realized through the radiator 32, and the hot steam will condense to form liquid and flow to the other end of the heat pipe 31, so that the cycle can achieve efficient heat dissipation. In addition, since the heat sink 32 and the fan 33 are located between the multiple PCB boards 2, the wiring length of the heat pipe 31 can be reduced, and the heat pipe 31 can be conveniently installed.

[0039] That is to say, an image signal generator provided by an embodiment of the utility model can connect the other end of each heat pipe 31 to the corresponding component 21 by corresponding bending or flattening, so as to adapt to the heat dissipation of multiple components 21 of image signal generators of different models and avoid being affected by the setting position of the component 21.

[0040] It is easy to understand that since the heat dissipation component 3 is a phase change heat dissipation method with the highest efficiency in convection heat transfer, its thermal conductivity exceeds that of any known metal. It has high thermal conductivity and low diffusion thermal resistance, and can quickly transfer and dissipate heat to avoid heat accumulation in the components 21 and damage to the components. In addition, the heat dissipation component 3 can achieve heat dissipation of multiple components 21 at multiple different positions through the same heat sink 32 and fan 33, without the need to set up multiple heat sinks 32 and fans 33.

[0041] In addition, since the heat pipe 31 is small in size, the other end of the heat pipe 31 can be adaptively bent and deformed according to the position of the component 21, so that the installation position of the radiator 32 and the fan 33 can be fixed, that is, the position in different models of image signal generators is fixed without adjusting the position, and it is not affected by other components in the box 1 or the setting position of the component 21, and thus it is suitable for the problem that the space around the component 21 is small and the radiator cannot be installed.

[0042] It should be noted that the heat pipe 31 is a hollow structure, and the volume of the coolant is much smaller than the volume in the heat pipe 31, which facilitates the phase change circulation of the coolant.

[0043] Exemplarily, the heat sink 32 may be a heat sink fin, thereby reducing the volume and weight of the heat sink assembly 3. In addition, the heat pipe 31 may be made of a copper alloy, which has a high heat transfer efficiency.

[0044] Exemplarily, the box body 1 has a plurality of heat dissipation holes 13 arranged at intervals, so as to achieve air circulation inside and outside the box body 1 and further facilitate heat dissipation of the components 21 .

[0045] In one implementation of the utility model, multiple components 21 of the upper PCB board 2 are located on the bottom surface of the PCB board 2, and multiple components 21 of the lower PCB board 2 are located on the top surface of the PCB board 2 (that is, the components 21 on the two PCB boards 2 are arranged relative to each other and both face the heat dissipation component 3), thereby further reducing the routing length of the heat pipe 31.

[0046] It should be noted that the hot end of the heat pipe 31 can extend horizontally or vertically, or pass through the PCB board 2 through the avoidance hole. In addition, one heat pipe 31 can also dissipate heat for two adjacent components 21 at the same time.

[0047] In this embodiment, the box body 1 includes a box cover 11 and a box shell 12. The box cover 11 is detachably inserted into an opening of the box shell 12 to form an inner cavity.

[0048] In the above embodiment, by providing the box body 1 with a detachably connected box cover 11 and box shell 12, it is convenient to install and maintain multiple PCB boards 2 and components 21. In addition, when it is necessary to adjust the model of the image signal generator, that is, to adjust multiple PCBs and corresponding components 21, a new PCB board 2 can be replaced, and the heat pipe 31 can be bent to the corresponding component 21, thereby realizing the universal use of the box body 1 and the heat dissipation assembly 3.

[0049] Furthermore, the box cover 11 includes a top plate 111 and a first side plate 112, the top plate 111 and the first side plate 112 are vertically connected, the box shell 12 includes a bottom plate 121 and multiple second side plates 122, each second side plate 122 is vertically connected to the bottom plate 121, and the top plate 111 and the bottom plate 121 are parallel and spaced apart.

[0050] In the above embodiment, the area of ​​the box cover 11 can be increased by fixing the top plate 111 and the first side plate 112 , thereby increasing the opening area of ​​the box shell 12 , making it easier to take the PCB board 2 out of the opening.

[0051] Exemplarily, the number of the second side plates 122 may be three, forming a U-shape. In addition, the heat dissipation holes 13 are located on the second side plates 122 .

[0052] In this embodiment, a plurality of PCB boards 2 are arranged in parallel and at intervals, and a plurality of spaced-apart slide grooves are provided on the inner wall of the box shell 12, and each PCB board 2 is inserted into a corresponding slide groove, and the slide groove facilitates the disassembly and assembly of the PCB board 2, thereby facilitating the maintenance of each component 21.

[0053] Continue to see Figure 3 and Figure 4 The heat dissipation assembly 3 further includes a fixing plate 34, on which the radiator 32 and the fan 33 are both located. The fixing plate 34 can realize the assembly of the radiator 32 and the fan 33, thereby facilitating the installation of the heat dissipation assembly 3.

[0054] Furthermore, the fixing plate 34 includes a first plate body 341 and a second plate body 342 , the first plate body 341 and the second plate body 342 are vertically connected, the first plate body 341 is fixed on the inner wall of the box body 1 , and the radiator 32 and the fan 33 are both located on the second plate body 342 .

[0055] In the above embodiment, the first plate 341 serves to connect the box body 1 , thereby realizing the installation of the entire heat dissipation assembly 3 , while the second plate 342 serves to support the radiator 32 and the fan 33 .

[0056] Exemplarily, the second plate body 342 is a U-shaped structure.

[0057] In addition, a plurality of connecting bolts are inserted on the fixing plate 34 to connect the fan 33, and a damping cotton 36 is sandwiched between the fan 33 and the fixing plate 34. The connecting bolts lock the fan 33, and the damping cotton 36 can reduce the vibration and noise generated when the fan 33 is running.

[0058] In addition, the fan 33 and the radiator 32 are also sandwiched with shock-absorbing cotton, which fills the gap between the two, so that the air output of the fan 33 blows through the fins of the radiator 32 as much as possible.

[0059] In one implementation of the present invention, the heat dissipation assembly 3 also includes multiple heat conducting plates 35 , the outer wall of the other end of each heat pipe 31 is connected to the first surface of the corresponding heat conducting plate 35 , and the second surface of each heat conducting plate 35 is fixed on the corresponding component 21 .

[0060] In the above embodiment, the heat conducting plate 35 has good thermal conductivity. The heat pipe 31 and the component 21 are transitionally connected by the heat conducting plate 35 , which can increase the contact area with the component 21 and improve the heat dissipation efficiency of the component 21 .

[0061] Furthermore, a heat conducting medium is disposed on the second surface of each heat conducting plate 35. The heat conducting medium includes but is not limited to heat conducting silicone grease, heat conducting gel, etc., which can reduce contact thermal resistance and facilitate heat transfer from the component 21 to the heat pipe 31.

[0062] In addition, the heat conducting plate 35 is provided with a plurality of installation holes arranged at intervals, and a installation bolt is inserted into each installation hole, so that a reliable connection between the heat conducting plate 35 and the component 21 is achieved through the installation bolt.

[0063] Exemplarily, two ends of each heat pipe 31 are respectively connected by welding to the heat sink 32 and the corresponding heat conducting plate 35. The heat conducting plate 35 is made of copper alloy.

[0064] It should be noted that the size and thickness of the heat conducting plate 35 are adapted to the corresponding components 21 .

[0065] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An image signal generator, characterized in that: The image signal generator comprises a box, a plurality of PCB boards and a heat dissipation component; The plurality of PCB boards and the heat dissipation assembly are all located in the inner cavity of the box, and each of the PCB boards has components; The heat dissipation assembly includes a plurality of bendable and deformable heat pipes, a radiator and a fan, one end of each of the heat pipes is connected to the radiator, each of the heat pipes is provided with a coolant, and the outer wall of the other end of each of the heat pipes is used to be connected to the corresponding components; the air inlet of the radiator is arranged opposite to the air outlet of the fan, and the radiator and the fan are located between the plurality of PCB boards.

2. An image signal generator according to claim 1, characterized in that: The heat dissipation assembly also includes a fixing plate, and the heat sink and the fan are both located on the fixing plate.

3. An image signal generator according to claim 2, characterized in that: The fixing plate includes a first plate body and a second plate body, the first plate body and the second plate body are vertically connected, the first plate body is fixed on the inner wall of the box body, and the radiator and the fan are both located on the second plate body.

4. The image signal generator according to claim 2, characterized in that: A plurality of connecting bolts are inserted on the fixing plate to connect the fan, and shock-absorbing cotton is sandwiched between the fan and the fixing plate.

5. The image signal generator according to claim 1, characterized in that: The box body comprises a box cover and a box shell, wherein the box cover is detachably inserted into the opening of the box shell to form the inner cavity.

6. The image signal generator according to claim 5, characterized in that: The box cover includes a top plate and a first side plate, the top plate and the first side plate are vertically connected, the box shell includes a bottom plate and a plurality of second side plates, each of the second side plates is vertically connected to the bottom plate, and the top plate and the bottom plate are parallel and spaced apart.

7. The image signal generator according to claim 5, characterized in that: The plurality of PCB boards are arranged in parallel and at intervals, and the inner wall of the box shell is provided with a plurality of slide grooves arranged at intervals, and each of the PCB boards is inserted in the corresponding slide groove.

8. The image signal generator according to claim 1, characterized in that: The heat dissipation assembly further includes a plurality of heat conducting plates, the outer wall of the other end of each heat pipe is connected to the first surface of the corresponding heat conducting plate, and the second surface of each heat conducting plate is fixed on the corresponding component.

9. The image signal generator according to claim 8, characterized in that: The second surface of each heat conducting plate is provided with a heat conducting medium.

10. An image signal generator according to any one of claims 1 to 9, characterized in that: The box body is provided with a plurality of heat dissipation holes arranged at intervals.

Images