Heat dissipation PCB

Abstract

The utility model relates to the technical field of PCBs, and discloses a heat dissipation PCB, which comprises a PCB mainboard, one side of the PCB mainboard is movably connected with a mounting seat, the bottom of the mounting seat is fixedly connected with supporting legs, one side of the mounting seat is provided with a groove, the inner wall of the groove is movably connected with a movable block, the top of the movable block is fixedly connected with a rotating shaft, and the rotating shaft is fixedly connected with the PCB mainboard. A positioning column is movably connected to the inner wall of the movable block, a positioning ring is movably connected to the outer wall of the positioning column, a connecting block is movably connected to the inner wall of the mounting base, and a fin frame is fixedly connected to one side of the connecting block. According to the heat dissipation PCB, a user can conveniently assemble and disassemble the fin frame and the PCB main board, inconvenience and complexity of later disassembly and maintenance caused by the fact that the heat dissipation fins are installed on the PCB main board in a welding or bolt mode are avoided, meanwhile, the heat dissipation PCB is simple in disassembly and assembly result and convenient and fast to operate, the use effect is effectively improved, and the requirement for convenient installation of the heat dissipation fins is met.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, in particular to a heat dissipation PCB board. Background Art

[0002] PCB, the Chinese name for printed circuit board, is also called printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing technology, it is called a "printed" circuit board. PCB boards can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer boards according to the number of layers of the circuit board. At the same time, when the PCB board is in use, in order to avoid high temperature generated by the circuit structure, heat dissipation fins and heat dissipation fans are usually installed outside the PCB board for cooling to prevent the PCB board from being damaged by high temperature.

[0003] The existing heat dissipation PCB board is usually directly welded or fixed by bolts when installed with the heat dissipation fins. The welding method affects the later maintenance. At the same time, the bolt installation method requires the use of auxiliary workpieces for disassembly operations, which is inconvenient and affects the disassembly and assembly of the heat dissipation structure. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the utility model provides a heat dissipation PCB board, which has the advantages of convenient disassembly and assembly, and solves the problems in the above-mentioned background technology.

[0006] (II) Technical solution

[0007] In order to achieve the purpose of convenient disassembly and assembly, the utility model provides the following technical solutions: a heat dissipation PCB board, including a PCB mainboard, a mounting seat is movably connected to one side of the PCB mainboard, a support leg is fixedly connected to the bottom of the mounting seat, a groove is opened on one side of the mounting seat, a movable block is movably connected to the inner wall of the groove, a rotating shaft is fixedly connected to the top of the movable block, a positioning column is movably connected to the inner wall of the movable block, and a positioning ring is movably connected to the outer wall of the positioning column.

[0008] The inner wall of the mounting seat is movably connected with a connecting block, one side of the connecting block is fixedly connected with a fin rack, one side of the fin rack is movably connected with a fin plate, the top of the fin plate is provided with fins, and the inner wall of the fin plate is fixedly connected with a fan seat, so that users can install and disassemble the fin rack and the PCB main board conveniently, avoiding the inconvenience and cumbersomeness of later disassembly and maintenance caused by the heat dissipation fins being installed with the PCB main board by welding or screws, and at the same time, the result is simple during disassembly and assembly, and the operation is convenient, which effectively improves the use effect and satisfies the convenience of installing the heat dissipation fins.

[0009] Preferably, a heat dissipation fan is installed on the inner wall of the fan base, a cleaning brush is fixedly connected to the shaft end of the heat dissipation fan, and a dustproof net is fixedly connected to the top of the fan base, so that when the heat dissipation fan rotates to dissipate heat to the PCB mainboard, the cleaning brush can be driven to rotate synchronously, and the surface of the dustproof net can be cleaned during rotation, thereby preventing a large amount of dust from adhering to the surface of the dustproof net during long-term heat dissipation, affecting the heat dissipation effect of the PCB mainboard, thereby effectively improving the use effect.

[0010] Preferably, the movable block is movably connected to the groove via a rotating shaft, and the diameter of the groove is larger than the diameter of the movable block, so that the movable block can be rotated to move outward in the groove during disassembly and assembly, thereby facilitating disassembly and assembly.

[0011] Preferably, the inner wall of the positioning ring is provided with an anti-slip rubber layer, and the positioning ring is movably connected to the positioning column through the anti-slip rubber layer, which can improve the efficiency and convenience of disassembly and assembly of the positioning ring and the positioning column, and at the same time can also improve the tightness between the positioning ring and the positioning column during installation.

[0012] Preferably, a connecting piece is provided at the bottom of the fin rack, a screw is installed at the top of the fin plate, and the fin rack and the fin plate are movably installed by screws, so that the fin rack and the fin plate can be easily assembled by screws, so that adjustments can be made according to usage requirements.

[0013] Preferably, the top of the mounting seat is movably connected with a bolt, and the mounting seat is movably connected to the PCB mainboard through the bolt, so as to facilitate the installation of the mounting seat and the PCB mainboard.

[0014] Preferably, a mounting block is fixedly connected to the inner wall of the fan seat, and the fan seat is fixedly connected to the heat dissipation fan via the mounting block, so that the heat dissipation fan can be installed and fixed in the fan seat by screws.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides a heat dissipation PCB board, which has the following beneficial effects:

[0017] 1. The heat dissipation PCB board is convenient for users to install and disassemble the fin frame and the PCB main board through the mounting seat, the groove, the movable block, the rotating shaft, the positioning column, the positioning ring and the connecting block, so as to avoid the inconvenience and cumbersomeness of later disassembly and maintenance caused by the heat dissipation fins being installed with the PCB main board by welding or screws. At the same time, the disassembly and assembly are simple and the operation is convenient, which effectively improves the use effect and satisfies the convenience of heat dissipation fin installation.

[0018] 2. The heat dissipation PCB board, through the heat dissipation fan, the cleaning brush and the dustproof net, can simultaneously drive the cleaning brush to rotate when the heat dissipation fan rotates to dissipate the heat of the PCB mainboard, and clean the surface of the dustproof net during rotation, thereby avoiding a large amount of dust adhering to the surface of the dustproof net during long-term heat dissipation, affecting the heat dissipation effect of the PCB mainboard, and effectively improving the use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the disassembly structure of the fin plate and the heat dissipation fan of the utility model;

[0021] Figure 3 For this utility model Figure 1 Enlarged view of point A in the middle;

[0022] Figure 4 This is a schematic diagram of the installation of the fan base and the heat dissipation fan structure of the utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the movable block of the utility model.

[0024] In the figure: 1. PCB main board; 2. mounting base; 3. supporting leg; 4. groove; 5. movable block; 6. rotating shaft; 7. positioning column; 8. positioning ring; 9. connecting block; 10. bolt; 11. fin frame; 12. fin plate; 13. fin; 14. fan base; 15. mounting block; 16. cooling fan; 17. cleaning brush; 18. dust net. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Example 1

[0027] The preferred embodiment of the heat dissipation PCB board provided by the utility model is as follows: Figures 1 to 5 As shown: a heat dissipation PCB board, including a PCB mainboard 1, a mounting seat 2 is movably connected to one side of the PCB mainboard 1, a support leg 3 is fixedly connected to the bottom of the mounting seat 2, a groove 4 is opened on one side of the mounting seat 2, a movable block 5 is movably connected to the inner wall of the groove 4, a rotating shaft 6 is fixedly connected to the top of the movable block 5, a positioning column 7 is movably connected to the inner wall of the movable block 5, and a positioning ring 8 is movably connected to the outer wall of the positioning column 7.

[0028] The inner wall of the mounting base 2 is movably connected with a connecting block 9, one side of the connecting block 9 is fixedly connected with a fin frame 11, one side of the fin frame 11 is movably connected with a fin plate 12, the top of the fin plate 12 is provided with fins 13, and the inner wall of the fin plate 12 is fixedly connected with a fan base 14, so that the user can install and disassemble the fin frame 11 and the PCB main board 1 conveniently, avoiding the inconvenience and cumbersomeness of later disassembly and maintenance caused by the heat dissipation fins being installed with the PCB main board 1 by welding or screws. At the same time, the disassembly and assembly are simple and easy to operate, which effectively improves the use effect and satisfies the convenience of heat dissipation fin installation.

[0029] In this embodiment, a heat dissipation fan 16 is installed on the inner wall of the fan base 14, and a cleaning brush 17 is fixedly connected to the shaft end of the heat dissipation fan 16. A dustproof net 18 is fixedly connected to the top of the fan base 14. When the heat dissipation fan 16 rotates to dissipate heat for the PCB mainboard 1, the cleaning brush 17 is simultaneously driven to rotate, and the surface of the dustproof net 18 is cleaned during rotation, thereby avoiding a large amount of dust adhering to the surface of the dustproof net 18 during long-term heat dissipation, which affects the heat dissipation effect of the PCB mainboard 1, and effectively improves the use effect.

[0030] Example 2

[0031] On the basis of Example 1, a preferred embodiment of the heat dissipation PCB board provided by the present invention is as follows: Figures 1 to 5 As shown: the movable block 5 is movably connected to the groove 4 through the rotating shaft 6, and the diameter of the groove 4 is larger than the diameter of the movable block 5, so that the movable block 5 can be rotated to move outward in the groove 4 during disassembly and assembly, thereby bringing convenience to disassembly and assembly.

[0032] In this embodiment, the inner wall of the positioning ring 8 is provided with an anti-slip rubber layer, and the positioning ring 8 is movably connected to the positioning column 7 through the anti-slip rubber layer, which can improve the efficiency and convenience of disassembly and assembly of the positioning ring 8 and the positioning column 7, and at the same time can also improve the tightness between the positioning ring 8 and the positioning column 7 during installation.

[0033] Furthermore, a connecting piece is provided at the bottom of the fin frame 11, a screw is installed at the top of the fin plate 12, and the fin frame 11 and the fin plate 12 are movably installed by screws, so that the fin frame 11 and the fin plate 12 can be screwed together, so that adjustment can be made according to usage requirements.

[0034] Furthermore, a bolt 10 is movably connected to the top of the mounting base 2, and the mounting base 2 is movably connected to the PCB mainboard 1 through the bolt 10, so that the mounting base 2 and the PCB mainboard 1 can be easily installed.

[0035] In addition, a mounting block 15 is fixedly connected to the inner wall of the fan base 14 , and the fan base 14 is fixedly connected to the heat dissipation fan 16 via the mounting block 15 , so that the heat dissipation fan 16 can be fixed in the fan base 14 by screws.

[0036] When in use, the heat dissipation fan 16 arranged in the fan seat 14 will drive the cleaning brush 17 to rotate synchronously when dissipating the PCB mainboard 1, and when the cleaning brush 17 rotates, it can brush off the dust attached to the surface of the dustproof net 18, thereby improving the air circulation. When it is necessary to disassemble and assemble the heat dissipation fins installed on the PCB mainboard 1, the positioning ring 8 can be rotated first to disengage it from the positioning column 7, and then the movable block 5 can be rotated, and the movable block 5 can be rotated outside the groove 4 and away from the positioning column 7 with the cooperation of the rotating shaft 6, and then the fin frame 11 can be lifted upward, so as to quickly complete the disassembly of the fin frame 11 and the fin plate 12 as a whole, which is convenient for the operator to repair the circuit structure on the PCB mainboard 1.

[0037] To sum up, the heat dissipation PCB board makes it convenient for users to install and disassemble the fin frame 11 and the PCB main board 1, avoiding the inconvenience and tediousness of later disassembly and maintenance caused by the heat dissipation fins being installed with the PCB main board 1 by welding or screws. At the same time, when the heat dissipation fan 16 rotates to dissipate the PCB main board 1, it will simultaneously drive the cleaning brush 17 to rotate, and clean the surface of the dustproof net 18 during rotation, thereby avoiding a large amount of dust adhering to the surface of the dustproof net 18 during long-term heat dissipation, affecting the heat dissipation effect of the PCB main board 1.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation PCB board, comprising a PCB main board (1), characterized in that: A mounting seat (2) is movably connected to one side of the PCB mainboard (1), a support leg (3) is fixedly connected to the bottom of the mounting seat (2), a groove (4) is provided on one side of the mounting seat (2), a movable block (5) is movably connected to the inner wall of the groove (4), a rotating shaft (6) is fixedly connected to the top of the movable block (5), a positioning column (7) is movably connected to the inner wall of the movable block (5), and a positioning ring (8) is movably connected to the outer wall of the positioning column (7); The inner wall of the mounting seat (2) is movably connected to a connecting block (9), one side of the connecting block (9) is fixedly connected to a fin rack (11), one side of the fin rack (11) is movably connected to a fin plate (12), a fin (13) is arranged on the top of the fin plate (12), and the inner wall of the fin plate (12) is fixedly connected to a fan seat (14).

2. A heat dissipation PCB board according to claim 1, characterized in that: A heat dissipation fan (16) is installed on the inner wall of the fan seat (14), a cleaning brush (17) is fixedly connected to the shaft end of the heat dissipation fan (16), and a dustproof net (18) is fixedly connected to the top of the fan seat (14).

3. The heat dissipation PCB board according to claim 1, characterized in that: The movable block (5) is movably connected to the groove (4) via a rotating shaft (6), and the diameter of the groove (4) is greater than the diameter of the movable block (5).

4. The heat dissipation PCB board according to claim 1, characterized in that: The inner wall of the positioning ring (8) is provided with an anti-skid rubber layer, and the positioning ring (8) is movably connected to the positioning column (7) via the anti-skid rubber layer.

5. The heat dissipation PCB board according to claim 1, characterized in that: A connecting piece is provided at the bottom of the fin frame (11), a screw is installed at the top of the fin plate (12), and the fin frame (11) and the fin plate (12) are movably installed by means of the screws.

6. The heat dissipation PCB board according to claim 1, characterized in that: The top of the mounting seat (2) is movably connected with a bolt (10), and the mounting seat (2) is movably connected to the PCB mainboard (1) via the bolt (10).

7. The heat dissipation PCB board according to claim 1, characterized in that: The inner wall of the fan base (14) is fixedly connected with a mounting block (15), and the fan base (14) is fixedly connected to the heat dissipation fan (16) via the mounting block (15).

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