Semiconductor substrate processing device

Abstract

The utility model discloses a semiconductor substrate processing device, comprising a main body unit which comprises a bearing plate and a support plate fixedly connected on the upper surface of the bearing plate; and the polishing and cleaning unit comprises a mounting plate fixedly connected to one side of the inclined supporting plate and a supporting plate fixedly connected to one side of the mounting plate. According to the utility model, the L-shaped holding plate is used for holding a semiconductor substrate, the rotating shaft is further used for driving the L-shaped holding plate to move so as to clamp the semiconductor substrate, the output shaft of the servo motor is further used for driving the screw rod to move, the screw rod is further used for driving the sliding block to carry out adjustment, and after equipment processing is completed, the semiconductor substrate is placed on the holding plate. The limiting plate is taken down through the clamping block, then the adjusting shaft is rotated, the cleaning plate is driven to move towards one side through the adjusting shaft, chippings on the upper surface of the bearing plate are synchronously cleaned, the situation that the chippings influence placement of the semiconductor substrate in the subsequent machining process is prevented, and the product machining efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor substrate processing device structure, in particular to a semiconductor substrate processing device. Background Art

[0002] III-V compound semiconductor materials, represented by gallium arsenide, have very wide applications in satellite communications, microwave devices, lasers, and light-emitting diodes due to their unique electrical properties, such as heterojunction bipolar transistors, high electron mobility transistors, LEDs and other semiconductor devices.

[0003] The production of semiconductor devices requires the growth of epitaxial structures on the main surface of a high-quality substrate using molecular beam epitaxy technology or organometallic compound vapor phase epitaxy technology. Therefore, before growing the epitaxial structure on the surface of the semiconductor substrate, the main surface of the semiconductor substrate needs to be polished. Otherwise, the surface of the semiconductor substrate will easily become rough, which will lead to poor installation of the semiconductor substrate and reduced equipment performance. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the problems existing in the above-mentioned conventional semiconductor substrate processing device, the present utility model is proposed.

[0006] Therefore, the purpose of the utility model is to provide a semiconductor substrate processing device, which is suitable for solving the problem that the production of semiconductor devices requires growing an epitaxial structure on the main surface of a high-quality substrate using molecular beam epitaxy technology or organic metal compound vapor phase epitaxy technology. Therefore, before growing the epitaxial structure on the surface of the semiconductor substrate, the main surface of the semiconductor substrate needs to be polished, otherwise it is easy to cause the surface of the semiconductor substrate to be rough, which in turn leads to poor installation effect of the semiconductor substrate and reduced equipment use effect.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions: a semiconductor substrate processing device, comprising:

[0008] The main unit comprises a load-bearing plate and a support plate fixedly connected to the upper surface of the load-bearing plate, wherein one side of the support plate is fixedly connected to an inclined support plate;

[0009] The grinding and cleaning unit includes a mounting plate fixedly connected to one side of an inclined support plate and a supporting plate fixedly connected to one side of the mounting plate, a placement groove is hollowed out in the load-bearing plate, a locking block is slidably connected in the placement groove, a limiting plate is fixedly connected to one side of the locking block, a rotating shaft is threadedly connected in the limiting plate, an L-shaped holding plate is slidably connected to the upper surface of the load-bearing plate, the mounting plate is fixedly connected to a guide rod, a screw rod is rotatably connected to the inner surface of the mounting plate, a sliding block is threadedly connected to the outer surface of the screw rod, and a guide rod is slidably connected in the sliding block.

[0010] As a preferred solution of a semiconductor substrate processing device of the utility model, wherein: a snap-fit ​​frame is fixedly connected to the lower surface of the load-bearing plate, a connection box is snap-fitted to the lower surface of the snap-fit ​​frame, a maintenance door is fixedly connected to one side of the connection box through a hinge, and there are two groups of inclined support plates, and the two groups of inclined support plates are symmetrical about the center of the support plate.

[0011] As a preferred solution of a semiconductor substrate processing device of the utility model, wherein: a placement block is fixedly connected to one side of the support plate, a servo motor is fixedly connected to the upper surface of the placement block, and a lead screw is fixedly connected to one end of the servo motor.

[0012] As a preferred solution of a semiconductor substrate processing device of the utility model, wherein: the lower surface of the sliding block is fixedly connected to an electric telescopic rod, the lower surface of the electric telescopic rod is fixedly connected to a driving motor, and one end of the driving motor output shaft is fixedly connected to a grinding disc.

[0013] As a preferred solution of a semiconductor substrate processing device of the utility model, wherein: a cleaning plate is slidably connected to the lower surface of the support plate, a brush is fixedly connected to the lower surface of the cleaning plate, a limiting plate is fixedly connected inside the support plate, and an adjusting shaft is threadedly connected inside the limiting plate.

[0014] As a preferred solution of a semiconductor substrate processing device of the utility model, wherein: a shaft rod is fixedly connected to one side of the limiting plate, the shaft rod is rotatably connected inside the adjusting shaft, a bearing is fixedly connected inside the L-shaped containing plate, a rotating shaft is rotatably connected inside the bearing, a placing plate is fixedly connected inside the connecting box, and a limiting screw is threadedly connected inside the locking block.

[0015] Beneficial effects of the utility model:

[0016] When the equipment is working normally, the semiconductor substrate is placed on the L-shaped holding plate, and the rotating shaft is further used to drive the L-shaped holding plate to move, and then the semiconductor substrate is clamped, and the servo motor output shaft is further used to drive the lead screw to move, and then the lead screw is used to drive the sliding block to adjust, and then the drive motor is used to drive the grinding disk to rotate, and then the semiconductor substrate is polished by the grinding disk. After the equipment processing is completed, the limit plate is removed by the locking block, and then the cleaning plate is driven to move to one side by rotating the adjusting shaft, and the debris on the upper surface of the load-bearing plate is cleaned simultaneously, so as to prevent the debris from affecting the placement of the semiconductor substrate during subsequent processing, thereby improving the processing efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor substrate processing device proposed by the utility model;

[0019] Figure 2 This is a schematic structural diagram of a polishing and cleaning unit of a semiconductor substrate processing device proposed by the utility model;

[0020] Figure 3 This is a schematic diagram of the upper surface distribution structure of a load-bearing plate of a semiconductor substrate processing device proposed by the utility model.

[0021] Description of the drawings: 100, main unit; 101, load-bearing plate; 102, snap-fit ​​frame; 103, connection box; 104, support plate; 105, tilting support plate; 106, maintenance door; 200, grinding and cleaning unit; 201, mounting plate; 202, screw rod; 203, guide rod; 204, electric telescopic rod; 205, cleaning plate; 206, limit plate; 207, L-shaped holding plate; 208, placement plate; 209, snap-fit ​​block; 210, limit screw; 211, rotating shaft; 212, limit plate; 213, adjusting shaft; 214, placement block; 215, servo motor; 216, placement groove; 217, bearing; 218, sliding block; 219, drive motor; 220, grinding disc. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned objectives, features and advantages of the present invention more obvious and understandable, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the "one embodiment" or "embodiment" referred to herein refers to a specific feature structure or characteristic that can be included in at least one implementation of the utility model. The "in one embodiment" that appears in different places in this specification does not refer to the same embodiment, nor is it an embodiment that is mutually exclusive with other embodiments alone or selectively.

[0025] Secondly, the utility model is described in detail with reference to the schematic diagram. When describing the embodiments of the utility model, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagrams are only examples, which should not limit the scope of protection of the utility model. In addition, in actual production, the three-dimensional space dimensions of length, width and depth should be included.

[0026] Reference Figure 1 - Figure 3 , which is an embodiment of the utility model, provides a semiconductor substrate processing device, including a main unit 100 and a polishing and cleaning unit 200.

[0027] The main unit 100 includes a load-bearing plate 101 and a support plate 104 fixedly connected to the upper surface of the load-bearing plate 101, an inclined support plate 105 fixedly connected to one side of the support plate 104, a snap-fit ​​frame 102 fixedly connected to the lower surface of the load-bearing plate 101, a connection box 103 snap-fitted to the lower surface of the snap-fit ​​frame 102, a maintenance door 106 fixedly connected to one side of the connection box 103 via a hinge, and two groups of inclined support plates 105 are symmetrical about the center of the support plate 104;

[0028] The polishing and cleaning unit 200 includes a mounting plate 201 fixedly connected to one side of the inclined support plate 105 and a supporting plate 104 fixedly connected to one side of the mounting plate 201. A placement groove 216 is hollowed out in the load-bearing plate 101, and a snap-fit ​​block 209 is slidably connected in the placement groove 216. The limit plate 206 is removed by the snap-fit ​​block 209, and then the cleaning plate 205 is driven to move to one side by rotating the adjustment shaft 213, and the debris on the upper surface of the load-bearing plate 101 is cleaned synchronously, thereby preventing the debris from affecting the placement of the semiconductor substrate during subsequent processing, thereby improving the processing of the product. The working efficiency is improved. One side of the locking block 209 is fixedly connected to the limit plate 206. The limit plate 206 is internally threaded with a rotating shaft 211. The upper surface of the load-bearing plate 101 is slidably connected to an L-shaped holding plate 207. The semiconductor substrate is placed using the L-shaped holding plate 207. The rotating shaft 211 is further used to drive the L-shaped holding plate 207 to move, thereby clamping the semiconductor substrate. The mounting plate 201 is fixedly connected to the guide rod 203. The inner surface of the mounting plate 201 is rotatably connected to the screw rod 202. The outer surface of the screw rod 202 is threadedly connected to a sliding block 218. The guide rod 203 is slidably connected to the sliding block 218. The support plate A placement block 214 is fixedly connected to one side of 104, and a servo motor 215 is fixedly connected to the upper surface of the placement block 214. The output shaft of the servo motor 215 drives the screw rod 202 to move, and then the screw rod 202 drives the sliding block 218 to adjust the process, and the driving motor 219 is further used to drive the grinding disc 220 to rotate, and then the semiconductor substrate is polished by the grinding disc 220. One end of the servo motor 215 is fixedly connected to the screw rod 202, and the lower surface of the sliding block 218 is fixedly connected to the electric telescopic rod 204, and the lower surface of the electric telescopic rod 204 is fixedly connected to the driving motor 219. A grinding disc 220 is fixedly connected to one end of the output shaft of the motor 219, a cleaning plate 205 is slidably connected to the lower surface of the support plate 104, a brush is fixedly connected to the lower surface of the cleaning plate 205, a limiting plate 212 is fixedly connected inside the support plate 104, an adjusting shaft 213 is threadedly connected to the limiting plate 212, a shaft rod is fixedly connected to one side of the limiting plate 212, the adjusting shaft 213 is rotatably connected to the shaft rod, a bearing 217 is fixedly connected to the L-shaped containing plate 207, a rotating shaft 211 is rotatably connected to the bearing 217, a placing plate 208 is fixedly connected to the connecting box 103, and a limiting screw 210 is threadedly connected to the locking block 209.

[0029] When the equipment is working normally, the semiconductor substrate is placed on the L-shaped holding plate 207, and the rotating shaft 211 is further used to drive the L-shaped holding plate 207 to move, so as to clamp the semiconductor substrate, and the output shaft of the servo motor 215 is further used to drive the screw rod 202 to move, and the screw rod 202 is used to drive the sliding block 218 to adjust, and the driving motor 219 is further used to drive the grinding disk 220 to rotate, and the semiconductor substrate is grinded and polished by the grinding disk 220. After the equipment processing is completed, the limit plate 206 is removed by the locking block 209, and the adjusting shaft 213 is rotated to drive the cleaning plate 205 to move to one side, and the debris on the upper surface of the load-bearing plate 101 is cleaned simultaneously, so as to prevent the debris from affecting the placement of the semiconductor substrate during subsequent processing, thereby improving the processing efficiency of the product.

[0030] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A semiconductor substrate processing device, characterized in that: include: A main body unit (100) comprising a load-bearing plate (101) and a support plate (104) fixedly connected to the upper surface of the load-bearing plate (101), wherein one side of the support plate (104) is fixedly connected to an inclined support plate (105); A grinding and cleaning unit (200) comprises a mounting plate (201) fixedly connected to one side of an inclined support plate (105) and a supporting plate (104) fixedly connected to one side of the mounting plate (201); a placement groove (216) is hollowed out in the load-bearing plate (101); a locking block (209) is slidably connected in the placement groove (216); a limiting plate (206) is fixedly connected to one side of the locking block (209); a rotating shaft (211) is internally threadedly connected to the limiting plate (206); an L-shaped containing plate (207) is slidably connected to the upper surface of the load-bearing plate (101); the mounting plate (201) is fixedly connected to a guide rod (203); a lead screw (202) is rotatably connected to the inner surface of the mounting plate (201); a sliding block (218) is threadedly connected to the outer surface of the lead screw (202); and the guide rod (203) is slidably connected to the sliding block (218).

2. A semiconductor substrate processing device according to claim 1, characterized in that: The lower surface of the load-bearing plate (101) is fixedly connected to a snap-fit ​​frame (102), the lower surface of the snap-fit ​​frame (102) is snap-fitted to a connection box (103), one side of the connection box (103) is fixedly connected to a maintenance door (106) via a hinge, and the inclined support plates (105) are provided in two groups, and the two groups of inclined support plates (105) are symmetrical about the center of the support plate (104).

3. The semiconductor substrate processing device according to claim 1, characterized in that: A placement block (214) is fixedly connected to one side of the support plate (104), a servo motor (215) is fixedly connected to the upper surface of the placement block (214), and a lead screw (202) is fixedly connected to one end of the servo motor (215).

4. The semiconductor substrate processing device according to claim 1, characterized in that: The lower surface of the sliding block (218) is fixedly connected to an electric telescopic rod (204), the lower surface of the electric telescopic rod (204) is fixedly connected to a driving motor (219), and one end of an output shaft of the driving motor (219) is fixedly connected to a grinding disc (220).

5. The semiconductor substrate processing device according to claim 2, characterized in that: The lower surface of the support plate (104) is slidably connected to a cleaning plate (205), the lower surface of the cleaning plate (205) is fixedly connected to a brush, the support plate (104) is internally fixedly connected to a limiting plate (212), and the limiting plate (212) is internally threadedly connected to an adjusting shaft (213).

6. The semiconductor substrate processing device according to claim 5, characterized in that: A shaft is fixedly connected to one side of the limiting plate (212), a shaft is rotatably connected inside the adjusting shaft (213), a bearing (217) is fixedly connected inside the L-shaped containing plate (207), a rotating shaft (211) is rotatably connected inside the bearing (217), a placement plate (208) is fixedly connected inside the connection box (103), and a limiting screw (210) is internally threadedly connected to the locking block (209).

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