Heat-conducting silica gel patch for electronic device
By composited graphene thermally conductive blocks on the thermally conductive silicone patch and fixed their position, the problem of poor heat transfer effect of existing thermally conductive silicone patches is solved, and a more efficient heat dissipation effect of electronic devices is achieved.
Patent Information
- Application Number
- CN202420879826.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-04-25
AI Technical Summary
The existing thermally conductive silicone patches have average heat transfer effect, which cannot achieve rapid and uniform heat conduction, resulting in poor heat dissipation effect of electronic devices.
A layer of graphene thermal conductivity block is combined on the surface of the thermally conductive silicone patch, which uses the high thermal conductivity of graphene to quickly transfer heat, and fixes the graphene thermal conductivity block through the design of the limiting groove and the insertion edge.
It improves thermal conductivity, ensures the heat dissipation effect of electronic devices, and can discharge heat faster and evenly.
Smart Images
Figure CN222509796U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic products, in particular to a thermally conductive silica gel patch for electronic devices. Background Art
[0002] As the functions of electronic products become more and more abundant, more and more electronic devices are used in electronic products. The use of a large number of electronic devices will generate a lot of heat. If this heat is not discharged in time, it will seriously affect the performance of electronic products. Thermal conductive silicone patches are a commonly used heat dissipation product, which conducts heat and dissipates heat by attaching to the surface of electronic devices. However, the heat transfer effect of conventional thermal conductive silicone patches is general and cannot achieve fast and uniform heat conduction.
[0003] Therefore, there is an urgent need for a thermally conductive silicone patch for electronic devices that can solve the above problems. Utility Model Content
[0004] The utility model aims to provide a thermally conductive silicone patch for electronic devices to solve the problems existing in the above-mentioned prior art.
[0005] To achieve the above purpose, the utility model provides the following solutions:
[0006] The utility model provides a thermally conductive silicone patch for electronic devices, comprising a thermally conductive silicone layer, one side of the thermally conductive silicone layer is provided with an adhesive structure, the other side of the thermally conductive silicone layer is provided with a limiting groove, and a graphene thermal conductive block is limited in the limiting groove.
[0007] Preferably, the adhesive structure comprises an adhesive layer, and a release paper layer is disposed on the outer side of the adhesive layer.
[0008] Preferably, spherical protrusions are distributed on the surface of the limiting groove.
[0009] Preferably, a fixing hole is provided on the side of the limiting groove.
[0010] Preferably, the side of the graphene heat conductive block is provided with an insert edge, and the insert edge cooperates with the fixing hole.
[0011] Preferably, wave protrusions are provided on both sides of the graphene heat conductive block.
[0012] Compared with the prior art, the utility model has achieved the following beneficial technical effects:
[0013] The utility model provides a thermally conductive silicone patch for electronic devices, comprising a thermally conductive silicone layer, one side of the thermally conductive silicone layer is provided with an adhesive structure, the other side of the thermally conductive silicone layer is provided with a limiting groove, and a graphene thermal conductive block is limited in the limiting groove; by compounding a layer of graphene thermal conductive blocks on the surface of a traditional thermally conductive silicone patch, heat can be quickly transferred, thereby improving thermal conductivity efficiency and ensuring the heat dissipation effect of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0015] Figure 1 The utility model provides a schematic diagram of the structure of a thermally conductive silicone patch for electronic devices. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0017] The utility model aims to provide a thermally conductive silicone patch for electronic devices to solve the problems existing in the prior art.
[0018] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0019] Embodiment 1:
[0020] This embodiment provides a thermally conductive silicone patch for electronic devices, such as Figure 1 As shown, it comprises a thermally conductive silicone layer 1, one side of the thermally conductive silicone layer 1 is provided with an adhesive structure 2, and the other side of the thermally conductive silicone layer 1 is provided with a limiting groove 3, and a graphene thermal conductive block 4 is limited in the limiting groove 3.
[0021] Specifically, the pasting structure 2 includes an adhesive layer 21 , and a release paper layer 22 is disposed on the outer side of the adhesive layer 21 , so that the pasting structure 2 can be directly pasted on the surface of the electronic device for use, which is more convenient to use.
[0022] Furthermore, the surface of the limiting groove 3 is distributed with spherical protrusions 31, which can better contact with the graphene heat conductive block 4, thereby improving the heat conduction effect.
[0023] Furthermore, a fixing hole 32 is provided on the side of the limiting groove 3 to facilitate the installation of the graphene heat conducting block 4.
[0024] Furthermore, an insert edge 41 is provided on the side of the graphene heat conductive block 4 , and the insert edge 41 cooperates with the fixing hole 32 , so as to fix the graphene heat conductive block 4 .
[0025] Furthermore, wave protrusions 42 are provided on both sides of the graphene heat conductive block 4, which can increase the heat transfer area and thus improve the heat conduction efficiency.
[0026] The utility model provides a thermally conductive silicone patch for electronic devices. By compounding a layer of graphene thermal conductive blocks on the surface of a traditional thermally conductive silicone patch, heat can be quickly transferred, thereby improving thermal conductivity and ensuring the heat dissipation effect of the electronic device.
[0027] The utility model uses specific examples to illustrate the principle and implementation of the utility model. The above examples are only used to help understand the method and core idea of the utility model. At the same time, for those skilled in the art, according to the idea of the utility model, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as limiting the utility model.
Claims
1. A thermally conductive silicone patch for electronic devices, characterized in that: It comprises a heat-conducting silicone layer, one side of which is provided with an adhesive structure, and the other side of which is provided with a limiting groove, in which a graphene heat-conducting block is limited; The surface of the limiting groove is distributed with spherical protrusions; A fixing hole is provided on the side of the limiting groove; The side of the graphene heat conductive block is provided with an insert edge, and the insert edge matches the fixing hole; Both sides of the graphene heat conducting block are provided with wave protrusions.
2. The thermally conductive silicone patch for electronic devices according to claim 1, characterized in that: The pasting structure comprises an adhesive layer, and a release paper layer is arranged on the outer side of the adhesive layer.