Radiator with good sealing performance

By designing a combination of multiple heat dissipation mechanisms and sealing structures, the problems of poor heat dissipation effect and insufficient sealing properties of existing radiators are solved, and the demand for efficient heat dissipation and high sealing properties of inverters are achieved, meeting the needs of today's market.

CN222509837UActive Publication Date: 2025-02-18NINGBO HAOCHENG MASCH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421207088.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-30
Publication Date
2025-02-18
Estimated Expiration
2034-05-30

AI Technical Summary

Technical Problem

The existing radiator has a single heat dissipation mechanism during use, which leads to poor heat dissipation effect, which easily leads to overheating and damage to the inverter, and lacks an integrated injection sealing structure, which makes it difficult to guarantee the sealing after installation and cannot meet the needs of today's market.

Method used

A radiator including a plurality of heat dissipation mechanisms is designed, and multiple heat dissipation paths and high sealing properties are provided through a combination of a first heat dissipation mechanism, an installation mechanism, a connecting mechanism, a second heat dissipation mechanism and a sealing mechanism. The first heat dissipation mechanism includes a heat conducting plate and a heat sink, the installation mechanism includes a mounting plate and a mounting hole, the connecting mechanism includes a connecting through groove and a limiting groove, the second heat dissipation mechanism includes a connecting groove and a connecting through hole, and the sealing mechanism includes a sealing groove and a seal pad.

Benefits of technology

Through the cooperation of multiple heat dissipation mechanisms, efficient heat dissipation of the inverter is achieved, which avoids overheating damage to the inverter, and has an integrated injection sealing structure, which meets the high sealing requirements of specific scenarios and solves the existing heat dissipation The problem of poor heat dissipation effect and insufficient sealing performance of the device.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222509837U_ABST
    Figure CN222509837U_ABST
Patent Text Reader

Abstract

The radiator with the good sealing performance comprises a first radiating mechanism, the top and the bottom of the first radiating mechanism are fixedly connected with mounting mechanisms, a connecting mechanism is arranged on the surface of the first radiating mechanism, and a second radiating mechanism is arranged on the left side of the top of the front face of the first radiating mechanism. And a sealing mechanism is arranged on the surface of the first heat dissipation mechanism. The beneficial effects of the utility model are that through the cooperation of a plurality of heat dissipation mechanisms, the inverter can be subjected to efficient heat dissipation, the inverter is prevented from being damaged by overheating, the integrated injection sealing structure is provided, the requirement of high sealing performance in a specific scene can be satisfied, some defects still exist in the use of the existing heat dissipation device, and the service life of the heat dissipation device is prolonged. The problems that only a single heat dissipation mechanism is arranged, the heat dissipation effect is poor, an inverter is prone to being damaged due to overheating, an integrated injection sealing structure is not arranged, the sealing performance of a heat dissipation device after installation is difficult to guarantee, and the requirements of the current market cannot be met are solved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a radiator with good sealing performance. Background Art

[0002] The components in the inverter have a rated operating temperature. If the inverter has poor heat dissipation performance, when the inverter continues to work, the heat of the components will continue to gather inside the cavity, and its temperature will become higher and higher. Excessive temperature will reduce the performance and life of the components, and the machine is prone to failure. Natural heat dissipation means not using any external auxiliary energy, allowing local heat-generating components to dissipate heat to the surrounding environment, thereby achieving temperature control.

[0003] However, the existing radiators still have some defects in use, such as only having a single heat dissipation mechanism, poor heat dissipation effect, easily causing overheating and damage to the inverter, and lacking an integrated injection sealing structure. The sealing of the radiator is difficult to ensure after installation, and cannot meet the needs of today's market. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and utility model name of this application to avoid blurring the purpose of this section, specification abstract and utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the above problems and / or the problems existing in the existing radiators with good sealing performance, the present utility model is proposed.

[0006] Therefore, the problem to be solved by the utility model is that the existing radiator still has some defects in use, such as only having a single heat dissipation mechanism, poor heat dissipation effect, easily causing overheating and damage to the inverter, and lacking an integrated injection sealing structure. The sealing of the radiator is difficult to guarantee after installation, and cannot meet the needs of today's market.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions: a radiator with good sealing performance, comprising a first heat dissipation mechanism, the top and bottom of the first heat dissipation mechanism are fixedly connected with a mounting mechanism, a connecting mechanism is provided on the surface of the first heat dissipation mechanism, a second heat dissipation mechanism is provided on the left side of the top of the front side of the first heat dissipation mechanism, a sealing mechanism is provided on the surface of the first heat dissipation mechanism, and the material composition of the first heat dissipation mechanism and the mounting mechanism is the same.

[0008] As a preferred solution of the heat sink with good sealing performance described in the utility model, wherein: the first heat dissipation mechanism includes a heat conducting plate, and the back side of the heat conducting plate is fixedly connected with evenly distributed heat dissipation fins.

[0009] As a preferred solution of the radiator with good sealing performance of the utility model, wherein: the mounting mechanism includes a mounting plate, the surface of the mounting plate is provided with a mounting inclined groove, and the surface of the mounting plate is provided with a mounting hole.

[0010] As a preferred solution of the heat sink with good sealing performance described in the utility model, wherein: the connecting mechanism includes a connecting through groove, and the inner wall of the connecting through groove is provided with a limiting groove.

[0011] As a preferred solution of the heat sink with good sealing performance of the utility model, wherein: the second heat dissipation mechanism includes a connecting groove, and the inner wall of the connecting groove is provided with a connecting through hole.

[0012] As a preferred solution of the heat sink with good sealing performance of the utility model, wherein: the sealing mechanism comprises a sealing groove, and the inner cavity of the sealing groove is provided with a sealing gasket.

[0013] As a preferred solution of the heat sink with good sealing performance described in the utility model, wherein: a wire groove is opened on the surface of the heat conducting plate, and connection wire holes are opened around the surface of the heat conducting plate.

[0014] As a preferred solution of the radiator with good sealing performance described in the utility model, wherein: the first heat dissipation mechanism includes a base layer, a reinforcement layer and an anti-corrosion layer, the reinforcement layer is coated on the outer surface of the base layer, the anti-corrosion layer is coated on the outer surface of the reinforcement layer, and the anti-corrosion layer includes a first protective layer and a second protective layer.

[0015] As a preferred solution of the heat sink with good sealing performance described in the utility model, the material of the base layer is aluminum material, and the material of the reinforcement layer is aluminum-silicon alloy.

[0016] As a preferred solution of the heat sink with good sealing performance of the utility model, the material of the first protective layer is a metal-based ceramic composite coating, and the material of the second protective layer is a polyurethane coating.

[0017] The beneficial effects of the utility model are as follows: through the cooperation of various heat dissipation mechanisms in the application document, the inverter can be efficiently cooled to avoid overheating and damage of the inverter, and it has an integrated injection sealing structure, which can meet the high sealing requirements of specific scenarios, and solves the problems that the existing radiators still have some defects in use, such as only having a single heat dissipation mechanism, poor heat dissipation effect, easily causing overheating and damage of the inverter, and not having an integrated injection sealing structure, and the sealing of the radiator after installation is difficult to guarantee, which cannot meet the needs of today's market. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0019] Figure 1 This is an overall three-dimensional diagram of a radiator with good sealing performance.

[0020] Figure 2 This is an overall projection of a radiator with good sealing performance.

[0021] Figure 3 Isometric view of a well-sealed radiator.

[0022] Figure 4 Schematic diagram of the material composition of the first heat dissipation mechanism of a radiator with good sealing performance.

[0023] Figure 5 Schematic diagram of the material composition of the radiator anti-corrosion layer with good sealing performance. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0027] Example 1

[0028] Reference Figures 1 to 5, is the first embodiment of the utility model, which provides a radiator with good sealing performance, including a first heat dissipation mechanism 1, the top and bottom of the first heat dissipation mechanism 1 are fixedly connected with a mounting mechanism 2, a connecting mechanism 3 is provided on the surface of the first heat dissipation mechanism 1, a second heat dissipation mechanism 4 is provided on the left side of the top of the front side of the first heat dissipation mechanism 1, a sealing mechanism 5 is provided on the surface of the first heat dissipation mechanism 1, and the material composition of the first heat dissipation mechanism 1 and the mounting mechanism 2 are the same.

[0029] Through the coordination of various heat dissipation mechanisms in this application document, the inverter can be efficiently cooled to avoid overheating and damage of the inverter. It also has an integrated injection sealing structure, which can meet the high sealing requirements of specific scenarios and solves some defects that still exist in the existing radiators during use, such as only having a single heat dissipation mechanism, poor heat dissipation effect, which easily leads to overheating and damage of the inverter, and lack of an integrated injection sealing structure, and the sealing of the radiator after installation is difficult to guarantee, which cannot meet the needs of today's market.

[0030] Example 2

[0031] Reference Figures 1 to 5 , which is the second embodiment of the utility model, and this embodiment is based on the previous embodiment.

[0032] Specifically, the first heat dissipation mechanism 1 includes a heat conducting plate 101 , and evenly distributed heat dissipation fins 102 are fixedly connected to the back side of the heat conducting plate 101 .

[0033] The heat conducting plate 101 can absorb and conduct the heat generated by the operation of the inverter, the heat sink 102 can absorb and dissipate the heat of the heat conducting plate 101 , and the heat on the surfaces of the heat conducting plate 101 and the heat sink 102 can be taken away by the flowing air.

[0034] Specifically, the mounting mechanism 2 includes a mounting plate 201 , a mounting groove 202 is formed on the surface of the mounting plate 201 , and a mounting hole 203 is formed on the surface of the mounting plate 201 .

[0035] The mounting plate 201 and the first heat dissipation mechanism 1 are integrally cast, the mounting bevel 202 has an inclination angle of thirty degrees, and the mounting hole 203 is located on the right side of the mounting bevel 202. The radiator can be quickly installed through the cooperation of the mounting bevel 202 and the mounting plate 201. Since the mounting bevel 202 is provided and a limit rod compatible with the mounting bevel 202 is fixedly connected to the surface of the inverter, the radiator can be clamped and fixed, so only a set of bolts and nuts are needed to fix the radiator.

[0036] Specifically, the connecting mechanism 3 includes a connecting through slot 301 , and a limiting slot 302 is formed on the inner wall of the connecting through slot 301 .

[0037] The connecting slot 301 can be connected to the electrical components of the inverter or the cooling fan, which can increase the air circulation speed and thus enhance the heat dissipation effect. The limiting slot 302 can limit the electrical components or the cooling fan, thereby improving their stability after connection.

[0038] Specifically, the second heat dissipation mechanism 4 includes a connection groove 401 , and a connection through hole 402 is formed on the inner wall of the connection groove 401 .

[0039] The heat dissipation ceramic sheet can be connected by the cooperation of the connection groove 401 and the connection through hole 402. The heat dissipation ceramic sheet has a high thermal conductivity and a large heat dissipation area, and can quickly and effectively dissipate the heat generated by the electronic products, thereby ensuring the stability of the electronic equipment. The heat dissipation ceramic sheet has a high high temperature resistance, can withstand certain mechanical shocks and thermal shocks, is not easy to break and deform, thereby improving the life of the electronic equipment.

[0040] Specifically, the sealing mechanism 5 includes a sealing groove 501 , and a sealing gasket 502 is disposed in the inner cavity of the sealing groove 501 .

[0041] The sealing groove 501 is used to accommodate and connect the sealing gasket 502. The sealing gasket 502 is an integrated injection sealing material. The sealing material is injected into the inner cavity of the sealing groove 501 through external equipment, and then a tightly connected sealing gasket 502 is obtained after cooling, thereby ensuring the sealing of the connection.

[0042] Specifically, a wire groove 6 is provided on the surface of the heat conducting plate 101 , and connection wire holes 7 are provided around the surface of the heat conducting plate 101 .

[0043] The wires can be connected through the cooperation of the wire slot 6 and the wire hole, thereby meeting the conductivity requirements of a specific environment.

[0044] Specifically, the first heat dissipation mechanism 1 includes a base layer 1001, a reinforcement layer 1002 and an anti-corrosion layer 1003, the reinforcement layer 1002 is coated on the outer surface of the base layer 1001, the anti-corrosion layer 1003 is coated on the outer surface of the reinforcement layer 1002, and the anti-corrosion layer 1003 includes a first protective layer 10031 and a second protective layer 10032.

[0045] Specifically, the base layer 1001 is made of aluminum, and the reinforcement layer 1002 is made of aluminum silicon alloy.

[0046] Aluminum materials can ensure the heat conduction effect of the radiator. The advantage of aluminum silicon alloy is light weight. The density of aluminum silicon alloy is generally 2.6-2.7g / cm 3, which makes it lighter than many other metals, which is conducive to reducing weight, saving material costs, and improving production and transportation efficiency. It has good thermal conductivity, and its thermal conductivity coefficient is about 101~126W / (m·℃), which indicates that it has good thermal conductivity, certain strength and hardness, and the Young's modulus of aluminum silicon alloy is 71.0GPa, the impact value is about 7~8.5J, and the fatigue limit is ±45MPa, which indicates that it has certain strength and hardness and is suitable for occasions with certain loads.

[0047] Specifically, the material of the first protective layer 10031 is a metal-based ceramic composite coating, and the material of the second protective layer 10032 is a polyurethane coating.

[0048] Metal-based ceramic composite coatings can change the morphology, structure and chemical composition of the outer surface of the metal substrate and give the substrate new properties. By coating a metal-ceramic coating on the metal surface, a composite material with the advantages of metal strength and toughness as well as wear resistance and corrosion resistance is prepared. By setting a polyurethane coating, the corrosion resistance and wear resistance of the radiator can be further improved, thereby extending the service life of the radiator.

[0049] When in use, since the installation bevel groove 202 is provided, and the surface of the inverter is fixedly connected with a limit rod adapted to the installation bevel groove 202, the radiator can be clamped and fixed, so only a set of bolts and nuts are needed to fix the radiator, the heat conducting plate 101 can absorb and conduct the heat of the inverter, and the heat conducting plate 101 is absorbed and dissipated through the heat sink 102, and the heat on the surfaces of the heat conducting plate 101 and the heat sink 102 is taken away by the flowing air, and the heat dissipation ceramic sheet can be connected through the cooperation of the connecting groove 401 and the connecting through hole 402. The heat dissipation ceramic sheet has a high thermal conductivity and a large heat dissipation area, and can quickly and effectively dissipate the heat generated by electronic products. The heat dissipation ceramic sheet has high high temperature resistance, can withstand certain mechanical shock and thermal shock, is not easy to break and deform, thus improving the life of the electronic equipment. The sealing material is injected into the inner cavity of the sealing groove 501 through an external device, and then a tightly connected sealing gasket 502 is obtained after cooling, thereby ensuring the sealing of the connection. The aluminum material can ensure the thermal conductivity of the radiator. The advantages of aluminum silicon alloy are light weight, which is conducive to reducing weight, saving material costs, and improving production and transportation efficiency. It has good thermal conductivity, certain strength and hardness, which shows that it has certain strength and hardness and is suitable for occasions with certain loads.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A radiator with good sealing performance, characterized in that: The invention comprises a first heat dissipation mechanism (1), the top and bottom of the first heat dissipation mechanism (1) are fixedly connected to a mounting mechanism (2), a connecting mechanism (3) is provided on the surface of the first heat dissipation mechanism (1), a second heat dissipation mechanism (4) is provided on the left side of the top of the front face of the first heat dissipation mechanism (1), a sealing mechanism (5) is provided on the surface of the first heat dissipation mechanism (1), and the first heat dissipation mechanism (1) and the mounting mechanism (2) are made of the same material.

2. The heat sink with good sealing performance as claimed in claim 1, characterized in that: The first heat dissipation mechanism (1) comprises a heat conducting plate (101), and evenly distributed heat dissipation fins (102) are fixedly connected to the back side of the heat conducting plate (101).

3. The heat sink with good sealing performance as claimed in claim 1, characterized in that: The mounting mechanism (2) comprises a mounting plate (201), a mounting inclined groove (202) is provided on the surface of the mounting plate (201), and a mounting hole (203) is provided on the surface of the mounting plate (201).

4. The heat sink with good sealing performance as claimed in claim 1, characterized in that: The connecting mechanism (3) comprises a connecting through groove (301), and a limiting groove (302) is provided on the inner wall of the connecting through groove (301).

5. The heat sink with good sealing performance as claimed in claim 1, characterized in that: The second heat dissipation mechanism (4) comprises a connection groove (401), and a connection through hole (402) is provided on the inner wall of the connection groove (401).

6. The heat sink with good sealing performance as claimed in claim 1, characterized in that: The sealing mechanism (5) comprises a sealing groove (501), and a sealing gasket (502) is provided in the inner cavity of the sealing groove (501).

7. The heat sink with good sealing performance as claimed in claim 2, characterized in that: A wire groove (6) is provided on the surface of the heat conducting plate (101), and connection wire holes (7) are provided around the surface of the heat conducting plate (101).

8. The heat sink with good sealing performance as claimed in claim 1, characterized in that: The first heat dissipation mechanism (1) comprises a base layer (1001), a reinforcement layer (1002) and an anti-corrosion layer (1003), wherein the reinforcement layer (1002) is coated on the outer surface of the base layer (1001), the anti-corrosion layer (1003) is coated on the outer surface of the reinforcement layer (1002), and the anti-corrosion layer (1003) comprises a first protective layer (10031) and a second protective layer (10032).

9. The heat sink with good sealing performance as claimed in claim 8, characterized in that: The material of the base layer (1001) is aluminum material, and the material of the reinforcement layer (1002) is aluminum silicon alloy.

10. The heat sink with good sealing performance as claimed in claim 8, characterized in that: The material of the first protective layer (10031) is a metal-based ceramic composite coating, and the material of the second protective layer (10032) is a polyurethane coating.