Circuit board and display module

Abstract

The utility model provides a circuit board and a display module. The circuit board comprises a substrate, and a plurality of voltage conversion units and a plurality of light-emitting driving units which are arranged on the substrate, and each voltage conversion unit comprises an input end and an output end and is configured to output a preset voltage; the light-emitting driving unit is connected to the output end of the voltage conversion unit and is configured to drive the light-emitting unit; wherein the plurality of voltage conversion units and the plurality of driving units are arranged in a one-to-one correspondence manner, and the voltage conversion units are arranged between the adjacent light-emitting driving units; the voltage conversion unit comprises a first inductor and a second inductor which are connected in parallel and are arranged in a staggered mode. According to the circuit board provided by the invention, the voltage conversion units are arranged between the adjacent light-emitting driving units, and the first inductors and the second inductors in the voltage conversion units are arranged in the staggered manner, so that components with relatively high heat can be arranged in a dispersed manner, and the heating addition influence between the components is improved.

Description

Technical Field

[0001] At least one embodiment of the utility model relates to a circuit board and a display module. Background Art

[0002] With the development of light emitting diode (LED) technology, its application scope is also expanding. In some liquid crystal screen devices, the constant current board can output a constant current to the LED backlight source, thereby ensuring the consistency of brightness and color of each LED. Utility Model Content

[0003] At least one embodiment of the utility model provides a circuit board, comprising: a substrate; a plurality of voltage conversion units and a plurality of light-emitting driving units arranged on the substrate, the voltage conversion unit comprising an input end and an output end, and being configured to output a preset voltage; the light-emitting driving unit is connected to the output end of the voltage conversion unit, and is configured to drive the light-emitting unit; wherein the plurality of voltage conversion units and the plurality of light-emitting driving units are arranged in a one-to-one correspondence, and the voltage conversion unit is arranged between adjacent light-emitting driving units; the voltage conversion unit comprises a first inductor and a second inductor connected in parallel, and the first inductor and the second inductor are arranged in a staggered manner.

[0004] For example, according to an embodiment of the present utility model, the circuit board includes a first edge close to the voltage conversion unit in a first direction, and the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; the first inductor is spaced apart from the first edge in the first direction at a first spacing, and the second inductor is spaced apart from the first edge in the first direction at a second spacing, and the first spacing is different from the second spacing.

[0005] For example, according to an embodiment of the present invention, the difference between the first spacing and the second spacing is less than or equal to 1 / 2 of the width dimension of the first inductor in the first direction.

[0006] For example, according to an embodiment of the present utility model, the plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of a first light-emitting driving unit in a first direction, where the first direction is the direction from the voltage conversion unit to the light-emitting driving unit; the first voltage conversion unit includes a first inductor module, and the second voltage conversion unit includes a second inductor module; the distance between the first inductor module and the second inductor module in the first direction is y, the orthographic projection of the first inductor on a first reference plane and the orthographic projection of the second inductor on the first reference plane have non-overlapping parts, the size of the non-overlapping parts in the first direction is h, and the size of the light-emitting driving unit in the first direction is x, then: y = a × x + b × h, 2 < a < 4, 1 < b < 3; where the second direction intersects the first direction, and the first reference plane is a plane perpendicular to the second direction.

[0007] For example, according to an embodiment of the present utility model, the plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of a first light-emitting driving unit, the first voltage conversion unit includes a first inductor module, a first capacitor module and a first switch module, and the second voltage conversion unit includes a second inductor module; the distance between the first inductor module and the second inductor module in a first direction is y, the size of the first inductor module in the first direction is y1, the size of the first capacitor module in the first direction is y2, and the size of the first switch module in the first direction is y3, then: y = k × y1 + y3 + 2 × y2, 1 < k < 3; where the first direction is the direction from the voltage conversion unit to the light-emitting driving unit.

[0008] For example, according to an embodiment of the present utility model, the plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of the first light-emitting driving unit, the first voltage conversion unit includes a first inductance module, a first capacitor module and a first switch module; the first inductance module includes the first inductance and the second inductance connected in parallel to each other, the first inductance and the second inductance have a first interval in the second direction, the first capacitor module includes a first output capacitor module and a first input capacitor module connected in parallel to each other, the first output capacitor module and the first input capacitor module have a second interval in the second direction, the first switch module includes a first switch and a second switch connected in parallel to each other, the first switch and the second switch have a third interval in the second direction, the second voltage conversion unit includes a second capacitor module, the second capacitor module includes a second output capacitor module and a second input capacitor module connected in parallel to each other, the second output capacitor module and the second input capacitor module have a fourth interval in the second direction; the fourth interval has an overlapping portion with at least one of the first interval, the second interval and the third interval on a second reference plane, the second reference plane is a plane perpendicular to the first direction, the first direction is a direction from the voltage conversion unit to the light-emitting driving unit, and the second direction is parallel to the substrate and intersects with the first direction.

[0009] For example, according to an embodiment of the present invention, the first interval, the second interval, the third interval, and the fourth interval have a common overlapping portion on the second reference plane.

[0010] For example, according to an embodiment of the present invention, a size of the common overlapping portion in the second direction is less than or equal to a size of the first interval in the second direction.

[0011] For example, according to an embodiment of the present invention, the ratio of the size of the common overlapping portion in the second direction to the size of the first interval in the second direction is 0.3-0.7.

[0012] For example, according to an embodiment of the present invention, the first interval, the second interval, the third interval and the fourth interval are configured to satisfy at least one of the following conditions: the first interval is greater than or equal to 10 mm; the second interval is greater than or equal to 28 mm; the third interval is greater than or equal to 8 mm; the fourth interval is greater than or equal to 4 mm.

[0013] For example, according to an embodiment of the present utility model, the second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor arranged opposite to each other in a second direction; the second direction is parallel to the substrate and intersects with the first direction; the first interval is configured to satisfy at least one of the following conditions: the orthographic projection of the first interval on the second reference plane and the orthographic projection of the third inductor or the fourth inductor on the second reference plane have a first overlapping part; the size of the first overlapping part in the second direction is greater than 1 / 3 of the size of the third inductor or the fourth inductor in the second direction; the orthographic projection of the first interval on the second reference plane and the orthographic projection of the second input capacitor module on the second reference plane have a third overlapping part, and the size of the third overlapping part in the second direction is greater than 1 / 3 of the size of the second input capacitor module in the second direction.

[0014] For example, according to an embodiment of the present invention, a size of the first interval in the second direction is the same as a distance between the third inductor and the fourth inductor in the second direction.

[0015] For example, according to an embodiment of the present invention, the second interval is configured to satisfy at least one of the following conditions: the second voltage conversion unit includes a second inductance module, and the orthographic projection of the second interval on the second reference plane at least partially overlaps with the orthographic projection of the second inductance module on the second reference plane; the orthographic projection of the second interval on the second reference plane and the orthographic projection of the second output capacitor module or the second input capacitor module on the second reference plane have an eighth overlapping portion, and the size of the eighth overlapping portion in the second direction is greater than 2 / 3 of the size of the second output capacitor module or the second input capacitor module in the second direction.

[0016] For example, according to an embodiment of the present utility model, the second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor arranged relatively in the second direction; the second interval is configured to satisfy at least one of the following conditions: the size of the second interval in the second direction is larger than the size of the first inductor or the second inductor in the second direction; the orthographic projection of the second interval on the second reference plane and the orthographic projection of the first inductor or the second inductor on the second reference plane have a sixth overlapping part, and the size of the sixth overlapping part in the second direction is larger than 1 / 3 of the size of the first inductor in the second direction; the orthographic projection of the second interval on the second reference plane at least partially overlaps with the orthographic projection of the third inductor on the second reference plane; the orthographic projection of the second interval on the second reference plane completely overlaps with the orthographic projection of the fourth inductor on the second reference plane.

[0017] For example, according to an embodiment of the present utility model, the second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor arranged relatively to each other in the second direction; the third interval is configured to satisfy at least one of the following conditions: the orthographic projection of the third interval on the second reference plane and the orthographic projection of the third inductor or the fourth inductor on the second reference plane have a fourteenth overlapping part; the orthographic projection of the third interval on the second reference plane and the orthographic projection of the second output capacitor module or the second input capacitor module on the second reference plane have a sixteenth overlapping part.

[0018] For example, according to an embodiment of the present invention, the size of the fourteenth overlapping portion in the second direction is larger than the size of the third inductor or 1 / 2 of the size in the second direction; and / or the size of the sixteenth overlapping portion in the second direction is larger than 1 / 3 of the size of the second output capacitor module or the second input capacitor module in the second direction.

[0019] For example, according to an embodiment of the present invention, the second voltage conversion unit includes a second inductor module; an orthographic projection of the first inductor module on the second reference plane and an orthographic projection of the second inductor module on the second reference plane have non-overlapping portions.

[0020] For example, according to an embodiment of the present utility model, the voltage conversion unit includes an inductor module, a diode module, a switch module, an output capacitor module, and an input capacitor module; the inductor module includes the first inductor and the second inductor; the inductor module is connected between the input end of the voltage conversion unit and the positive electrode of the diode module; the negative electrode of the diode module is connected to the output end of the voltage conversion unit; the switch module includes a control end, an input end, and an output end, the control end of the switch module is configured to receive a control signal, the control signal is used to control the conduction or cutoff between the input end and the output end of the switch module, one of the input end and the output end of the switch module is connected between the inductor module and the diode module, and the other of the input end and the output end of the switch module is connected to the ground end; the first electrode of the output capacitor module is connected to the negative electrode of the diode module, and the second electrode of the output capacitor module is connected to the ground end; the input capacitor module is connected between the input end and the ground end.

[0021] For example, according to an embodiment of the present utility model, the substrate includes a first edge and a second edge arranged opposite to each other in the first direction, and in each of the driving structures, the first direction is a direction pointing from the voltage conversion unit to the light-emitting driving unit, and at least in the voltage conversion unit closest to the first edge of the substrate, the inductor module is arranged on a side of the voltage conversion unit away from the light-emitting driving unit in the first direction; the output capacitor module is arranged on a side of the voltage conversion unit close to the light-emitting driving unit in the first direction; the input capacitor module and the output capacitor module are arranged opposite to each other in the second direction, and the second direction is parallel to the substrate and intersects with the first direction; the diode module is closer to the third edge of the substrate than the inductor module and the output capacitor module, and the third edge connects the first edge and the second edge; the switch module is arranged between the inductor module and the output capacitor module.

[0022] For example, according to an embodiment of the present utility model, the circuit board is configured to satisfy at least one of the following conditions: the switch module includes at least a first switch element and a second switch element connected in parallel; the spacing between the first switch element and the second switch element in the second direction is greater than or equal to 8 mm; the output capacitor module includes at least a first output capacitor module and a second output capacitor module connected in parallel; the spacing between the first output capacitor module and the second output capacitor module in the first direction is greater than or equal to 2 mm; in the voltage conversion unit closest to the first edge of the substrate, the distance between the inductor module and the periphery of the substrate in the first direction is greater than or equal to 5 mm; the diode module includes a first diode and a second diode connected in parallel, and the spacing between the first diode and the second diode in the first direction is greater than or equal to 9 mm; wherein the first direction is a direction from the voltage conversion unit to the light-emitting drive unit, and the second direction is parallel to the substrate and intersects with the first direction.

[0023] For example, according to an embodiment of the present utility model, the voltage conversion unit is configured to satisfy at least one of the following conditions: the spacing between the inductor module and the switch module in the first direction is greater than or equal to 10 mm; the spacing between the inductor module and the diode module in the second direction is greater than or equal to 12 mm; the spacing between the inductor module and the output capacitor module in the first direction is greater than or equal to 15 mm; the spacing between the inductor module and the input capacitor module in the first direction is greater than or equal to 29 mm; the spacing between the diode module and the switch module in the second direction is greater than or equal to 10 mm; the spacing between the diode module and the output capacitor module in the first direction is greater than or equal to 4 mm; the spacing between the switch module and the output capacitor module in the second direction is greater than or equal to 3 mm; the spacing between the switch module and the input capacitor module in the first direction is greater than or equal to 6 mm; the spacing between the switch module and the input capacitor module in the second direction is greater than or equal to 2 mm.

[0024] For example, according to an embodiment of the present invention, the diode module includes a Schottky diode; and / or the switch module includes a transistor.

[0025] For example, according to an embodiment of the present invention, the voltage conversion unit is provided in plurality, and the light-emitting driving unit is provided in plurality; the plurality of voltage conversion units and the plurality of light-emitting driving units are provided in one-to-one correspondence, and the voltage conversion units and the light-emitting driving units corresponding to each other are connected to form a plurality of driving structures; the plurality of driving structures are arranged in sequence along a first direction, and the plurality of light-emitting driving units and the plurality of voltage conversion units are alternately provided along the first direction; the plurality of driving structures include a first driving structure and a second driving structure, the first driving structure includes a first voltage conversion unit and a first light-emitting driving unit, and the second driving structure includes a second voltage conversion unit and a second light-emitting driving unit; the first driving structure and the second driving structure are configured to satisfy at least one of the following conditions: the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the second voltage conversion unit on the second reference plane perpendicular to the first direction There is a non-overlapping part in the orthographic projection on the straight plane; the second reference plane is a plane perpendicular to the first direction; there is a non-overlapping part in the orthographic projection of the first light-emitting driving unit on the second reference plane and the orthographic projection of the second light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the first light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the second light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the second voltage conversion unit on the second reference plane and the orthographic projection of the second light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the second voltage conversion unit on the second reference plane and the orthographic projection of the first light-emitting driving unit on the second reference plane.

[0026] For example, according to an embodiment of the present utility model, the first voltage conversion unit includes a first diode module and a first input capacitor module, the first light-emitting driving unit includes a first switch tube module and a first driving module; the second voltage conversion unit includes a second output capacitor module and a second inductor module, the second light-emitting driving unit includes a second switch tube module and a second driving module; the first driving structure and the second driving structure are configured to satisfy at least one of the following conditions: the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the second output capacitor module on the second reference plane have a first non-overlapping portion; the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane have a second non-overlapping portion; the orthographic projection of the first switch tube module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane have a third non-overlapping portion; the orthographic projection of the first driving module on the second reference plane and the orthographic projection of the second driving module on the second reference plane have a fourth non-overlapping portion; the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the first switch tube module on the second reference plane have a fourth non-overlapping portion. There is a fifth non-overlapping portion between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the first driver module on the second reference plane; there is a sixth non-overlapping portion between the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane; there is an eighth non-overlapping portion between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the second driver module on the second reference plane; there is a ninth non-overlapping portion between the orthographic projection of the first switch tube module on the second reference plane and the orthographic projection of the second output capacitor module on the second reference plane; there is a tenth non-overlapping portion between the orthographic projection of the first driver module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane; there is an eleventh non-overlapping portion between the orthographic projection of the second output capacitor module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane; there is a twelfth non-overlapping portion between the orthographic projection of the second inductor module on the second reference plane and the orthographic projection of the second driver module on the second reference plane.

[0027] For example, according to an embodiment of the present utility model, the substrate includes a first conductive layer and a first solder resist layer, the first conductive layer and the first solder resist layer are located on a side of the substrate where the light-emitting driving unit is provided, and the first conductive layer is located on a side of the first solder resist layer away from the light-emitting driving unit; the voltage conversion unit includes an inductor module, a diode module, and a switch module, the inductor module includes the first inductor and the second inductor; a first opening is provided in the first solder resist layer to expose the first conductive layer; the first opening surrounds at least one of the inductor module, the diode module and the switch module.

[0028] For example, according to an embodiment of the present utility model, the first opening includes a first opening portion, a second opening portion and a third opening portion that do not overlap each other; the first opening portion is located between the inductor module, the diode module and the switch module, the second opening portion surrounds the inductor module, and the third opening portion surrounds the diode module; wherein the area of ​​the first opening portion is greater than the area of ​​the second opening portion, and the area of ​​the first opening portion is greater than the area of ​​the third opening portion.

[0029] For example, according to an embodiment of the present invention, the area of ​​the first opening is less than or equal to 800 square millimeters; the area of ​​the second opening is greater than or equal to 320 square millimeters; and the area of ​​the third opening is greater than or equal to 90 square millimeters.

[0030] For example, according to an embodiment of the present invention, the substrate includes a second conductive layer and a second solder resist layer located on a side of the first conductive layer away from the first solder resist layer, and the second conductive layer is located between the second solder resist layer and the first conductive layer; a second opening exposing the second conductive layer is opened in the second solder resist layer; the orthographic projection of the second opening on the third reference plane overlaps with the orthographic projection of the first opening on the third reference plane; and the third reference plane is parallel to the substrate.

[0031] For example, according to an embodiment of the present invention, it also includes: a plurality of vias penetrating at least the first conductive layer and the second conductive layer, and the plurality of vias are arranged in an array; the orthographic projection of the first opening on the third reference plane covers at least part of the orthographic projection of the vias on the third reference plane.

[0032] For example, according to an embodiment of the present invention, a shielding component is further included; the shielding component is at least arranged on two opposite sides of the light-emitting driving unit in a first direction, and the first direction is a direction pointing from the voltage conversion unit to the light-emitting driving unit.

[0033] At least one embodiment of the utility model provides a display module, comprising: a back plate; a circuit board as described in any of the above embodiments, arranged on the back plate; a light-emitting unit, arranged on a side of the back plate away from the circuit board and connected to the driving structure; and a shell, covering the outside of the circuit board; wherein the shell comprises a top wall and a bottom wall arranged opposite to each other in the first direction; the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; the shell is configured to satisfy at least one of the following conditions: a first through hole is provided on the top wall, and the first through hole connects the internal space and the external space of the shell; and a second through hole is provided on the bottom wall, and the second through hole connects the internal space and the external space of the shell.

[0034] For example, according to an embodiment of the present utility model, the shell also includes a side wall connecting the top wall and the bottom wall, and the side wall is provided with a third through hole; the orthographic projection of the third through hole on the third reference plane overlaps with the orthographic projection of the driving structure on the third reference plane; and the third reference plane is parallel to the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present utility model, rather than limiting the present utility model.

[0036] Figure 1 The present invention is a schematic diagram of a light panel exemplified by the present invention.

[0037] Figure 2 This is a schematic diagram of the area division of a light-emitting unit exemplified in the present invention.

[0038] Figure 3 It is a schematic diagram of a mainboard driving architecture of a light-emitting unit exemplified in the present invention.

[0039] Figure 4 It is a schematic diagram of a sub-board driving architecture of a light-emitting unit exemplified by the present invention.

[0040] Figure 5 This is a schematic diagram of another light panel exemplified by the present invention.

[0041] Figure 6 This is a schematic diagram of the area division of another light-emitting unit exemplified in the present invention.

[0042] Figure 7 It is a schematic diagram of another mainboard driving architecture of a light-emitting unit exemplified in the present invention.

[0043] Figure 8It is a schematic diagram of another sub-board driving architecture of a light-emitting unit exemplified in the present invention.

[0044] Fig. 9 The present invention is a schematic diagram of a light-emitting unit driving circuit exemplified in the present invention.

[0045] Fig. 10A The present invention is a schematic diagram of a circuit board exemplified by the present invention.

[0046] Fig. 10B for Fig. 10A A partial schematic diagram of the circuit board shown.

[0047] Fig.11 This is a schematic diagram of another light-emitting unit driving circuit exemplified in the present invention.

[0048] Fig. 12A This is a schematic diagram of another circuit board exemplified by the present invention.

[0049] Fig. 12B for Fig. 12A A partial schematic diagram of the circuit board shown.

[0050] Fig.13A A schematic diagram of a light-emitting unit driving circuit provided by at least one embodiment of the present utility model.

[0051] Fig. 13B This is a schematic diagram of the principle of a voltage conversion unit in a light-emitting unit driving circuit provided in an example of the present utility model.

[0052] Fig. 13C This is a schematic diagram of the principle of a voltage conversion unit in a light-emitting unit driving circuit provided by another example of the present invention.

[0053] Fig.13D A schematic diagram of the principle of a control module in a voltage conversion unit provided as an example of the utility model.

[0054] Fig.13E This is a schematic diagram of an equivalent circuit of a control module provided as an example of the present utility model.

[0055] Fig.13F A schematic diagram of the principle of a control module in a voltage conversion unit provided as another example of the present utility model.

[0056] Figure 13G This is a schematic diagram of an equivalent circuit of a control module provided in another example of the present utility model.

[0057] Fig.14 This is a schematic diagram of a light-emitting unit driving circuit provided by another example of the present invention.

[0058] Fig.15AA schematic diagram of one side surface of a circuit board provided by at least one embodiment of the utility model.

[0059] Fig. 15B A schematic diagram of the other side surface of a circuit board provided by at least one embodiment of the utility model.

[0060] Fig. 15C for Fig.15A A partial schematic diagram of the circuit board shown.

[0061] Fig.15D for Fig.15A A schematic plan view of the circuit board shown.

[0062] Fig.16 This is a schematic diagram of a light-emitting unit driving circuit provided by another example of the present invention.

[0063] Fig.17A The present invention is a schematic diagram of a circuit board provided in yet another example.

[0064] Fig. 17B for Fig.17A A partial schematic diagram of the circuit board shown.

[0065] Fig. 17C for Fig.17A A schematic plan view of the circuit board shown.

[0066] Fig.18 The present invention is a schematic diagram of a light-emitting unit driving circuit provided in yet another example.

[0067] Fig.19 A schematic diagram of a housing provided in accordance with an example of the present invention. DETAILED DESCRIPTION

[0068] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution of the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the described embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0069] Unless otherwise defined, the technical terms or scientific terms used in this utility model shall have the usual meanings understood by people with ordinary skills in the field to which this utility model belongs. The words "first", "second" and similar words used in this utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. The words "include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0070] The features such as "vertical", "parallel" and "same" used in the embodiments of the present invention include the features such as "vertical", "parallel" and "same" in a strict sense, as well as the cases where "approximately vertical", "approximately parallel" and "approximately the same" contain certain errors, taking into account the errors associated with the measurement of specific quantities (that is, the limitations of the measurement system), and are expressed within the acceptable deviation range for specific values ​​determined by ordinary technicians in this field. The "center" in the embodiments of the present invention can include a position strictly located at the geometric center and a position approximately centered within a small area around the geometric center. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the value.

[0071] At present, local dimming technology (LD) has been widely used in splicing screens on the market, but most commercial display advertising screens do not have the function of local dimming, and the brightness is generally less than 1000nit. Most of these products use AC / DC (Alternating Current to Direct Current) converters to convert 220v AC voltage into a voltage that matches the LED light strip, thereby achieving constant current drive for the LED light strip. At the same time, the components of the AC / DC converter support high-power output, and the requirements for the package size and height of the components are relatively low.

[0072] In order to achieve the local dimming function of display devices such as commercial display advertising screens while meeting the requirements of backlight brightness and wide temperature operation, it is necessary to perform voltage conversion through a direct current to direct current (DC / DC) converter and control the constant current output at the same time. In addition, higher requirements are also placed on the package size and height of components. Limited by size, cost, etc., DC-to-DC converters often use smaller packaged power MOSFETs (metal-oxide semiconductor field-effect transistors), and it is often impossible to add heat sinks. This makes MOSFET face the problem of overtemperature. On this basis, the temperature rise of components is often too high, and the heat dissipation efficiency is difficult to improve.

[0073] For example, local dimming technology can divide the entire light-emitting unit into multiple light-emitting partitions that can be driven separately, and each light-emitting partition includes one or more LEDs. According to the grayscale that needs to be displayed in different parts of the display screen, the driving current of the LEDs in the light-emitting partitions corresponding to these parts is automatically adjusted to achieve separate adjustment of the brightness of each partition in the light-emitting unit, thereby improving the contrast of the display screen. Local dimming technology is usually only applicable to direct-type light-emitting units, and multiple LEDs as light sources are evenly distributed on the entire backplane, for example.

[0074] At least one embodiment of the utility model also provides a circuit board, including: a substrate and a plurality of voltage conversion units and a plurality of light-emitting driving units arranged on the substrate, the voltage conversion unit including an input end and an output end, and being configured to output a preset voltage; the light-emitting driving unit is connected to the output end of the voltage conversion unit, and is configured to drive the light-emitting unit; wherein the plurality of voltage conversion units and the plurality of driving units are arranged in a one-to-one correspondence, and a voltage conversion unit is arranged between adjacent light-emitting driving units; the voltage conversion unit includes a first inductor and a second inductor connected in parallel, and the first inductor and the second inductor are arranged in a staggered manner. The circuit board provided by the present disclosure can disperse components with higher heat and improve the heat addition effect between components by arranging a voltage conversion unit between adjacent light-emitting driving units and arranging the first inductor and the second inductor in the voltage conversion unit in a staggered manner.

[0075] At least one embodiment of the present utility model further provides a display module, comprising: a back plate; a circuit board as in any of the above embodiments, arranged on the back plate; a light-emitting unit, arranged on a side of the back plate away from the circuit board and connected to the driving structure; and a housing, which is covered outside the circuit board; wherein the housing comprises a top wall and a bottom wall arranged opposite to each other in a first direction; the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; the housing is configured to satisfy at least one of the following conditions: the top wall is provided with a first through hole, the first through hole connecting the internal space and the external space of the housing; the bottom wall is provided with a second through hole, the second through hole connecting the internal space and the external space of the housing. In the display module provided by at least one embodiment of the present utility model, the first through hole provided on the top wall and the second through hole provided on the bottom wall can connect the internal and external spaces of the housing, can dissipate heat from both sides of the circuit board in the first direction, accelerate the heat exchange between the internal and external spaces of the housing, and improve the heat dissipation efficiency.

[0076] The circuit board, display module and display device provided by the present invention are described below with reference to the accompanying drawings and through some embodiments.

[0077] Figure 1 The present invention is a schematic diagram of a light panel exemplified by the present invention. Figure 2This is a schematic diagram of the area division of a light-emitting unit exemplified in the present invention.

[0078] For example, Figure 1 4 light boards are shown, each of which is provided with a light emitting unit 10A, and the light emitting units 10A on the 4 light boards are arranged in two rows and two columns. For example, the region division diagram of the light source LED 11A in each light emitting unit 10A is as follows: Figure 2 As shown in the figure, the small square represents an LED 11A, and the multiple areas framed by the dotted lines represent the light-emitting subareas 12A. Each light-emitting unit 10A may include multiple light-emitting subareas 12A. It is understandable that Figure 2 4 dotted boxes are shown in the figure, but it does not mean that there are only 4 light-emitting subareas 12A on the light-emitting unit 10A, and other light-emitting subareas 12A on the light-emitting unit 10A are omitted. Each light-emitting subarea 12A includes one or more LEDs 11A, and can be controlled independently of other light-emitting subareas 12A. For example, the multiple LEDs 11A in each light-emitting subarea 12A are linked, that is, the current passing through the multiple LEDs 11A in the same light-emitting subarea 12A is consistent, so that the light brightness is basically consistent.

[0079] like Figure 2 As shown, the light emitting unit includes a plurality of light emitting subareas 12A. For example, the light emitting unit can be driven by a local dimming method. For example, Figure 2 , a light-emitting unit including 12 light-emitting subareas 12A is shown, and each light-emitting subarea 12A includes 24 LEDs 11A, but the present invention is not limited thereto.

[0080] Figure 3 It is a schematic diagram of a mainboard driving architecture of a light-emitting unit exemplified in the present invention. Figure 4 It is a schematic diagram of a sub-board driving architecture of a light-emitting unit exemplified by the present invention.

[0081] like Figure 3 and Figure 4 As shown, two constant current boards control four light emitting units 10A, and each constant current board controls one light emitting unit 10A. In combination with some of the above embodiments, the maximum anode voltage of the 24 LEDs 11A in each light emitting partition 12A needs to be about 72V.

[0082] For example, each constant current board is boosted by a boost converter and regulated by a constant current through an LED driver. In the two constant current boards, a microcontroller unit (MCU) is also provided on the main board, which is used to control the LED driver to regulate the LED current and establish communication between the main constant current board and the other sub-board constant current board.

[0083] like Figure 3 As shown, the main board 010 is provided with two boost converters 011, two buck converters 012 (BuckConverter) and two groups of LED drivers 013. For example, the main board 010 includes input interfaces CN1-CN2 and output interfaces CN4-CN6. The input interface CN1 on the main board 010 can receive a 24V voltage and input voltage to the two boost converters 011 and the two buck converters 012. For example, each boost converter 011 outputs a first drive signal (for example, a high voltage) to the LED anode in a corresponding light-emitting unit through the output interfaces CN5-CN6. The two groups of LED drivers 013 output a second drive signal (for example, a low voltage) to the LED cathode in a corresponding light-emitting unit through the output interfaces CN5 and CN6. As a result, the LED in the light-emitting unit is applied with a corresponding drive voltage (for example, the drive voltage is the difference voltage between the first drive signal and the second drive signal), so that the corresponding drive current flows through and emits light. The microcontroller unit 014 is used to control the LED driver 013 to drive each corresponding light-emitting partition 12A to be turned on or off, and is also used to control the magnitude of the current when turned on, thereby realizing local dimming of the two light-emitting units 10A controlled by the mainboard 010. The buck converter 012a is used to step down the 24V high voltage input from the input interface CN1 to a 12V low voltage, thereby supplying power to the LED driver 013, and the buck converter 012b is used to step down the 12V low voltage to 3.3V, thereby supplying power to the microcontroller unit 014.

[0084] like Figure 4 As shown, the sub-board 020 is provided with two boost converters 021, one buck converter 022 and two groups of LED drivers 023. For example, the sub-board 020 includes input interfaces CN1 and CN3, and also includes output interfaces CN5 and CN6. For example, the input interface CN1 on the sub-board 020 can receive a 24V voltage. The driving principle of driving the LED to emit light in the sub-board 020 is roughly the same as that of the main board 010, and reference can be made to the driving method of the aforementioned main board 010. For example, the microcontroller unit 014 on the main board 010 transmits backlight data to the LED driver 023 through three groups of serial peripheral interfaces (SPI). The first group SPI1 is used to receive local dimming data through the input interface CN2, and after processing, it is sent to the LED driver 013 on the main board 010 through the second group SPI2, and at the same time, it is sent to the LED driver 023 of the sub-board 020 through the input interface CN3 by the third group SPI3, so as to correspond to LEDs in different partitions.

[0085] For example, the driving current outputted through the output interfaces CN5-CN6 can be obtained by a conventional algorithm in the art, and the opening time of the output interfaces CN5-CN6 can be obtained according to the backlight data to realize local dimming. For example, the LED driver 023 can provide a switch control signal and an output control signal to the output interfaces CN5-CN6, thereby driving the LEDs in each backlight partition to emit light. For example, the aforementioned backlight data includes a width configuration parameter of the output control signal of the output interfaces CN5-CN6.

[0086] Figure 5 This is a schematic diagram of another light panel exemplified by the present invention. Figure 6 This is a schematic diagram of the area division of another light-emitting unit exemplified in the present invention. Figure 7 It is a schematic diagram of another mainboard driving architecture of a light-emitting unit exemplified in the present invention. Figure 8 It is a schematic diagram of another sub-board driving architecture of a light-emitting unit exemplified in the present invention.

[0087] For example, Figure 5 The six light emitting units 10A on the six light boards are arranged in three rows and two columns. Figure 6 The light-emitting unit shown in FIG. 1 includes 12 light-emitting subareas 12A, each light-emitting subarea 12A includes 30 LEDs 11A. Similarly, the present invention is not limited to this. In combination with some of the above embodiments, the anode voltage of the LED 11A light string in each light-emitting subarea 12A needs to be at most about 90V.

[0088] like Figure 7 and Figure 8 As shown, two constant current plates control six light-emitting units 10A, and each constant current plate controls three light-emitting units. To achieve the control of three light-emitting units by each constant current plate, as shown in FIG. Figure 7 As shown, the main board 010 is provided with three boost converters 011 and three groups of LED drivers 013. Figure 8 As shown, three boost converters 021 and three LED drivers 023 are provided on the sub-board 020. The specific driving principle of the light-emitting unit can refer to the above description of driving four light-emitting units 10A, which will not be repeated here.

[0089] Fig. 9 The present invention is a schematic diagram of a light-emitting unit driving circuit exemplified in the present invention.

[0090] For example, Fig. 9As shown, the light-emitting unit driving circuit 100 includes a voltage conversion unit 110 and a light-emitting driving unit 120, the voltage conversion unit 110 is configured to output voltage, and the light-emitting driving unit 120 is connected to the output end of the voltage conversion unit 110 and is configured to drive the light-emitting unit. The voltage conversion unit 110 includes an inductor module 111, a switch element 112, a diode module 113, an output capacitor 114 and an input capacitor 115. The inductor module 111 includes a first inductor L1 and a second inductor L2 connected in parallel, and the diode module 113 includes a first diode D1 and a second diode D2 connected in parallel. The input capacitor 115 is used to reduce the obstruction caused by the parasitic inductance on the wiring to the current change. When the switch element 112 is closed, the inductor module 111 is grounded, the input voltage charges the inductor module 111, the diode module 113 is turned off, and the output capacitor 114 outputs a voltage to the light-emitting driving unit 120. When the switch element 112 is opened, the inductor module 111 is discharged, the diode module 113 is turned on, and the voltage across the output capacitor 114 increases. In this way, the output voltage is adjusted by adjusting the switching frequency and duty cycle of the switch element 112 , thereby achieving voltage boost. For example, the voltage conversion unit 110 further includes a control chip 116 (Boost IC) configured to control the on and off of the switch element 112 .

[0091] For example, in combination with some of the foregoing examples, each light-emitting unit includes 12 light-emitting partitions, and each partition includes 24 or 30 LEDs connected in series. The light-emitting driving unit 120 includes a driving module 121 (for example, an LED driver) to correspond to the 12 light-emitting partitions. For example, the light-emitting driving unit 120 also includes 12 switch tubes 122 connected between the driving module 121 and the light-emitting partitions to receive the driving signal of the driving module 121 to achieve conduction or cutoff between the driving module 121 and the light-emitting partitions.

[0092] Fig. 10A The present invention is a schematic diagram of a circuit board exemplified by the present invention. Fig. 10B for Fig. 10A It should be noted that in order to more clearly show the arrangement of components in the circuit board, Fig. 10B Only some components in the first driving structure are shown schematically.

[0093] For example, Fig. 10A As shown, the circuit board includes a substrate 200 and Fig. 9The light-emitting unit driving circuit 100 shown is disposed on a substrate 200. In combination with some of the aforementioned embodiments, an example is given in which two light-emitting unit driving circuits 100 drive six light-emitting units. In order to realize that each light-emitting unit driving circuit 100 drives three light-emitting units, the light-emitting unit driving circuit 100 includes a first driving structure 101, a second driving structure 102, and a third driving structure 103. Each driving structure includes a voltage conversion unit 110 and a light-emitting driving unit 120 connected to each other, and is configured to drive a corresponding light-emitting unit.

[0094] In some usage scenarios, the circuit board is installed in the display panel, and the longitudinal direction of the substrate 200 of the circuit board can extend along one edge of the display panel, for example, it can extend along the short side of the display panel. For example, when the display panel is in a normal viewing state, the circuit board can be placed vertically relative to the ground. For example, the voltage conversion units 110 in the three driving structures are concentrated on one side of the substrate 200 along the first direction y, and the light-emitting driving units 120 are concentrated on the other side of the substrate 200 along the first direction y. The first direction y is parallel to the longitudinal direction of the substrate 200. For example, the first direction y is a direction from the side where the light-emitting driving unit 120 is located to the side where the voltage conversion unit 110 is located. In this way, the high-voltage area where the voltage conversion unit 110 is located is separated from the low-voltage area where the light-emitting driving unit 120 is located, which can effectively reduce the interference effect during the transmission of the logic signal. For example, when the circuit board is placed vertically relative to the ground, the three voltage conversion units 110 are located on the upper side of the substrate 200, and the three light-emitting driving units 120 are located on the lower side of the substrate 200.

[0095] To facilitate the arrangement of wiring, the light-emitting driving unit 1201 of the first driving structure 101, the light-emitting driving unit 1202 of the second driving structure 102, the light-emitting driving unit 1203 of the third driving structure 103, the voltage conversion unit 1103 of the third driving structure 103, the voltage conversion unit 1102 of the second driving structure 102 and the voltage conversion unit 1101 of the first driving structure 101 are arranged in sequence along the first direction y.

[0096] like Fig. 10A Shown and combined Fig. 10B, taking the voltage conversion unit 1101 in the first driving structure 101 as an example, the output capacitor 114 and the inductor module 111 are arranged on both sides of the substrate 200 along the second direction x. For example, in combination with the above example, the output capacitor 114 on the circuit board is located on the side close to the output interface CN5-CN7. In the inductor module 111, the first inductor L1 and the second inductor L2 are arranged spaced apart from each other along the second direction x, and the second direction x is parallel to the substrate 200 and intersects with the first direction y. For example, the second direction x is perpendicular to the first direction y. The spacing d11 between the first inductor L1 and the second inductor L2 in the second direction x is less than or equal to 0.5 mm.

[0097] The diode module 113 is located between the output capacitor 114 and the inductor module 111 on one side close to the output capacitor 114, and the distance d12 between the diode module 113 and the output capacitor 114 in the second direction x is greater than or equal to 1.2 mm. In the diode module 113, the first diode D1 and the second diode D2 are arranged spaced apart from each other along the first direction y, and the distance d13 between the first diode D1 and the second diode D2 in the first direction y is less than or equal to 0.5 mm.

[0098] The switch element 112 is located between the inductor module 111 and the diode module 113. For example, the minimum distance d14 between the switch element 112 and the diode module 113 is less than or equal to 2 mm. For example, the minimum distance d15 between the switch element 112 and the inductor module 111 is less than or equal to 2 mm.

[0099] The input capacitor 115 and the inductor module 111 are spaced apart in the first direction y, and the spacing d16 between the inductor module 111 and the input capacitor 115 in the first direction y is greater than or equal to 3 mm. For example, in combination with the above example, the input capacitor 115 on the circuit board is located on a side close to the input interface CN1.

[0100] like Fig. 10A As shown, the arrangement of components in the voltage conversion unit 1102 of the second driving structure 102 and the voltage conversion unit 1103 of the third driving structure 103 is basically the same as that in the voltage conversion unit 1101 of the first driving structure 101. Of course, the arrangement of components in the voltage conversion unit of the second driving structure and the voltage conversion unit of the third driving structure may also be different from the arrangement of components in the voltage conversion unit of the first driving structure, and may be adjusted according to actual needs, and the present invention does not limit this. For example, the arrangement of components in the light-emitting driving unit in the first driving structure, the second driving structure, and the third driving structure may be as follows: Fig. 10A The same as shown in the figure can also be adjusted according to actual needs, and the present utility model does not limit this. It should be noted that Fig. 10AA schematic diagram of the main board of the circuit board is schematically shown. Referring to the arrangement of components on the main board, the output capacitor and the input capacitor on the sub-board of the circuit board are correspondingly arranged on the side close to the output interface on the sub-board and the side close to the input interface on the sub-board. The arrangement of other components can be basically consistent with the arrangement of components on the main board.

[0101] After testing the above embodiment for 2 hours at the maximum power state of the components, it was found that the temperature of the switch element 112 was 123.6° C., the temperature of the first inductor L1 and the second inductor L2 was 114.6° C., and the temperature of the first diode D1 and the second diode D2 was 111.5° C. The temperature of the components was too high and it was difficult to dissipate heat.

[0102] Combined with the above test results, when components with high heat generation are close to each other, the heat generated by each other will have an additive effect, causing the temperature of the components to rise. In response to this, the inventor adjusted the layout of the components in the voltage conversion unit. At the same time, considering that the temperature of the switching element is the highest, the inventor adjusted the circuit of the voltage conversion unit to improve the problem of excessive current in the switching element.

[0103] Fig.11 This is a schematic diagram of another light-emitting unit driving circuit exemplified in the present invention.

[0104] For example, Fig.11 As shown, the light-emitting unit driving circuit 300 includes a voltage conversion unit 310 and a light-emitting driving unit 320, the voltage conversion unit 310 is configured to output voltage, and the light-emitting driving unit 320 is connected to the output end of the voltage conversion unit 310 and is configured to drive the light-emitting unit. The voltage conversion unit 310 includes an inductor module 311, a switch module 312, a diode module 313, an output capacitor 314 and an input capacitor 315. The inductor module 311 includes a first inductor L1 and a second inductor L2 connected in parallel, the diode module 313 includes a first diode D1 and a second diode D2 connected in parallel, and the switch module 312 includes a first switch element Q1 and a second switch element Q2 connected in parallel. For example, in combination with some of the above examples, each light-emitting unit includes 12 light-emitting partitions, and each partition includes 24 or 30 LEDs connected in series. The light-emitting driving unit 320 includes a driving module 321 that can correspond one-to-one to the 12 light-emitting partitions. For example, the light-emitting driving unit 320 further includes 12 switch tubes 322 connected between the driving module 321 and the light-emitting partitions to receive the driving signal of the driving module 321 to achieve conduction or cutoff between the driving module 321 and the light-emitting partitions.

[0105] Thus, in some embodiments according to the present invention, the second switch element Q2 is connected in parallel with the first switch element Q1, and the conduction loss is reduced by reducing the current borne by the single switch element, thereby reducing the temperature of the switch module 312. The driving principle of the voltage conversion unit 310 and the light-emitting driving unit 320, and the centralized arrangement of the voltage conversion unit 310 and the light-emitting driving unit 320 in the three driving structures can be referred to the above embodiments, and will not be repeated here.

[0106] Fig. 12A This is a schematic diagram of another circuit board exemplified by the present invention. Fig. 12B for Fig. 12A It should be noted that in order to more clearly show the arrangement of components in the circuit board, Fig. 12B Only some components in the first driving structure and the second driving structure are shown schematically.

[0107] refer to Fig. 12A , along the first direction y, the light-emitting driving unit 3201 of the first driving structure 301, the light-emitting driving unit 3202 of the second driving structure 302, the light-emitting driving unit 3203 of the third driving structure 303, the voltage conversion unit 3103 of the third driving structure 303, the voltage conversion unit 3102 of the second driving structure 302 and the voltage conversion unit 3101 of the first driving structure 301 are arranged in sequence.

[0108] like Fig. 12A Shown and combined Fig. 12B , taking the voltage conversion unit 3101 in the first driving structure 301 as an example, the output capacitor 314 and the input capacitor 315 are arranged on both sides of the substrate 400 along the second direction x, thereby improving the heating effect of the power device on the two. The second direction x is parallel to the substrate 400 and intersects with the first direction y. For example, the second direction x is perpendicular to the first direction y.

[0109] The inductor module 311 is disposed between the input capacitor 315 and the output capacitor 314 on one side close to the input capacitor 315. In the inductor module 311, the first inductor L1 and the second inductor L2 are spaced apart from each other along the first direction y. The spacing d31 between the first inductor L1 and the second inductor L2 in the first direction y is greater than or equal to 8 mm. It should be noted that, Fig. 12A The schematic diagram of the main board of the circuit board is schematically shown. Referring to the arrangement of components of the main board, on the sub-board of the circuit board, the output capacitor and the input capacitor are arranged on the side close to the output interface and the side close to the input interface, respectively, and the arrangement of other components can be basically consistent with the arrangement of components of the main board. For example, the voltage conversion unit 310 also includes a control chip 316, which is configured to control the conduction and cutoff of the switch element 312.

[0110] The diode module 313 is located between the output capacitor 314 and the inductor module 311 on one side close to the output capacitor 314. The first diode D1 and the second diode D2 in the diode module 313 are spaced apart from each other along the first direction y. The distance d32 between the first diode D1 and the second diode D2 in the first direction y is greater than or equal to 2.2 mm.

[0111] The switch module 312 is located between the inductor module 311 and the diode module 313. For example, the minimum distance d33 between the switch element and the diode module 313 is greater than or equal to 3 mm. For example, the minimum distance d34 between the switch element and the inductor module 311 is greater than or equal to 5 mm. In the switch module 312, the first switch element Q1 and the second switch element Q2 are spaced apart from each other in the second direction x, and the spacing d35 between the two is greater than or equal to 0.4 mm.

[0112] like Fig. 12A As shown, in the voltage conversion unit 3102 of the second driving structure 302 and the voltage conversion unit 3103 of the third driving structure 303, the arrangement of components is basically the same as that of the voltage conversion unit 3101 of the first driving structure 301. Fig. 12B , the distance d36 between the first inductor L1 in the first driving structure 301 and the second inductor L2' in the second driving structure 302 in the first direction y is also greater than 8 mm, thereby ensuring sufficient heat dissipation of the inductor module 311. Fig. 12A In the voltage conversion unit 311 in the second driving structure 302, the arrangement of the switch module 312, the diode module 313 and the output capacitor 314 is the same as that in the first driving structure 301, and the input capacitor 315 in the first driving structure 302 and the second driving structure 302 is arranged along the first direction y. For example, the arrangement of components in the voltage conversion unit 310 in the third driving structure 303 is substantially the same as that in the second driving structure 302.

[0113] Of course, the arrangement of components in the voltage conversion unit of the second driving structure and the voltage conversion unit of the third driving structure can also be completely the same as the arrangement of components in the voltage conversion unit of the first driving structure, and can also be adjusted according to actual needs, and the present invention does not limit this. For example, the arrangement of components in the light-emitting driving units of the first driving structure, the second driving structure, and the third driving structure can be the same, or it can be as follows: Fig. 12A The above diagrams are slightly different and can be adjusted according to actual needs, and the present invention does not impose any restrictions on this.

[0114] For example, the substrate 400 includes a first conductive layer 410 and a first solder resist layer 420, the first conductive layer 410 and the first solder resist layer 420 are located on a side of the substrate 400 where the light-emitting unit driving circuit 300 is provided, the first conductive layer 410 is located on a side of the first solder resist layer 420 away from the light-emitting unit driving circuit 300, and a first opening 421 exposing the first conductive layer 410 is provided in the first solder resist layer 420. The first conductive layer 410 can be exposed through the first opening 421 provided in the first solder resist layer 420, so as to dissipate heat. Considering the layout of the wiring and components on the circuit board, the first opening 421 is slightly different in the area where the first driving structure 301, the second driving structure 302 and the third driving structure 303 are located. The utility model is described by taking the first opening 421 in the area where the first driving structure 301 is located as an example.

[0115] The first opening 421 includes a first opening portion 4211, which is located between the inductor module 311, the diode module 313 and the switch module 312, so as to dissipate heat in the middle of the components and improve the heat addition effect between the components. The area of ​​the first opening portion 4211 is greater than or equal to 320 square millimeters.

[0116] The first opening 421 includes a second opening portion 4212, which is located at a side of the inductor module 311 away from the switch module 412 in the second direction x, so as to cooperate with the first opening portion 4211 to dissipate heat for the inductor module 311. The area of ​​the second opening portion 4212 is greater than or equal to 75 square millimeters.

[0117] The first opening 421 includes a third opening portion 4213, which is located on a side of the diode module 313 facing the voltage conversion unit 310 of the second driving structure 302, so as to dissipate heat for the diode module 313. The area of ​​the third opening portion 4213 is greater than or equal to 90 square millimeters.

[0118] The side of the substrate 400 away from the first solder resist layer 420 also includes a second conductive layer and a second solder resist layer, and the second conductive layer is located between the second solder resist layer and the first conductive layer 410. A second opening is provided in the second solder resist layer to expose the second conductive layer, and the orthographic projection of the second opening on a plane parallel to the substrate 400 covers the orthographic projection of the first opening 421 on the plane. In this way, the openings on the two opposite sides of the substrate 400 correspond to each other, and while the components dissipate heat with the help of the first opening 421, the side where the second opening is located dissipates heat with the help of the second opening, thereby improving the heat dissipation efficiency of the circuit board.

[0119] After testing the aforementioned embodiment for 2 hours at the maximum power state of the components, it was found that in the switch module 312, the temperature of the first switch element Q1 close to the inductor module 311 was relatively higher, at 101.8°C. Due to the influence of the upward heat, in the inductor module 311, the temperature of the second inductor L2 located further up was higher, at 96.5°C. In the diode module 313, the temperature of the second diode D2 located between the output capacitor 314 and the second switch element Q2 was relatively higher, at 93.0°C. Compared with the aforementioned embodiment, the temperature of the improved switch module 312 dropped by 21.8°C, the temperature of the inductor module 311 dropped by 18.1°C, and the temperature of the diode module 313 dropped by 18.5°C.

[0120] Fig.13A A schematic diagram of a light-emitting unit driving circuit provided by at least one embodiment of the present utility model.

[0121] refer to Fig.13A At least one embodiment of the utility model provides a light-emitting unit driving circuit 500, including a voltage conversion unit 510 and a light-emitting driving unit 520. For example, the voltage conversion unit 510 is a DC-DC converter. For example, the voltage conversion unit 510 is a Boost boost circuit, which can generate an output voltage higher than the input voltage. For example, the light-emitting driving unit 520 is an LED Driver. The voltage conversion unit 510 includes an input end and an output end, and is configured to output a preset voltage. For example, the voltage conversion unit 510 adjusts the voltage to a preset voltage by controlling the duty cycle, so that the preset voltage is output from the output end of the voltage conversion unit 510. The light-emitting driving unit 520 is connected to the output end of the voltage conversion unit 510 and is configured to drive the light-emitting unit. The voltage conversion unit 510 outputs a preset voltage to the light-emitting driving unit 520, thereby adjusting the brightness of the light-emitting unit. For example, in combination with some of the above examples, each light-emitting unit includes 12 light-emitting partitions, and each partition includes 24 or 30 LEDs connected in series. The light-emitting driving unit 520 includes a driving module 521 that can correspond to the 12 light-emitting partitions one by one. For example, the light-emitting driving unit 520 further includes 12 switch tubes 522 connected between the driving module 521 and the light-emitting partitions to receive the driving signal of the driving module 521 to realize conduction or cutoff between the driving module 521 and the light-emitting partitions.

[0122] like Fig.13AAs shown, the voltage conversion unit 510 includes an inductor module 511, a diode module 513, a switch module 512, and an output capacitor module 514. For example, during the charging process, the switch module 512 is closed, the input voltage flows through the inductor module 511, the diode module 513 prevents the output capacitor module 514 from discharging to the ground, and the current on the inductor module 511 increases linearly to store energy in the inductor module 511. For example, during the discharging process, the switch module 512 is disconnected, the inductor module 511 discharges and charges the output capacitor module 514, and the voltage across the output capacitor module 514 increases, thereby achieving the voltage boost of the voltage conversion unit 510. For example, the voltage conversion unit 510 also includes a control chip 516, which is configured to control the conduction and cutoff of the switch element 512.

[0123] like Fig.13A As shown, the inductor module 511 is connected between the input end of the voltage conversion unit 510 and the positive electrode of the diode module 513, and the negative electrode of the diode module 513 is connected to the output end of the voltage conversion unit 510. Fig.13A , one end of the inductor module 511 close to the input end of the voltage conversion unit 510 is used to load the input voltage Vin, and is electrically connected to the input capacitor module 515. The other end of the inductor module 511 is electrically connected to one end of the switch module 512 (combined with the examples described later, for example, one of the input end and the output end of the switch module 512), and the other end of the switch module 512 (combined with the examples described later, for example, the other of the input end and the output end of the switch module 512) is used to load the ground voltage GND. For example, the inductor module 511 is used to convert electrical energy into magnetic field energy for storage when the switch module 512 is turned on, and when the switch module 512 is turned off, the inductor module 511 converts the stored magnetic field into electric field energy. The electric field energy converted by the inductor module 511 is superimposed on the input voltage, and after filtering by the diode module 513 and the output capacitor module 514, a smooth DC voltage is output.

[0124] For example, the anode of the diode module 513 is electrically connected to one end of the switch module 512 (combined with the example described later, for example, one of the input end and the output end of the switch module 512); the cathode of the diode module 513 is electrically connected to the output end of the voltage conversion unit 510, and is connected to the output capacitor module 514. In this way, by controlling the on and off of the switch module 512, the output voltage Vout of the voltage conversion unit 510 can be made higher than the input voltage Vin.

[0125] For example, the forward conduction direction of the diode module 513 is from the input end to the output capacitor module 514. For example, the diode module 513 plays an isolation role in the voltage conversion unit 510. When the switch module 512 is turned on, the positive electrode voltage of the diode module 513 is higher than the negative electrode voltage, the diode module 513 is reversely cut off, and the energy storage process of the inductor module 511 will not affect the power supply output of the output capacitor module 514, thereby reducing the conduction loss of the switch module 512. When the switch module 512 is turned off, the energy obtained by superimposing the electric field energy converted by the inductor module 511 and the input voltage is used to supply power to the output end of the voltage conversion unit 510 through the diode module 513.

[0126] like Fig.13A As shown, the switch module 512 includes a control end, an input end, and an output end. The control end of the switch module 512 is configured to receive a control signal, and the control signal is used to control the conduction or cutoff between the input end and the output end of the switch module 512. One of the input end and the output end of the switch module 512 is connected between the inductor module 511 and the diode module 513, and the other of the input end and the output end of the switch module 512 is connected to the ground end. For example, the control end of the switch module 512 receives a conduction control signal, the input end and the output end of the switch module 512 are connected, the voltage conversion unit 510 starts the charging process, and the input voltage charges the inductor module 511. For example, the control end of the switch module 512 receives a cutoff control signal, the input end and the output end of the switch module 512 are cutoff, the voltage conversion unit 510 starts the discharging process, and the energy stored in the inductor module 511 is discharged through the diode module 513.

[0127] like Fig.13A As shown, the first pole of the output capacitor module 514 is connected to the cathode of the diode module 513, and the second pole of the output capacitor module 514 is connected to the ground terminal. The output capacitor module 514 can reduce the AC ripple coefficient and smooth the DC output. For example, the first pole of the output capacitor module 514 is a positive pole, and the second pole is a negative pole.

[0128] Fig.14 This is a schematic diagram of a light-emitting unit driving circuit provided by another example of the present invention.

[0129] like Fig.13A and Fig.14 As shown, the switch module 512 at least includes a first switch element Q1 and a second switch element Q2 connected in parallel. For example, the switch module 512 includes a first switch element Q1, a second switch element Q2 and a third switch element Q3 connected in parallel. Fig.14As shown, when the output capacitor module 514 has only one output capacitor, the heat generated by the switch module 512 is high, and the temperature of each switch element is difficult to reduce. By connecting the first switch element Q1, the second switch element Q2 and the third switch element Q3 in parallel, the current on a single switch element can be reduced, thereby reducing the conduction loss.

[0130] For example, the voltage conversion unit 510 is provided with a first switch element Q1, a second switch element Q2 and a third switch element Q3. The first switch element Q1 and the second switch element Q2 are connected in parallel first, and when the temperature cannot be further reduced by connecting the two switch elements in parallel, the third switch element Q3 is connected in parallel to further reduce the temperature of each switch element.

[0131] For example, at least one of the first switch element Q1 and the second switch element Q2 is a transistor. It should be noted that the transistors used in the embodiments of the present invention can be field effect transistors or other switch components with the same characteristics, and the embodiments of the present invention are described using field effect transistors as examples.

[0132] Fig. 13B This is a schematic diagram of the principle of a voltage conversion unit in a light-emitting unit driving circuit provided in an example of the present utility model.

[0133] refer to Fig. 13B , the switch module 512 is a field effect transistor (power MOSFET) as an example for explanation, for example, the voltage conversion unit 510 also includes a control module CTR connected to the control end of the power MOSFET (for example, the control module CTR is Fig.13A The control module CTR is configured to provide a control signal capable of controlling the on and off of the power MOSFET; the control signal includes a high level signal and a low level signal. The voltage value of the high level signal in the control signal is 0.5 to 0.8 times the maximum rated value of the gate-source voltage of the power MOSFET.

[0134] In the example of the utility model, the high-level signal of the control signal provided by the control module CTR has a higher voltage value, which can make the power MOSFET maintain a higher gate-source voltage when it is turned on, thereby reducing the static loss of the power MOSFET, especially greatly reducing the conduction loss of the power MOSFET, thereby greatly reducing the power consumption of the power MOSFET and reducing the heat release of the power MOSFET, and avoiding excessive temperature rise of the power MOSFET and the voltage conversion unit. In this example, when the high-level signal of the control signal is loaded to the control end of the power MOSFET, the gate-source voltage of the power MOSFET is substantially equal to the voltage value of the high-level signal (without considering the voltage drop); so that the voltage value of the high-level signal of the control signal is 0.5 to 0.8 times the maximum rated value of the gate-source voltage of the power MOSFET, which can not only ensure the safety of the power MOSFET, but also increase the gate-source voltage of the power MOSFET as much as possible when it is turned on. In this way, the voltage conversion unit can reduce the loss and heat of the power MOSFET while ensuring the safety of the power MOSFET.

[0135] For example, power MOSFET losses mainly include static losses and dynamic losses. Among them, static losses include conduction losses (also called power conduction losses) and cutoff losses (also called turn-off losses). Dynamic losses mainly include switching losses, gate drive losses, built-in diode forward losses (also called freewheeling losses), internal diode reverse losses, etc. The zero gate voltage leakage current of power MOSFET is small, so the cutoff loss is not the main loss factor of power MOSFET. The total gate charge of power MOSFET and the reverse recovery charge of the PN junction of the internal diode are also very small, so the gate drive loss and the internal diode reverse loss are not the main loss factors of power MOSFET.

[0136] For example, the largest share of power MOSFET loss is conduction loss. By reducing the static impedance of the power MOSFET when it is turned on, the conduction loss of the power MOSFET can be reduced; at the same time, increasing the gate-source voltage of the power MOSFET when it is turned on can also reduce the turn-on loss of the power MOSFET. In this way, the voltage conversion unit 510 can reduce the loss of the power MOSFET and reduce the temperature of the power MOSFET.

[0137] For example, the voltage value of the high-level signal in the control signal is 0.6 to 0.7 times the maximum rated value of the gate-source voltage of the power MOSFET. For example, when the maximum rated value of the gate-source voltage of the power MOSFET is 20V, the voltage value of the high-level signal in the control signal can be 12 to 14V, thereby making the gate-source voltage of the power MOSFET in the range of 12 to 14V when it is turned on.

[0138] For example, a control signal for controlling the on and off of the power MOSFET can be provided by the control module CTR; the control signal includes a high-level signal and a low-level signal. The voltage value of the high-level signal of the control signal output by the control module CTR is often relatively low, for example, generally between 4 and 8V. Although the high-level signal is sufficient to turn on the power MOSFET, since the gate-source voltage of the power MOSFET is not high enough, the power MOSFET will have a large on-resistance, resulting in a large conduction loss of the power MOSFET and severe heat generation, and the temperature of the power MOSFET is high. In the example of the utility model, the gate-source voltage of the power MOSFET when it is turned on can be increased as much as possible under the premise of ensuring the safety of the power MOSFET, for example, the gate-source voltage of the power MOSFET when it is turned on can be increased to 12-14V, thereby achieving the purpose of reducing the conduction loss of the power MOSFET, reducing the heat generation of the power MOSFET, and reducing the temperature of the power MOSFET.

[0139] It is understandable that the above example only takes the maximum rated value of the gate-source voltage of the power MOSFET as 20V as an example to exemplify the gate-source voltage when the power MOSFET is turned on. In other examples of the present invention, the maximum rated value of the gate-source voltage of the power MOSFET may not be 20V, for example, it may be 25V, 30V, etc. Further, the maximum rated value of the gate-source voltage of the power MOSFET may be obtained by querying the parameter manual of the power MOSFET.

[0140] The inventor found in his research that Fig.13A and Fig.14 , on the basis of connecting the first switch element Q1 and the second switch element Q2 in parallel, after further connecting the third switch element Q3 in parallel, the temperature change of each switch element is small. It can be seen that in the voltage conversion unit 510 in the example of the present utility model, the influence on the temperature of the switch module 512 mainly comes from the switching loss, and the influence of the conduction loss is not significant. In addition, when the spacing between components with high heat generation is small, the heat generation between the components will have an additive effect, which will also cause the temperature of the components to rise. Based on this, the switch module 512 only includes the first switch element Q1 and the second switch element Q2 connected in parallel. In this way, not only the conduction loss can be reduced, but also the spacing between the components can be increased, thereby reducing the temperature of the switch module 512 by increasing the spacing and reducing the conduction loss.

[0141] For example, a larger switch component can be selected to reduce the temperature rise of the switch module 512, and the utility model does not limit this. For example, the switch loss can be reduced by selecting a switch component with smaller switch loss. Although the cost will increase accordingly, the temperature of the switch module 512 can also be reduced. The utility model does not limit this.

[0142] like Fig.13A As shown, the output capacitor module 514 includes at least a first output capacitor C1 and a second output capacitor C2 connected in parallel. Since the output current of the voltage conversion unit 510 is constantly fluctuating, the temperature of the output capacitor module 514 increases. By connecting the first output capacitor C1 and the second output capacitor C2 in parallel, the current on a single component is reduced, thereby reducing the temperature of the first output capacitor C1 and the second output capacitor C2, increasing the service life of the capacitor module, and reducing the output voltage and current ripple, thereby improving output stability.

[0143] For example, the inductor module 511 includes at least a first inductor L1 and a second inductor L2 connected in parallel. By connecting the first inductor L1 and the second inductor L2 in parallel, the current flowing through the first inductor L1 and the second inductor L2 can be reduced, thereby reducing the temperature of the inductor module 511. For example, a larger inductor component can be packaged to reduce the temperature rise of the inductor module 511, and the utility model is not limited here.

[0144] For example, the diode module 513 includes at least a first diode D1 and a second diode D2 connected in parallel. The first diode D1 and the second diode D2 are connected in parallel to reduce the temperature of each component, thereby reducing the temperature of the diode module 513. For example, at least one of the first diode D1 and the second diode D2 is a Schottky diode. The Schottky diode has a high current density and a low forward voltage drop, that is, the Schottky diode consumes less power and generates less heat. For example, a larger diode component can also be packaged to reduce the temperature rise of the diode module 513, and the utility model is not limited here.

[0145] refer to Fig. 13B For example, the control module CTR is also configured such that when providing a current injection to the control terminal of the power MOSFET, the maximum value of the current injection is not less than 0.5A, for example, between 1A and 2A. In this way, the control module CTR can provide a large current injection to the power MOSFET, thereby further reducing the opening loss of the power MOSFET, which is conducive to reducing the temperature of the power MOSFET. It can be understood that when the control module CTR provides a current injection to the control terminal of the power MOSFET, the magnitude of the current injection is dynamically changing rather than a constant current.

[0146] refer to Fig. 13BThe voltage conversion unit 510 may further include a gate resistor Rg. A first end of the gate resistor Rg is electrically connected to the output end of the control module CTR, and a second end of the gate resistor Rg is electrically connected to the control end of the power MOSFET. In this way, when the control module CTR loads a high-level signal to the control end of the power MOSFET, the gate resistor Rg can control the injection current together to prevent the injection current from being too large and damaging the power MOSFET.

[0147] Fig. 13C This is a schematic diagram of the principle of a voltage conversion unit in a light-emitting unit driving circuit provided by another example of the present invention. Fig.13D A schematic diagram of the principle of a control module in a voltage conversion unit provided as an example of the utility model. Fig.13E This is a schematic diagram of an equivalent circuit of a control module provided as an example of the present utility model.

[0148] refer to Fig. 13C , the voltage conversion unit 510 may further include a diode D'. The anode of the diode D' is electrically connected to the second end of the gate resistor Rg, and the cathode of the diode D' is electrically connected to the first end of the gate resistor Rg. When the control signal output by the control module CTR is a low-level signal, the control end of the power MOSFET can be discharged through the diode D' and the gate resistor Rg; at this time, the diode D' is turned on, so that the power MOSFET has a large current draw, which can reduce the turn-off loss of the power MOSFET.

[0149] refer to Fig.13D For example, the control module CTR may include a voltage stabilizing unit U1, which is configured to provide a driving voltage that is not less than the voltage of the high-level signal in the control signal. The control module CTR can use the driving voltage to make the high-level signal of the output control signal have a higher voltage value, thereby achieving the purpose of increasing the gate-source voltage of the power MOSFET when it is turned on, and overcoming the problem that the voltage value of the high-level signal of the control signal directly output by the control chip 516 is low. For example, the voltage stabilizing unit U1 can output the driving voltage according to the input voltage Vin. In this way, the power supply on the driving circuit board can simultaneously power the inductor module 511 and the voltage stabilizing unit U1, which is conducive to simplifying the circuit of the driving circuit board and reducing the cost of the driving circuit board. Of course, in other examples of the utility model, the voltage stabilizing unit U1 can also use other power supply voltages to generate the driving voltage.

[0150] For example, refer to Fig.13E, the voltage stabilizing unit U1 includes a first switching element Q1, a voltage stabilizing diode ZD1, a first resistor R1 and a filtering subcircuit C1. The first end of the first switching element Q1 is used to load the input voltage Vin, and the second end of the first switching element Q1 is electrically connected to the output end of the voltage stabilizing unit U1; a first resistor R1 is connected between the control end of the first switching element Q1 and the first end of the first switching element Q1, the control end of the first switching element Q1 is electrically connected to the cathode of the voltage stabilizing diode ZD1, and the anode of the voltage stabilizing diode ZD1 is used to load the ground voltage GND; the filtering subcircuit C1 is electrically connected to the output end of the voltage stabilizing unit U1. In this example, the first switching element Q1, the voltage stabilizing diode ZD1 and the first resistor R1 form a voltage stabilizer, and the filtering subcircuit C1 can filter the output of the voltage stabilizer to filter out the AC component. A suitable voltage stabilizing diode ZD1 can be selected according to the required driving voltage. For example, when the maximum rated value of the gate-source voltage of the power MOSFET is 20V and the derating factor used is 0.6-0.7, the voltage regulator diode ZD1 can use a voltage regulator diode with a stable voltage of 12V-14V. It is understandable that when selecting the first switch element Q1, the first resistor R1 and the voltage regulator diode ZD1, the specifications (such as current specifications, power specifications, voltage specifications, etc.) of the first switch element Q1, the first resistor R1 and the voltage regulator diode ZD1 can also be verified to avoid the first switch element Q1, the first resistor R1 and the voltage regulator diode ZD1 from being damaged during operation due to the specifications not meeting the requirements.

[0151] It is understandable that a variety of different strategies can be used to generate a control signal using the voltage stabilizing unit U1 and make the voltage value of the high level signal of the control signal higher, and even enable the control module CTR to provide a large sink current for the control terminal of the power MOSFET.

[0152] refer to Fig.13D and Fig.13E For example, the control module CTR includes a driving chip DIC, a voltage stabilizing unit U1, an inverter unit U2 and a driving unit U3. The driving chip DIC is configured to provide an initial control signal, which includes a high level signal and a low level signal. The voltage stabilizing unit U1 is configured to provide a driving voltage, and the driving voltage is not less than the voltage of the high level signal in the control signal. The inverter unit U2 includes a second resistor R2 and a second switch element Q2, a first end of the second resistor R2 is electrically connected to the output end of the voltage stabilizing unit U1, a second end of the second resistor R2 and a first end of the second switch element Q2 are electrically connected to the first node N1, and a second end of the second switch element Q2 is used to load the ground voltage GND.

[0153] The driving chip DIC has an output terminal GATE of the driving chip for outputting an initial control signal, and the control terminal of the second switch element Q2 is electrically connected to the output terminal of the driving chip. In this way, the control terminal of the second switch element Q2 can receive the initial control signal sent by the driving chip DIC. The second switch element Q2 is used to turn on in response to a high-level signal in the initial control signal, and to turn off in response to a low-level signal in the initial control signal. When the second switch element Q2 is turned on, the voltage of the first node N1 is pulled down to the ground voltage GND and is at a low level; when the second switch element Q2 is turned off, the voltage of the first node N1 is pulled up by the voltage stabilizing unit U1 and is at a high level.

[0154] The first end of the driving unit U3 is electrically connected to the output end of the voltage stabilizing unit U1, and the second end of the driving unit U3 is used to load the ground voltage GND. The control end of the driving unit U3 is electrically connected to the first node N1, and the output end of the driving unit U3 is electrically connected to the control end of the power MOSFET. The driving unit U3 is configured to make the first end of the driving unit U3 and the control end of the power MOSFET conductive when the voltage of the first node N1 is at a low level (at this time, the driving unit U3 outputs a high-level signal of the control signal), and make the second end of the driving unit U3 and the control end of the power MOSFET conductive when the voltage of the first node N1 is at a high level (at this time, the driving unit U3 outputs a low-level signal of the control signal).

[0155] In this way, when the voltage of the first node N1 is at a low level, the driving voltage can be written into the control end of the power MOSFET (i.e., providing a sink current to charge the control end of the power MOSFET) to turn on the power MOSFET, and the power MOSFET has a larger gate-source voltage when it is turned on. Moreover, since the driving voltage has a larger voltage value, the driving unit U3 can provide a large sink current for the control end of the power MOSFET. Overall, when the initial control signal output by the driving chip DIC is a high-level signal, the control signal output by the driving unit U3 is a high-level signal. On the contrary, when the voltage of the first node N1 is at a high level, the ground voltage GND can be written into the control end of the power MOSFET by the driving unit U3 (i.e., providing a drain current to discharge the control end of the power MOSFET), thereby turning off the power MOSFET. In this process, the control end of the power MOSFET is discharged, which is equivalent to the driving unit U3 providing a drain current for the control end of the power MOSFET. Overall, when the initial control signal output by the driving chip DIC is a low-level signal, the control signal output by the driving unit U3 is a low-level signal. In this way, the control signal output by the driving unit U3 is synchronized with the initial control signal output by the driving chip DIC.

[0156] In this example, the inverter unit U2 and the driving unit U3 together constitute a level conversion sub-circuit, which converts the high-level voltage of the initial control signal output by the driving chip DIC into the gate drive voltage required by the power MOSFET; the driving unit U1 provides the injection current in the gate drive current required by the power MOSFET, and the gate drive current also includes the extraction current (also called the leakage current).

[0157] Fig.13F A schematic diagram of the principle of a control module in a voltage conversion unit provided as another example of the present utility model. Figure 13G This is a schematic diagram of an equivalent circuit of a control module provided in another example of the present utility model.

[0158] refer to Fig.13F and Figure 13G For example, the control module CTR includes a driving chip DIC, a voltage stabilizing unit U1 and a driving unit U3. The voltage stabilizing unit U1 is configured to provide a driving voltage, and the driving voltage is not less than the voltage of the high-level signal in the control signal. The driving chip DIC is a control chip that can utilize an external voltage, and is configured to output an initial control signal according to the driving voltage provided by the voltage stabilizing unit U1. The first end of the driving unit U3 is electrically connected to the output end of the voltage stabilizing unit U1, and the second end of the driving unit U3 is used to load the ground voltage GND; the control end of the driving unit U3 is configured to receive the initial control signal, and the output end of the driving unit U3 is electrically connected to the gate of the power MOSFET. The driving unit U3 is configured to electrically conduct the first end of the driving unit U3 with the power MOSFET in response to the high-level signal in the initial control signal, and electrically conduct the second end of the driving unit U3 with the power MOSFET in response to the low-level signal in the initial control signal.

[0159] In this example, the high level signal of the initial control signal output by the driver chip DIC has a sufficiently high voltage value, and is therefore sufficient to directly drive the driver unit U3. Therefore, the control module CTR of this example does not need to be provided with an inverter unit U2, thereby reducing the cost of the control module CTR.

[0160] For example, refer to Fig.13F and Figure 13G, the driving unit U3 includes a third switch element Q3 and a fourth switch element Q4. The first end of the third switch element Q3 is electrically connected to the output end of the voltage stabilizing unit U1, and the first end of the fourth switch element Q4 is used to load the ground voltage GND; the control end of the third switch element Q3 and the control end of the fourth switch element Q4 are configured to receive an initial control signal, and the second end of the third switch element Q3 and the second end of the fourth switch element Q4 are electrically connected to the second node N2, and the second node N2 is electrically connected to the control end of the power MOSFET, for example, through the gate resistor Rg. The third switch element Q3 is configured to be turned on in response to a high-level signal in the initial control signal, and to be turned off in response to a low-level signal in the initial control signal. The fourth switch element Q4 is configured to be turned on in response to a low-level signal in the initial control signal, and to be turned off in response to a high-level signal in the initial control signal.

[0161] For example, refer to Fig.13F and Figure 13G , the control module CTR includes a driver chip DIC and a voltage regulator unit U1. The voltage regulator unit U1 is configured to provide a driving voltage, which is not less than the voltage of the high-level signal in the control signal; the driver chip DIC is a control chip that can utilize an external voltage, and is configured to output a control signal according to the driving voltage. In this example, the initial control signal output by the driver chip DIC can be directly loaded to the control end of the power MOSFET as a control signal, without the need for voltage or current adjustment with the help of the driver unit U3.

[0162] Exemplary, reference Fig.13F and Figure 13G The driver chip DIC has an external voltage terminal VCC for loading an external voltage, and an output terminal GATE for outputting a control signal. The output terminal of the voltage stabilizing unit U1 can be electrically connected to the external voltage terminal VCC, so that the driving voltage is loaded to the driver chip DIC as an external voltage. The driver chip DIC can output a control signal from the output terminal GATE according to the external voltage, rather than outputting the control signal according to an internal constant voltage, which makes the high-level signal of the control signal have a high voltage value. The output terminal GATE can be electrically connected to the control terminal of the power MOSFET, for example, electrically connected to the control terminal of the power MOSFET through a gate resistor Rg.

[0163] In this example, the driver chip DIC can generate a control signal according to the external input voltage (driving voltage) provided by the voltage stabilizing unit U1. The high-level signal of the control signal has a higher voltage value, so the conduction loss of the control end of the power MOSFET can be greatly reduced. In particular, when the DC-DC boost circuit does not have strict control requirements on temperature rise, the control module CTR of this example can omit the inverter unit U2 and the driving unit U3, thereby reducing the cost of the control module CTR.

[0164] It is understandable that if FIG. 13A to FIG. 13G The light-emitting unit driving circuits shown can all be applied to the circuit board in the utility model.

[0165] Fig.15A A schematic diagram of one side surface of a circuit board provided by at least one embodiment of the utility model. Fig. 15B A schematic diagram of the other side surface of a circuit board provided by at least one embodiment of the utility model. Fig. 15C for Fig.15A A partial schematic diagram of the circuit board shown. Fig.15D for Fig.15A A schematic plan view of the circuit board shown. Fig.16 This is a schematic diagram of a light-emitting unit driving circuit provided by another example of the present invention. It should be noted that in order to more clearly illustrate the arrangement of components in the circuit board, Fig. 15C Only some components in the first driving structure are shown. Fig.15D Only some of the components on the circuit board are shown.

[0166] refer to FIG. 15A to FIG. 16 At least one embodiment of the utility model further provides a circuit board, including a substrate 600 and a light-emitting unit driving circuit 500. The light-emitting unit driving circuit 500 is arranged on the substrate 600, and the light-emitting unit driving circuit 500 includes a voltage conversion unit 510 and a light-emitting driving unit 520. For example, the voltage conversion unit 510 is a DC-DC converter. For example, the voltage conversion unit 510 is a Boost boost circuit, which can generate an output voltage higher than the input voltage. For example, the light-emitting driving unit 520 is an LED Driver. The voltage conversion unit 510 includes an input end and an output end, and is configured to output a preset voltage. The light-emitting driving unit 520 is connected to the output end of the voltage conversion unit 510 and is configured to drive the light-emitting unit. For example, the voltage conversion unit 510 adjusts the voltage to a preset voltage by controlling the duty cycle, so that the preset voltage is output from the output end of the voltage conversion unit 510. The light-emitting driving unit 520 is connected to the output end of the voltage conversion unit 510 and is configured to drive the light-emitting unit. The voltage conversion unit 510 outputs a preset voltage to the light-emitting driving unit 520, thereby adjusting the brightness of the light-emitting unit.

[0167] like Fig.15A and Fig.16 As shown, the voltage conversion unit 510 is set to be multiple, and the light-emitting driving unit 520 is set to be multiple. Multiple voltage conversion units 510 and multiple light-emitting driving units 520 are set in one-to-one correspondence, and the voltage conversion units 510 and light-emitting driving units 520 corresponding to each other are connected to form multiple driving structures. For example, the voltage conversion unit 510 is set to three, the light-emitting driving unit 520 is set to three, and the voltage conversion units 510 and light-emitting driving units 520 corresponding to each other are connected to form three driving structures.

[0168] For example, the voltage conversion units in the multiple driving structures are concentrated on one side of the substrate, and the light-emitting driving units in the multiple driving structures are concentrated on the other side of the substrate. In this way, the high-voltage area where the voltage conversion unit is located is separated from the low-voltage area where the light-emitting driving unit is located, which can effectively reduce the interference effect during the transmission of the logic signal.

[0169] For example, the plurality of driving structures include three driving structures arranged in sequence along the longitudinal direction of the substrate. For example, the three driving structures are respectively a first driving structure, a second driving structure and a third driving structure, and a light-emitting driving unit of the first driving structure, a light-emitting driving unit of the second driving structure and a light-emitting driving unit of the third driving structure are arranged in sequence along the first direction. At the same time, in order to facilitate the arrangement of the wiring, a voltage conversion unit of the third driving structure, a voltage conversion unit of the second driving structure and a voltage conversion unit of the first driving structure are arranged in sequence along the first direction.

[0170] In some circuit board usage scenarios, the surface of the substrate 600 is arranged at an angle to the ground. For example, the surface of the substrate 600 is perpendicular to the ground. For example, in order to facilitate heat dissipation, the voltage conversion unit 510 is arranged on a side of the substrate 600 away from the ground.

[0171] like Fig.15A and Fig.16 As shown, a plurality of driving structures are sequentially arranged along a first direction y, and a plurality of light-emitting driving units 520 and a plurality of voltage conversion units 510 are alternately arranged along the first direction y, and the first direction y is parallel to the surface of the substrate 600. For example, the size of the substrate 600 in the first direction y is greater than the size of the substrate 600 in the second direction x, and the second direction x intersects with the first direction y and is parallel to the surface of the substrate 600. For example, the first direction y is the longitudinal direction of the substrate 600, and the second direction x is the width direction of the substrate 600. For example, the second direction x is perpendicular to the first direction y.

[0172] For example, in the first direction y, three driving structures are arranged in sequence, so that the voltage conversion unit 510 and the light-emitting driving unit 520 are arranged alternately. For example, the multiple driving structures include a first driving structure 501, a second driving structure 502, and a third driving structure 503. The light-emitting driving unit 5201 in the first driving structure 501 is adjacent to the voltage conversion unit 5102 in the second driving structure 502, and the light-emitting driving unit 5202 in the second driving structure 502 is adjacent to the voltage conversion unit 3103 in the third driving structure 503. By arranging the voltage conversion unit 510 and the light-emitting driving unit 520 alternately, the components with higher heat can be dispersed and the heat addition effect between the components can be improved. Moreover, considering that the heat propagates upward away from the ground, resulting in a relatively high overall temperature of the voltage conversion unit 510 located further above, the dispersed arrangement method can also reduce the heat addition effect between the components.

[0173] For example, the light emitting unit includes a plurality of light emitting diodes connected in series to form a plurality of light emitting diode strings. The number of light emitting diode strings is greater than the number of driving structures, and each driving structure is connected to more than two light emitting diode strings in the plurality of light emitting diode strings. Figure 6 and Fig.16 As shown, 30 LEDs are connected in series to form a LED string, and each light-emitting unit includes 12 LED strings. The light-emitting driving unit 520 in each driving structure includes 12 driving modules 521, and each driving module 521 drives a corresponding LED string.

[0174] For example, the light-emitting driving unit 520 further includes 12 switch tubes 522 connected between the driving module 521 and the light-emitting partitions to receive the driving signal of the driving module 521 to realize the conduction or cutoff between the light-emitting driving unit 520 and the light-emitting partitions. Fig.15A As shown, the 12 switch tubes 522 are arranged in two rows and six columns on the substrate 400, so as to facilitate heat dissipation. For example, the switch tubes 522 in two rows are arranged in an alternating manner, so as to increase the distance between two adjacent switch tubes 522.

[0175] For example, the circuit board further includes a shielding component, which is disposed at least on two opposite sides of the light-emitting driving unit 520 in the first direction y. The shielding component is arranged at the boundary between the light-emitting driving unit 520 and the voltage conversion unit 510, so as to shield the signal interference of the voltage conversion unit 510 to the light-emitting driving unit 520. For example, the shielding component is an intra-board grounding trace in a conductive layer in the circuit board.

[0176] In one usage scenario, the circuit board is placed vertically for use, and heat convection will be generated in the up and down directions relative to the ground, that is, hot air rises and cold air falls. In this case, the components below will continue to bake the components above. For example, the driving structure close to the edge of the substrate 600 in the first direction y is the first driving structure 501. Taking into account the influence of upward heat, among the three driving structures, the temperature of the components in the first driving structure 501 is often relatively higher. Based on this, when adjusting the layout of the components in each driving structure, the components in the first driving structure 501 are adjusted first.

[0177] For example, the substrate 600 includes a first edge a1 and a second edge a2 that are arranged opposite to each other in the first direction y. In each driving structure, the first driving structure 501 is used as an example for explanation, and the voltage conversion unit 510 and the light-emitting driving unit 520 are arranged in a direction from the first edge a1 to the second edge a2. At least in the voltage conversion unit 510 closest to the first edge a1 of the substrate 600, the inductor module 511 is arranged on the side of the voltage conversion unit 510 away from the light-emitting driving unit 520 in the first direction y. The power of the inductor module 511 is relatively large and the temperature is relatively high. The inductor module 511 is arranged at a relatively more marginal position on the substrate 600, which is easy to dissipate heat of the inductor module 511. For example, the first edge a1 and the second edge a2 are parallel to the second direction x, and the third edge a3 is parallel to the first direction y. For example, the size of the first edge a1 and the second edge a2 are both smaller than the size of the third edge a3.

[0178] For example, taking the first driving structure 501 as an example, the output capacitor module 514 is arranged on one side of the voltage conversion unit 510 close to the light-emitting driving unit 520 in the first direction y. Arranging the output capacitor module 514 opposite to the inductor module 511 can reduce the effect of the heat generated by the inductor module 511 on the output capacitor module 514 and reduce the temperature of the output capacitor module 514.

[0179] For example, taking the first driving structure 501 as an example, the diode module 513 is closer to the third edge a3 of the substrate 600 than the inductor module 511 and the output capacitor module 514, and the third edge a3 connects the first edge a1 and the second edge a2. The diode module 513 is arranged on the side close to the third edge a3 of the substrate 600, which can increase the distance between the diode module 513 and other power devices, thereby reducing the influence of the heat generated by the power devices on the diode module 513.

[0180] For example, taking the first driving structure 501 as an example, the switch module 512 is arranged between the inductor module 511 and the output capacitor module 514. There is a relatively open area between the inductor module 511 and the output capacitor module 514 that are arranged opposite to each other. By arranging the switch module 512 between the inductor module 511 and the output capacitor module 514, a relatively large distance can be maintained between the inductor module 511, the switch module 512 and the output capacitor module 514, thereby improving the heat addition effect between the modules.

[0181] For example, taking the first driving structure 501 as an example, the light-emitting unit driving circuit 500 also includes an input capacitor module 515, and the input capacitor module 515 is connected between the input terminal and the ground terminal. Considering that a long wiring is often required between the input power supply for supplying power to the voltage conversion unit 510 and the input terminal of the light-emitting unit driving circuit 500, and the parasitic inductance on the wiring may hinder the change of the current, the input capacitor module 515 is set at the input terminal of the light-emitting unit driving circuit 500. When the switch module 512 of the voltage conversion unit 510 is turned on, the current suddenly increases, and the input capacitor module 515 is in a discharge state to assist in providing current. When the switch module 512 is closed, the current suddenly decreases to 0, and the input capacitor module 515 is in a charging state. The input capacitor module 515 and the output capacitor module 514 are arranged relative to each other in the second direction x to form a heat conduction channel extending along the first direction y, and the second direction x is parallel to the substrate 600 and intersects with the first direction y. For example, the second direction x is perpendicular to the first direction y. That is, the input capacitor module 515 and the output capacitor module 514 are arranged on both sides of the substrate 600, which can reduce the impact of heat generation of the power device. The heat conduction channel formed between the input capacitor module 515 and the output capacitor module 514 can facilitate heat transfer. It should be noted that Fig.15A The schematic diagram of the main board of the circuit board is schematically shown, and the arrangement of components on the sub-board can be basically consistent with the arrangement of components on the main board. For example, the output capacitor module on the sub-board of the circuit board is correspondingly arranged on the side close to the output interface, and the input capacitor module on the sub-board is correspondingly arranged on the side close to the input interface, and the arrangement of other components is completely consistent with the arrangement of components on the main board.

[0182] For example, the plurality of driving structures include a first driving structure, a second driving structure, and a third driving structure. At least two of the first driving structure, the second driving structure, and the third driving structure have non-overlapping portions in the first direction. Fig.15A, the first driving structure 501 and the second driving structure 502 have non-overlapping parts in the first direction y, and the second driving structure 502 is staggered relative to the first driving structure 501 in the second direction x. In this way, the first driving structure 501 and the second driving structure 502 form a heat dissipation space due to the staggered arrangement. When the circuit board is placed vertically, the heat emitted by the second driving structure 502 at a relatively lower position can flow upward through the heat dissipation space, reducing obstacles to heat flow.

[0183] In some examples, the plurality of driving structures include a first driving structure 501 and a second driving structure 502, the first driving structure 501 includes a first voltage conversion unit 5101 and a first light-emitting driving unit 5201, and the second driving structure 502 includes a second voltage conversion unit 5102 and a second light-emitting driving unit 5202; the first driving structure 501 and the second driving structure 502 are configured to satisfy at least one of the following conditions: the orthographic projection of the first voltage conversion unit 5101 on a plane perpendicular to the first direction y and the orthographic projection of the second voltage conversion unit 5102 on a plane perpendicular to the first direction y have non-overlapping portions; the orthographic projection of the first light-emitting driving unit 5201 on a plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on a plane perpendicular to the first direction y have non-overlapping portions part; the orthographic projection of the first voltage conversion unit 5101 on the plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driving unit 5201 on the plane perpendicular to the first direction y have non-overlapping parts; the orthographic projection of the first voltage conversion unit 5101 on the plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on the plane perpendicular to the first direction y have non-overlapping parts; the orthographic projection of the second voltage conversion unit 5102 on the plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on the plane perpendicular to the first direction y have non-overlapping parts; and the orthographic projection of the second voltage conversion unit 5102 on the plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driving unit 5201 on the plane perpendicular to the first direction y have non-overlapping parts.

[0184] For example, the orthographic projection of the first voltage conversion unit 5101 on a plane perpendicular to the first direction y and the orthographic projection of the second voltage conversion unit 5102 on a plane perpendicular to the first direction y have non-overlapping parts. For example, in at least two driving structures of the first driving structure, the second driving structure and the third driving structure, the voltage conversion units have non-overlapping parts in the first direction. For example, referring to Fig.15AThere is a non-overlapping portion between the voltage conversion unit 5101 in the first driving structure 501 and the voltage conversion unit 5102 in the second driving structure 502 in the first direction y, and the voltage conversion unit 5102 is staggered relative to the voltage conversion unit 5101 in the second direction x.

[0185] refer to Fig.15A For example, the first voltage conversion unit 5101 includes a first diode module 513 and a first input capacitor module 515, and the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second inductor module 511'. The orthographic projection of the first diode module 513 on a plane perpendicular to the first direction y and the orthographic projection of the second output capacitor module 514' on a plane perpendicular to the first direction y have a first non-overlapping portion; the orthographic projection of the first input capacitor module 515 on a plane perpendicular to the first direction y and the orthographic projection of the second inductor module 511' on a plane perpendicular to the first direction y have a second non-overlapping portion. For example, the size of the first non-overlapping portion in the second direction x is greater than 10 mm; the second direction x is parallel to the substrate and intersects with the first direction y; the size of the second non-overlapping portion in the second direction x is greater than 3 mm.

[0186] refer to Fig.15A For example, the side edge of the diode module 513 (first diode module) close to the third edge a3 is the side edge of the first voltage conversion unit 5101, and the side edge of the input capacitor module 515 (first input capacitor module) away from the third edge a3 is the other side edge of the first voltage conversion unit 5101. For example, the side edge of the output capacitor module 514' (second output capacitor module) close to the third edge a3 is the side edge of the second voltage conversion unit 5102, and the side edge of the inductor module 511' (second inductor module) away from the third edge a3 is the other side edge of the second voltage conversion unit 5102. Therefore, the offset distance between the first diode module 513 and the second output capacitor module 514' is the offset distance between the first voltage conversion unit 5101 and the second voltage conversion unit 5102 on the side close to the third edge a3. Correspondingly, the offset distance between the first input capacitor module 515 and the second inductor 511 ′ is also the offset distance between the first voltage conversion unit 5101 and the second voltage conversion unit 5102 on the side away from the third edge a3 .

[0187] like Fig.15AAs shown, taking the first driving structure 501 and the second driving structure 502 as examples, the two boundaries of the first voltage conversion unit 5101 in the first driving structure 501 in the second direction x are the boundary of the first diode module 513 and the boundary of the first input capacitor module 515. The two boundaries of the first light-emitting driving unit 5201 in the first driving structure 501 in the second direction x are the boundary of the first switch tube module 522 and the boundary of the first driving module 521. In the second driving structure 502, the two boundaries of the second voltage conversion unit 5102 in the second direction x are the boundary of the second output capacitor module 514' and the boundary of the second inductor 511'. The two boundaries of the second light-emitting driving unit 5202 in the second direction x are the boundary of the second switch tube module 522' and the boundary of the second driving module 521'. In this way, according to the misalignment distance between components, the misalignment distance between the voltage conversion unit and the voltage conversion unit, and between the light-emitting driving unit and the light-emitting driving unit can be known.

[0188] For example, the plurality of driving structures include a first driving structure 501 and a second driving structure 502, the first driving structure 501 includes a first voltage conversion unit 5101, the first voltage conversion unit 5101 includes a first inductance module 511; the second driving structure 502 includes a second voltage conversion unit 5102, the second voltage conversion unit 5102 includes a second inductance module 511'; the orthographic projection of the first inductance module 511 on a plane perpendicular to the first direction y and the orthographic projection of the second inductance module 511' on a plane perpendicular to the first direction y have non-overlapping parts. For example, the inductance module 511 in the voltage conversion unit 5101 and the inductance module 511' in the voltage conversion unit 5102 are staggered. For example, the switch module 512 in the voltage conversion module 5101 and the switch module 512' in the voltage conversion unit 5102 are staggered.

[0189] For example, in at least two of the first driving structure, the second driving structure and the third driving structure, the orthographic projections of the diode modules on the plane perpendicular to the first direction at least partially do not overlap. For example, the diode module 513 in the voltage conversion module 5101 and the diode module 513' in the voltage conversion unit 5102 are arranged in a staggered manner.

[0190] For example, the orthographic projection of the first light-emitting driving unit 5201 on a plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on a plane perpendicular to the first direction y have non-overlapping parts. For example, in at least two driving structures of the first driving structure, the second driving structure and the third driving structure, the light-emitting driving units have non-overlapping parts in the first direction. For example, referring to Fig.15AThere is a non-overlapping portion between the light-emitting driving unit 5201 in the first driving structure 501 and the light-emitting driving unit 5202 in the second driving structure 502 in the first direction y, and the light-emitting driving unit 5202 is staggered relative to the light-emitting driving unit 5201 in the second direction x.

[0191] For example, the first light-emitting driving unit 5201 includes a first switch tube module 522 and a first driving module 521, and the second light-emitting driving unit 5202 includes a second switch tube module 522' and a second driving module 521'; for example, the orthographic projection of the first switch tube module 522 on a plane perpendicular to the first direction y and the orthographic projection of the second switch tube module 522' on a plane perpendicular to the first direction y have a third non-overlapping portion; the orthographic projection of the first driving module 521 on a plane perpendicular to the first direction y and the orthographic projection of the second driving module 521' on a plane perpendicular to the first direction y have a fourth non-overlapping portion. For example, the size of the third non-overlapping portion in the second direction x is greater than 5 mm; the size of the fourth non-overlapping portion in the second direction x is greater than 3 mm. For example, the switch tube 522 in the light-emitting driving unit 5201 and the switch tube 522' in the light-emitting driving unit 5202 are staggered. For example, in combination with the above example, the switch tubes 522 are arranged in two rows and six columns, and the switch tubes 522 in two adjacent rows are staggered. For example, the switch tubes 522 ′ are also arranged in two rows and six columns, and the switch tubes 522 ′ in two adjacent rows are staggered.

[0192] For example, the orthographic projection of the first voltage conversion unit 5101 on the plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driving unit 5201 on the plane perpendicular to the first direction y have non-overlapping parts. For example, the orthographic projection of the first voltage conversion unit 5101 on the plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on the plane perpendicular to the first direction y have non-overlapping parts. For example, the orthographic projection of the second voltage conversion unit 5102 on the plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on the plane perpendicular to the first direction y have non-overlapping parts. For example, the orthographic projection of the second voltage conversion unit 5102 on the plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driving unit 5201 on the plane perpendicular to the first direction y have non-overlapping parts. For example, in at least two driving structures of the first driving structure, the second driving structure and the third driving structure, at least one voltage conversion unit and at least one light-emitting driving unit have non-overlapping parts in the first direction. For example, referring to Fig.15A, the light-emitting driving unit 5201 in the first driving structure 501 and the voltage conversion unit 5102 in the second driving structure 502 have non-overlapping parts in the first direction y, and the voltage conversion unit 5102 is staggered relative to the light-emitting driving unit 5201 in the second direction x. For example, the switch tube 522 in the light-emitting driving unit 5201 and the output capacitor module 514' in the voltage conversion unit 5102 are staggered.

[0193] For example, the two boundaries of the first voltage conversion unit 5101 in the first driving structure 501 in the second direction x are the boundary of the first diode module 513 and the boundary of the first input capacitor module 515. The two boundaries of the first light-emitting driving unit 5201 in the first driving structure 501 in the second direction x are the boundary of the first switch tube module 522 and the boundary of the first driving module 521. In the second driving structure 502, the two boundaries of the second voltage conversion unit 5102 in the second direction x are the boundary of the second output capacitor module 514' and the boundary of the second inductor 511'. The two boundaries of the second light-emitting driving unit 5202 in the second direction x are the boundary of the second switch tube module 522' and the boundary of the second driving module 521'. It can be understood that the misalignment relationship between the voltage conversion unit and the light-emitting driving unit is the distance difference between the edges of each component.

[0194] For example, the orthographic projection of the first diode module 513 on the plane perpendicular to the first direction y and the orthographic projection of the first switch tube module 522 on the plane perpendicular to the first direction y have a fifth non-overlapping portion. For example, the size of the fifth non-overlapping portion in the second direction x is greater than 6 mm.

[0195] For example, the orthographic projection of the first input capacitor module 515 on the plane perpendicular to the first direction y and the orthographic projection of the first driving module 521 on the plane perpendicular to the first direction y have a sixth non-overlapping portion. For example, the size of the sixth non-overlapping portion in the second direction x is greater than 11 mm.

[0196] For example, the orthographic projection of the first diode module 513 on the plane perpendicular to the first direction y and the orthographic projection of the second switch tube module 522' on the plane perpendicular to the first direction y have a seventh non-overlapping portion; for example, the size of the seventh non-overlapping portion in the second direction x is greater than 11 mm.

[0197] For example, the orthographic projection of the first input capacitor module 515 on the plane perpendicular to the first direction y and the orthographic projection of the second driving module 521 ′ on the plane perpendicular to the first direction y have an eighth non-overlapping portion; for example, the size of the eighth non-overlapping portion in the second direction x is greater than 7 mm.

[0198] For example, the orthographic projection of the first switch tube module 522 on the plane perpendicular to the first direction y and the orthographic projection of the second output capacitor module 514' on the plane perpendicular to the first direction y have a ninth non-overlapping portion; for example, the size of the ninth non-overlapping portion in the second direction x is greater than 5 mm.

[0199] For example, the orthographic projection of the first driving module 521 on the plane perpendicular to the first direction y and the orthographic projection of the second inductor module 511 ′ on the plane perpendicular to the first direction y have a tenth non-overlapping portion; for example, the size of the tenth non-overlapping portion in the second direction x is greater than 8 mm.

[0200] For example, the orthographic projection of the second output capacitor module 514' on the plane perpendicular to the first direction y and the orthographic projection of the second switch tube module 522' on the plane perpendicular to the first direction y have an eleventh non-overlapping portion; for example, the size of the eleventh non-overlapping portion in the second direction x is greater than 0.5 mm.

[0201] For example, the orthographic projection of the second inductor module 511' on the plane perpendicular to the first direction y and the orthographic projection of the second driving module 521' on the plane perpendicular to the first direction y have a twelfth non-overlapping portion; for example, the size of the twelfth non-overlapping portion in the second direction x is greater than 4 mm.

[0202] For example, the substrate includes a first edge and a second edge disposed opposite to each other in a first direction, and the heat conduction channel is directed from the second edge to the first edge. Fig.15D For example, the heat conduction channel shown by the arrow can guide the heat from the second edge a2 to the first edge a1.

[0203] like Fig.15D As shown, the spacing between components forms a heat conduction channel. Fig.15D The spacing between two adjacent inductors, the spacing between the output capacitor and the input capacitor, the spacing between two adjacent switching elements, and the spacing between the diode and the inductor (as shown in the shaded area) are schematically shown. It can be understood that the above spacings all extend along the longitudinal direction of the circuit board. When the circuit board is placed in a vertical state for use, the spacings extending along the longitudinal direction formed between the components together form a heat conduction channel, so that the heat dissipated by the components goes up through the heat conduction channel formed by the spacing, goes up from the second edge a2 and dissipates from the first edge a1. The utility model reduces the barriers to heat by arranging the heat conduction channel in the longitudinal direction of the components, so that the heat can be dissipated through the shortest possible channel, thereby improving the heat dissipation effect. Reference Fig.15DIn addition to the intervals extending along the first direction, the circuit board of the utility model is also provided with a plurality of intervals extending along the second direction, such as the intervals between two adjacent diodes. In this way, in addition to the heat going up along the first direction, the heat can also be dissipated to both sides of the circuit board through the intervals in the second direction. In addition, by providing the intervals extending along the second direction, the spacing between components can be widened, thereby providing a larger peripheral space for the heat dissipation of the components, and reducing the problem of heat addition caused by the overly dense distribution of components.

[0204] Combination FIG. 15A to FIG. 15D As shown, for example, the first inductor module 511 includes a first inductor and a second inductor arranged oppositely in the second direction x, and the second inductor module 511' includes a third inductor and a fourth inductor arranged oppositely in the second direction x; the second direction x is parallel to the substrate and intersects with the first direction y; the heat conduction channel includes a first interval between the first inductor and the second inductor. For example, the first interval is greater than or equal to 10 mm. Reference Fig.15D , the gray area between the first inductor L1 and the second inductor L2 shows a first interval extending along the first direction y. Fig.15D In the embodiment, only the first interval extending to the second switch module 512' is shown, however, the utility model is not limited thereto, and reference is made to Fig.15A and Fig.15D , the first interval may further continue to extend along the first direction y to the second edge a2 of the substrate 600 .

[0205] Combination FIG. 15A to FIG. 15D As shown, for example, the orthographic projection of the first interval on the plane perpendicular to the first direction y and the orthographic projection of the third inductor on the plane perpendicular to the first direction y have a first overlapping portion 01. For example, the orthographic projection of the first interval on the plane perpendicular to the first direction y and the orthographic projection of the fourth inductor on the plane perpendicular to the first direction y have a second overlapping portion. For example, the size of the first overlapping portion 01 in the second direction x is greater than 1 / 3 of the size of the third inductor in the second direction x. For example, the size of the first overlapping portion 01 in the second direction x can be 10 mm, and the size of the third inductor in the second direction x can be 17 mm. Of course, the size of the first overlapping portion 01 and the size of the third inductor are not limited here. For example, the size of the second overlapping portion in the second direction x is greater than 1 / 3 of the size of the fourth inductor in the second direction x. For example, the fourth inductor may also overlap with the interval in the first direction y. For example, the size of the second overlapping portion in the second direction x may also be 10 mm, and the size of the fourth inductor in the second direction x may be 17 mm. Of course, the size of the second overlapping portion and the size of the fourth inductor are not limited here.

[0206] Combination FIG. 15A to FIG. 15DAs shown, for example, the spacing between the first inductor and the second inductor in the second direction x is the same as the spacing between the third inductor and the fourth inductor in the second direction x. For example, the spacing between the first inductor and the second inductor is equal to 10 mm, and the spacing between the third inductor and the fourth inductor is equal to 10 mm. In some other examples, the spacing between the first inductor and the second inductor may also be different from the spacing between the third inductor and the fourth inductor, and the present invention does not limit this.

[0207] For example, the plurality of driving structures further include a third driving structure 503, the third driving structure 503 includes a third voltage conversion unit 5103, the third voltage conversion unit 5103 includes a third inductor module; the first inductor module and the third inductor module have non-overlapping parts in the first direction. For example, the second inductor module and the third inductor module have non-overlapping parts in the first direction. It can be understood that the inductor modules in the first driving structure 501, the second driving structure 502, and the third driving structure 503 can be staggered in pairs.

[0208] For example, the third inductor module includes a fifth inductor and a sixth inductor arranged relatively in the second direction. The spacing between the first inductor and the third inductor in the first direction is the same as the spacing between the third inductor and the fifth inductor in the first direction. The spacing between the second inductor and the fourth inductor in the first direction is the same as the spacing between the fourth inductor and the sixth inductor in the first direction. It can be understood that in two adjacent drive structures, the spacing between the inductor modules can be set to be the same. In this way, the distribution of each drive structure on the circuit board can be made more uniform.

[0209] Combination FIG. 15A to FIG. 15D As shown, for example, the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second input capacitor module 515' arranged oppositely in the second direction x; the orthographic projection of the first interval on a plane perpendicular to the first direction y and the orthographic projection of the second input capacitor module 515' on a plane perpendicular to the first direction y have a third overlapping portion 03. In this way, in the first direction y, at least part of the second input capacitor module 515' overlaps with the first interval, and the heat of the input capacitor module can be better dissipated from the first interval. For example, the size of the third overlapping portion 03 in the second direction x is greater than 1 / 3 of the size of the second input capacitor module 515' in the second direction x. For example, in the second direction x, the size of the third overlapping portion 03 is 10 mm, and the size of the second input capacitor module 515' is 18 mm. Of course, the size of the third overlapping portion 03 and the size of the second input capacitor module 515' are not limited here.

[0210] Combination FIG. 15A to FIG. 15DAs shown, for example, the first voltage conversion unit 5101 includes a first switch module 512; the orthographic projection of the first interval on a plane perpendicular to the first direction y overlaps at least partially with the orthographic projection of the first switch module 512 on a plane perpendicular to the first direction y. In this way, when the heat dissipated by the first switch module 512 goes upward, the first interval overlapping with the first switch module 512 in the first direction y can reduce the obstruction to the heat dissipation.

[0211] For example, the second voltage conversion unit 5102 includes a second switch module, and the spacing between the first switch module and the first inductor module in the first direction is the same as the spacing between the second switch module and the second inductor module in the first direction. For example, the plurality of drive structures also include a third drive structure 503, the third drive structure 503 includes a third voltage conversion unit 5103; the third voltage conversion unit 5103 includes a third switch module; the spacing between the first switch module and the second switch module in the first direction is the same as the spacing between the second switch module and the third switch module in the first direction. In this way, by setting the switch module spacings in two adjacent drive structures to be the same, the components can be distributed more evenly on the circuit board.

[0212] Combination FIG. 15A to FIG. 15D As shown, for example, the first switch module 512 includes a first switch element and a second switch element arranged at intervals along the second direction x. The orthographic projection of the first interval on a plane perpendicular to the first direction y and the orthographic projection of the first switch element on a plane perpendicular to the first direction y have a fourth overlapping portion 04, thereby facilitating the heat of the first switch element to pass upward through the first interval and dissipate. For example, the orthographic projection of the first interval on a plane perpendicular to the first direction y and the orthographic projection of the second switch element on a plane perpendicular to the first direction y have a fifth overlapping portion, thereby facilitating the heat of the second switch element to pass upward through the first interval and dissipate.

[0213] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the first interval in the second direction x is larger than the size of the first switch element in the second direction x, so as to facilitate the heat dissipation of the first switch element. For example, the size of the first interval in the second direction x is larger than the size of the second switch element in the second direction x, so as to facilitate the heat dissipation of the second switch element.

[0214] Combination FIG. 15A to FIG. 15DAs shown, for example, the size of the fourth overlapping portion 04 in the second direction x is greater than 1 / 2 of the size of the first switch element in the second direction x. For example, the size of the fourth overlapping portion 04 in the second direction x is 5 mm, and the size of the first switch element in the second direction x is 8 mm. For example, the size of the fifth overlapping portion in the second direction x is greater than 1 / 2 of the size of the second switch element in the second direction x. For example, the size of the fifth overlapping portion in the second direction x is 5 mm, and the size of the second switch element in the second direction x is 8 mm. Of course, the utility model does not limit the size of the first switch element, the second switch element, the fourth overlapping portion 04 or the fifth overlapping portion.

[0215] Combination FIG. 15A to FIG. 15D As shown, for example, the second voltage conversion unit 5102 includes a second switch module 512'. The orthographic projection of the first interval on a plane perpendicular to the first direction y overlaps at least partially with the orthographic projection of the second switch module 512' on a plane perpendicular to the first direction y. In some use scenarios of the circuit board, the second voltage conversion unit 5102 is located below the first voltage conversion unit 5101, and the first interval in the first voltage conversion unit 5101 overlaps with the second switch module 512' in the second voltage conversion unit 5102 in the first direction y, which can facilitate the heat of the second switch module 512' to dissipate upward.

[0216] Combination FIG. 15A to FIG. 15D As shown, for example, the second switch module 512' includes a third switch element and a fourth switch element arranged at intervals along the second direction x. For example, the orthographic projection of the first interval on a plane perpendicular to the first direction y overlaps at least partially with the orthographic projection of the third switch element on a plane perpendicular to the first direction y, so that the heat of the third switch element can be dissipated from the first interval. For example, the orthographic projection of the first interval on a plane perpendicular to the first direction y overlaps at least partially with the orthographic projection of the fourth switch element on a plane perpendicular to the first direction y, so that the heat of the fourth switch element can be dissipated from the first interval.

[0217] Combination FIG. 15A to FIG. 15D As shown, for example, the orthographic projection of the first interval on the plane perpendicular to the first direction y completely overlaps with the orthographic projection of the third switch element on the plane perpendicular to the first direction y, thereby improving the heat dissipation effect on the third switch element. For example, the orthographic projection of the first interval on the plane perpendicular to the first direction y completely overlaps with the orthographic projection of the fourth switch element on the plane perpendicular to the first direction y, thereby improving the heat dissipation effect on the fourth switch element.

[0218] Combination FIG. 15A to FIG. 15DAs shown, for example, the voltage conversion unit includes an inductor module, an output capacitor module and an input capacitor module, and the input capacitor module is arranged opposite to the output capacitor module in a second direction, and the second direction is parallel to the substrate and intersects with the first direction. The first inductor module 511 includes a first inductor and a second inductor arranged opposite to each other in a second direction x, and the second direction x is parallel to the substrate and intersects with the first direction y; the first voltage conversion unit 5101 includes a first output capacitor module 514 and a first input capacitor module 515 arranged opposite to each other in the second direction x; the heat conduction channel includes a second interval between the first output capacitor module 514 and the first input capacitor module 515. For example, the second interval is greater than or equal to 28 mm. Reference Fig.15D , the gray area between the first output capacitor module 514 and the first input capacitor module 515 shows a second interval extending along the first direction y. Fig.15D In the embodiment, only the second interval extending to the second switch module 512' is shown, however, the utility model is not limited thereto, and reference is made to Fig.15A and Fig.15D , the second interval may further continue to extend along the first direction y to the second edge a2 of the substrate 600 .

[0219] Combination FIG. 15A to FIG. 15D As shown, for example, the orthographic projection of the second interval on the plane perpendicular to the first direction y and the orthographic projection of the first inductor on the plane perpendicular to the first direction y have a sixth overlapping portion 06, so that the first inductor is cooled by the second interval. For example, the orthographic projection of the second interval on the plane perpendicular to the first direction y and the orthographic projection of the second inductor on the plane perpendicular to the first direction y have a seventh overlapping portion 07, so that the second inductor is cooled by the second interval.

[0220] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the second interval in the second direction x is larger than the size of the first inductor in the second direction x, so as to improve the heat dissipation effect of the first inductor. For example, the size of the second interval in the second direction x is larger than the size of the second inductor in the second direction x, so as to improve the heat dissipation effect of the second inductor.

[0221] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the sixth overlapping portion 06 in the second direction x is greater than 1 / 3 of the size of the first inductor in the second direction x. For example, the size of the sixth overlapping portion 06 in the second direction x is 6 mm, and the size of the first inductor in the second direction x is 17 mm. For example, the size of the seventh overlapping portion 07 in the second direction x is greater than 1 / 3 of the size of the second inductor in the second direction x. For example, the size of the seventh overlapping portion 07 in the second direction x is 12 mm. The size of the second inductor in the second direction x is 19 mm.

[0222] Combination FIG. 15A to FIG. 15D As shown, for example, the orthographic projection of the second interval on the plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second inductor module 511 ′ on the plane perpendicular to the first direction y, so that the heat of the second inductor module 511 ′ can be dissipated through the second interval.

[0223] Combination FIG. 15A to FIG. 15D As shown, for example, the second inductor module 511' includes a third inductor and a fourth inductor arranged opposite to each other in the second direction x. The orthographic projection of the second interval on the plane perpendicular to the first direction y overlaps with the orthographic projection of the third inductor on the plane perpendicular to the first direction y at least partially, so as to improve the heat dissipation effect of the third inductor. The orthographic projection of the second interval on the plane perpendicular to the first direction y overlaps with the orthographic projection of the fourth inductor on the plane perpendicular to the first direction y at least partially, so as to improve the heat dissipation effect of the fourth inductor.

[0224] Combination FIG. 15A to FIG. 15D As shown, for example, the orthographic projection of the second interval on the plane perpendicular to the first direction y completely overlaps with the orthographic projection of the third inductor on the plane perpendicular to the first direction y, that is, the orthographic projection of the second interval can completely cover the orthographic projection of the third inductor, thereby increasing the heat dissipation area. For example, the orthographic projection of the second interval on the plane perpendicular to the first direction y completely overlaps with the orthographic projection of the fourth inductor on the plane perpendicular to the first direction y, that is, the orthographic projection of the second interval can completely cover the orthographic projection of the fourth inductor, thereby increasing the heat dissipation area.

[0225] Combination FIG. 15A to FIG. 15D As shown, for example, the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second input capacitor module 515' arranged opposite to each other in the second direction x. The orthogonal projection of the second interval on the plane perpendicular to the first direction y and the orthogonal projection of the second output capacitor module 514' on the plane perpendicular to the first direction y have an eighth overlapping portion 08 to improve the heat dissipation effect of the second output capacitor module 514'. For example, the orthogonal projection of the second interval on the plane perpendicular to the first direction y and the orthogonal projection of the second input capacitor module 515' on the plane perpendicular to the first direction y have a ninth overlapping portion 09 to improve the heat dissipation effect of the second input capacitor module 515'.

[0226] Combination FIG. 15A to FIG. 15DAs shown, for example, the size of the eighth overlapping portion 08 in the second direction x is greater than 1 / 15 of the size of the second output capacitor module 514' in the second direction x. For example, in the second direction x, the size of the eighth overlapping portion 08 is 2 mm, and the size of the second output capacitor module 514' is 28 mm. For example, the size of the ninth overlapping portion 09 in the second direction x is greater than 2 / 3 of the size of the second output capacitor module 514' in the second direction x. For example, in the second direction x, the size of the ninth overlapping portion 09 is 22 mm, and the size of the second output capacitor module 514' is 28 mm. Of course, the sizes of the eighth overlapping portion 08, the ninth overlapping portion 09, the second output capacitor module 514' and the second input capacitor module 515' of the utility model are not limited.

[0227] Combination FIG. 15A to FIG. 15D As shown, for example, the first voltage conversion unit 5101 includes a first switch module 512. The orthographic projection of the second interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the first switch module 512 on a plane perpendicular to the first direction y, so that the heat of the first switch module 512 can be better dissipated.

[0228] Combination FIG. 15A to FIG. 15D As shown, for example, the first switch module 512 includes a first switch element and a second switch element arranged at intervals along the second direction x. For example, the orthographic projection of the second interval on a plane perpendicular to the first direction y overlaps at least partially with the orthographic projection of the first switch element on a plane perpendicular to the first direction y, thereby dissipating heat for the first switch element through the second interval. For example, the orthographic projection of the second interval on a plane perpendicular to the first direction y overlaps at least partially with the orthographic projection of the second switch element on a plane perpendicular to the first direction y, thereby dissipating heat for the second switch element through the second interval.

[0229] Combination FIG. 15A to FIG. 15D As shown, for example, the orthographic projection of the second interval on the plane perpendicular to the first direction y completely overlaps with the orthographic projection of the first switch element on the plane perpendicular to the first direction y, so as to improve the heat dissipation effect on the first switch element. For example, the orthographic projection of the second interval on the plane perpendicular to the first direction y completely overlaps with the orthographic projection of the second switch element on the plane perpendicular to the first direction y, so as to improve the heat dissipation effect on the second switch element.

[0230] Combination FIG. 15A to FIG. 15D As shown, for example, the second voltage conversion unit 5102 includes a second switch module 512'. The orthographic projection of the second interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second switch module 512' on a plane perpendicular to the first direction y, so that the heat of the second switch module 512' can be better dissipated.

[0231] Combination FIG. 15A to FIG. 15D As shown, for example, the second switch module 512' includes a third switch element and a fourth switch element arranged at intervals along the second direction x. For example, the orthographic projection of the second interval on a plane perpendicular to the first direction y and the orthographic projection of the third switch element on a plane perpendicular to the first direction y have a tenth overlapping portion 10, so that the heat of the third switch element can be better dissipated. For example, the orthographic projection of the second interval on a plane perpendicular to the first direction y and the orthographic projection of the fourth switch element on a plane perpendicular to the first direction y have an eleventh overlapping portion 11, so that the heat of the fourth switch element can be better dissipated.

[0232] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the tenth overlapping portion 10 in the second direction x is greater than 2 / 3 of the size of the third switching element in the second direction x. Of course, the tenth overlapping portion 10 may also completely overlap with the third switching element. For example, the size of the eleventh overlapping portion 11 in the second direction x is greater than 2 / 3 of the size of the fourth switching element in the second direction x. For example, the size of the eleventh overlapping portion 11 in the second direction x is 7 mm, and the size of the fourth switching element in the second direction x is 8 mm. It can be understood that the utility model does not limit the sizes of the tenth overlapping portion 10, the eleventh overlapping portion 11, the third switching element, and the fourth switching element. FIG. 15A to FIG. 15D As shown, for example, the heat conduction channel includes a second interval between the output capacitor module and the input capacitor module. For example, the second interval in the first drive structure 501 is formed between the input capacitor module 515 and the output capacitor module 514, for example, between the input capacitor module 515, the first output capacitor C1 and the second output capacitor C2. The second interval in the second drive structure 502 is formed between the input capacitor module 515' and the output capacitor module 514', for example, between the input capacitor module 515', the first output capacitor C1' and the second output capacitor C2'. The second interval in the third drive structure 503 is formed between the input capacitor module 515" and the output capacitor module 514", for example, between the input capacitor module 515", the first output capacitor C1" and the second output capacitor C2".

[0233] Combination FIG. 15A to FIG. 15DAs shown, for example, the second interval in the first drive structure 501, the second interval in the second drive structure 502, and the second interval in the third drive structure 503 have overlapping parts in the corresponding extension direction. In this way, when the components closer to the second edge a2 dissipate heat, due to the upward movement of heat, the heat further below can pass through the three second intervals in sequence and dissipate from one end of the second interval close to the first edge a1. Thus, the heat conduction channel in the drive structure can reduce the obstacles in the upward movement of heat and improve the heat dissipation efficiency of the components. For example, the size of the second interval in the second drive structure 502 in the second direction and the size of the second interval in the third drive structure 503 in the second direction are both smaller than the size of the second interval in the first drive structure 501 in the second direction. Since the components further above will be continuously baked by the heat source below, the wider second interval can not only widen the spacing between the output capacitor module 514 and the input capacitor module 515, but also make it easier to dissipate heat.

[0234] For example, the orthographic projection of the inductor module on the plane perpendicular to the first direction overlaps with the orthographic projection of the interval on the plane perpendicular to the first direction. Fig.15D , in the first driving structure 501, part of the structure of the inductor module 511 is located in the extension direction of the interval. Taking the first driving structure 501 as an example, the inductor module 511 includes a first inductor L1 and a second inductor L2 connected in parallel, and the first inductor L1 and the second inductor L2 are arranged at intervals from each other along the second direction x. The first inductor L1 and the second inductor L2 arranged at intervals can increase the spacing between components to improve the heat dissipation effect. For example, part of the structure of the first inductor L1 is located in the extension direction of the second interval, and part of the structure of the second inductor L2 is located in the extension direction of the second interval.

[0235] For example, the ratio of the size of the interval in the second direction to the size of the first inductor in the second direction is greater than 1.5. For example, the ratio of the size of the interval in the second direction to the size of the second inductor in the second direction is greater than 1.5, and the ratio may be, but is not limited to, 1.5, 1.55, 1.6, 1.65, 1.7, etc., and the present invention does not limit this. Fig.15D In the first driving structure 501, the ratio of the second interval to the length of the first inductor L1 is greater than 1.5. The ratio of the second interval to the length of the second inductor L2 is greater than 1.5, and the ratio may be, but is not limited to, 1.5, 1.55, 1.6, 1.65, 1.7, etc., and the present invention does not impose any limitation on this.

[0236] For example, the orthographic projection of the interval on the plane perpendicular to the second direction and the orthographic projection of the inductor module on the plane perpendicular to the second direction at least partially do not overlap. Fig.15D, the first driving structure 501 is used as an example for description. Since the second interval is located between the output capacitor module 514 and the input capacitor module 515, the second interval and the inductor module 511 are spaced apart in the first direction y, that is, the inductor module 514 and the output capacitor module 514 are spaced apart, and the inductor module 514 and the input capacitor module 515 are spaced apart, which increases the spacing between components and improves the heating effect between components.

[0237] Combination FIG. 15A to FIG. 15D As shown, for example, the first inductor module 511 includes a first inductor and a second inductor arranged opposite to each other in a second direction x, the second direction x is parallel to the substrate and intersects with the first direction y; the first voltage conversion unit 5101 includes a first switch module 512, and the first switch module 512 includes a first switch element and a second switch element arranged at intervals along the second direction x. The heat conduction channel includes a third interval between the first switch element and the second switch element. Fig.15D , the gray area between the first switch element Q1 and the second switch element Q2 shows a third interval extending along the first direction y. Fig.15D In the embodiment, only the third interval is extended to the second switch module 512', however, the utility model is not limited thereto, and reference is made to Fig.15A and Fig.15D , the third interval can also continue to extend along the first direction y to the second edge a2 of the substrate 600. For example, the third interval is greater than or equal to 8 mm. For example, the orthographic projection of the third interval on the plane perpendicular to the first direction y and the orthographic projection of the first inductor on the plane perpendicular to the first direction y have a twelfth overlapping portion 12, so that the first inductor is cooled by the third interval. For example, the orthographic projection of the third interval on the plane perpendicular to the first direction y and the orthographic projection of the second inductor on the plane perpendicular to the first direction y have a thirteenth overlapping portion 13, so that the second inductor is cooled by the third interval.

[0238] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the twelfth overlapping portion 12 in the second direction x is greater than 1 / 10 of the size of the first inductor in the second direction x. For example, the size of the thirteenth overlapping portion 13 in the second direction x is greater than 1 / 10 of the size of the second inductor in the second direction x. For example, the size of the thirteenth overlapping portion 13 in the second direction x is 3 mm, and the size of the second inductor in the second direction x is 19 mm. Of course, the utility model does not limit the sizes of the twelfth overlapping portion 12, the thirteenth overlapping portion 13, the first inductor, and the second inductor.

[0239] Combination FIG. 15A to FIG. 15DAs shown, for example, the second inductor module 511' includes a third inductor and a fourth inductor arranged oppositely in the second direction x; the second direction x is parallel to the substrate and intersects with the first direction y. For example, the orthogonal projection of the third interval on the plane perpendicular to the first direction y and the orthogonal projection of the third inductor on the plane perpendicular to the first direction y have a fourteenth overlapping portion 14, so that the third inductor is dissipated through the third interval. For example, the orthogonal projection of the third interval on the plane perpendicular to the first direction y and the orthogonal projection of the fourth inductor on the plane perpendicular to the first direction y have a fifteenth overlapping portion, so that the fourth inductor is dissipated through the third interval.

[0240] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the fourteenth overlapping portion 14 in the second direction x is greater than 1 / 2 of the size of the third inductor in the second direction x. For example, the size of the fourteenth overlapping portion 14 in the second direction x is 8 mm, and the size of the third inductor in the second direction x is 17 mm. For example, the size of the fifteenth overlapping portion in the second direction x is greater than 1 / 2 of the size of the fourth inductor in the second direction x. Of course, the utility model does not limit the sizes of the fourteenth overlapping portion 14, the fifteenth overlapping portion, the third inductor, and the fourth inductor.

[0241] Combination FIG. 15A to FIG. 15D As shown, for example, the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second input capacitor module 515' arranged opposite to each other in the second direction x. For example, the orthogonal projection of the third interval on the plane perpendicular to the first direction y and the orthogonal projection of the second output capacitor module 514' on the plane perpendicular to the first direction y have a sixteenth overlapping portion, so that the second output capacitor module 514' is dissipated through the third interval. For example, the orthogonal projection of the third interval on the plane perpendicular to the first direction y and the orthogonal projection of the second input capacitor module 515' on the plane perpendicular to the first direction y have a seventeenth overlapping portion 17, so that the second input capacitor module 515' is dissipated through the third interval.

[0242] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the sixteenth overlapping portion in the second direction x is greater than 1 / 3 of the size of the second output capacitor module 514' in the second direction x. For example, the size of the seventeenth overlapping portion 17 in the second direction x is greater than 1 / 3 of the size of the second input capacitor module 515' in the second direction x. For example, the size of the seventeenth overlapping portion 17 in the second direction x is 8 mm, and the size of the second input capacitor module 515' in the second direction x is 28 mm. Of course, the utility model does not limit the sizes of the sixteenth overlapping portion, the seventeenth overlapping portion 17, the second output capacitor module 514' and the second input capacitor module 515'.

[0243] Combination FIG. 15A to FIG. 15D As shown, for example, the second voltage conversion unit 5102 includes a second switch module 512'; the orthographic projection of the third interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second switch module 512' on a plane perpendicular to the first direction y, so as to dissipate heat for the second switch module 512' through the third interval.

[0244] Combination FIG. 15A to FIG. 15D As shown, for example, the second switch module 512' includes a third switch element and a fourth switch element arranged at intervals along the second direction x; the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the third switch element on a plane perpendicular to the first direction y have an eighteenth overlapping portion 18, so that the third switch element is cooled by the third interval. For example, the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the fourth switch element on a plane perpendicular to the first direction y have a nineteenth overlapping portion, so that the fourth switch element is cooled by the third interval.

[0245] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the eighteenth overlapping portion 18 in the second direction x is greater than 1 / 3 of the size of the third switch element in the second direction x. For example, the size of the eighteenth overlapping portion 18 in the second direction x is 3 mm, and the size of the third switch element in the second direction x is 7 mm. The size of the nineteenth overlapping portion in the second direction x is greater than 1 / 3 of the size of the fourth switch element in the second direction x. Of course, the utility model does not limit the sizes of the eighteenth overlapping portion 18, the nineteenth overlapping portion, the third switch element, and the fourth switch element.

[0246] For example, the voltage conversion unit further includes a switch module. For example, the orthographic projection of the switch module on a plane perpendicular to the first direction overlaps with the orthographic projection of the heat conduction channel on a plane perpendicular to the first direction. Fig.15D In the first driving structure 501, part of the structure of the switch module 512 is located in the extension direction of the heat conduction channel. Taking the first driving structure 501 as an example, part of the structure of the first switch element Q1 is located in the extension direction of the heat conduction channel, and part of the structure of the second switch element Q2 is located in the extension direction of the heat conduction channel.

[0247] Combination FIG. 15A to FIG. 15DAs shown, for example, the first inductor module 511 includes a first inductor and a second inductor arranged opposite to each other in a second direction x, the second direction x is parallel to the substrate and intersects with the first direction y; the first voltage conversion unit 5101 includes a first diode module 513, the first diode module 513 includes a first diode and a second diode arranged at intervals in the first direction y; the first voltage conversion unit 5101 also includes a first output capacitor module 514. The heat conduction channel includes a fourth interval located between the first diode and the second inductor. Fig.15A and Fig.15D , the gray area between the first diode D1 and the second inductor L2 shows a fourth interval extending along the first direction y. Fig.15D In the embodiment, only the fourth interval extending to the second output capacitor module 514' is shown, however, the utility model is not limited thereto, and reference is made to Fig.15A and Fig.15D , the fourth interval can also continue to extend along the first direction y to the second edge a2 of the substrate 600. For example, the fourth interval is greater than or equal to 12 mm. For example, the orthographic projection of the fourth interval on the plane perpendicular to the first direction y and the orthographic projection of the first output capacitor module 514 on the plane perpendicular to the first direction y have a twentieth overlapping portion 20, so that the first output capacitor module 514 is cooled by the fourth interval.

[0248] Combination FIG. 15A to FIG. 15D As shown, for example, the size of the twentieth overlapping portion 20 in the second direction x is greater than 1 / 3 of the size of the first output capacitor module 514 in the second direction x. For example, the size of the twentieth overlapping portion 20 in the second direction x is 12 mm, and the size of the first output capacitor module 514 in the second direction x is 28 mm. Of course, the utility model does not limit the size of the twentieth overlapping portion 20 and the first output capacitor module 514.

[0249] Combination FIG. 15A to FIG. 15D As shown, for example, the second voltage conversion unit 5102 includes a second output capacitor module 514'; the orthographic projection of the fourth interval on the plane perpendicular to the first direction y and the orthographic projection of the second output capacitor module 514' on the plane perpendicular to the first direction y have a twenty-first overlapping portion 21, so as to dissipate heat for the second output capacitor module 514' through the fourth interval.

[0250] Combination FIG. 15A to FIG. 15DAs shown, for example, the size of the twenty-first overlapping portion 21 in the second direction x is greater than 1 / 3 of the size of the second output capacitor module 514' in the second direction x. For example, the size of the twenty-first overlapping portion 21 in the second direction x is 12 mm, and the size of the second output capacitor module 514' in the second direction x is 28 mm. Of course, the utility model does not limit the size of the twenty-first overlapping portion 21 and the second output capacitor module 514'.

[0251] Combination FIG. 15A to FIG. 15D As shown, for example, multiple driving structures include a first driving structure 501 and a second driving structure 502, the first driving structure 501 includes a first voltage conversion unit 5101, the first voltage conversion unit 5101 includes a first diode module 513, the second driving structure 502 includes a second voltage conversion unit 5102, and the second voltage conversion unit 5102 includes a second diode module 513'; the orthographic projection of the first diode module 513 on a plane perpendicular to the first direction y and the orthographic projection of the second diode module 513' on a plane perpendicular to the first direction y have non-overlapping parts. In this way, through the misalignment between the first diode module 513 and the second diode module 513', the obstruction of heat dissipation between components in the first direction y can be reduced, thereby improving the heat dissipation effect.

[0252] Combination FIG. 15A to FIG. 15D As shown, for example, the orthographic projection of the first diode module 513 on a plane perpendicular to the first direction y and the orthographic projection of the second diode module 513' on a plane perpendicular to the first direction y do not overlap at all. In this way, the first diode module 513 and the second diode module 513' are completely misaligned, thereby providing a larger heat dissipation space.

[0253] For example, in at least two of the first drive structure, the second drive structure, and the third drive structure, the spacing between the inductor module and the switch module in the first direction is the same. For example, in at least two of the plurality of drive structures, the spacing between the inductor module and the switch module in the first direction is the same. Fig.15D In the second driving structure 502 and the third driving structure 503, the spacing between the inductor module and the switch module is the same. For example, the spacing l21 between the first inductor L1' and the first switch element Q1' and the spacing l31 between the first inductor L1" and the first switch element Q1" can be the same or different. For example, in the first driving structure, the second driving structure and the third driving structure, the spacing between the inductor module and the switch module can be the same or different. Fig.15DIn the example, the spacing l11 between the first inductor L1 and the first switch element Q1 is different from the spacing l21, and is different from the spacing l31. For example, the spacing l22 between the second inductor L2' and the second switch element Q2' and the spacing l32 between the second inductor L2" and the second switch element Q2" may be the same as or different from each other. For example, the spacing l12 between the second inductor L2 and the second switch element Q2 is different from the spacing l22, and is different from the spacing l32.

[0254] refer to Fig.15A and Fig. 15B For example, the substrate 600 includes a first conductive layer 610 and a first solder resist layer 620, the first conductive layer 610 and the first solder resist layer 620 are located on a side of the substrate 600 where the light-emitting unit driving circuit 500 is provided, the first conductive layer 610 is located on a side of the first solder resist layer 620 away from the light-emitting unit driving circuit 500, and a first opening 621 exposing the first conductive layer 610 is provided in the first solder resist layer 620. The first conductive layer 610 can be exposed through the first opening 621 provided in the first solder resist layer 620, so as to dissipate heat. Considering the layout of the wiring and components on the circuit board, the first opening 621 is slightly different in the area where the first driving structure 501, the second driving structure 502 and the third driving structure 503 are located. The utility model is described by taking the first opening 621 in the area where the first driving structure 501 is located as an example.

[0255] The first opening 621 includes a first opening portion 6211, which is located between the inductor module 511, the diode module 513 and the switch module 512, so as to dissipate heat in the middle of the components and improve the heat addition effect between the components. The area of ​​the first opening portion 6211 is greater than or equal to 970 square millimeters.

[0256] The first opening 621 includes a second opening portion 6212, and the second opening portion 6212 surrounds the inductor module 511, thereby dissipating heat from the inductor module 511. The area of ​​the second opening portion 6212 is greater than or equal to 320 square millimeters. Surrounding means that the second opening portion 6212 is opened in the peripheral area of ​​the inductor module 511. Surrounding can be as follows: Fig.15A The illustrated embodiment only covers a local area around the inductor module 511 in the circumferential direction, and can also be adjusted to cover the entire area around the inductor module in the circumferential direction according to actual needs, and the present invention does not make any limitation thereto.

[0257] The first opening 621 includes a third opening portion 6213, and the third opening portion 6213 surrounds the diode module 513, thereby dissipating heat for the diode module 513. It is understandable that the third opening portion 6213 can be Fig.15AThe third opening 6213 is shown as being opened between the first diode D1 and the second diode D2, and may also surround the entire circumferential area of ​​the diode module according to actual needs. The third opening 6213 includes a sub-area located between the first diode D1 and the second diode D2, with an area greater than or equal to 50 square millimeters. The third opening 6213 also includes an area located on the side of the second diode D2 away from the first diode D1, with an area greater than or equal to 90 square millimeters.

[0258] refer to FIG. 15A to FIG. 15C , the substrate 600 includes a second conductive layer 630 and a second solder resist layer 640 located on a side of the first conductive layer 610 away from the first solder resist layer 620, and the second conductive layer 630 is located between the second solder resist layer 640 and the first conductive layer 610. A second opening 641 exposing the second conductive layer 630 is provided in the second solder resist layer 640, and the orthographic projection of the second opening 641 on the third reference plane overlaps with the orthographic projection of the first opening 621 on the plane, and the third reference plane is parallel to the substrate 600. In this way, the openings on the two opposite sides of the substrate 600 correspond to each other, and while the components dissipate heat with the help of the first opening 621, the side where the second opening 641 is located dissipates heat with the help of the second opening 641, thereby improving the heat dissipation efficiency of the circuit board. Fig. 15B The second opening 641 includes a first opening portion 6411 corresponding to the first opening portion 6211 of the first opening 621, a second opening portion 6412 corresponding to the second opening portion 6212 of the first opening 621, and a third opening portion 6413 corresponding to the third opening portion 6213 of the first opening 621. The second opening 641 also includes a fourth opening portion 6414 corresponding to the position of the diode module 513. Fig.15A and Fig. 15B As shown, the orthographic projection of the second opening 641 on the third reference plane covers the orthographic projection of the first opening 621 on the third reference plane. For example, the orthographic projection of the first opening 621 on the substrate 600 completely falls within the orthographic projection of the second opening 641 on the substrate 600. It is understandable that the shape and size of the second opening can also be adjusted according to actual needs. Fig. 15B The second opening 641 is only schematically shown, and the shape and size of the second opening are not limited.

[0259] For example, it also includes a plurality of vias that at least penetrate the first conductive layer 610 and the second conductive layer 630, and the plurality of vias are arranged in an array. For example, the vias are heat dissipation vias. The vias can transfer the heat of the first conductive layer 610 to the second conductive layer 630, thereby dissipating heat. For example, copper is electroplated and filled in the vias. The orthographic projection of the first opening 621 on the third reference plane (a plane parallel to the substrate 600) covers at least part of the orthographic projection of the vias on the third reference plane, that is, the vias are opened around the components, so as to dissipate heat faster. For example, the orthographic projection of the vias on the plane parallel to the substrate 600 also falls into the orthographic projection of the second opening 641 on the plane. In this way, the vias can conduct the heat at the first opening 621 to the second opening 641.

[0260] Fig.17A The present invention is a schematic diagram of a circuit board provided in yet another example. Fig. 17B for Fig.17A A partial schematic diagram of the circuit board shown, Fig.17A and Fig.15A The difference is that Fig.17A The number of switching elements and output capacitors in each voltage conversion unit is Fig.15A The number of switching elements and the number of output capacitors in each voltage conversion unit are different. For example, Fig.17A Each voltage conversion unit in the circuit includes three switching elements and one output capacitor. Fig.17A The circuit board shown is Figure 1 The circuit boards shown may also have other differences, such as the positional relationship between components, etc., which are not limited by the present invention. Fig. 17C for Fig.17A A schematic plan view of the circuit board shown. Fig.18 This is a schematic diagram of a light-emitting unit driving circuit provided by another example of the present invention. It should be noted that in order to more clearly illustrate the arrangement of components in the circuit board, Fig. 17B Only some components in the first driving structure are shown. Fig. 17C Only some of the components on the circuit board are shown.

[0261] For example, FIG. 17A to FIG. 17C As shown, combined with Fig.15DThe circuit board includes a substrate 600, a plurality of voltage conversion units 510 and a plurality of light-emitting driving units 520 arranged on the substrate 600. The voltage conversion unit 510 includes an input terminal and an output terminal, and is configured to output a preset voltage. The light-emitting driving unit 520 is connected to the output terminal of the voltage conversion unit 510, and is configured to drive the light-emitting unit. The plurality of voltage conversion units 510 and the plurality of light-emitting driving units 520 are arranged in a one-to-one correspondence, and a voltage conversion unit 510 is arranged between adjacent light-emitting driving units 520. The voltage conversion unit 510 includes a first inductor L1 and a second inductor L2 connected in parallel, and the first inductor L1 and the second inductor L2 are arranged in a staggered manner. The circuit board provided in the present disclosure can disperse components with higher heat and improve the heat addition effect between components by arranging the voltage conversion unit 510 between adjacent light-emitting driving units 520 and arranging the first inductor L1 and the second inductor L2 in the voltage conversion unit 510 in a staggered manner.

[0262] For example, FIG. 17A to FIG. 17C As shown, combined with Fig.15D The circuit board includes a first edge a1 close to the voltage conversion unit 510 in the first direction y, and the first direction y is a direction from the voltage conversion unit 510 to the light-emitting driving unit 520; the first inductor L1 is spaced from the first edge a1 in the first direction y by a first spacing, and the second inductor L2 is spaced from the first edge a1 in the first direction y by a second spacing, and the first spacing is different from the second spacing. By setting the first spacing to be different from the second spacing, the misalignment space between the first inductor L1 and the second inductor L2 can be made larger, thereby improving the heat dissipation effect.

[0263] For example, FIG. 17A to FIG. 17C As shown, combined with Fig.15D The difference between the first spacing and the second spacing is less than or equal to 1 / 2 of the width of the first inductor L1 in the first direction y. For example, the difference between d54 and d55 is less than or equal to 1 / 2 of the width of the first inductor L1 in the first direction y.

[0264] For example, FIG. 17A to FIG. 17C As shown, combined with Fig.15D, a plurality of voltage conversion units 510 include a first voltage conversion unit 510 and a second voltage conversion unit 510 located on both sides of the first light-emitting driving unit 520 in the first direction y, and the first direction y is the direction pointing from the voltage conversion unit 510 to the light-emitting driving unit 520; the first voltage conversion unit 510 includes a first inductor module 511, and the second voltage conversion unit 510 includes a second inductor module 511'; the distance between the first inductor module 511 and the second inductor module 511' in the first direction y is y, and there is a non-overlapping part between the orthographic projection of the first inductor L1 on the first reference plane and the orthographic projection of the second inductor L2 on the first reference plane. The size of the non-overlapping part in the first direction y is h, and the size of the light-emitting driving unit 520 in the first direction y is x, then: y = a×x + b×h, 2 < a < 4, 1 < b < 3; wherein, the second direction x intersects with the first direction y, and the first reference plane is a plane perpendicular to the second direction x. For example, by setting the parameter relationship between the distance between the first inductor module 511 and the second inductor module 511' and the misalignment size between the first inductor L1 and the second inductor L2, the layout of each component on the circuit board can be made more reasonable, and the heat dissipation effect can also be improved.

[0265] For example, as FIG. 17A to FIG. 17C shown, and in combination with Fig.15D , a plurality of voltage conversion units 510 include a first voltage conversion unit 510 and a second voltage conversion unit 510 located on both sides of the first light-emitting driving unit 520. The first voltage conversion unit 510 includes a first inductor module 511, a first capacitor module, and a first switch module 512, and the second voltage conversion unit 510 includes a second inductor module 511'; the distance between the first inductor module 511 and the second inductor module 511' in the first direction y is y, the size of the first inductor module 511 in the first direction y is y1, the size of the first capacitor module in the first direction y is y2, and the size of the first switch module 512 in the first direction y is y3, then: y = k×y1 + y3 + 2×y2, 1 < k < 3; wherein, the first direction y is the direction pointing from the voltage conversion unit 510 to the light-emitting driving unit 520. By setting the parameter relationship between the first inductor module 511, the first capacitor module, the first switch module 512, and the distance y between the first inductor module 511 and the second inductor module 511' in the first direction y, the arrangement between each driving structure can be made more reasonable.

[0266] For example, as FIG. 17A to FIG. 17C shown, and in combination with Fig.15DThe plurality of voltage conversion units 510 include a first voltage conversion unit 510 and a second voltage conversion unit 510 located on both sides of the first light-emitting driving unit 520. The first voltage conversion unit 510 includes a first inductance module 511, a first capacitance module and a first switch module 512. The first inductance module 511 includes a first inductance L1 and a second inductance L2 connected in parallel to each other. The first inductance L1 and the second inductance L2 have a first interval in the second direction x. The first capacitance module includes a first output capacitance module 514 and a first input capacitance module 515 connected in parallel to each other. The first output capacitance module 514 and the first input capacitance module 515 have a second interval in the second direction x. The first switch module 512 includes a first switch connected in parallel to each other. Q1 and the second switch Q2, the first switch Q1 and the second switch Q2 have a third interval in the second direction x, the second voltage conversion unit 510 includes a second capacitor module, the second capacitor module includes a second output capacitor module 514' and a second input capacitor module 515' connected in parallel, the second output capacitor module 514' and the second input capacitor module 515' have a fourth interval in the second direction x; the fourth interval has an overlapping part with at least one of the first interval, the second interval, and the third interval on the second reference plane, the second reference plane is a plane perpendicular to the first direction y, the first direction y is a direction from the voltage conversion unit 510 to the light-emitting driving unit 520, and the second direction x is parallel to the substrate 600 and intersects with the first direction y.

[0267] For example, FIG. 17A to FIG. 17C As shown, combined with Fig.15D The first interval, the second interval, the third interval, and the fourth interval have a common overlapping portion on the second reference plane. By arranging the first interval, the second interval, the third interval, and the fourth interval to overlap, it is possible to reduce the obstacles to the heat of the components on the circuit board when they are dissipated upward, thereby improving the heat dissipation efficiency.

[0268] For example, FIG. 17A to FIG. 17C As shown, combined with Fig.15D , the size of the common overlapping part in the second direction x is less than or equal to the size of the first interval in the second direction x. For example, the ratio of the size of the common overlapping part in the second direction x to the size of the first interval in the second direction x is 0.3 to 0.7. For example, the ratio of the size of the common overlapping part in the second direction x to the size of the first interval in the second direction x is 0.4 to 0.6. For example, the ratio of the size of the common overlapping part in the second direction x to the size of the first interval in the second direction x is 0.5.

[0269] For example, FIG. 17A to FIG. 17C As shown, combined with Fig.15DThe first interval, the second interval, the third interval and the fourth interval are configured to satisfy at least one of the following conditions: the first interval is greater than or equal to 10 mm; the second interval is greater than or equal to 28 mm; the third interval is greater than or equal to 8 mm; and the fourth interval is greater than or equal to 4 mm.

[0270] In some embodiments, Fig.17A Shown and combined Fig. 17B , the voltage conversion unit 5101 in the first driving structure 501 is taken as an example for description. In combination with some of the above embodiments, in order to further reduce the temperature of the switch module 512, as Fig.18 As shown, the switch module 512 includes a first switch element Q1, a second switch element Q2 and a third switch element Q3 connected in parallel. Fig.17A and Fig. 17B The first switch element Q1, the second switch element Q2 and the third switch element Q3 are spaced apart from each other along the second direction x, and a distance d51 between any two of them is not less than 8 mm.

[0271] refer to Fig.17A and Fig. 17B For example, according to the temperature conditions of the inductor module 511, the switch module 512 and the diode module 513, the spacing d51 between the first switch element Q1, the second switch element Q2 and the third switch element Q3 in the switch module 512 is smaller than the spacing d52 between the first diode D1 and the second diode D2 in the diode module 513, and the spacing d52 between the first diode D1 and the second diode D2 is smaller than the spacing d53 between the first inductor L1 and the second inductor L2 in the inductor module 511.

[0272] refer to Fig.17A and Fig. 17B For example, the inductor module 511 is located on one side of the switch module 512 in the first direction y, and the first inductor L1 and the second inductor L2 are spaced apart from each other along the second direction x. For example, the spacing d53 between the first inductor L1 and the second inductor L2 is greater than or equal to 10 mm.

[0273] refer to Fig.17A and Fig. 17BFor example, in the first direction y, the minimum spacing between the first inductor L1 and the periphery of the substrate 600 is the first spacing d54, the minimum spacing between the second inductor L2 and the periphery of the substrate 600 is the second spacing d55, and the first spacing d54 is different from the second spacing d55. For example, the minimum spacing between the edge of one side of the first inductor L1 in the first direction y and the periphery of the substrate 600 is the first spacing d54, the minimum spacing between the edge of one side of the second inductor L2 in the first direction y and the periphery of the substrate 600 is the second spacing d55, and the first spacing d54 is different from the second spacing d55. The first inductor L1 and the second inductor L2 are alternately arranged in the first direction y, which can increase the peripheral space of the first inductor L1 and the second inductor L2, thereby increasing the heat dissipation space of the first inductor L1 and the second inductor L2 and reducing the temperature of the inductor module 511.

[0274] refer to Fig.17A and Fig. 17B For example, the difference between the first spacing d54 and the second spacing d55 is greater than or equal to 1 / 2 of the width of the first inductor L1 in the first direction y. For example, the staggered distance between the first inductor L1 and the second inductor L2 in the first direction y is greater than or equal to 1 / 2 of the width of the first inductor L1. For example, the size specifications of the first inductor L1 and the second inductor L2 are consistent. Fig. 17C For example, the difference between the first spacing d54 and the second spacing d55 is the staggered distance between the first inductor L1 and the second inductor L2 in the first direction y. For example, in multiple driving structures, the staggered distance between the first inductor and the second inductor in the first direction y can be the same or different. Fig. 17C At least two of the interleaving distance d between the first inductor L1 and the second inductor L2, the interleaving distance d' between the first inductor L1' and the second inductor L2', and the interleaving distance d" between the first inductor L1" and the second inductor L2" are the same.

[0275] refer to Fig.17A and Fig. 17B For example, the first inductor L1 and the second inductor L2 are arranged alternately in the first direction y. For example, between the inductor module 511 and the switch module 512, the spacing d56 between the first inductor L1 relatively closer to the switch module 512 and the first switch element Q1 is at least 10 mm, that is, greater than or equal to 10 mm. For example, the spacing d57 between the second inductor L2 relatively farther from the switch module 512 and the third switch element Q3 is greater than or equal to 11 mm. The spacing between the third switch element Q3 and the second diode D2 in the diode module 513 is the smallest, and the spacing d58 is greater than or equal to 10 mm. The first diode D1 and the second diode D2 in the diode module 513 are spaced from each other along the first direction y, and the spacing d52 between the two is greater than or equal to 9 mm.

[0276] For example, the orthographic projection of the switch module on the plane perpendicular to the first direction overlaps with the orthographic projection of the heat conduction channel on the plane perpendicular to the first direction. Fig. 17C , in the first driving structure 501, part of the structure of the switch module 512 is located in the extension direction of the heat conduction channel. In the first driving structure 501, the second switch element Q2 is located between the first switch element Q1 and the third switch element Q3, and the second switch element Q2 is located in the extension direction of the heat conduction channel. In the second driving structure 502, the second switch element Q2' is located between the first switch element Q1' and the third switch element Q3', and the second switch element Q2' is located in the extension direction of the heat conduction channel. In the third driving structure 503, the second switch element Q2" is located between the first switch element Q1" and the third switch element Q3", and part of the structure of the second switch element Q2" and part of the structure of the first switch element Q1 are located in the extension direction of the heat conduction channel. Considering that the second switch element is located between the first switch element and the third switch element, it will be affected by the heat addition between the components, arranging the second switch element in the extension direction of the heat conduction channel is conducive to the heat dissipation of the second switch element.

[0277] For example, in at least two of the first drive structure, the second drive structure, and the third drive structure, the inductor modules have non-overlapping portions in the first direction. For example, among the multiple inductor modules in the multiple drive structures, at least two inductor modules have non-overlapping portions in the first direction. In this way, by staggering the inductor modules on the heat dissipation path, the spacing between components can be increased, and the heat resistance can be reduced, so that the heat can flow faster. For example, referring to Fig. 17C The inductance module 511 of the first driving structure 501, the inductance module 511' of the second driving structure 502 and the inductance module 511" of the third driving structure 503 are all staggered. For example, at least two of the first inductance L1 in the inductance module 511, the first inductance L1' in the inductance module 511' and the first inductance L1" in the inductance module 511" are staggered, and at least two of the second inductance L2 in the inductance module 511, the second inductance L2' in the inductance module 511' and the second inductance L2" in the inductance module 511" are staggered.

[0278] For example, in at least two of the first driving structure, the second driving structure, and the third driving structure, the first inductor and the second inductor have the same spacing in the second direction. For example, in the multiple inductor modules in the multiple driving structures, the first inductor and the second inductor in each inductor module have the same spacing in the second direction. Fig. 17CIn the inductance module 511 of the first driving structure 501, the spacing between the first inductance L1 and the second inductance L2 in the second direction x is l1; in the inductance module 511' of the second driving structure 502, the spacing between the first inductance L1' and the second inductance L2' in the second direction x is l2; in the inductance module 511" of the third driving structure 503, the spacing between the first inductance L1" and the second inductance L2" in the second direction x is l3, and the spacing l1, spacing l2 and spacing l3 are all the same.

[0279] For example, the spacing between the first inductor of the first driving structure and the first inductor of the second driving structure in the first direction is the same as the spacing between the first inductor of the second driving structure and the first inductor of the third driving structure in the first direction. For example, in the multiple inductor modules in the multiple driving structures, the spacing between the first inductors in each adjacent two driving structures in the first direction is the same. For example, referring to Fig. 17C The distance between the first inductor L1 in the inductor module 511 and the first inductor L1' in the inductor module 511' in the first direction y is l1', and the distance between the first inductor L1' in the inductor module 511' and the first inductor L1" in the inductor module 511" in the first direction y is l2', and the distance l1' is equal to the distance l2'.

[0280] For example, the spacing between the second inductor of the first driving structure and the second inductor of the second driving structure in the first direction is the same as the spacing between the second inductor of the second driving structure and the second inductor of the third driving structure in the first direction. For example, in the multiple inductor modules in the multiple driving structures, the spacing between the second inductors in each adjacent two driving structures in the first direction is the same. For example, referring to Fig. 17C The distance between the second inductor L2 in the inductor module 511 and the second inductor L2' in the inductor module 511' in the first direction y is l1", the distance between the second inductor L2' in the inductor module 511' and the second inductor L2" in the inductor module 511" in the first direction y is l2", and the distance l1" is equal to the distance l2".

[0281] like Fig.17A and Fig.18 As shown, in the voltage conversion unit 5102 of the second driving structure 502 and the voltage conversion unit 5103 of the third driving structure 503 , the arrangement of components is substantially consistent with that of the voltage conversion unit 5101 of the first driving structure 501 .

[0282] For example, refer to Fig.17A, the arrangement of the inductor module 511', the switch module 512' and the diode module 513' of the voltage conversion unit 5102 in the second driving structure 502 is the same as that in the first driving structure 501, and the output capacitor module 514' and the input capacitor module 515' are located on the side of the voltage conversion unit 5102 closer to the first edge a1, that is, located relatively above the inductor module 511'. For example, the arrangement of the components in the voltage conversion unit 5103 in the third driving structure 503 is substantially the same as that in the second driving structure 502.

[0283] Of course, the arrangement of components in the voltage conversion unit of the second driving structure and the voltage conversion unit of the third driving structure can also be completely the same as the arrangement of components in the voltage conversion unit of the first driving structure, and can also be adjusted according to actual needs, and the present invention does not limit this. For example, the arrangement of components in the light-emitting driving units in the first driving structure, the second driving structure, and the third driving structure can be completely the same, or Fig.17A The above diagrams are slightly different and can be adjusted according to actual needs, and the present invention does not impose any restrictions on this.

[0284] According to FIG. 17A to FIG. 18 In the embodiment shown, after testing the aforementioned embodiment at the maximum power state of the components for 2 hours, it was found that in the first drive structure 501, in the switch module 512, the temperature of the second switch element Q2 close to the inductor module 511 is relatively higher, at 76.8°C. Due to the influence of the upward heat, in the inductor module 511, the temperature of the second inductor L2 located higher up is higher, at 87.5°C. In the diode module 513, the temperature of the first diode D1 located higher up is higher, at 82.5°C. The temperature of the output capacitor is 69.4°C. Compared with the aforementioned Fig. 12A Compared with the embodiment shown in the figure, the temperature of the improved switch module 512 drops by 25°C, the temperature of the inductor module 511 drops by 9°C, and the temperature of the diode module 513 drops by 10.5°C. The improvement effect is obvious. Except for the inductor module 511, the temperature of other components can be controlled within 85°C. In addition, the inventors also found that the temperature of the output capacitor is relatively high.

[0285] like Fig.15A and Fig.16As shown, for example, the switch module 512 includes at least a first switch element Q1 and a second switch element Q2 connected in parallel. The first switch element Q1 and the second switch element Q2 connected in parallel can not only reduce the conduction loss, but also increase the spacing between components, thereby reducing the temperature of the switch module 512 by increasing the spacing and reducing the conduction loss. The first switch element Q1 and the second switch element Q2 are arranged spaced apart from each other along the second direction x, that is, the first switch element Q1 and the second switch element Q2 are spaced apart from each other, which can reduce the heat addition effect between the two.

[0286] refer to Fig.15A and 15C , taking the first driving structure 501 as an example, the spacing d1 between the first switch element Q1 and the second switch element Q2 in the second direction x is greater than or equal to 8 mm. It can be understood that the spacing d1 between the first switch element Q1 and the second switch element Q2 can be, but is not limited to, 8 mm, 8.1 mm, 8.2 mm, 8.3 mm, 8.4 mm, 8.5 mm, 8.6 mm, 8.7 mm, 8.8 mm, 8.9 mm, 9 mm. Of course, depending on the space size of different circuit boards, the spacing between the first switch element Q1 and the second switch element Q2 can be larger, which is not limited here.

[0287] For example, the output capacitor module 514 includes at least a first output capacitor C1 and a second output capacitor C2 connected in parallel. By connecting the first output capacitor C1 and the second output capacitor C2 in parallel, the current on a single component is reduced, thereby reducing the temperature of the first output capacitor C1 and the second output capacitor C2, and increasing the service life of the capacitor module. The first output capacitor C1 and the second output capacitor C2 are arranged at intervals from each other along the first direction y, that is, the first output capacitor C1 and the second output capacitor C2 are arranged in the longitudinal direction of the substrate 600. For example, the spacing between the first output capacitor C1 and the second output capacitor C2 in the first direction y is greater than or equal to 2 mm.

[0288] For example, in at least two of the first driving structure, the second driving structure, and the third driving structure, the orthographic projections of the output capacitor modules on a plane perpendicular to the first direction at least partially do not overlap. Fig.15A and Fig.15D The output capacitor module 514 in the first driving structure 501 and the output capacitor module 514' in the second driving structure 502 are staggered in the first direction y. The output capacitor module 514' in the second driving structure 502 and the output capacitor module 514" in the third driving structure 503 are staggered in the first direction y.

[0289] For example, in at least two of the first driving structure, the second driving structure, and the third driving structure, the orthographic projections of the input capacitor modules on a plane perpendicular to the first direction at least partially do not overlap. Fig.15A and Fig.15D The input capacitor module 515 in the first driving structure 501 and the input capacitor module 515' in the second driving structure 502 are staggered in the first direction y. The input capacitor module 515' in the second driving structure 502 and the input capacitor module 515" in the third driving structure 503 are staggered in the first direction y.

[0290] For example, the orthographic projection of the output capacitor module on the plane perpendicular to the second direction at least partially overlaps with the orthographic projection of the input capacitor module on the plane perpendicular to the second direction. Fig.15A and Fig.15D In the first driving structure 501, the output capacitor module 514 and the input capacitor module 515 are spaced apart and arranged opposite to each other in the second direction x. For example, the second output capacitor C2 in the output capacitor module 514 and the input capacitor module 515 are spaced apart and arranged opposite to each other in the second direction x. For example, the second output capacitor C2 and the input capacitor module 515 at least partially overlap in the second direction x, and the first output capacitor C1 and the input capacitor 515 do not overlap in the second direction x. In the second driving structure 502, the first output capacitor C1' and the input capacitor module 515 partially overlap in the second direction x, and the second output capacitor C2' and the input capacitor module 515 partially overlap in the second direction x. In the third driving structure 503, the first output capacitor C1" and the second output capacitor C1" also overlap with the input capacitor module 515 in the second direction x.

[0291] For example, refer to Fig.15D The spacing between the switch module 512 of the first driving structure 501 and the switch module 512' of the second driving structure 502 in the first direction y is the same as the spacing between the switch module 512' of the second driving structure 502 and the switch module 512" of the third driving structure 503 in the first direction y.

[0292] In combination with some of the aforementioned embodiments, the arrangement in which only the first switch element Q1 and the second switch element Q2 are connected in parallel can save the arrangement space on the surface of the substrate 600. When the first output capacitor C1 and the second output capacitor C2 are arranged in parallel, more sufficient arrangement space can be provided for the two, and the spacing between the output capacitor module 514 and other components can be increased.

[0293] like Fig.15A and Fig.16As shown, for example, the inductor module 511 includes at least a first inductor L1 and a second inductor L2 connected in parallel. By connecting the first inductor L1 and the second inductor L2 in parallel, the current flowing through the first inductor L1 and the second inductor L2 can be reduced, thereby reducing the temperature of the inductor module 511. The first inductor L1 and the second inductor L2 are arranged spaced apart from each other along the second direction x to reduce the temperature influence between the first inductor L1 and the second inductor L2, and to increase the heat dissipation space around the first inductor L1 and the second inductor L2.

[0294] refer to Fig.15A and 15C For example, the spacing d2 between the first inductor L1 and the second inductor L2 in the second direction x is greater than or equal to 10 mm. It can be understood that the spacing d2 between the first inductor L1 and the second inductor L2 in the second direction x includes but is not limited to 10 mm, 10.1 mm, 10.2 mm, 10.3 mm, 10.4 mm, 10.5 mm, 10.5 mm, 10.7 mm, 10.8 mm, 10.9 mm, and 11 mm.

[0295] refer to Fig.15A and 15C For example, in some circuit board usage scenarios, the substrate 600 is arranged at an angle to the ground. In combination with some of the above embodiments, the arrangement of the components of the voltage conversion unit 510 in the first driving structure 501 is first adjusted. For example, Fig.15A The arrangement of components in the second driving structure 502 and the third driving structure 503 shown in FIG. Fig.17A The arrangement of the components shown is consistent. For example, in the voltage conversion unit 510 closest to the first edge a1 of the substrate 600, the distance d3 between the inductor module 511 and the periphery of the substrate 600 in the first direction y is greater than or equal to 5 mm. By adjusting the position of the inductor module 511, a heat dissipation space is reserved between the inductor module 511 and the periphery of the substrate 600, which facilitates the heat dissipation of the inductor module 511. It can be understood that the distance d3 between any point on the inductor module 511 and any point on the periphery of the substrate 600 can be, but is not limited to, 5 mm, 5.1 mm, 5.2 mm, 5.3 mm, 5.4 mm, 5.5 mm.

[0296] For example, in some circuit board usage scenarios, the circuit board housing is provided with a shell to protect the circuit board from dust. By adjusting the position of the inductor module 511 so that there is a certain distance between it and the periphery of the substrate 600, a larger space can be reserved between the inductor module 511 and the shell, so that the inductor module 511 can dissipate heat better.

[0297] refer to Fig.15A and 15CFor example, the spacing d4 between the inductor module 511 and the switch module 512 in the first direction y is greater than or equal to 10 mm. That is, the minimum distance between the inductor module 511 and the switch module 512 is greater than or equal to 10 mm. It can be understood that the spacing d4 between any point on the inductor module 511 and any point on the switch module 512 can be, but is not limited to, 10 mm, 10.1 mm, 10.2 mm, 10.3 mm, 10.4 mm, 10.5 mm, 10.6 mm, 10.7 mm, 10.8 mm, 10.9 mm, 11 mm. Of course, the spacing between the inductor module 511 and the switch module 512 can be larger, which is not limited here. For example, the spacing between the inductor module and the diode module in the second direction is greater than or equal to 12 mm. For example, the spacing between the inductor module and the output capacitor module in the first direction is greater than or equal to 15 mm. For example, the spacing between the inductor module and the input capacitor module in the first direction is greater than or equal to 29 mm.

[0298] refer to Fig.15A and 15C For example, the spacing d5 between the diode module 513 and the switch module 512 in the first direction y is greater than or equal to 10 mm. That is, the minimum distance between the diode module 513 and the switch module 512 is greater than or equal to 10 mm. It can be understood that the spacing d5 between any point on the diode module 513 and any point on the switch module 512 can be, but is not limited to, 10 mm, 10.1 mm, 10.2 mm, 10.3 mm, 10.4 mm, 10.5 mm, 10.6 mm, 10.7 mm, 10.8 mm, 10.9 mm, 11 mm. Of course, the spacing between the diode module 513 and the switch module 512 can be larger, which is not limited here. For example, the spacing between the diode module and the output capacitor module in the first direction is greater than or equal to 4 mm. For example, the spacing between the switch module and the output capacitor module in the second direction is greater than or equal to 3 mm. For example, the spacing between the switch module and the input capacitor module in the first direction is greater than or equal to 6 mm. For example, the spacing between the switch module and the input capacitor module in the second direction is greater than or equal to 2 mm.

[0299] For example, the diode module 513 includes a first diode D1 and a second diode D2 connected in parallel. The first diode D1 and the second diode D2 connected in parallel can reduce the temperature of each component, thereby reducing the temperature of the diode module 513. For example, the first diode D1 and the second diode D2 are arranged spaced apart from each other along the first direction y. That is, the first diode D1 and the second diode D2 are both arranged on one side of the substrate 600 close to the longitudinal side. In this way, there can be a large heat dissipation space between the first diode D1 and the second diode D2 and other power components, thereby facilitating the heat dissipation of the first diode D1 and the second diode D2.

[0300] refer to Fig.15A and 15C For example, the spacing d6 between the first diode D1 and the second diode D2 in the first direction y is greater than or equal to 9 mm. It can be understood that the spacing between the first diode D1 and the second diode D2 in the first direction y can be, but is not limited to, 9 mm, 9.1 mm, 9.2 mm, 9.3 mm, 9.4 mm, 9.5 mm, 9.6 mm, 9.7 mm, 9.8 mm, 9.9 mm, and 10 mm. Of course, the first diode D1 and the second diode D2 can also have a larger spacing, which is not limited here.

[0301] For example, a first conductive layer 610 and a first solder resist layer 620 are provided on one side of the substrate 600 on which the light-emitting unit driving circuit 500 is provided. For example, components in the light-emitting unit driving circuit 500 can be electrically connected to the first conductive layer 610. For example, the material of the first conductive layer 610 includes copper. For example, the first solder resist layer 620 is a green oil layer, which plays an insulating solder resist role.

[0302] For example, a first opening 621 exposing the first conductive layer 610 is provided in the first solder resist layer 620. The first conductive layer 610 can be exposed through the first opening 621 provided in the first solder resist layer 620, so as to dissipate heat. The first opening 621 surrounds at least one of the inductor module 511, the diode module 513 and the switch module 512, that is, the first opening 621 is provided around at least one of the inductor module 511, the diode module 513 and the switch module 512, so as to improve the heat dissipation efficiency. For example, the first opening 621 can surround the entire surrounding area of ​​at least one of the inductor module 511, the diode module 513 and the switch module 512, or only surround a part of the surrounding area of ​​at least one of the inductor module 511, the diode module 513 and the switch module 512. For example, the first opening 621 is a heat dissipation window provided in the first solder resist layer 620.

[0303] For example, the first opening 621 includes a first opening portion 6211, a second opening portion 6212, and a third opening portion 6213. The first opening portion 6211 is located between the inductor module 511, the diode module 513, and the switch module 512, thereby improving the heat addition effect between the inductor module 511, the diode module 513, and the switch module 512. For example, the area of ​​the first opening portion 6211 is less than or equal to 800 square millimeters. Compared with the above example, the area of ​​the first opening portion 6211 is reduced by at least 150 square millimeters. For example, the first opening portion 6211 includes a first sub-area, a second sub-area, a third sub-area, and a fourth sub-area. The first sub-area is located between the first inductor L1, the second inductor L2, the first switch element Q1, and the second switch element Q2. The second sub-area is located between the first inductor L1 and the second inductor L2. The third sub-area is located between the first switch element Q1 and the second switch element Q2. The fourth sub-area is located between the second inductor L2 and the first diode D1. For example, the second sub-region, the third sub-region and the fourth sub-region are all adjacent to the first sub-region. In this way, a more complete first opening portion 6211 can be formed by the adjacency of the four sub-regions, thereby increasing the area of ​​the first opening portion 6211 and thus improving the heat dissipation effect of the first opening portion 6211.

[0304] For example, the second opening 6212 surrounds the inductor module 511, the third opening 6213 surrounds the diode module 513, and the first opening 6211, the second opening 6212 and the third opening 6213 do not overlap each other. For example, the second opening 6212 surrounds at least a portion of the inductor module 511 in the circumferential direction of the inductor module 511, and the third opening 6213 surrounds at least a portion of the diode module 513 in the circumferential direction of the diode module 513. Since the second opening 6212 is arranged around the inductor module 511 and does not overlap with the first opening 6211, heat can be dissipated in the circumferential region of the inductor module 511 that is not covered by the first opening 6211. Since the third opening 6213 is arranged around the diode module 513 and does not overlap with the first opening 6211, heat can be dissipated in the circumferential region of the diode module 513 that is not covered by the first opening 6211.

[0305] For example, the area of ​​the first opening 6211 is larger than the area of ​​the second opening 6212, and the area of ​​the first opening 6211 is larger than the area of ​​the third opening 6213. It can be understood that the area of ​​the first opening 6211 is the largest among the three areas of the first opening 621. The temperature of the switch module 512 and the inductor module 511 is relatively high, and the first opening 6211 with a larger area can dissipate heat more effectively.

[0306] For example, a second conductive layer 630 and a second solder resist layer 640 are also provided on one side of the substrate 600 away from the first solder resist layer 620, and the second conductive layer 630 is located between the second solder resist layer 640 and the first conductive layer 610. For example, the material of the second conductive layer 630 includes copper. For example, the second solder resist layer 640 is a green oil layer, which plays an insulating solder resist role. For example, a second opening 641 is provided in the second solder resist layer 640 to expose the second conductive layer 630, and the orthographic projection of the second opening 641 on a plane parallel to the substrate 600 overlaps with the orthographic projection of the first opening 621 on the plane. The orthographic projections of the first opening 621 and the second opening 641 overlap on a plane parallel to the substrate 600, that is, the openings on the opposite sides of the substrate 600 correspond. As a result, while the components dissipate heat by means of the first opening 621, the side where the second opening 641 is located dissipates heat by means of the second opening 641, thereby improving the heat dissipation efficiency of the circuit board. For example, the second opening 641 is a heat dissipation window opened in the second solder resist layer 640. Understandably, Fig. 15B The second opening 641 corresponding to the area where the first driving structure 501 is located is only schematically shown. Fig. 15B The shape, area and opening position of the second opening 641 shown can be adaptively adjusted according to actual needs, and the present invention does not impose any limitation thereto.

[0307] For example, the orthographic projection of the first opening 621 on the plane falls within the orthographic projection of the second opening 641 on the plane. On the side surface of the substrate 600 where the first opening 621 is located, the opening of the first opening 621 is more restricted due to the arrangement of components, while the side surface where the second opening 641 is located is relatively less restricted. Therefore, a larger heat dissipation opening can be opened in the second opening 641. Moreover, when opening the second opening 641, there is no need to consider the avoidance of components, which also simplifies the manufacturing process when opening, saving costs.

[0308] like Fig.15A and Fig. 15B As shown, in the voltage conversion unit 5102 of the second driving structure 502 and the voltage conversion unit 5103 of the third driving structure 503, the arrangement of components is basically the same as that of the voltage conversion unit 510 of the first driving structure 501. Fig.15A, the arrangement of the inductor module 511', the switch module 512' and the diode module 513' of the voltage conversion unit 5102 in the second driving structure 502 is substantially the same as that in the first driving structure 501, and the output capacitor module 514' and the input capacitor module 551' are located on the side of the voltage conversion unit 5102 closer to the first edge a1, that is, located relatively above the inductor module 511'. For example, the diode module 513' is farther away from the third edge a3 than the diode module 513, which can avoid the output interface (such as the output interface CN6-CN7) on the one hand, and can also make the second driving structure 502 and the first driving structure 501 staggered in the second direction x, so that heat can be discharged upward more easily. For example, in the second direction x, the spacing between the diode module 513' and the third edge a3 is different from the spacing between the diode module 513 and the third edge a3. For example, the first inductor L1' and the second inductor L2' in the inductor module 511' are staggered in the first direction y, thereby increasing the heat dissipation space between the first inductor L1' and the second inductor L2'. For example, the arrangement of components in the voltage conversion unit 5103 in the third driving structure 503 is substantially the same as the arrangement of components in the second driving structure 502.

[0309] Of course, the arrangement of components in the voltage conversion unit of the second driving structure and the voltage conversion unit of the third driving structure can also be completely the same as the arrangement of components in the voltage conversion unit of the first driving structure, and can also be adjusted according to actual needs, and the present invention does not limit this. For example, the arrangement of components in the light-emitting driving units of the first driving structure, the second driving structure, and the third driving structure can be the same, or it can be as follows: Fig.15A The above diagrams are slightly different and can be adjusted according to actual needs, and the present invention does not impose any restrictions on this.

[0310] For example, it also includes a plurality of vias 601 that at least penetrate the first conductive layer 610 and the second conductive layer 630, and the plurality of vias 601 are arranged in an array. For example, the vias 601 are heat dissipation vias. The vias 601 can transfer the heat of the first conductive layer 610 to the second conductive layer 630, thereby dissipating heat. For example, the vias 601 are filled with copper by electroplating. The orthographic projection of at least part of the vias 601 on the plane falls within the orthographic projection of the first opening 621 on the plane. It can be understood that the vias 601 are formed at positions where heat dissipation windows are opened around the components. By opening the vias 601 around the components, the components can be dissipated more quickly, thereby achieving cooling of the components. In addition, the first conductive layer 610 and the second conductive layer 630 can cooperate with the via 601, and the exposed first conductive layer 610 and the exposed second conductive layer 630 are formed into a whole by the via 601. While the first conductive layer 610 is dissipating heat, the heat emitted by the components is more quickly conducted to the other side surface, and then the heat is further dissipated with the help of the second opening 641 that exposes the second conductive layer 630, thereby improving the heat dissipation efficiency.

[0311] After testing the above embodiment for 2 hours at the maximum power state of the components, it is found that in the first driving structure 501, in the switch module 512, the second switch element Q2 is greatly affected by the heat addition of other components and has a relatively higher temperature of 80.3°C. FIG. 17A to FIG. 18 Compared with the embodiment shown in the figure, the maximum temperature of the switch module 512 increases by 3.5°C. Compared with the embodiment in which the third switch element Q3 is connected in parallel, although the temperature of the second switch element Q2 increases relatively, the change is only about 3°C, the temperature increase is small, and the temperature increase effect on other components is relatively small. In the inductor module 511, the temperature of the first inductor L1 closer to the first switch element Q1 is 84.2°C, and the temperature of the second inductor L2 closer to the diode module 513 is 86.1°C. FIG. 17A to FIG. 18 Compared with the embodiment shown in FIG. 1 , the maximum temperature of the inductor module 511 drops by 1.4° C. In the diode module 513 , the temperature of the first diode D1 located at the upper side is higher, which is 81.2° C. FIG. 17A to FIG. 18 Compared with the embodiment shown in FIG. 1 , the maximum temperature of the diode module 513 decreases by 1.3° C. In the output capacitor module 514 , the temperature of the first output capacitor C1 at the upper side is higher, which is 56.2° C. FIG. 17A to FIG. 18 Compared with the embodiment shown, the maximum temperature of the output capacitor module 514 drops by 13.2°C. It can be seen that except for the second inductor L2, which has a higher temperature, which is only 1.1°C higher than 85°C, the temperatures of other components can be controlled below 85°C. At the same time, the temperatures of the components in the second driving structure 502 and the third driving structure 503 below are also below 85°C.

[0312] Fig.19 A schematic diagram of a housing provided in accordance with an example of the present invention.

[0313] At least one embodiment of the utility model provides a display module, including a back plate, such as Fig.15A The circuit board, the light emitting unit and the housing 900 are shown. The circuit board is arranged on the back plate, and the light emitting unit is arranged on the side of the back plate away from the circuit board and connected to the driving structure. The light emitting unit emits light and adjusts the brightness under the drive of the driving structure.

[0314] For example, in some use scenarios of the circuit board, the circuit board is also covered with a Fig.19 The housing 900 shown. The housing 900 can protect the circuit board from external damage on the one hand, and can also prevent dust from entering and causing short circuits or other problems on the circuit board on the other hand. It is understandable that Fig.19 The housing 900 is only schematically shown, and the shape structure of the housing provided outside the circuit board is not limited. Fig.19 Exactly the same as shown.

[0315] like Fig.19 As shown, the housing 900 includes a top wall 910 and a bottom wall 920 that are arranged opposite to each other in the first direction y, the top wall 910 is provided with a first through hole 911, and the bottom wall 920 is provided with a second through hole 912, and the first through hole 911 and the second through hole 912 are both connected to the internal space and the external space of the housing 900. The first through hole 911 and the second through hole 912 can dissipate heat from both sides of the circuit board in the first direction y, accelerate the heat exchange between the internal and external spaces of the housing 900, and improve the heat dissipation efficiency.

[0316] Combination Fig.19 and Fig.15A As shown, in some use scenarios of the display module, the housing 900 and the circuit board in the housing 900 are set at an angle to the ground. For example, the first direction y is the longitudinal direction of the substrate 600 in the circuit board, and the first direction y is set at an angle to the ground. As heat travels upward away from the ground, the first through hole 911 and the second through hole 912 connecting the inner and outer spaces of the housing 900 can form a convection cycle to dissipate heat.

[0317] For example, the first through hole 911 is provided in plurality, and the plurality of first through holes 911 are arranged at intervals along the second direction x, and the second direction x is parallel to the substrate 600 and intersects with the first direction y. For example, the second direction x is perpendicular to the first direction y. The second through hole 912 is provided in plurality, and the plurality of second through holes 912 are arranged at intervals along the second direction x. For example, the second direction x is the width direction of the substrate 600 in the circuit board. By providing a plurality of first through holes 911 and a plurality of second through holes 912, the opening area of ​​the top wall 910 and the bottom wall 920 can be increased, thereby increasing the heat dissipation area. Moreover, the plurality of first through holes 911 and the plurality of second through holes 912 can also more easily form a convection cycle to accelerate heat dissipation.

[0318] like Fig.19 As shown, taking the case 900 having a size of 115 mm in the first direction y and a size of 15 mm in the second direction x as an example, the number of the first through holes 911 is set to be no less than 9, and the number of the second through holes 912 is set to be no less than 9. For example, the diameters of the first through holes 911 and the second through holes 912 are no less than 6 mm. For example, the plurality of first through holes 911 and the plurality of second through holes 912 are evenly arranged in the second direction x. Of course, the utility model is not limited here, and the number and size of the first through holes 911 and the second through holes 912 can also be set according to actual needs.

[0319] For example, the housing 900 further includes a side wall 930 connecting the top wall 910 and the bottom wall 920, and the side wall 930 is provided with a third through hole 931. Fig.19 and Fig.15A As shown, for example, two side walls 930 of the shell 900 parallel to the surface of the substrate 600 of the circuit board are provided with a plurality of third through holes 931, and the plurality of third through holes 931 are arranged in an array. In this way, the shell 900 can also achieve heat exchange between the inner and outer spaces of the shell 900 with the help of the plurality of third through holes 931, thereby further improving the heat dissipation efficiency of the components on the circuit board. For example, the orthographic projection of the third through hole 931 on the third reference plane overlaps with the orthographic projection of the driving structure on the third reference plane, and the third reference plane is parallel to the substrate. For example, the third through hole 931 corresponds to the position of the components in the driving structure to facilitate heat dissipation. For example, the third through hole 931 basically corresponds to the position of the voltage conversion unit 510 and the light-emitting driving unit 520. For example, with reference to Fig.19 , the third through hole 9311 close to the first through hole 911 can be Fig.15A Corresponding to the voltage conversion unit 5101 in FIG. 1 , the third through hole 9313 close to the second through hole 912 can be connected to Fig.15A The third through hole 9312 in the middle portion can correspond to the light-emitting driving unit 5203. Fig.15A The light-emitting driving unit 5201, the second driving structure 502 and the voltage conversion unit 5103 correspond to each other.

[0320] After testing the above embodiment for 2 hours at the maximum power state of the components, it was found that the light-emitting unit in the display module generated heat, causing the temperature of the backplane to rise to 52°C, but the temperature of all components in the circuit board dropped to below 85°C, with the highest temperature being only 83.4°C. All components met the temperature rise requirements.

[0321] At least one embodiment of the present invention provides a display device, including the above-mentioned display module.

[0322] For example, the display device provided in the embodiment of the utility model can be: a liquid crystal display, a television, an electronic paper display device, a mobile phone, a tablet computer, a laptop computer, a digital photo frame, a navigator, a virtual reality device, or any other product or component with a display function. It should be noted that the display device can also include other conventional components or structures. For example, in order to realize the necessary functions of the display device, those skilled in the art can set other conventional components or structures according to specific application scenarios, and the embodiment of the utility model does not limit this.

[0323] Since the display device according to the embodiment of the utility model includes the above-mentioned display module, it also has corresponding beneficial technical effects, which will not be described in detail here.

[0324] There are a few points to note:

[0325] (1) The drawings of the embodiments of the present invention only relate to the structures related to the embodiments of the present invention, and other structures may refer to the conventional designs.

[0326] (2) In the absence of conflict, features in the same embodiment or in different embodiments of the present invention may be combined with each other.

[0327] The above description is merely an exemplary embodiment of the present invention and is not intended to limit the protection scope of the present invention. The protection scope of the present invention is determined by the appended claims.

Claims

1. A circuit board, characterized in that: include: substrate; A plurality of voltage conversion units and a plurality of light-emitting driving units are disposed on the substrate, wherein the voltage conversion unit comprises an input terminal and an output terminal and is configured to output a preset voltage; The light-emitting driving unit is connected to the output end of the voltage conversion unit and is configured to drive the light-emitting unit; The plurality of voltage conversion units and the plurality of light-emitting driving units are arranged in one-to-one correspondence, and the voltage conversion unit is arranged between adjacent light-emitting driving units; The voltage conversion unit includes a first inductor and a second inductor connected in parallel, and the first inductor and the second inductor are staggered.

2. The circuit board according to claim 1, characterized in that The circuit board comprises a first edge close to the voltage conversion unit in a first direction, wherein the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; The first inductor is spaced a first distance from the first edge in the first direction, and the second inductor is spaced a second distance from the first edge in the first direction, and the first distance is different from the second distance.

3. The circuit board according to claim 2, characterized in that: A difference between the first spacing and the second spacing is less than or equal to 1 / 2 of a width of the first inductor in the first direction.

4. The circuit board according to claim 1, characterized in that: The plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located at both sides of the first light-emitting driving unit in a first direction, wherein the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; The first voltage conversion unit includes a first inductor module, and the second voltage conversion unit includes a second inductor module; the interval between the first inductor module and the second inductor module in the first direction is y, and there is a non-overlapping part between the orthographic projection of the first inductor on the first reference plane and the orthographic projection of the second inductor on the first reference plane, and the size of the non-overlapping part in the first direction is h, and the size of the light-emitting driving unit in the first direction is x, then: y=a×x+b×h,2 <a<4,1<b<3; The second direction intersects with the first direction, and the first reference plane is a plane perpendicular to the second direction.

5. The circuit board according to claim 1, wherein: The multiple voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of the first light-emitting driving unit, the first voltage conversion unit includes a first inductor module, a first capacitor module and a first switch module, and the second voltage conversion unit includes a second inductor module; The interval between the first inductor module and the second inductor module in the first direction is y, the size of the first inductor module in the first direction is y1, the size of the first capacitor module in the first direction is y2, and the size of the first switch module in the first direction is y3, then: y=k×y1+y3+2×y2,1 <k<3; The first direction is a direction from the voltage conversion unit to the light-emitting driving unit.

6. The circuit board according to claim 1, wherein: The multiple voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located at both sides of the first light-emitting driving unit, and the first voltage conversion unit includes a first inductor module, a first capacitor module and a first switch module; The first inductor module includes the first inductor and the second inductor connected in parallel with each other, and the first inductor and the second inductor have a first interval in a second direction. The first capacitor module includes a first output capacitor module and a first input capacitor module connected in parallel with each other, and the first output capacitor module and the first input capacitor module have a second interval in the second direction. The first switch module includes a first switch and a second switch connected in parallel with each other, and the first switch and the second switch have a third interval in the second direction. The second voltage conversion unit includes a second capacitor module, the second capacitor module includes a second output capacitor module and a second input capacitor module connected in parallel, and the second output capacitor module and the second input capacitor module have a fourth interval in the second direction; The fourth interval has an overlapping portion with at least one of the first interval, the second interval, and the third interval on the second reference plane, The second reference plane is a plane perpendicular to a first direction, the first direction is a direction pointing from the voltage conversion unit to the light-emitting driving unit, and the second direction is parallel to the substrate and intersects with the first direction.

7. The circuit board according to claim 6, characterized in that: The first interval, the second interval, the third interval, and the fourth interval have a common overlapping portion on the second reference plane.

8. The circuit board according to claim 7, characterized in that: A size of the common overlapping portion in the second direction is smaller than or equal to a size of the first interval in the second direction.

9. The circuit board according to claim 7, characterized in that: A ratio of a size of the common overlapping portion in the second direction to a size of the first interval in the second direction is 0.3 to 0.

7.

10. The circuit board according to claim 6, characterized in that: The first interval, the second interval, the third interval, and the fourth interval are configured to satisfy at least one of the following conditions: The first interval is greater than or equal to 10 mm; The second interval is greater than or equal to 28 mm; The third interval is greater than or equal to 8 mm; The fourth interval is greater than or equal to 4 mm.

11. The circuit board according to claim 6, characterized in that: The second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor that are arranged opposite to each other in the second direction; The first interval is configured to satisfy at least one of the following conditions: An orthographic projection of the first interval on the second reference plane and an orthographic projection of the third inductor or the fourth inductor on the second reference plane have a first overlapping portion; a size of the first overlapping portion in the second direction is greater than 1 / 3 of a size of the third inductor or the fourth inductor in the second direction; There is a third overlapping portion between the orthographic projection of the first interval on the second reference plane and the orthographic projection of the second input capacitor module on the second reference plane, and a size of the third overlapping portion in the second direction is greater than 1 / 3 of a size of the second input capacitor module in the second direction.

12. The circuit board according to claim 11, characterized in that: A size of the first interval in the second direction is the same as a distance between the third inductor and the fourth inductor in the second direction.

13. The circuit board according to claim 6, characterized in that: The second interval is configured to satisfy at least one of the following conditions: The second voltage conversion unit includes a second inductor module, and an orthographic projection of the second interval on the second reference plane at least partially overlaps with an orthographic projection of the second inductor module on the second reference plane; There is an eighth overlapping portion between the orthographic projection of the second interval on the second reference plane and the orthographic projection of the second output capacitor module or the second input capacitor module on the second reference plane, and a size of the eighth overlapping portion in the second direction is greater than 2 / 3 of a size of the second output capacitor module or the second input capacitor module in the second direction.

14. The circuit board according to claim 6, characterized in that: The second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor that are arranged opposite to each other in the second direction; The second interval is configured to satisfy at least one of the following conditions: The size of the second interval in the second direction is greater than the size of the first inductor or the second inductor in the second direction; An orthographic projection of the second interval on the second reference plane and an orthographic projection of the first inductor or the second inductor on the second reference plane have a sixth overlapping portion, and a size of the sixth overlapping portion in the second direction is greater than 1 / 3 of a size of the first inductor in the second direction; The orthographic projection of the second interval on the second reference plane at least partially overlaps with the orthographic projection of the third inductor on the second reference plane; An orthographic projection of the second interval on the second reference plane completely overlaps with an orthographic projection of the fourth inductor on the second reference plane.

15. The circuit board according to claim 6, characterized in that: The second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor that are arranged opposite to each other in the second direction; The third interval is configured to satisfy at least one of the following conditions: An orthographic projection of the third interval on the second reference plane and an orthographic projection of the third inductor or the fourth inductor on the second reference plane have a fourteenth overlapping portion; There is a sixteenth overlapping portion between the orthographic projection of the third interval on the second reference plane and the orthographic projection of the second output capacitor module or the second input capacitor module on the second reference plane.

16. The circuit board according to claim 15, characterized in that The size of the fourteenth overlapping portion in the second direction is larger than 1 / 2 of the size of the third inductor in the second direction; and / or, A size of the sixteenth overlapping portion in the second direction is larger than 1 / 3 of a size of the second output capacitor module or the second input capacitor module in the second direction.

17. The circuit board according to claim 6, characterized in that: The second voltage conversion unit includes a second inductor module; An orthographic projection of the first inductor module on the second reference plane and an orthographic projection of the second inductor module on the second reference plane have non-overlapping portions.

18. The circuit board according to claim 1, wherein: The voltage conversion unit includes an inductor module, a diode module, a switch module, an output capacitor module, and an input capacitor module; The inductor module is connected between the input end of the voltage conversion unit and the positive electrode of the diode module; The cathode of the diode module is connected to the output end of the voltage conversion unit; The switch module comprises a control end, an input end and an output end. The control end of the switch module is configured to receive a control signal, and the control signal is used to control the conduction or cutoff between the input end and the output end of the switch module. One of the input end and the output end of the switch module is connected between the inductor module and the diode module, and the other of the input end and the output end of the switch module is connected to the ground end. The first electrode of the output capacitor module is connected to the cathode of the diode module, and the second electrode of the output capacitor module is connected to the ground terminal; The input capacitor module is connected between the input terminal and the ground terminal.

19. The circuit board according to claim 18, characterized in that The substrate comprises a first edge and a second edge arranged opposite to each other in a first direction, a plurality of the voltage conversion units and a plurality of the light-emitting driving units are arranged in one-to-one correspondence, the voltage conversion units and the light-emitting driving units corresponding to each other are connected to form a plurality of driving structures, and in each of the driving structures, the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; At least in the voltage conversion unit closest to the first edge of the substrate, The inductor module is arranged on a side of the voltage conversion unit away from the light-emitting driving unit in the first direction; The output capacitor module is arranged on a side of the voltage conversion unit close to the light-emitting driving unit in the first direction; The input capacitor module and the output capacitor module are arranged opposite to each other in a second direction, wherein the second direction is parallel to the substrate and intersects with the first direction; The diode module is closer to a third edge of the substrate than the inductor module and the output capacitor module, and the third edge connects the first edge and the second edge; The switch module is arranged between the inductor module and the output capacitor module.

20. The circuit board according to claim 19, characterized in that The circuit board is configured to satisfy at least one of the following conditions: The switch module at least includes a first switch element and a second switch element connected in parallel; the distance between the first switch element and the second switch element in the second direction is greater than or equal to 8 mm; The output capacitor module at least includes a first output capacitor module and a second output capacitor module connected in parallel; The distance between the first output capacitor module and the second output capacitor module in the first direction is greater than or equal to 2 mm; In the voltage conversion unit closest to the first edge of the substrate, a distance between the inductor module and the periphery of the substrate in the first direction is greater than or equal to 5 mm; The diode module includes a first diode and a second diode connected in parallel, and a distance between the first diode and the second diode in the first direction is greater than or equal to 9 mm; The first direction is a direction from the voltage conversion unit to the light-emitting driving unit, and the second direction is parallel to the substrate and intersects with the first direction.

21. The circuit board according to claim 19, wherein: The voltage conversion unit is configured to satisfy at least one of the following conditions: The distance between the inductor module and the switch module in the first direction is greater than or equal to 10 mm; The distance between the inductor module and the diode module in the second direction is greater than or equal to 12 mm; The distance between the inductor module and the output capacitor module in the first direction is greater than or equal to 15 mm; The distance between the inductor module and the input capacitor module in the first direction is greater than or equal to 29 mm; The distance between the diode module and the switch module in the second direction is greater than or equal to 10 mm; The distance between the diode module and the output capacitor module in the first direction is greater than or equal to 4 mm; The distance between the switch module and the output capacitor module in the second direction is greater than or equal to 3 mm; The distance between the switch module and the input capacitor module in the first direction is greater than or equal to 6 mm; A distance between the switch module and the input capacitor module in the second direction is greater than or equal to 2 mm.

22. The circuit board according to claim 19, wherein: The diode module includes a Schottky diode; and / or The switch module includes a transistor.

23. The circuit board according to claim 1, wherein: The voltage conversion unit is provided in plurality, and the light-emitting driving unit is provided in plurality; the plurality of voltage conversion units and the plurality of light-emitting driving units are provided in one-to-one correspondence, and the voltage conversion units and the light-emitting driving units corresponding to each other are connected to form a plurality of driving structures; The plurality of driving structures are arranged in sequence along a first direction, and the plurality of light-emitting driving units and the plurality of voltage conversion units are alternately arranged along the first direction; The plurality of driving structures include a first driving structure and a second driving structure, the first driving structure includes a first voltage conversion unit and a first light-emitting driving unit, and the second driving structure includes a second voltage conversion unit and a second light-emitting driving unit; The first driving structure and the second driving structure are configured to satisfy at least one of the following conditions: An orthographic projection of the first voltage conversion unit on the second reference plane and an orthographic projection of the second voltage conversion unit on a plane perpendicular to the first direction have a non-overlapping portion; The second reference plane is a plane perpendicular to the first direction; An orthographic projection of the first light-emitting driving unit on the second reference plane and an orthographic projection of the second light-emitting driving unit on the second reference plane have a non-overlapping portion; An orthographic projection of the first voltage conversion unit on the second reference plane and an orthographic projection of the first light-emitting driving unit on the second reference plane have non-overlapping parts; An orthographic projection of the first voltage conversion unit on the second reference plane and an orthographic projection of the second light-emitting driving unit on the second reference plane have non-overlapping parts; An orthographic projection of the second voltage conversion unit on the second reference plane and an orthographic projection of the second light-emitting driving unit on the second reference plane have non-overlapping parts; An orthographic projection of the second voltage conversion unit on the second reference plane and an orthographic projection of the first light-emitting driving unit on the second reference plane have non-overlapping portions.

24. The circuit board according to claim 23, characterized in that The first voltage conversion unit includes a first diode module and a first input capacitor module, and the first light-emitting driving unit includes a first switch tube module and a first driving module; the second voltage conversion unit includes a second output capacitor module and a second inductor module, and the second light-emitting driving unit includes a second switch tube module and a second driving module; The first driving structure and the second driving structure are configured to satisfy at least one of the following conditions: An orthographic projection of the first diode module on the second reference plane and an orthographic projection of the second output capacitor module on the second reference plane have a first non-overlapping portion; The orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane have a second non-overlapping portion; There is a third non-overlapping portion between the orthographic projection of the first switch tube module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane; There is a fourth non-overlapping portion between the orthographic projection of the first driving module on the second reference plane and the orthographic projection of the second driving module on the second reference plane; There is a fifth non-overlapping portion between the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the first switch tube module on the second reference plane; There is a sixth non-overlapping portion between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the first driving module on the second reference plane; There is a seventh non-overlapping portion between the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane; An orthographic projection of the first input capacitor module on the second reference plane and an orthographic projection of the second driving module on the second reference plane have an eighth non-overlapping portion; There is a ninth non-overlapping portion between the orthographic projection of the first switch tube module on the second reference plane and the orthographic projection of the second output capacitor module on the second reference plane; The orthographic projection of the first driving module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane have a tenth non-overlapping portion; The orthographic projection of the second output capacitor module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane have an eleventh non-overlapping portion; The orthographic projection of the second inductor module on the second reference plane and the orthographic projection of the second driving module on the second reference plane have a twelfth non-overlapping portion.

25. The circuit board according to claim 1, wherein: The substrate comprises a first conductive layer and a first solder resist layer, wherein the first conductive layer and the first solder resist layer are located on a side of the substrate where the light-emitting driving unit is provided, and the first conductive layer is located on a side of the first solder resist layer away from the light-emitting driving unit; The voltage conversion unit includes an inductor module, a diode module, and a switch module, and the inductor module includes the first inductor and the second inductor; A first opening exposing the first conductive layer is formed in the first solder resist layer; the first opening surrounds at least one of the inductor module, the diode module and the switch module.

26. The circuit board according to claim 25, characterized in that The first opening includes a first opening portion, a second opening portion and a third opening portion that do not overlap each other; The first opening portion is located between the inductor module, the diode module and the switch module, the second opening portion surrounds the inductor module, and the third opening portion surrounds the diode module; wherein an area of ​​the first opening portion is greater than an area of ​​the second opening portion, and an area of ​​the first opening portion is greater than an area of ​​the third opening portion.

27. The circuit board according to claim 26, characterized in that The area of ​​the first opening is less than or equal to 800 square millimeters; The area of ​​the second opening is greater than or equal to 320 square millimeters; The area of ​​the third opening is greater than or equal to 90 square millimeters.

28. The circuit board according to claim 25, characterized in that The substrate comprises a second conductive layer and a second solder resist layer located at a side of the first conductive layer away from the first solder resist layer, and the second conductive layer is located between the second solder resist layer and the first conductive layer; A second opening is formed in the second solder resist layer to expose the second conductive layer; an orthographic projection of the second opening on a third reference plane overlaps with an orthographic projection of the first opening on the third reference plane; The third reference plane is parallel to the substrate.

29. The circuit board according to claim 28, characterized in that Also includes: A plurality of via holes at least penetrating the first conductive layer and the second conductive layer, wherein the plurality of via holes are arranged in an array; The orthographic projection of the first opening on the third reference plane covers at least a portion of the orthographic projection of the via hole on the third reference plane.

30. The circuit board according to any one of claims 1 to 29, characterized in that: Also included is a shielding component; The shielding component is at least disposed on two opposite sides of the light-emitting driving unit in a first direction, where the first direction is a direction from the voltage conversion unit to the light-emitting driving unit.

31. A display module, characterized in that: include: Back panel; The circuit board according to any one of claims 1 to 30, arranged on the backplane; A light emitting unit, arranged on a side of the back plate away from the circuit board and connected to the driving structure; and A housing, which is arranged outside the circuit board; The housing includes a top wall and a bottom wall arranged opposite to each other in a first direction; the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; and the housing is configured to satisfy at least one of the following conditions: The top wall is provided with a first through hole, and the first through hole communicates the inner space and the outer space of the shell; The bottom wall is provided with a second through hole, and the second through hole communicates the inner space and the outer space of the shell.

32. The display module according to claim 31, wherein: The housing further comprises a side wall connecting the top wall and the bottom wall, and the side wall is provided with a third through hole; The orthographic projection of the third through hole on the third reference plane overlaps with the orthographic projection of the driving structure on the third reference plane; and the third reference plane is parallel to the substrate.

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