Wafer processing transmission mechanism and wafer thinning machine
By using the robotic technology of five-axis robotics in wafer thinning machines to transfer wafers, the problem of complex installation and low accuracy of linear slide rail structures in the prior art is solved, and more efficient and accurate wafer transfer is achieved. And helps miniaturize equipment.
Patent Information
- Application Number
- CN202421249068.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-04-28
- Filing Date
- 2024-06-03
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2034-06-03
AI Technical Summary
In existing wafer thinning machines, the linear slide structure is cumbersome to install, has low accuracy, is difficult to debug, and takes up a large space, which is not conducive to miniaturization.
Using robotic technology, the wafer is transferred between the positioning member and the working disk through a five-axis robot, and between the working disk and the cleaning member, achieving safe, fast and accurate transfer of the wafer.
It simplifies the installation process, improves positioning accuracy, reduces debugging difficulty, reduces space usage, and helps to miniaturize wafer thinning machines.
Smart Images
Figure CN222514900U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer processing transmission mechanism and a wafer thinning machine. Background Art
[0002] Wafers are usually stored in standard wafer storage boxes to facilitate transfer and ensure that the wafers are not damaged during the transfer process. Wafer thinning machines are used to grind the thickness of wafers. Wafer storage boxes containing unthinned wafers are placed in the designated position of the wafer thinning machine. When the wafer thinning machine is working, the unthinned wafers need to be taken out of the wafer storage box. After the wafers are centered, they will be placed on the work plate. After the grinding process is completed, the wafers need to be removed and cleaned, and finally placed in the wafer storage box that stores the thinned wafers.
[0003] The wafer needs to be transferred to multiple stations during the entire processing process. Each transfer process must ensure that the wafer is not damaged and requires sufficient movement accuracy. The existing wafer thinning machine is equipped with multiple motion platforms composed of linear slides and lead screws, on which the wafer fixing mechanism is installed, and the wafer transfer is achieved through motor drive.
[0004] However, when the processing position is transferred to the cleaning position, the wafer is changed from a horizontal state to a vertical state, which requires a large number of linear slide rail structures with complex designs. The installation is cumbersome, the installation accuracy is low, the debugging is difficult, and the space is large, which is not conducive to reducing the miniaturization of the wafer thinning machine.
[0005] Therefore, it is urgent to study a wafer processing transmission mechanism to solve the above problems. Utility Model Content
[0006] The purpose of the utility model is to provide a wafer processing transmission mechanism and a wafer thinning machine to solve the problems in the prior art that the installation is complicated, the installation accuracy is low and the debugging is difficult, the space occupied is large, and it is not conducive to reducing the miniaturization of the wafer thinning machine.
[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0008] A wafer processing transmission mechanism, comprising:
[0009] A positioning piece, wherein the positioning piece is used to position the wafer;
[0010] A working disk, the working disk is used to carry the wafer, a processing piece can process the wafer located on the working disk, and an axis of the wafer located on the working disk extends along a first direction;
[0011] A cleaning member, the cleaning member is used to clean the wafer, the axis of the wafer located on the cleaning member extends along a second direction, and the first direction and the second direction are arranged at an angle;
[0012] A robot is provided, wherein the robot can move the wafer located on the positioning member to the working disk, and can transfer the wafer located on the working disk to the cleaning member.
[0013] In some embodiments, the robot is at least a five-axis manipulator; and / or
[0014] An adsorption part and a clamping part are installed at the end of the robot. The adsorption part is used to adsorb the wafer that has been positioned on the positioning part, and can place the wafer that has been positioned on the working disk; the clamping part is used to clamp the wafer that has been processed on the working disk, and place the wafer that has been processed on the cleaning part.
[0015] In some embodiments, the carrying surface of the working disk is parallel to the horizontal plane, and the working disk is provided with an adsorption hole penetrating the carrying surface. The negative pressure gas can adsorb the wafer after passing through the adsorption hole, and the positive pressure gas can blow up the wafer after passing through the adsorption hole to make the wafer in a suspended state, and the clamping member can clamp the wafer in the suspended state.
[0016] In some embodiments, the manipulator includes a base, a first arm, a second arm, a third arm, a fourth arm and a fifth arm, the starting end of the first arm is rotated at the base via a first axis, the starting end of the second arm is rotated at the end of the first arm via a second axis, the starting end of the third arm is rotated at the end of the second arm via a third axis, the starting end of the fourth arm is rotated at the end of the third arm via a fourth axis, the starting end of the fifth arm is rotated at the end of the fourth arm via a fifth axis, the adsorption member and the clamping member are both arranged at the end of the fifth arm, the first axis extends in a vertical direction, the extension directions of the second axis, the third axis and the fourth axis are all parallel to the horizontal plane, and the fifth axis is perpendicular to the extension direction of the fourth axis.
[0017] In some embodiments, the adsorption component and the clamping component are symmetrically arranged about the fifth axis.
[0018] In some embodiments, the wafer processing and transmission mechanism includes a workbench, which can rotate around its own axis. A plurality of work disks are provided, and the plurality of work disks are evenly spaced circumferentially around the axis of the workbench. During the rotation of the workbench, each work disk passes through a pick-and-place position and a processing position in turn. When the work disk is located at the processing position, the processing part can process the wafer. When the work disk is located at the pick-and-place position, the robot can place the wafer on or take it out of the work disk.
[0019] In some embodiments, the workbench, the positioning member and the cleaning member are not in the same straight line, and the robot is located in a triangle formed by the connecting lines between the workbench, the positioning member and the cleaning member.
[0020] In some embodiments, the bearing surface of the working disc, the positioning surface of the positioning member and the supporting portion of the cleaning member are staggered in the vertical direction.
[0021] In some embodiments, the working disk includes a disk body, and the disk body rotates around its own axis under the drive of the power member.
[0022] A wafer thinning machine comprises a processing part and the above-mentioned wafer processing and transmission mechanism.
[0023] The beneficial effects of the utility model are:
[0024] The utility model provides a wafer processing and transmission mechanism and a wafer thinning machine. The wafer processing and transmission mechanism completes the transfer of the wafer between a positioning part and a working plate, and the transfer of the wafer between the working plate and a cleaning part by arranging a robot. The arrangement of the robot can satisfy the requirement of flipping the wafer to a certain angle, and the installation is convenient, easy to debug, and has high repeated positioning accuracy, which is conducive to the safe, fast and accurate transfer of the wafer. Compared with the linear slide rail structure, the robot occupies less space, which is conducive to reducing the overall size of the wafer thinning machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is a schematic diagram of the structure of the wafer processing transmission mechanism in the embodiment of the utility model;
[0026] Figure 2 It is a schematic diagram of the top view of the wafer processing transmission mechanism in the embodiment of the utility model.
[0027] In the figure:
[0028] 1000, wafer;
[0029] 100. Positioning piece;
[0030] 200, working disk;
[0031] 300, cleaning parts;
[0032] 400, robot; 410, base; 420, first arm; 430, second arm; 440, third arm; 450, fourth arm; 460, fifth arm. DETAILED DESCRIPTION
[0033] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0034] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0037] like Figure 1 and Figure 2As shown, the present embodiment provides a wafer processing and transmission mechanism, which includes a positioning member 100, a working disk 200, a cleaning member 300 and a robot 400, wherein the positioning member 100 is used to position the wafer 1000; the working disk 200 is used to carry the wafer 1000, the processing member can process the wafer 1000 located on the working disk 200, and the axis of the wafer 1000 located on the working disk 200 extends along a first direction; the cleaning member 300 is used to clean the wafer 1000, and the axis of the wafer 1000 located on the cleaning member 300 extends along a second direction, and the first direction is set at an angle to the second direction; the robot 400 can move the wafer 1000 located on the positioning member 100 to the working disk 200, and can transfer the wafer 1000 located on the working disk 200 to the cleaning member 300.
[0038] The wafer processing and transmission mechanism completes the transfer of the wafer 1000 between the positioning part 100 and the working disk 200, and the transfer of the wafer 1000 between the working disk 200 and the cleaning part 300 by setting up a robot 400. The setting of the robot 400 can satisfy the requirement of flipping the wafer 1000 at a certain angle. It is easy to install and debug, and has high repeated positioning accuracy, which helps to transfer the wafer 1000 safely, quickly and accurately. Compared with the linear slide rail structure, the robot 400 occupies a small space, which is conducive to reducing the overall size of the wafer processing and transmission mechanism and the wafer thinning machine.
[0039] Due to the complexity of the action to be performed, in some embodiments, the robot 400 is at least a five-axis manipulator. In some embodiments, the robot 400 can be a six-axis manipulator.
[0040] Considering that there will be residual liquid medicine or debris on the surface of the wafer 1000 after processing, the liquid medicine or debris will be sucked into the vacuum system by adsorption, corroding the vacuum pipeline or blocking the vacuum components, making the vacuum system invalid and unable to be reused. To this end, in some embodiments, an adsorbent and a clamping member are installed at the end of the robot 400. The adsorbent is used to adsorb the wafer 1000 that has been positioned on the positioning member 100, and can place the wafer 1000 that has been positioned on the working disk 200; the clamping member is used to clamp the wafer 1000 that has been processed on the working disk 200, and place the wafer 1000 that has been processed on the cleaning member 300. The above-mentioned setting can not only ensure the convenience of transferring the wafer 1000 from the positioning member 100 to the working disk 200 after being adsorbed, but also transfer the wafer 1000 from the working disk 200 to the cleaning member 300 through the clamping member, thereby avoiding the adsorbent from being damaged by the residue on the wafer 1000 and improving the service life.
[0041] In some embodiments, the clamping member includes a clamping cylinder and two clamping claws. The clamping cylinder is provided at the end of the robot 400. The two clamping claws are respectively fixed to the two output ends of the clamping cylinder. The clamping cylinder can drive the two clamping claws to move closer or farther away. When the two clamping claws clamp the wafer 1000, one is on the top and the other is on the bottom. It should be noted that the structural working principle of the adsorption member is well known to those skilled in the art, so it will not be repeated here.
[0042] The bearing surface of the working plate 200 is parallel to the horizontal plane. The working plate 200 is provided with adsorption holes penetrating the bearing surface. After the negative pressure gas passes through the adsorption holes, the wafer 1000 can be adsorbed. After the positive pressure gas passes through the adsorption holes, the wafer 1000 can be blown up to make the wafer 1000 in a suspended state. The clamping member can clamp the wafer 1000 in a suspended state. The above arrangement enables the clamping member to clamp one of the clamping jaws on the lower surface of the wafer 1000 and the other clamping jaw on the upper surface of the wafer 1000, thereby maintaining the stability of the clamping.
[0043] Regarding the structure of the manipulator, specifically, the manipulator includes a base 410, a first arm 420, a second arm 430, a third arm 440, a fourth arm 450 and a fifth arm 460. The starting end of the first arm 420 is rotated on the base 410 through a first axis, the starting end of the second arm 430 is rotated on the end of the first arm 420 through a second axis, the starting end of the third arm 440 is rotated on the end of the second arm 430 through a third axis, the starting end of the fourth arm 450 is rotated on the end of the third arm 440 through a fourth axis, the starting end of the fifth arm 460 is rotated on the end of the fourth arm 450 through a fifth axis, the adsorption part and the clamping part are both arranged at the end of the fifth arm 460, the first axis extends in a vertical direction, the extension directions of the second axis, the third axis and the fourth axis are all parallel to the horizontal plane, and the fifth axis is perpendicular to the extension direction of the fourth axis. The above arrangement can ensure that the robot arm can complete the transfer of the wafer 1000 between the positioning member 100 , the working plate 200 and the cleaning member 300 , and can adapt to the placement angle of the wafer 1000 .
[0044] To avoid mutual interference between the adsorption component and the clamping component, in some embodiments, the adsorption component and the clamping component are symmetrically arranged about the fifth axis.
[0045] The working disk 200 includes a disk body, which rotates around its own axis under the drive of a power member. The working disk 200 also includes a power member, which is used to drive the disk body to rotate. The above arrangement enables the wafer 1000 on the disk body to rotate around its own axis, thereby adapting to more processing scenarios.
[0046] In order to improve the processing efficiency, the wafer processing and transmission mechanism includes a workbench, which can rotate around its own axis, and a plurality of work disks 200 are provided, and the circumferential intervals of the plurality of work disks 200 around the axis of the workbench are uniform. During the rotation of the workbench, each work disk 200 passes through the pick-up and placement position and the processing position in sequence. When the work disk 200 is located at the processing position, the workpiece can process the wafer 1000. When the work disk 200 is located at the pick-up and placement position, the robot 400 can place the wafer 1000 on the work disk 200 or take it out from the work disk 200. In other words, when the work disk 200 is located at the pick-up and placement position, the robot 400 can place the wafer 1000 on the work disk 200 or take it out from the work disk 200. The above arrangement enables the workbench to carry a plurality of work disks 200 at the same time, wherein at least one work disk 200 can be located at the processing position, and one work disk 200 can be located at the pick-up and placement position, so that the processing and pick-up of the wafer 1000 can be carried out synchronously, thereby improving the processing efficiency.
[0047] Specifically, there are at least five working trays 200. In this embodiment, there are at least two processing positions, so that at least two wafers 1000 can be processed simultaneously. In other embodiments, the number of working trays 200 can also be three, six or even ten or more.
[0048] In some embodiments, the workbench, the positioning member 100 and the cleaning member 300 are not in the same straight line, and the robot 400 is located in a triangle formed by the connecting lines between the workbench, the positioning member 100 and the cleaning member 300. The above arrangement minimizes the distance between the robot 400 and the workbench, the positioning member 100 and the cleaning member 300, thereby improving the transfer efficiency of the wafer 1000.
[0049] Considering the different structures of the equipment, the bearing surface of the working plate 200, the positioning surface of the positioning member 100 and the supporting part of the cleaning member 300 are staggered in the vertical direction. That is, the bearing surface of the working plate 200, the positioning surface of the positioning member 100 and the supporting part of the cleaning member 300 are at different heights in the vertical direction. With the help of the structure of the robot 400, the transfer action of the wafer 1000 between the components of different heights can be easily completed with high repeatability.
[0050] In some embodiments, the first direction is perpendicular to the second direction. The structures of the positioning member 100 and the cleaning member 300 can refer to the positioning device and the wafer 1000 cleaning device in the prior art, which is not the focus of this application and will not be described in detail.
[0051] The workbench is provided with a pressure device for providing positive and negative pressure gas and negative pressure gas to the adsorption holes. The workbench is provided with a circulation pipeline and a circulation pump, the circulation pump and the cleaning tank of the cleaning part 300 are connected through the circulation pipeline, and the circulation pump is used to provide circulating cleaning liquid for the cleaning part 300.
[0052] This embodiment also provides a wafer thinning machine, which includes a processing part and the above-mentioned wafer processing and transmission mechanism. The processing part includes a grinding head, which is arranged at a processing position and is used to grind the wafer 1000 on the working disk 200 located at the processing position to reduce the thickness of the wafer 1000.
[0053] In some embodiments, the wafer thinning machine further comprises a first box body and a second box body, wherein the first box body is used to load the unthinned wafer 1000, and the second box body is used to load the thinned wafer 1000. When in use, the first box body and the second box body are respectively placed at designated positions of the wafer thinning machine, the robot 400 takes out the wafer 1000 in the first box body, and places it on the positioning member 100 for positioning, after positioning and centering, the robot 400 takes out the wafer 1000 from the positioning member 100 and places it on the working plate 200, the grinding head performs grinding processing on the wafer 1000, after the grinding processing is completed, the robot 400 needs to remove the wafer 1000 and transfer it to the cleaning member 300 for cleaning, and finally put the wafer 1000 after cleaning into the second box body.
[0054] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.
Claims
1. A wafer processing transmission mechanism, characterized in that: include: A positioning member (100), wherein the positioning member (100) is used to position a wafer (1000); A working disk (200), the working disk (200) being used to carry the wafer (1000), the processing piece being able to process the wafer (1000) located on the working disk (200), the axis of the wafer (1000) located on the working disk (200) extending along a first direction; A cleaning member (300), the cleaning member (300) being used to clean the wafer (1000), the axis of the wafer (1000) located on the cleaning member (300) extending along a second direction, the first direction being arranged at an angle to the second direction; A robot (400) is provided, wherein the robot (400) is capable of moving the wafer (1000) located on the positioning member (100) to the working disk (200), and is capable of transferring the wafer (1000) located on the working disk (200) to the cleaning member (300).
2. The wafer processing and transmission mechanism according to claim 1, characterized in that: The robot (400) is at least a five-axis manipulator; and / or The end of the robot (400) is equipped with an adsorption component and a clamping component. The adsorption component is used to adsorb the wafer (1000) that has been positioned on the positioning component (100), and can place the wafer (1000) that has been positioned on the working disk (200); the clamping component is used to clamp the wafer (1000) that has been processed and is located on the working disk (200), and place the wafer (1000) that has been processed on the cleaning component (300).
3. The wafer processing and transmission mechanism according to claim 2, characterized in that: The bearing surface of the working disk (200) is parallel to the horizontal plane. The working disk (200) is provided with an adsorption hole penetrating the bearing surface. After the negative pressure gas passes through the adsorption hole, the wafer (1000) can be adsorbed. After the positive pressure gas passes through the adsorption hole, the wafer (1000) can be blown up to put the wafer (1000) in a suspended state. The clamping member can clamp the wafer (1000) in the suspended state.
4. The wafer processing and transmission mechanism according to claim 2, characterized in that: The robot arm comprises a base (410), a first arm (420), a second arm (430), a third arm (440), a fourth arm (450) and a fifth arm (460), wherein the starting end of the first arm (420) is rotatably arranged on the base (410) via a first axis, the starting end of the second arm (430) is rotatably arranged on the end of the first arm (420) via a second axis, the starting end of the third arm (440) is rotatably arranged on the end of the second arm (430) via a third axis, the starting end of the fourth arm (450) is rotatably arranged on the end of the third arm (440) via a fourth axis, the starting end of the fifth arm (460) is rotatably arranged on the end of the fourth arm (450) via a fifth axis, the adsorption component and the clamping component are both arranged on the end of the fifth arm (460), the first axis extends in a vertical direction, the extension directions of the second axis, the third axis and the fourth axis are all parallel to a horizontal plane, and the fifth axis is perpendicular to the extension direction of the fourth axis.
5. The wafer processing and transmission mechanism according to claim 4, characterized in that: The adsorption member and the clamping member are symmetrically arranged about the fifth axis.
6. The wafer processing and transmission mechanism according to claim 1, characterized in that: The wafer processing and transmission mechanism comprises a workbench, which can rotate around its own axis. A plurality of work disks (200) are provided, and the plurality of work disks (200) are evenly spaced around the circumferential axis of the workbench. During the rotation of the workbench, each work disk (200) passes through a pick-up and placement position and a processing position in sequence. When the work disk (200) is located at the processing position, the processing piece can process the wafer (1000). When the work disk (200) is located at the pick-up and placement position, the robot (400) can place the wafer (1000) on the work disk (200) or take it out from the work disk (200).
7. The wafer processing and transmission mechanism according to claim 6, characterized in that: The workbench, the positioning member (100) and the cleaning member (300) are not in the same straight line, and the robot (400) is located in a triangle formed by lines connecting the workbench, the positioning member (100) and the cleaning member (300).
8. The wafer processing and transmission mechanism according to any one of claims 1 to 7, characterized in that: The bearing surface of the working disk (200), the positioning surface of the positioning member (100) and the supporting portion of the cleaning member (300) are staggered in the vertical direction.
9. The wafer processing and transmission mechanism according to any one of claims 1 to 7, characterized in that: The working disc (200) comprises a disc body, and the disc body rotates around its own axis under the drive of a power member.
10. A wafer thinning machine, characterized in that: It comprises a processing part and a wafer processing and transmission mechanism as described in any one of claims 1-9.