Power supply module and electronic equipment

Abstract

According to the power supply module and the electronic equipment provided by the invention, when the liquid cooling heat dissipation assembly leaks liquid, the liquid can be discharged from the liquid discharge hole, so that the condition of liquid accumulation is reduced, and the operation reliability of the equipment is improved. The power supply module comprises a shell, and a circuit board and a liquid cooling heat dissipation assembly which are arranged in the shell. The liquid cooling heat dissipation assembly is used for circulation of cooling liquid, and the cooling liquid is used for heat exchange with components on the circuit board. The shell comprises a first top plate, a first bottom plate and a side plate, and the first top plate, the first bottom plate and the side plate define a containing space in the shell. The circuit board is fixed on the inner wall of the first top plate. The liquid cooling heat dissipation assembly is fixed on the surface, away from the first top plate, of the circuit board. The first bottom plate or the side plate is provided with a liquid discharging hole, and the liquid discharging hole is used for discharging leaked liquid out of the shell when the liquid cooling heat dissipation assembly leaks liquid.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a power module and an electronic device. Background Art

[0002] With the rapid development of the new energy industry, the output power of power modules in high-power switching power supplies or energy storage devices has gradually increased, and the heat generated by the power modules has also increased, so higher requirements have been placed on the heat dissipation capacity of the power modules. Liquid cooling can effectively dissipate heat for power modules. However, the coolant flows under high pressure in the liquid cooling pipeline. Long-term high-pressure operation may cause leakage and seepage in the liquid cooling pipeline, resulting in short circuits of devices in the power module. In addition, when the power module is running, it is affected by temperature and humidity, and condensation will occur on the outer wall of the liquid cooling pipeline, which will also affect the safe operation of the power module. Utility Model Content

[0003] The present application provides a power module and an electronic device, which can solve the problem of device short circuit caused by coolant leakage or condensation in the liquid cooling pipeline, thereby improving the safety of equipment operation.

[0004] A power module provided in the present application includes a shell, a circuit board and a liquid cooling heat dissipation component arranged in the shell. The liquid cooling heat dissipation component is used to circulate cooling liquid, and the cooling liquid is used to perform heat exchange with components on the circuit board. The above-mentioned shell includes a first top plate, a first bottom plate and a side plate, and the first top plate, the first bottom plate and the side plate are surrounded to form a accommodating space in the shell. The circuit board is fixed on the inner wall of the first top plate, and the liquid cooling heat dissipation component is fixed on the surface of the circuit board away from the first top plate. The first bottom plate or the side plate is provided with a drainage hole, and the drainage hole is used to discharge the leaked liquid out of the shell when the liquid cooling heat dissipation component leaks.

[0005] In the above embodiment, when the liquid cooling and heat dissipation component leaks, seeps or produces condensation, the leaked liquid or condensation can flow to the first bottom plate under the action of gravity. Since the circuit board is located above the liquid cooling and heat dissipation component, the liquid is prevented from flowing to the circuit board and causing a short circuit. The housing is provided with a drainage hole, and the leaked liquid can be discharged from the drainage hole, reducing the accumulation of liquid in the housing, thereby improving the reliability of the operation of the power module.

[0006] In one embodiment, the first bottom plate includes a first edge and a second edge that are mutually opposite in a first direction, and when the power module is mounted on the carrier, the second edge is closer to the second bottom plate of the carrier than the first edge. The drainage hole is arranged at the second edge. Since the first bottom plate is arranged obliquely, the first bottom plate can act as a guide component to allow the leaked liquid to flow rapidly from the higher end to the lower end, and then be discharged from the housing through the drainage hole at the lower end of the first bottom plate, thereby accelerating the drainage speed and reducing the occurrence of liquid accumulation in the housing, thereby improving the reliability of the operation of the power module.

[0007] In one embodiment, there are multiple drainage holes, which are arranged along the extension direction of the second edge, and there is a gap between two adjacent drainage holes. Multiple drainage holes are conducive to accelerating the drainage speed and reducing liquid accumulation.

[0008] In another embodiment, the first bottom plate includes a first edge and a second edge that are mutually opposite in a first direction, and when the power module is mounted on the carrier, the second edge is closer to the second bottom plate of the carrier than the first edge. The side plate includes a third edge connected to the second edge, and the drainage hole is arranged on the third edge. Since the first bottom plate is arranged obliquely, the first bottom plate can act as a guide component to allow the leaked liquid to flow rapidly from the higher end to the lower end, and then be discharged from the housing through the drainage hole located on the side plate, thereby accelerating the drainage speed and reducing the occurrence of liquid accumulation in the housing, thereby improving the reliability of the operation of the power module.

[0009] In one embodiment, there are multiple drainage holes, which are arranged along the extension direction of the third edge, and there is a gap between two adjacent drainage holes. Multiple drainage holes are conducive to accelerating the drainage speed and reducing the accumulation of liquid.

[0010] In one embodiment, the power module further includes a sensor disposed in the housing, the sensor is disposed on the inner wall of the first bottom plate or the side plate, the distance between the sensor and the drain hole is less than a threshold value, and the sensor is used to send a signal to the controller when leakage is detected. When the leakage flows to the first bottom plate, it can be detected by the sensor. The user can take corresponding measures in time according to the alarm of the controller to reduce the loss caused by the leakage of the liquid cooling component and maintain the power module.

[0011] In one embodiment, the sensor is an immersion sensor or a liquid level sensor. The above two sensors are relatively sensitive and can both serve as a leakage alarm to remind the user to deal with the leakage in time.

[0012] In one embodiment, the power module further comprises a guide plate, which is mounted on a side of the liquid cooling component away from the circuit board, and has an acute angle with the first bottom plate, and the guide plate comprises a fourth edge and a fifth edge which are away from each other along a first direction, the fifth edge is connected to the first bottom plate, and the fourth edge is connected to the side plate. The first bottom plate comprises a first edge and a second edge which are away from each other along a first direction, the fifth edge is located between the first edge and the second edge, a drainage hole is provided at the second edge, and the guide plate is used to guide the leaked liquid to the drainage hole. Under the action of the guide plate, the leaked liquid can flow down quickly along the guide plate to be collected, and then be discharged from the drainage hole, thereby increasing the drainage speed.

[0013] In one embodiment, the power module further comprises a guide plate, which is mounted on a side of the liquid cooling component away from the circuit board, and has an acute angle with the first bottom plate, and the guide plate comprises a fourth edge and a fifth edge that are away from each other along a first direction. The first bottom plate comprises a first edge and a second edge that are away from each other along a first direction, the fifth edge is connected to the second edge, the side plate comprises a third edge connected to the second edge, the drainage hole is arranged at the third edge, and the guide plate is used to guide the leaked liquid to the drainage hole. Under the action of the guide plate, the leaked liquid can flow down quickly along the guide plate to be collected, and then be discharged from the drainage hole, thereby increasing the drainage speed.

[0014] On the other hand, the present application also provides an electronic device, which includes a housing and the above-mentioned power module. The housing includes a second top plate, a second bottom plate and at least one mounting plate, the mounting plate is located between the second top plate and the second bottom plate, the mounting plate and the second bottom plate have an acute angle, the mounting plate includes a sixth edge and a seventh edge that are away from each other along a first direction, the seventh edge is closer to the second bottom plate than the sixth edge, and the seventh edge is provided with a liquid receiving groove. The power module is installed on the mounting plate, the first bottom plate of the power module is in contact with the mounting plate, and the mounting plate is used to carry the power module so that it is installed in the housing in an inclined posture. The above-mentioned drainage hole faces the liquid receiving groove, and the liquid receiving groove is used to accommodate the leaked liquid discharged from the drainage hole.

[0015] In one embodiment, the angle between the mounting plate and the second bottom plate is α, 10°≤α≤20°. When the angle between the mounting plate and the second bottom plate is set within this angle range, the leaked liquid can quickly flow to the lower end and then be discharged from the housing, thereby reducing the situation where the liquid level rises too quickly due to the rapid leakage speed, the liquid surface contacts the circuit board, and damages the equipment.

[0016] In one embodiment, the liquid receiving groove is a strip groove, and the extension direction of the strip groove is parallel to the seventh edge. The volume of the strip groove is large and can accommodate more leaked liquid. When the above-mentioned mounting plate is specifically prepared, the seventh edge of the mounting plate can be bent to form the liquid receiving groove, and the processing technology is relatively simple.

[0017] In one embodiment, the strip groove comprises a first side wall, a second side wall and a groove bottom plate, the first side wall and the second side wall are arranged opposite to each other and are respectively connected to the groove bottom plate, the groove bottom plate is parallel to the second bottom plate, the first side wall is connected to the seventh edge, and the height a of the first side wall and the height b of the second side wall in a direction perpendicular to the groove bottom plate satisfy a≤b. The second side wall is equal to the first side wall or the second side wall is higher than the first side wall, and can accommodate more leaked liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a power module in one embodiment of the present application;

[0019] Figure 2 This is a schematic diagram of the structure of a power module in another embodiment of the present application;

[0020] Figure 3 This is a schematic diagram of a power module installed on a carrier in one embodiment of the present application;

[0021] Figure 4 This is a schematic diagram of another embodiment of the present application in which a power module is installed on a carrier;

[0022] Figure 5 This is a schematic diagram of the structure of a power module in another embodiment of the present application;

[0023] Figure 6 This is a schematic diagram of the structure of a power module in another embodiment of the present application;

[0024] Figure 7 A schematic diagram of the structure of an electronic device in one embodiment of the present application;

[0025] Figure 8 This is a schematic structural diagram of an electronic device in another embodiment of the present application;

[0026] Fig. 9 This is a schematic structural diagram of a liquid receiving tank and a mounting plate in one embodiment of the present application;

[0027] Fig.10 This is a structural schematic diagram of a liquid receiving tank and a mounting plate in another embodiment of the present application;

[0028] Fig.11 This is a schematic diagram of the structure of a power module in one embodiment of the present application;

[0029] Fig.12 This is a schematic diagram of the structure of a power module in another embodiment of the present application.

[0030] Reference numerals:

[0031] 0-carrier; 1-power module; 11-housing; 12-circuit board; 13-liquid cooling assembly; 111-first top plate; 112-first bottom plate; 110-side plate; 113-drain hole; 1101-third edge; 1121-first edge; 1122-second edge; 10-guide plate; 101-fourth edge; 102-fifth edge; 2-housing; 20-second top plate; 21-second bottom plate; 22-mounting plate; 221-sixth edge; 222-seventh edge; 223-liquid receiving tank; 2231-first side wall; 2232-second side wall; 223 3-slot bottom plate; 14-sensor; 131-liquid inlet main pipe; 132-liquid outlet main pipe; 133-cold plate; 1331-liquid inlet; 1332-liquid outlet; 1330-first cold plate; 1333-second cold plate; 1334-third cold plate; 1335-fourth cold plate; 134-connecting pipe; 15-power device; 151-first power device group; 152-second power device group; 13311-first heat dissipation surface; 13312-second heat dissipation surface; 16-air-liquid heat exchanger; 17-inductor; 18-fan; 19-connector; X-first direction; Y-second direction. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship, and they do not represent the true proportion.

[0033] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.

[0034] Photovoltaic power stations or charging stations are often equipped with energy storage devices or high-power switching power supply devices, which are equipped with power modules, which can be used to realize power conversion functions. The power module is provided with a circuit structure, which includes a heating device, and the heating device is cooled by liquid cooling, which has high heat dissipation efficiency. The liquid cooling method usually requires that a liquid cooling device, such as a cold plate, is connected with a pipeline to form a circulating flow channel structure, and is installed in the power module. The cold plate is in contact with the heating device to dissipate heat for the heating device. When connecting the pipeline and the cold plate, the pipeline and the cold plate are often connected by welding or plugging. Since the coolant in the circulating flow channel needs to operate under a high-pressure environment, the welding or plugging connection is weak, so leakage or seepage is prone to occur here. The leaked coolant contacts the circuit structure and causes a short circuit, affecting the safe operation of the power module. If the circulating flow channel is made by an integrated molding process, leakage or seepage of welds and interfaces can be avoided to a certain extent, but the production cost will increase. Furthermore, the circulation channel produced by the one-piece molding process cannot guarantee complete avoidance of leakage or seepage.

[0035] In order to solve the above problems, the present application proposes a power module and an electronic device, which achieves the isolation of leaked coolant from the circuit structure and can discharge the leaked coolant, thereby improving the safety of equipment operation.

[0036] Figure 1 This is a schematic diagram of the structure of a power module in one embodiment of the present application. Figure 2 FIG. 1 is a schematic diagram of the structure of a power module in another embodiment of the present application. Figure 1 and Figure 2 As shown, the power module 1 includes a housing 11, a circuit board 12 and a liquid cooling and heat dissipation assembly 13, and the circuit board 12 and the liquid cooling and heat dissipation assembly 13 are stacked in the housing 11. The circuit board 12 is provided with heat generating components, and the liquid cooling and heat dissipation assembly 13 is used to circulate cooling liquid, and the cooling liquid is used to perform heat exchange with the components on the circuit board 12. The housing 11 includes a first top plate 111, a first bottom plate 112 and a side plate 110, and the first top plate 111, the first bottom plate 112 and the side plate 110 are surrounded to form a containing space in the housing 11. The circuit board 12 is fixedly mounted on the inner wall of the first top plate 111, and the liquid cooling and heat dissipation assembly 13 is fixedly mounted on the surface of the circuit board 12 away from the first top plate 111. The first bottom plate 112 or the side plate 110 is provided with a drainage hole 113, and the drainage hole 113 is used to discharge the leaked liquid out of the housing when the liquid cooling and heat dissipation assembly 13 leaks.

[0037] In the above embodiment, when the liquid cooling and heat dissipation component 13 leaks, seeps, or condenses, the leaked liquid or condensed liquid can flow to the first bottom plate 112 located below the liquid cooling and heat dissipation component 13 under the action of gravity. Since the circuit board 12 is located above the liquid cooling and heat dissipation component 13, the situation where the liquid flows to the circuit board 12 and causes a short circuit is reduced. In addition, the housing 11 is provided with a drainage hole 113, and the leaked liquid can be discharged from the drainage hole 113, reducing the situation where liquid accumulates in the housing 11, thereby improving the reliability of the operation of the power module.

[0038] Figure 3 FIG. 1 is a schematic diagram of a power module installed on a carrier in an embodiment of the present application. Figure 3 As shown, in one embodiment, the first bottom plate 112 includes a first edge 1121 and a second edge 1122 that are mutually opposite along a first direction X, and the first edge 1121 and the second edge 1122 are parallel to each other. When the power module 1 is installed on the carrier 0, the second edge 1122 is closer to the second bottom plate 21 of the carrier 0 than the first edge 1121, and the drainage hole 113 is arranged on the second edge 1122. The carrier 0 may be a housing 2 of an electronic device. The power module 1 is obliquely installed in the housing 2 of the electronic device. Since the first bottom plate 112 is obliquely arranged to have a slope, the first bottom plate 112 can act as a guide component to allow the leaked liquid to quickly flow down from the higher end of the first bottom plate 112 to the lower end, and then discharge from the housing from the drainage hole 113 located at the lower end of the first bottom plate 112, thereby accelerating the drainage speed and reducing the occurrence of liquid accumulation in the housing 11, thereby improving the reliability of the operation of the power module 1. In order to speed up the drainage and reduce the accumulation of liquid in the shell 11, the above-mentioned drainage holes 113 can be set to multiple, and the multiple drainage holes 113 are arranged along the extension direction of the second edge 1122 of the first bottom plate 112, and there is a gap between two adjacent drainage holes 113.

[0039] Figure 4 FIG. 1 is a schematic diagram of another embodiment of the present application in which a power module is installed on a carrier. Figure 4As shown, in another embodiment, the first bottom plate 112 includes a first edge 1121 and a second edge 1122 that are mutually opposite along the first direction X, and the first edge 1121 and the second edge 1122 are parallel to each other. When the power module 1 is installed on the carrier 0, the second edge 1122 is closer to the second bottom plate 21 of the carrier than the first edge 1121. The side plate 110 includes a third edge 1101 connected to the second edge 1122, and the drainage hole 113 is arranged on the third edge 1101. The difference between this embodiment and the previous embodiment lies in the setting position of the drainage hole 113. The drainage hole 113 is arranged on the first bottom plate 112 or the side plate 110, and the effect of draining the leaked liquid can be achieved. There are multiple drainage holes 113, and multiple drainage holes 113 are conducive to improving the drainage speed. The multiple drainage holes 113 are arranged along the extension direction of the third edge 1101 of the side plate 110, and there is a gap between two adjacent drainage holes 113.

[0040] Figure 5 FIG. 1 is a schematic diagram of the structure of a power module in another embodiment of the present application. Figure 5 As shown, in one embodiment, the power module 1 may further include a guide plate 10, which is installed on the side of the liquid cooling component 13 away from the circuit board 12, and the guide plate 10 is used to guide the leaked liquid to the drain hole 113. The guide plate 10 can quickly collect and discharge the leaked liquid inside the power module 1 from the housing 11 when the power module 1 is not installed tilted. Specifically, the guide plate 10 has an acute angle with the first bottom plate 112, and the guide plate 10 includes a fourth edge 101 and a fifth edge 102 that are away from each other along the first direction X, and the fourth edge 101 is parallel to the fifth edge 102. Among them, the fifth edge 102 is connected to the first bottom plate 112, and the fourth edge 101 is connected to the side plate. The number of side plates is four, and the four sides are connected end to end to form a synthetic sleeve shape, and are connected to the first top plate 111 and the first bottom plate 112. The side plate refers to the side plate connected to the first edge 1121. The fourth edge 101 is farther from the first bottom plate 112 than the fifth edge 102. The fifth edge 102 is located between the first edge 1121 and the second edge 1122 of the first bottom plate 112, and the drainage hole 113 is provided at the second edge 1122. After the leaked liquid flows to the guide plate 10, it flows down from the higher end to the lower end of the guide plate 10, and is quickly gathered, and then discharged from the drainage hole 113 located on the first bottom plate 112, thereby increasing the drainage speed.

[0041] Figure 6 FIG. 1 is a schematic diagram of the structure of a power module in another embodiment of the present application. Figure 6As shown, in another embodiment, the fifth edge 102 of the guide plate 10 can also be connected to the second edge 1122 of the first bottom plate 112. The side plate 110 includes a third edge 1101 connected to the second edge 1122, and the drainage hole 113 is arranged on the third edge 1101. After the leaked liquid flows to the guide plate 10, it flows down from the higher end to the lower end of the guide plate 10, and is quickly gathered, and then discharged from the drainage hole 113 located at the third edge 1101 of the side plate 110, thereby improving the drainage speed.

[0042] Please continue to refer to Figure 3 or Figure 4 In one embodiment, the power module 1 also includes a sensor 14 disposed in the housing 11. The sensor 14 is disposed on the inner wall of the first bottom plate 112 or the side plate 110. The distance between the sensor 14 and the drain hole 113 is less than a threshold value, and the threshold value range can be 1 cm to 2 cm. The sensor 14 is used to send a signal to a controller (not shown in the figure) when a leakage is detected. The controller can specifically be a single-chip microcomputer. When the leakage flows to the first bottom plate 112, it can be detected by the sensor. The user can take corresponding measures in time according to the alarm signal of the controller, such as cutting off the power supply, to reduce the loss caused by the leakage of the liquid cooling heat dissipation component 13, and maintain the power module.

[0043] In a specific embodiment, the sensor 14 can be an immersion sensor or a liquid level sensor. The immersion sensor is based on the principle of liquid conductivity, uses electrodes to detect whether there is liquid, and then converts it into a leakage signal and outputs it to the controller. The liquid level sensor outputs a leakage signal to the controller when the liquid level reaches the threshold. Both of the above sensors can play the role of leakage alarm, and can be selected and configured according to specific circumstances.

[0044] On the other hand, the embodiments of the present application also provide electronic equipment, which can be energy storage equipment or high-power switching power supply equipment, and can be applied to scenes such as photovoltaic power stations or charging stations. Alternatively, the electronic equipment can also be a server device. Figure 7 This is a schematic diagram of the structure of an electronic device in one embodiment of the present application. Figure 8 FIG. 1 is a schematic diagram of the structure of an electronic device in another embodiment of the present application. Figure 7 or Figure 8As shown, the electronic device includes a housing 2 and the power module 1. The housing 2 is square and is used to accommodate the power module 1. The housing 2 includes a second top plate 20, a second bottom plate 21 and at least one mounting plate 22, and the mounting plate 22 is located between the second top plate 20 and the second bottom plate 21. The mounting plate 22 forms an acute angle with the second bottom plate 21. Specifically, the mounting plate 22 includes a sixth edge 221 and a seventh edge 222 that are mutually divergent along the first direction X, and the sixth edge 221 is parallel to the seventh edge 222. The seventh edge 222 is closer to the second bottom plate 21 than the sixth edge 221. The seventh edge 222 is provided with a liquid receiving groove 223. The power module 1 is mounted on the mounting plate 22, and the first bottom plate 112 of the power module 1 is in contact with the upper surface of the mounting plate 22, and the drainage hole 113 faces the liquid receiving groove 223. The mounting plate 22 is used to carry the power module 1 so that it is installed in the housing 2 in an inclined posture. When the leaked liquid is discharged from the housing 11 of the power module 1 , the leaked liquid flows into the liquid receiving groove 223 , thereby avoiding contamination of other electronic components in the electronic device, thereby improving the reliability of the operation of the electronic device.

[0045] In one embodiment, the angle between the mounting plate 22 and the second bottom plate 21 is α, 10°≤α≤20°. For example, α can be 10°, 12°, 13°, 15°, 18°, etc. The mounting plate 22 is arranged within this angle range, and the leaked liquid can quickly flow to the end of the housing 11 close to the seventh edge 222, so as to be collected and discharged. Moreover, within this angle range, the space occupied by the power module 1 in the housing 2 is smaller than that of a large-angle installation, making the structure of the electronic device compact.

[0046] In a possible implementation, the electronic device further includes a liquid guide tube (not shown in the figure), which is connected to the liquid receiving groove 223. The housing 2 is provided with a through hole to allow the liquid guide tube to pass through, and extend to the outside of the housing 2, so as to lead the leaked liquid out of the electronic device to avoid polluting the internal environment of the electronic device or causing safety hazards. A pump body can also be provided in the liquid guide tube to enable the leaked liquid to be discharged from the housing 2 more quickly.

[0047] In one embodiment, the liquid receiving groove 223 may be a strip groove, and the extension direction of the strip groove is parallel to the seventh edge 222 of the mounting plate 22. When the mounting plate 22 is specifically prepared, the seventh edge 222 of the mounting plate 22 may be bent to form the liquid receiving groove 223, and the processing technology is simple. The strip groove has a larger volume and can accommodate more leaked liquid.

[0048] Fig. 9 This is a schematic diagram of the structure of a liquid receiving tank and a mounting plate in one embodiment of the present application. Fig.10 FIG. 1 is a schematic diagram of the structure of the liquid receiving tank and the mounting plate in another embodiment of the present application. Fig. 9 or Fig.10As shown, in one embodiment, the liquid receiving tank 223 includes a first side wall 2231, a second side wall 2232 and a tank bottom plate 2233. The first side wall 2231 and the second side wall 2232 are arranged opposite to each other and are respectively connected to the tank bottom plate 2233. The tank bottom plate 2233 is parallel to the second bottom plate 21, and the first side wall 2231 is connected to the seventh edge 222 of the mounting plate 22. The height a of the first side wall 2231 and the height b of the second side wall 2232 in a direction perpendicular to the tank bottom plate 2233 satisfy a≤b. The second side wall 2232 is equal to the first side wall 2231 or the second side wall 2232 is higher than the first side wall 2231, and can accommodate more leaked liquid.

[0049] The structure of the liquid cooling and heat dissipation assembly 13 is introduced below.

[0050] Fig.11 FIG. 1 is a schematic diagram of the structure of a power module in an embodiment of the present application. Fig.11 As shown, in a specific embodiment, the liquid cooling heat dissipation assembly 13 includes a liquid inlet manifold 131, a liquid outlet manifold 132 and a plurality of cold plates 133, the plurality of cold plates 133 are arranged at intervals along a first direction X, the liquid inlet manifold 131 and the liquid outlet manifold 132 are arranged at intervals along a second direction Y, the first direction X and the second direction Y are perpendicular to each other, and the extension direction of the first edge and the second edge is the same as the second direction Y. The first direction X is the length direction of the shell 11, and the second direction Y is the width direction of the shell 11. Each cold plate 133 includes a liquid inlet 1331 and a liquid outlet 1332, the liquid inlet 1331 of each cold plate 133 is connected to the liquid inlet manifold 131, and the liquid outlet 1332 of each cold plate 133 is connected to the liquid outlet manifold 132. In this solution, the above-mentioned multiple cold plates 133 are operated in parallel to dissipate heat for the heat generating device. Parallel operation means that multiple cold plates 133 are arranged in parallel, and coolant enters and flows out of each cold plate 133 at the same time to ensure that the pressure in each cold plate 133 is uniform. The parallel operation can reduce the flow resistance of the coolant in the cold plate 133 and improve the heat dissipation efficiency.

[0051] Fig.12 FIG. 1 is a schematic diagram of the structure of a power module in another embodiment of the present application. Fig.12As shown, in another specific embodiment, the liquid cooling heat dissipation assembly 13 includes a plurality of cold plates 133, and the plurality of cold plates 133 are arranged at intervals along the first direction X, and each cold plate 133 includes a liquid inlet 1331 and a liquid outlet 1332. The plurality of cold plates 133 can be specifically four cold plates 133, which are the first cold plate 1330, the second cold plate 1333, the third cold plate 1334 and the fourth cold plate 1335 in the first direction X. The liquid inlet 1331 of the first cold plate 1330 is connected to the liquid inlet main pipe 131, and the liquid outlet 1332 of the fourth cold plate 1335 is connected to the liquid outlet main pipe 132. The liquid inlet 1331 and the liquid outlet 1332 of two adjacent cold plates 133 are connected by a connecting pipe 134. The connecting pipe 134 can be bent into an arc to reduce stress. The connecting pipe 134 realizes the series connection between the cold plates 133 and makes the adjacent cold plates 133 arranged compactly, which is conducive to the miniaturization of the power module 1. Multiple cold plates 133 are connected in series end to end to form an S-shaped flow channel. When the heat generation of components is relatively low, the series operation mode can save energy for heat dissipation of components.

[0052] In other embodiments, the cold plate 133 may also be replaced by liquid cooling components such as heat pipes, water cooling heads, and water drains.

[0053] Please continue to refer to Fig.11 and Fig.12 In one embodiment, the power module 1 further includes a plurality of power devices 15, which are mounted on the side of the circuit board 12 facing the first base plate 112, and the cold plate 133 is in contact with at least one power device 15. The cold plate 133 is used to cool the power device 15, which is a component with a relatively high heat generation, and a coolant flows in the cold plate 133. The cold plate 133 and the power device 15 are attached to each other for heat exchange to cool the power device 15. At the same time, the cold plate 133 can also cool the air in the housing 11, reduce the temperature in the housing 11, and thus reduce the overall temperature of the power module 1.

[0054] In one embodiment, the above-mentioned multiple power devices 15 are arranged along the second direction Y to form a power device group, and the multiple power device groups 15 are arranged along the first direction X and installed on the circuit board 12. The power device group includes a first power device group 151 and a second power device group 152. The above-mentioned cold plate 133 is installed perpendicular to the circuit board 12, and the cold plate 133 has a first heat dissipation surface 13311 and a second heat dissipation surface 13312 that are opposite to each other. The cold plate 133 is arranged between the first power device group 151 and the second power device group 152, and the first heat dissipation surface 13311 is in contact with the first power device group 151, and the second heat dissipation surface 13312 is in contact with the second power device group 152. One cold plate 133 dissipates heat for two power device groups at the same time, which not only makes full use of the internal space of the housing 11, but also improves the utilization rate of the cold plate 133.

[0055] Please continue to refer to Fig.11 and Fig.12 In one embodiment, the power module 1 further includes an air-liquid heat exchanger 16. The air-liquid heat exchanger 16 and the liquid cooling and heat dissipation assembly 13 are located on the same side of the circuit board 12. The cold plate 133 and the air-liquid heat exchanger 16 are arranged along the first direction X. Cooling liquid also flows in the air-liquid heat exchanger 16. When liquid leakage occurs, the leakage of the air-liquid heat dissipation 16 can also flow to the first bottom plate 112 located below it. The air-liquid heat exchanger 16 includes an inlet pipe and an outlet pipe. The inlet pipe is connected to the inlet main pipe 131, and the outlet pipe is connected to the outlet main pipe 132. The air-liquid heat exchanger 16 and the cold plate 133 operate in parallel. The air-liquid heat exchanger 16 performs heat exchange with the air in the shell 11 to cool the air in the shell 11, thereby cooling the power module 1. The air with a lower temperature absorbs the heat of the heating device in the power module 1 and its temperature rises. The air with the increased temperature can be cooled again when passing through the air-liquid heat exchanger 16. The air-liquid heat exchanger 16 combines air cooling and liquid cooling, and can take into account the heat dissipation of the heat generating device by both cooling methods, which is conducive to various components to obtain a better heat dissipation effect. At the same time, the power module combines air cooling and liquid cooling, and the heat dissipation efficiency is high.

[0056] In one embodiment, the power module 1 includes a plurality of inductors 17, and the plurality of inductors 17 are arranged along the second direction Y. The inductors 17 and the air-to-liquid heat exchanger 16 are arranged in the housing 11 along the first direction X. The air-to-liquid heat exchanger 16 can be used to dissipate heat for the low-heat-generating inductors 17. To increase the air flow rate in the housing 11 and thus improve the heat dissipation efficiency of the air-to-liquid heat exchanger 16, the power module 1 can also include a plurality of fans 18, and the plurality of fans 18 can be arranged along the second direction Y and located between the inductors 17 and the air-to-liquid heat exchanger 16. The power module 1 also includes heat-generating components such as capacitors and relays, which can also cool down the heat-generating components such as capacitors and relays when the air temperature in the housing 11 decreases.

[0057] In one embodiment, the liquid inlet manifold 131 and the liquid outlet manifold 132 are connected to the housing 11 through a connector 19. The connector 19 is mounted on the side plate 110, and the liquid inlet manifold 131 and the liquid outlet manifold 132 are respectively plugged into the connector 19, and the plugging position is prone to leakage. The sensor 14 can be installed at a position of the bottom plate 112 close to the connector 19. When leakage occurs at the connector 19, the leakage is detected in time by the sensor 14, thereby improving the safety of the power module.

[0058] The terms used in the above embodiments are only for the purpose of describing specific embodiments and are not intended to be used as limitations on the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0059] References to "one embodiment" or "a specific embodiment" described in this specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

Claims

1. A power module, characterized in that: It includes a housing, and a circuit board and a liquid cooling and heat dissipation assembly arranged in the housing; The liquid cooling and heat dissipation assembly is used for circulating cooling liquid, and the cooling liquid is used for heat exchange with components on the circuit board; The shell comprises a first top plate, a first bottom plate and a side plate, wherein the first top plate, the first bottom plate and the side plate are arranged to form a receiving space in the shell; The circuit board is fixed on the inner wall of the first top plate, and the liquid cooling heat dissipation component is fixed on the surface of the circuit board away from the first top plate; The first bottom plate or the side plate is provided with a drainage hole, and the drainage hole is used to discharge the leaked liquid from the shell when the liquid cooling heat dissipation component leaks.

2. The power module according to claim 1, characterized in that: The first bottom plate comprises a first edge and a second edge which are away from each other along a first direction, and when the power module is mounted on the carrier, the second edge is closer to the second bottom plate of the carrier than the first edge; The drainage hole is arranged at the second edge.

3. The power module according to claim 2, characterized in that: There are a plurality of drainage holes, and the plurality of drainage holes are arranged along the extension direction of the second edge, and there is a gap between two adjacent drainage holes.

4. The power module according to claim 1, characterized in that: The first bottom plate comprises a first edge and a second edge which are away from each other along a first direction, and when the power module is mounted on the carrier, the second edge is closer to the second bottom plate of the carrier than the first edge; The side plate includes a third edge connected to the second edge, and the drainage hole is arranged on the third edge.

5. The power module according to claim 4, characterized in that: There are a plurality of drainage holes, and the plurality of drainage holes are arranged along the extension direction of the third edge, and there is a gap between two adjacent drainage holes.

6. The power module according to claim 1, characterized in that: The power module also includes a sensor arranged in the shell, the sensor is arranged on the inner wall of the first bottom plate or the side plate, the distance between the sensor and the drainage hole is less than a threshold, and the sensor is used to send a signal to the controller when the leakage is detected.

7. The power module according to claim 6, characterized in that: The sensor is an immersion sensor or a liquid level sensor.

8. The power module according to claim 1, characterized in that: It also includes a guide plate, which is installed on a side of the liquid cooling and heat dissipation assembly away from the circuit board, the guide plate and the first bottom plate have an acute angle, the guide plate includes a fourth edge and a fifth edge that are away from each other along a first direction, the fifth edge is connected to the first bottom plate, and the fourth edge is connected to the side plate; The first bottom plate includes a first edge and a second edge that are opposite to each other along the first direction, the fifth edge is located between the first edge and the second edge, the drainage hole is arranged at the second edge, and the guide plate is used to guide the leaked liquid to the drainage hole.

9. The power module according to claim 1, characterized in that: It also includes a guide plate, which is installed on a side of the liquid cooling and heat dissipation assembly away from the circuit board, the guide plate and the first bottom plate have an acute angle, and the guide plate includes a fourth edge and a fifth edge that are away from each other along the first direction; The first bottom plate includes a first edge and a second edge that are opposite to each other along a first direction, the fifth edge is connected to the second edge, the side plate includes a third edge connected to the second edge, the drainage hole is arranged on the third edge, and the guide plate is used to guide the leaked liquid to the drainage hole.

10. An electronic device, characterized in that: comprising a housing and at least one power module according to any one of claims 1 to 7; The housing comprises a second top plate, a second bottom plate and at least one mounting plate, wherein the mounting plate is located between the second top plate and the second bottom plate, wherein the mounting plate and the second bottom plate have an acute angle, wherein the mounting plate comprises a sixth edge and a seventh edge which are mutually divergent along a first direction, wherein the seventh edge is closer to the second bottom plate than the sixth edge, and wherein the seventh edge is provided with a liquid receiving groove; The power module is mounted on the mounting plate, the first bottom plate of the power module is in contact with the mounting plate, the drainage hole faces the liquid receiving groove, and the liquid receiving groove is used to accommodate the leaked liquid.

11. The electronic device according to claim 10, characterized in that: The included angle between the mounting plate and the second bottom plate is α, 10°≤α≤20°.

12. The electronic device according to claim 10, characterized in that: The liquid receiving groove is a strip-shaped groove, and the extending direction of the strip-shaped groove is parallel to the seventh edge.

13. The electronic device according to claim 12, characterized in that: The strip groove includes a first side wall, a second side wall and a groove bottom plate, the first side wall and the second side wall are arranged opposite to each other and are respectively connected to the groove bottom plate, the groove bottom plate is parallel to the second bottom plate, the first side wall is connected to the seventh edge, and the height a of the first side wall and the height b of the second side wall along the direction perpendicular to the groove bottom plate satisfy a≤b.

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