Auxiliary support for bonding PCB and AME multilayer board
By designing an auxiliary bracket for PCB boards and multi-layer boards, the problem of difficulty in improving the assembly accuracy of multi-layer boards and substrates is solved, and higher bonding accuracy and insulation performance are achieved.
Patent Information
- Application Number
- CN202420524890.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-18
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-03-18
AI Technical Summary
In the process of manufacturing insulating pressure-resistant products, the fitting accuracy of the multi-layer board and substrate is difficult to improve, and due to the influence of thickness difference and protrusions, the bonding quality is poor.
An auxiliary bracket is designed, including multiple support columns and marking frames. The support columns are placed in an air with PCB boards and multi-layer boards. The marking frames are used to position and detect the fit, and the cover plate is used to strengthen the bonding effect.
By using auxiliary brackets, the adhesion accuracy between the multi-layer board and the substrate is significantly improved, the surface height deviation, thickness tolerance and center radial deviation are significantly improved, and the insulation performance is also improved to the working voltage equivalent value ≥70kv.
Smart Images
Figure CN222522067U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of PCB composite board manufacturing equipment, relates to an auxiliary bracket, and particularly relates to an auxiliary bracket for bonding a PCB board and an AME multilayer board. Background Art
[0002] Additive manufacturing, also known as 3D printing, is a manufacturing technology that builds three-dimensional objects by adding materials layer by layer. In recent years, additive manufacturing has made significant progress in product customization, especially in the field of electronic engineering. Additive manufacturing technology can achieve rapid manufacturing of complex structures at micro- and nano-scales, which brings new possibilities to the design and production of electronic products. Through additive manufacturing, more compact and lightweight designs can be achieved, while improving product performance and reliability.
[0003] In the preparation of printed circuit board products in various military fields, the manufacturing of traditional printed circuit boards has various defects, such as: poor distribution of circuits between layers within the board, substandard line width / line spacing, unclean etching, many drilling problems and difficulty in repair, etc. The introduction of additive manufacturing technology to prepare such products is an important solution to these problems.
[0004] In the process of manufacturing insulating and voltage-resistant products, there are very high technical requirements for the thickness tolerance of the PCB (printed circuit board) substrate, the height tolerance of the AME (additive manufacturing electronic technology) multi-layer board and substrate splicing, and the radial deviation of the assembly center of the multi-layer high-voltage unit.
[0005] At present, the multilayer board and the substrate are assembled on the workbench, and the multilayer composite unit components in the multilayer board composite unit group after completion can only meet the following index requirements:
[0006] The surface height deviation of the multilayer board and the substrate after splicing is ≤50μm, the thickness tolerance of the overlapping and pasted part of the substrate is ≤60μm, the radial deviation of the center of the circle between the multilayer boards in the component is ≤60μm, and the equivalent value of the working voltage of the insulation performance test of the component after bonding is ≥30kv.
[0007] In the process of implementing the utility model, the inventor discovered that the prior art has at least one of the following technical problems:
[0008] In the process of manufacturing insulating and withstand voltage products, improving the fitting and assembly of multilayer boards and substrates, and the assembly accuracy of multilayer composite unit components, is a key step to improve product technical indicators. However, the thickness difference between the multilayer board and the substrate, and the protrusions on the multilayer board or / and the substrate will affect the levelness of the multilayer board and the substrate on the platform, and thus affect the fitting and assembly of the multilayer board and the substrate. Utility Model Content
[0009] In view of this, the purpose of the utility model is to provide an auxiliary bracket suitable for the production and assembly of additive customized products.
[0010] The inventor has continuously innovated and reformed through long-term exploration and attempts, as well as multiple experiments and efforts, to solve the above technical problems. The technical solution provided by the utility model is to provide an auxiliary bracket for bonding a PCB board and an AME multilayer board, comprising a plurality of support columns, the tops of the plurality of support columns are connected to a standard frame, a storage platform is reserved on the tops of the support columns, and the top surface of the standard frame is higher than the storage platform and forms a height step.
[0011] Furthermore, the inner hole size of the marking frame is equal to the outer size of the PCB board.
[0012] Furthermore, the height of the elevation step is equal to the thickness of the PCB board.
[0013] Furthermore, the height of the support column is higher than the maximum thickness of the PCB board and the multilayer board.
[0014] Furthermore, a cover plate is also included, and the cover plate can completely cover the multilayer board without exceeding the mark frame.
[0015] Preferably, the cover plate weighs 8 to 15 g.
[0016] Preferably, the weight of the cover plate is 10g.
[0017] Furthermore, the label frame is made of a polylactic acid blend material.
[0018] Furthermore, the support column is made of a polylactic acid blend material.
[0019] Furthermore, a support column is arranged at a corner of the marking frame, and at least one support column is arranged between two corners.
[0020] Compared with the prior art, one of the above technical solutions has the following advantages:
[0021] a) The auxiliary bracket for bonding the PCB board and the AME multilayer board of the utility model suspends the PCB board and the AME multilayer board in the air through the support column, thereby avoiding the influence of the thickness difference between the multilayer board and the substrate, and the protrusions on the multilayer board or / and the substrate, and ensuring that the PCB board can be placed horizontally on the platform to wait for bonding with the AME multilayer board; by setting the marking frame, the fit and flatness of the PCB board and the AME multilayer board can be detected from all directions of front, back, left, and right, and the bonding quality of the PCB board and the AME multilayer board is fully guaranteed.
[0022] b) In one embodiment of the auxiliary bracket for bonding the PCB board and the AME multilayer board of the utility model, a cover plate is provided to help strengthen the bonding effect between the PCB board and the AME multilayer board and eliminate bubbles.
[0023] c) In one embodiment of the auxiliary bracket for bonding the PCB board and the AME multilayer board of the utility model, the marking frame and the support column are made of polylactic acid blend material, which is more conducive to the production of customized products.
[0024] d) Compared with the chimeric assembly of the multilayer board and the substrate on the work surface, the use of the auxiliary bracket of the utility model to bond the PCB board and the AME multilayer board can significantly improve the performance of the product: the surface height deviation of the multilayer board and the substrate after splicing is ≤15μm, the thickness tolerance of the overlapping and bonding part of the substrate is ≤20μm, the radial deviation of the center of the circle between the multilayer boards in the component is ≤20μm, and the working voltage equivalent value of the insulation performance test of the component after bonding is ≥70kv. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0026] Figure 1 It is a schematic diagram of the top structure of a preferred embodiment of the auxiliary bracket of the utility model.
[0027] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional structure.
[0028] Figure 3 It is a schematic diagram of the structure of a preferred embodiment of the auxiliary bracket of the utility model in a top view in use state.
[0029] Figure 4 yes Figure 3 AA section diagram of the explosion structure.
[0030] Figure 5 yes Figure 3 Schematic diagram of the three-dimensional explosion structure.
[0031] The marks in the figure are:
[0032] 100 support columns,
[0033] 101 storage table,
[0034] 200 standard frames,
[0035] 201 level steps,
[0036] 300 cover plate,
[0037] 400 PCB boards,
[0038] 401 first pad,
[0039] 402 through hole,
[0040] 500 layers of boards,
[0041] 501 second pad,
[0042] 502 protrusion. DETAILED DESCRIPTION
[0043] The following is a description with reference to the accompanying drawings and a specific embodiment.
[0044] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is claimed, but merely represents selected embodiments of the utility model.
[0045] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, it may not be further defined or explained in the subsequent drawings.
[0046] See also Figures 1 to 5 The auxiliary bracket for bonding a PCB board 400 and an AME multilayer board 500 described in this embodiment is used to position the PCB board 400 and the AME multilayer board 500 when bonding the PCB board 400 and the multilayer board 500 to improve the connection progress.
[0047] See also Figure 3 to Figure 5 In this embodiment, the PCB board and the AME multilayer board composite board are still confidential products. In order to clearly illustrate the role of the auxiliary bracket of the utility model, this embodiment describes the approximate shape and some indicators of the composite board.
[0048] The PCB board 400 and the AME multilayer board 500 are bonded together. The PCB board 400 is rectangular, with a through hole 402 and a first pad 401 in the middle, and the multilayer board 500 is circular, with a second pad 501 and a protrusion 502. The thickness of the multilayer board 500 is greater than that of the PCB board 400, and the upper surface is required to be flat when aligned and bonded, which causes the lower surface of the multilayer board 500 to protrude from the lower surface of the PCB board 400, which in turn causes many inconveniences when bonding the two circuit boards in production.
[0049] At present, the bonding work is carried out on the platform, and the performance indicators of the produced composite panels are as follows: the surface height deviation after splicing the multi-layer board and the substrate is ≤50μm, the thickness tolerance of the overlapping and bonding part of the substrate is ≤60μm, the radial deviation of the center of the circle between each multi-layer board in the component is ≤60μm, and the equivalent value of the working voltage of the insulation performance test of the component after bonding is ≥30kv.
[0050] In order to improve the performance of the composite board, the present embodiment provides an auxiliary bracket, including a plurality of support columns 100, the tops of the plurality of support columns 100 are connected to a standard frame 200, a storage platform 101 is reserved on the top of the support column 100, and the top surface of the standard frame 200 is higher than the storage platform 101 and forms an elevation step 201. The storage platforms 101 on each support column 100 are located on the same plane, which is parallel to the horizontal plane during bonding and assembly. The auxiliary bracket is usually placed on a platform, so the heights of each support column 100 are equal. The support column 100 is used to suspend the PCB board 400 and the multilayer board 500 to prevent their lower surfaces from contacting the platform, so as to make the upper surfaces of the PCB board 400 and the multilayer board 500 flat. When the PCB board 400 is rectangular, the standard frame 200 is a rectangular frame. The upper surface of the marking frame 200 is parallel to the storage table 101. The marking frame 200 is used to fix the PCB board 400 to prevent the PCB board 400 from being displaced during the bonding process. At the same time, the marking frame provides a reference standard for observing the status of the PCB board 400 and the multilayer board 500, and is used to evaluate the thickness, splicing height, upper surface flatness, and distortion of each composite board.
[0051] According to an embodiment of the auxiliary bracket for bonding the PCB board 400 and the AME multilayer board 500 of the utility model, the hole type size of the inner hole of the marking frame 200 is equal to the outer size of the PCB board 400. Although the position of the PCB board 400 can be limited by multi-point positioning, the distance between the inner wall outside the positioning point of the marking frame 200 and the outer wall of the PCB board 400 will increase, which is not conducive to improving the observation accuracy. The hole type size of the inner hole of the marking frame 200 is set to the outer size of the PCB board 400, so that the outer wall of the PCB board 400 fits the inner hole side wall of the marking frame 200, which is more convenient to clearly observe the height difference between the marking frame 200 and the PCB board 400.
[0052] According to an embodiment of the auxiliary bracket for bonding the PCB board 400 and the AME multilayer board 500 of the utility model, the height of the elevation step 201 is equal to the thickness of the PCB board 400. In some alternative embodiments, the flow into the elevation step 201 is higher than the thickness of the PCB board 400, and a scale line is set on the elevation step 201, so that the state of the composite board can be observed by comparison. However, the height of the elevation step 201 is equal to the thickness of the PCB board 400, so the height profit and loss of the thickness of the PCB board 400 relative to the upper surface of the mark frame 200 can be better observed. Because the composite board described in this embodiment is a small-batch high-standard customized product, and a cheaper auxiliary bracket manufacturing technology is used, even if an auxiliary bracket is customized for each composite board, it is acceptable in terms of cost. From the perspective of improving observation accuracy, it is recommended to set the height of the elevation step 201 to the thickness of the PCB board 400.
[0053] According to an embodiment of the auxiliary bracket for bonding the PCB board 400 and the AME multilayer board 500 of the utility model, the height of the support column 100 is higher than the maximum thickness of the PCB board 400 and the multilayer board 500. It is ensured that the bottom of the PCB board 400 and the multilayer board 500 is completely non-contact with the platform. The maximum thickness refers to the total thickness of the PCB board 400 or the multilayer board 500 body and the possible electronic components thereon.
[0054] According to an embodiment of the auxiliary bracket for bonding the PCB board 400 and the AME multilayer board 500 of the utility model, it also includes a cover plate 300, and the cover plate 300 can completely cover the multilayer board 500 and does not exceed the mark frame 200. Figure 5 In the embodiment, the size of the cover plate 300 is the same as that of the multilayer plate 500. The cover plate 300 has a certain weight and is used to apply pressure to the multilayer plate 500 to enhance the bonding effect and eliminate bubbles.
[0055] According to an embodiment of the auxiliary bracket for bonding the PCB board 400 and the AME multilayer board 500 of the utility model, the weight of the cover plate 300 is 8-15g, preferably, the weight of the cover plate 300 is 10g. The weight setting of the cover plate 300 should not only meet the pressure effect, but also avoid deformation of the PCB board 400 caused by the cover plate.
[0056] According to an embodiment of the auxiliary bracket for bonding the PCB board 400 and the AME multilayer board 500 of the utility model, the marking frame 200 is made of a polylactic acid blend material, and the support column 100 is made of a polylactic acid blend material. Polylactic acid blends are known materials, and the applicant has not improved the material. Polylactic acid blends, also known as CR-PLA, are commonly used materials for printing materials using fused deposition manufacturing (FDM) technology. The CR-PLA material auxiliary bracket printed using FDM technology has the following characteristics: green raw materials, light weight, low shrinkage, high rigidity, excellent impact toughness, wear resistance, good dimensional stability, economical and affordable, and can quickly conduct concept verification and design development. If an auxiliary bracket made of stainless steel is used, the output of customized services is not high, the cost of metal is high, the manufacturing is cumbersome, the later utilization rate is low, and the degree of resource waste is high.
[0057] According to an embodiment of the auxiliary bracket for bonding the PCB board 400 and the AME multilayer board 500 of the utility model, a support column 100 is arranged at a corner of the marking frame 200, and at least one support column 100 is arranged between two corners. Figure 1 and Figure 2 The figure shows a situation where a support column 100 is arranged between two corners. Eight support columns 100 can better support the PCB board 400 from all sides in the later processing process. Arranging multiple support columns instead of supporting rings is to facilitate air flow under the composite board in the later process, facilitate temperature transfer, enable the composite board to be better heated, and improve the curing quality.
[0058] The auxiliary bracket of the utility model is used to bond the PCB board 400 and the AME multilayer board 500. First, the PCB board 400 is placed in the standard frame to check whether the PCB board is flat, perfectly fitted, and distorted on the bracket. Next, a conductive glue is quantitatively applied on the first pad 401 of the PCB board 400. The conductive glue is a layer with a thickness controlled at 0.1mm. The multilayer board 500 is sucked up by a suction cup, and the second pad 501 of the multilayer board is overlapped with the first pad 401 after calibration, and pressed into place to keep it level. Next, a 10g heavy cover plate 300 is placed on the overlapped plate to enhance the bonding effect and eliminate bubbles. Then, it is placed in a blast drying oven, maintained at 50°C, and dried for 24 hours to complete curing. After curing, it is taken out to complete the production operation.
[0059] After using the auxiliary bracket, the surface height deviation of the multilayer board and the substrate after splicing is ≤15μm, the thickness tolerance of the overlapping and laminating part of the substrate is ≤20μm, the radial deviation of the center of each multilayer board in the component is ≤20μm, and the equivalent working voltage value of the insulation performance test of the component after bonding is ≥70kv. All indicators are better than the bonding process directly performed on the platform.
[0060] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0061] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0062] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0063] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0064] The above are only preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be regarded as limiting the present invention. The protection scope of the present invention should be based on the scope defined by the claims. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. An auxiliary bracket for bonding a PCB board and an AME multilayer board, characterized in that: It comprises a plurality of support columns, the tops of which are connected with a marking frame, the tops of which are reserved with a storage platform, the top surface of the marking frame is higher than the storage platform and forms a height step.
2. The auxiliary bracket for bonding a PCB board and an AME multilayer board according to claim 1, characterized in that: The inner hole size of the marking frame is equal to the outer size of the PCB board.
3. The auxiliary bracket for bonding the PCB board and the AME multilayer board according to claim 1, characterized in that: The height of the elevation step is equal to the thickness of the PCB board.
4. The auxiliary bracket for bonding a PCB board and an AME multilayer board according to claim 1, characterized in that: The height of the support column is higher than the maximum thickness of the PCB board and the multilayer board.
5. The auxiliary bracket for bonding a PCB board and an AME multilayer board according to claim 1, characterized in that: A cover plate is also included, and the cover plate can completely cover the multilayer board without exceeding the mark frame.
6. The auxiliary bracket for bonding the PCB board and the AME multilayer board according to claim 5, characterized in that: The weight of the cover plate is 8-15g.
7. The auxiliary bracket for bonding a PCB board and an AME multilayer board according to claim 6, characterized in that: The weight of the cover plate is 10 g.
8. The auxiliary bracket for bonding a PCB board and an AME multilayer board according to claim 1, characterized in that: The label frame is made of polylactic acid blend material.
9. The auxiliary bracket for bonding a PCB board and an AME multilayer board according to claim 8, characterized in that: The support column is made of polylactic acid blend material.
10. The auxiliary bracket for bonding a PCB board and an AME multilayer board according to claim 1, characterized in that: A support column is arranged at a corner of the marking frame, and at least one support column is arranged between two corners.