Heat dissipation structure of electric control box of air conditioner

Abstract

The utility model discloses a heat dissipation structure of an electric control box of an air conditioner, which relates to the technical field of air conditioners and comprises the electric control box, the electric control box adopts subareas of a plurality of closed spaces, and the subareas of different closed spaces are correspondingly provided with device plates with different heating values. The device boards with high heat productivity are concentrated in one or more independent subareas of the sealed space with the heat exchange enhancement function, the subareas of the different sealed spaces comprise multiple layers of structures, the bottom layer structure is used for arranging the device boards, and the bottom layer or the upper layer structure can be used for arranging circuit sealing pipelines; according to the technical scheme provided by the utility model, a partition isolation mode is adopted, the insertion of pipelines is changed into partition isolation, the first partition is preferably arranged to be an electric control device plate which is safe and does not generate static electricity, contact sparks and the like, leaked refrigerants pass through a circuit sealing pipeline of the second partition, and the leakage of the refrigerants is avoided. And then the electric control device board in the second partition is required, so that the risk is further reduced, and the reliability is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of air conditioners, in particular to a heat dissipation structure of an electric control box of an air conditioner. Background Art

[0002] At present, the conventional electronically controlled heat dissipation methods of air conditioners (heat pumps) are as follows:

[0003] 1. Use the high-heat components of the electronic control device board to fit the aluminum ingot fin type heat sink, cool the fin type heat sink through the air flow on the duct side, and at the same time, part of the duct diverts air to cool other components on the electronic control device board.

[0004] This method is fine for conventional refrigerant systems, but for flammable refrigerants, such as R290, once the refrigerant in the circulation system pipeline leaks, it is easy to directly contact the electronic control device board. Once there is electronic ignition or static electricity, as long as the ignition energy reaches the flammable point of the flammable refrigerant, and there is oxygen and the refrigerant concentration reaches the flammable state, it is very likely to cause a fire or explosion, and safety and reliability cannot be effectively guaranteed. Therefore, it is generally not directly applicable to flammable refrigerant heat pump systems.

[0005] 2. Use the high-heat components of the electronic control device board to fit the refrigerant (or other media) cooling pipeline, and (with or without) some air ducts to cool other components on the electronic control device board. The cost is lower.

[0006] This method is fine for conventional refrigerant systems, but for flammable refrigerants, such as R290, as described in 1, as long as the refrigerant leakage may come into contact with the electronic control components, the safety and reliability cannot be effectively guaranteed. In addition, the method of cooling the electronic control device board with the refrigerant (or other medium) cooling pipeline is also prone to the risk of condensation on the electronic control device board, so it is also difficult to apply to flammable refrigerant heat pump systems.

[0007] 3. The closed electronic control method is adopted. The electronic control board adopts an inverted design. In order to make the components with high heat generation fit to the fin-type radiator, so that the heat can be quickly and effectively transferred to the fin-type radiator, for the heat-generating components that cannot be fitted, the heat dissipation glue is filled between such heat-generating components and the fin-type radiator to transfer heat. The fin-type radiator is cooled by an external air duct. At the same time, the entire electronic control device board (such as the compressor module filter board, etc.) is placed in a closed area.

[0008] This method can indeed effectively isolate the flammable refrigerant from the electronic control device board. However, since it is a relatively large integrated electronic control device board that is inverted, local glue injection is generally performed through the electronic control PCB side. For mass production, once the glue injection is not well controlled, bubbles are easily generated in the local small space, resulting in large differences in the heat dissipation effect. This arrangement method has high process requirements, is difficult to manage quality, and is difficult to reduce costs. In addition, the safety and reliability of the gap sealing after the wire body passes through the wire hole of the electric control box is also difficult to control, and there are no further measures to protect the reliability of poor heat dissipation once the glue injection fails. Utility Model Content

[0009] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an air-conditioning electric control box heat dissipation structure to solve the problems of the prior art air-conditioning electric control radiator in terms of reliability, cost, manufacturing process difficulty and production consistency.

[0010] In view of this, the utility model provides a heat dissipation structure of an air conditioner electric control box, comprising:

[0011] An electric control box, wherein the electric control box is divided into multiple enclosed space partitions, and different enclosed space partitions are correspondingly installed with device boards with different heat generation, and the device boards with high heat generation are concentrated in one or more separate sealed space partitions with enhanced heat exchange function, and the partitions of different sealed spaces include a multi-layer structure, the bottom structure is used to arrange the device boards, and the bottom, side or upper structure can be used to arrange line sealing pipes;

[0012] A partition assembly, the partition assembly comprising a first enclosure baffle, a second enclosure baffle and a middle partition, and the partition assembly is arranged inside the electric control box;

[0013] The device board includes a first PCB board, a second PCB board and a third PCB board, and a temperature sensing device is arranged on part or all of the first PCB board, the second PCB board and the third PCB board; the first PCB board is arranged in one of the enclosed space partitions in a positive manner, and a first heat dissipation glue is optionally arranged on the surface of the first PCB board; the second PCB board is arranged in one of the enclosed space partitions in a flip-down manner, a PCB board fixing bracket is fixedly installed at the bottom of the second PCB board, and a second heat dissipation glue is arranged below the second PCB board and in the side wall of the second enclosure baffle; the third PCB board is arranged in another enclosed space partition;

[0014] The radiator includes a radiator substrate, a radiator fin or a first segmented radiator substrate, a first segmented radiator fin and a second segmented radiator substrate, and a second segmented radiator fin. The radiator is arranged on one side of the bottom of the electric control box and is used for heat conduction and cooling treatment of the first PCB board and the second PCB board.

[0015] Preferably, an electric control box top cover is arranged on the top of the electric control box, and a sealing treatment is adopted between the electric control box top cover and the electric control box body in a manner not limited to adding a sealing strip.

[0016] Preferably, a heat sink is provided at the lower part of the first PCB board, and a first enclosure baffle is optionally provided around the first PCB board, the first enclosure baffle is fixedly connected to the surrounding base of the heat sink substrate, and reserves a larger area than the first PCB board, and is sealed with the heat sink base, and the circuit board of the first PCB board is fixedly mounted with first (type) components with high heat generation and need to be directly attached to the heat sink substrate and second (type) components with average heat generation and can be dissipated through air ducts or natural cooling. In order to achieve enhanced heat dissipation of the first (type) components or the second (type) components on the first PCB board, the first enclosure baffle and heat dissipation glue are optionally added:

[0017] According to the heat dissipation intensity requirement, the first heat dissipation glue is optionally located on the end surface of the heat sink substrate, and the heat dissipation glue poured on the first PCB board is blocked by the first enclosure baffle plate and filled over the surface of the first PCB board, but does not overflow the corresponding docking or spiral fixing terminal;

[0018] According to the heat dissipation intensity requirement, the first heat dissipation glue is optionally located on the end surface of the heat sink substrate, and the heat dissipation glue poured on the first PCB is blocked by the first enclosure baffle, but does not fill and overflow the surface of the first PCB;

[0019] According to the heat dissipation intensity requirement, the first enclosure baffle and heat dissipation adhesive are not needed. Preferably, the second enclosure baffle is fixedly connected to the surrounding base of the radiator substrate, and reserves a larger area than the second PCB board, and is sealed with the radiator base, the second enclosure baffle is fixedly connected to the outer wall of the second heat dissipation adhesive, and the middle partition is used to separate the first PCB board, the second PCB board and the third PCB board from the electric control box.

[0020] Preferably, the second heat dissipation adhesive is wrapped around the outer wall of the third (type) component and is placed in a protective baffle for injecting heat dissipation adhesive into the second PCB board.

[0021] Preferably, one or more first wire-passing rubber plug sleeve holes are provided in the middle of the middle partition, and the first wire-passing rubber plug sleeve holes are used to install the wire body passing through the middle partition.

[0022] Preferably, a second wire-passing rubber plug sleeve hole close to the third PCB board is provided at one end of the electric control box, and the second wire-passing rubber plug sleeve hole includes a third wire-passing rubber plug sleeve hole and a fourth wire-passing rubber plug sleeve hole, and the third wire-passing rubber plug sleeve hole and the fourth wire-passing rubber plug sleeve hole are both provided at one end or at different positions of the electric control box.

[0023] Preferably, the radiator substrate is fixedly connected to the bottom of the electric control box, the optional first heat dissipation adhesive and the second heat dissipation adhesive are fitted with the radiator substrate, the radiator can be an integral structure or two or more split structures, which correspond as a whole or separately to the heat dissipation of the aforementioned PCB board, the ribs of the integrated radiator are arranged at the bottom of the radiator substrate or for the segmented radiator, the first segmented radiator ribs and the second segmented radiator ribs are respectively arranged at the bottom of the first segmented radiator substrate and the second segmented radiator substrate.

[0024] The fins of the integrated heat sink are arranged at the bottom of the heat sink substrate (801); or the segmented heat sink, the first segmented heat sink fins (802) and the second segmented heat sink fins (804) are arranged at the bottom of the first segmented heat sink substrate (801) and the second segmented heat sink substrate (803), respectively.

[0025] Preferably, the structure of the radiator can be an air-cooled fin-type structure, or a liquid or gas-liquid two-phase coolant cooling structure.

[0026] Preferably, the circuit board of the third PCB board has fourth (category) components with a smaller heat generation than the second (category) components and fifth (category) components with substantially zero heat generation fixedly mounted thereon.

[0027] Preferably, the wiring group terminals of the electric control components in the air-conditioning equipment will be arranged in a closed electric control box or sealed separately to eliminate the risk of ignition at the docking terminals after refrigerant leakage.

[0028] It can be seen from the above technical solutions that the embodiments of the utility model have the following advantages:

[0029] 1. With the multi-layer isolation method of partitions, the interlacing of pipelines will also become multi-layer isolation. Even if there is a gap in the first partition, the electronic control device board arranged in the first partition is safe in itself, and will not generate static electricity, contact sparks, etc. The leaked refrigerant will then go to the electronic control device board in the second partition (this generally may generate contact sparks, etc.), and also pass through the sealed pipeline of the second partition's line, so the reliability will naturally become higher.

[0030] 2. When arranging the electronic control device boards within the partition, high-temperature devices should be concentrated together as much as possible to reduce the reliability of the electronic control components that generate heat after being sealed and filled with heat dissipation glue, so as to further improve their service life.

[0031] 3. For some device boards, it is necessary to add sealing and heat dissipation glue to transfer the heat to the heat sink and then to the external environment. It is necessary to test the reliability of its electronic control heating in harsh environments to ensure that there are no problems with its reliability.

[0032] 4. Furthermore, in the target device board, the most heat-sensitive components (the components arranged in a device board are affected by the high heat generation of other components, which makes the sensitive components easily in a state of high temperature and exceeding the allowable operating environment temperature) can be controlled by arranging temperature-sensing devices (external or built-in PCB), thereby further placing the electronic control of the air-conditioning (heat pump) product in a highly reliable operating environment.

[0033] 5. All docking terminals in the whole machine can be placed in the electric control box or sealed separately to eliminate the risk of refrigerant leakage to the docking terminals (the docking terminals may spark).

[0034] Through the combination of multiple methods, the electric control method under this patent is more economical and more reliable, and is significantly better than other solutions.

[0035] These features and advantages of the present invention will be disclosed in detail in the following specific implementation manners and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0037] Figure 1 It is a schematic diagram of the structure of the utility model;

[0038] Figure 2 This is a schematic diagram of disassembling the top cover of the electric control box of the utility model;

[0039] Figure 3 It is a cross-sectional schematic diagram of the utility model;

[0040] Figure 4 For this utility model Figure 2 Middle top view;

[0041] Figure 5 This is a schematic diagram of disassembling the top cover of the electric control box of Example 2 of the utility model;

[0042] Figure 6For the utility model embodiment 2 Figure 5 Schematic cross-section;

[0043] Figure 7 For the utility model embodiment 2 Figure 5 Schematic diagram from top view;

[0044] Figure 8 This is a schematic diagram of disassembling the top cover of the electric control box of Example 3 of the utility model;

[0045] Fig. 9 For the utility model embodiment 3 Figure 8 Schematic cross-section;

[0046] Fig.10 For the utility model embodiment 3 Figure 8 Schematic diagram from top view.

[0047] Description of reference numerals: 1, electric control box; 101, electric control box top cover;

[0048] 2. First PCB board; 201. First component; 202. Second component; 203. First enclosure baffle; 204. First heat dissipation glue;

[0049] 3. Second PCB board; 301. Third component; 302. PCB board fixing bracket; 303. Second enclosure baffle; 304. Second heat dissipation glue;

[0050] 4. Rubber plug for the first wire hole;

[0051] 5. Middle partition;

[0052] 6. The third PCB board; 601. The fourth component; 602. The fifth component;

[0053] 7. Rubber plug for the second wire hole; 701. Rubber plug for the third wire hole; 702. Rubber plug for the fourth wire hole;

[0054] 8. Radiator; 801. Radiator substrate or first segmented radiator substrate; 802. Radiator fins or first segmented radiator fins; 803. second segmented radiator substrate; 804. second segmented radiator fins. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0056] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0057] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0058] The following is a detailed description of a heat dissipation structure of an air conditioner electric control box according to an embodiment of the utility model in conjunction with the accompanying drawings.

[0059] Example 1

[0060] For easier understanding, see Figures 1 to 4 The utility model provides an embodiment of a heat dissipation structure of an air conditioner electric control box, comprising:

[0061] An electric control box 1, wherein the electric control box is divided into multiple enclosed space partitions, and different enclosed space partitions are correspondingly installed with device boards with different heat generation, and the device boards with high heat generation are concentrated in one or more separate sealed space partitions with enhanced heat exchange function, and the partitions of different sealed spaces include a multi-layer structure, the bottom structure is used to arrange the device boards, and the bottom, side or upper structure is used to arrange the line sealing pipeline;

[0062] By using multiple enclosed space partitions, the risk of flammable refrigerant leaking into a small area is much greater than the risk of flammable refrigerant leaking into a large area without partitions and enclosed spaces, so the risk can be reduced.

[0063] Among them, devices with high heat generation are set up in a separate area, so that these devices themselves are directly attached to the (aluminum ingot) heat sink or directly attached to the (aluminum ingot) heat sink through heat dissipation glue and heat conduction is carried out, so that the heat dissipation effect is in the best state. For devices with low heat generation, the front side and the PCB board and the heat sink are directly filled with heat dissipation glue (heat is transferred to the (aluminum ingot) heat sink through heat dissipation glue, instead of using the flip-chip method, to avoid problems such as poor contact of the terminal block). Or for device boards with low heat generation, they are directly exposed to the air in the sealed electric control box. In general, different heat generation of electric controls in different areas is achieved and different heat dissipation methods are used for different applications. Ensure the reliability of the heating of the sealed electric control.

[0064] A partition assembly, the partition assembly includes an optional first enclosure baffle 203, a second enclosure baffle 303 and a middle partition 5, and the partition assembly is arranged inside the electric control box 1;

[0065] The device board includes a first PCB board 2, a second PCB board 3 and a third PCB board 6, and a temperature sensing device is arranged on part or all of the first PCB board 2, the second PCB board 3 and the third PCB board 6; the first PCB board 2 is arranged in a partition of one of the enclosed spaces in a positive manner, and an optional first heat dissipation adhesive 204 is arranged on the surface of the first PCB board 2; the second PCB board 3 is arranged in a partition of one of the enclosed spaces in a flip-down manner, a PCB board fixing bracket 302 is fixedly installed at the bottom of the second PCB board 3, and a second heat dissipation adhesive 304 is arranged below the second PCB board 3 and in the side wall of the second enclosure baffle 303; the third PCB board 6 is arranged in a partition of another enclosed space;

[0066] The radiator 8 includes a radiator substrate 801, radiator fins 802 or a first segmented radiator substrate 801, a first segmented radiator fin 802 and a second segmented radiator substrate 803, and a second segmented radiator fin 804. The radiator 8 is arranged on one side of the bottom of the electric control box 1 and is used for heat conduction and cooling treatment of the first PCB board 2 and the second PCB board 3.

[0067] This embodiment adopts the device separation method: separate the device boards (such as inductors, driver boards, etc.) with large differences in heat generation, and connect different device boards to a whole heat sink or connect them to their corresponding heat sinks respectively;

[0068] It should be noted that the first PCB board 2 is installed in a normal manner: the main components on the first PCB board 2 (such as display, control ports, etc.) and the heat sink 8 are placed on both sides of the PCB substrate respectively, and some first (type) components 201 (such as IGBT, etc.) with slightly higher heat generation are on the same side of the PCB substrate as the heat sink 8, and heat is dissipated after being directly bonded.

[0069] The second PCB board 3 is flip-mounted, where the main components on the PCB board and the heat sink 8 are placed on one side of the PCB substrate, and the pins of these components soldered on the PCB and the heat sink 8 are placed on both sides of the PCB substrate. Some components with slightly higher heat generation are placed on the same side of the PCB substrate as the heat sink 8, and heat is dissipated after being directly or indirectly (by adding heat dissipation glue filling) bonded.

[0070] After the second PCB board 3 is inverted, the PCB board fixing bracket 302 prevents the device from directly contacting the chassis of the electric control box 1 or the radiator 8. The second enclosure baffle 303 is made of a plastic part that does not produce a "poisoning" reaction with the heat dissipation glue or other materials used to limit the space. The middle partition 5 is made of sheet metal or plastic.

[0071] The third PCB board 6 is a device board with the lowest heat generation (low power) and the lowest (or no) risk of sparking and bursting. The third wire plug sleeve hole 701 is a weak current hole, and the fourth wire plug sleeve hole 702 is a strong current hole. The heat sink 8 is generally made of aluminum ingot, with a fin-type structure, and can be air-cooled or cooled by other coolants;

[0072] The middle partition 5 adopts a multi-section partition and sealed layout combined with a separation layout of some device boards. This method can more safely prevent the possibility of contact between electronic control devices and (flammable) refrigerants, and realize multi-layer protection. At the same time, the partition layout is combined with the satisfaction of electronic control heating reliability (based on the heat generation and the temperature or function that the components can withstand as a distinction, and different specifications of device boards are arranged in each area, so that reliability can be further improved) and economic considerations, which has the advantage of being more flexible.

[0073] For some components on some device boards, the temperature is high, while the operating temperature of some components is not high. The components with high heat generation (such as inductors, etc.) are separated, such as the second PCB board 3:

[0074] On the one hand, for components with high heat generation, the components (boards) with high heat generation, such as the second PCB board 3, are flipped upside down and face the fin-type heat sink 8 by separating, reassembling and then flipping them upside down. For those that cannot be directly attached, the second heat dissipation glue 304 for sealing and strengthening heat dissipation is filled between the components (boards), such as the second PCB board 3 and the fin-type heat sink 8, so as to quickly and effectively conduct heat to the fin-type heat sink 8 and ensure its reliability in operation;

[0075] On the other hand, for a device board that does not generate too much heat, such as the first PCB board 2, a separation-and-post-installation method is adopted, and the first heat dissipation adhesive 204 for sealing and enhancing heat dissipation is optionally directly filled, so that the space between the heat sink 8 and the device board is filled with the first heat dissipation adhesive 204, and the front area of ​​the device board is optionally covered with a certain amount of the first heat dissipation adhesive 204. In the case of the device board being covered with a certain amount of the first heat dissipation adhesive 204 for optimal enhanced heat dissipation, the entire device board will have a better heat conduction effect with the fin-type heat sink 8 through the first heat dissipation adhesive 204.

[0076] Further, in the case where the first PCB board needs to strengthen the heat dissipation, and the first enclosure baffle and heat dissipation glue are added, and the heat dissipation glue needs to cover the entire surface area of ​​the first PCB board 2: the connection terminals on the first PCB board 2 can be changed to directly cover the heat dissipation glue after welding connection (or external docking connection), if the connection terminals are docked or bolted, the sealing heat dissipation glue cannot cover its plug-in (bolt connection) position to prevent poor contact. In this way, when the production limit of the filling glue amount is M g, the filling amount range is controlled to M±ng, so as to balance the good heat dissipation effect of the first PCB board 2 while ensuring that the filling glue does not overflow the connection terminals (Note: when n exceeds the lower deviation, the filling amount is insufficient, which is easy to cause poor heat dissipation effect and affect the service life of the PCB; when n exceeds the upper deviation, the filling amount is too much, which is easy to cause the heat dissipation glue to overflow the docking or bolted connection type connection terminals, causing poor contact and other problems, affecting the reliability of the PCB). Therefore, for the whole surface area of ​​the first PCB board 2 covered in the formal way, it will be easier to control the tolerance variation of the filling amount accuracy. Therefore, it will be more convenient to control the production process and ensure the consistency and reliability of production.

[0077] For the device boards (such as the third PCB board 6) with very low heat generation in the electric control box 1, they are partitioned into low-temperature areas. After the electric control box 1 is sealed, an external fin-type heat sink 8 is generally not required, and glue sealing is no longer required. Instead, the heat dissipation requirements of the components on the device board can be met only by the convection heat transfer (heat conduction by sheet metal) of the device board itself at the partitioned position in the electric control box.

[0078] Through the above measures, it is ensured that the device boards arranged in each area are safe and reliable under different operating conditions of the air-conditioning (heat pump) unit.

[0079] After partitioning, the connection group wires passing through their respective wire holes will be sealed, and the device board with the greatest risk will be placed innermost, further improving safety.

[0080] Further partitioning can be into two zones, three zones or more zones, and the partitioning middle partition 5 can also be one, two or more. At the same time, there can be one or more first wire plug sleeve holes 4 on the middle partition 5, and the position of the wire plug sleeve hole 4 is not limited to any position of the middle partition 5.

[0081] To ensure the reliability of the electric control, the components that are most sensitive to heat (the components arranged in a device board are affected by the high heat generation of other components, which makes the sensitive components easily in a state of high temperature and exceeding the allowable operating environment temperature) can be controlled by arranging temperature sensing devices (external or built-in PCB) in the device boards (such as the first PCB board 2, the second PCB board 3, etc.) that require the external fin-type heat sink 8 for heat dissipation. When the temperature exceeds a certain threshold, T 感 ≥T 阈 If the duration is ts, the frequency reduction or even shutdown instructions are executed. This further ensures the high reliability of the electronic control of air conditioners (heat pumps). (The control method here is just one of the representatives).

[0082] Furthermore, the docking terminals of all the electric control components in the air conditioner (heat pump) can be placed in a sealed electric control box 1 or sealed separately to prevent the risk of refrigerant leaking to the docking terminals (because some docking terminals may ignite).

[0083] The heat sink 8 in the embodiment may be a heat sink shared by several PCBs, or may be a heat sink used individually by each PCB.

[0084] The fins of the heat sink 8 in the embodiment may be oriented along the length direction of the electric control box or along the width direction of the electric control box.

[0085] The separated first PCB board 2 of the electric control board is not limited to the upright mounting method, but can also be flipped, so that the heat generating components of the first PCB board 2 are as close as possible to the lower heat sink 8.

[0086] The electric control box 1 can be made into a long strip shape, or can be made into a special shape, a multi-section shape, etc. according to the allowable space of the actual air conditioner.

[0087] The positions of the multiple zones divided by the middle partition 5 can be exchanged according to the actual installation or design requirements. It is not limited to the position where the external line first enters the electric control box 1, which must be the area with the lowest heat generation (or the highest safety factor) of the PCB.

[0088] Temperature-control type temperature sensing components are generally arranged near the components that are most likely to reach their allowable limit temperature when the unit is operating under harsh conditions (such as high temperature, high pressure operation, high frequency operation). Or they can be arranged in other locations through related correlations to accurately identify the components that are most likely to exceed the standard operation, and set the operation below the limit temperature value. The temperature-control type temperature sensing components are not limited to one, but can also be two or more.

[0089] In an optional embodiment, an electric control box top cover 101 is provided on the top of the electric control box 1 .

[0090] It should be noted that the electric control box top cover 101 and the electric control box 1 need to be sealed, and the sealing is not limited to the use of sealing strips.

[0091] In an optional embodiment, the first (type) component 201 and the second (type) component 202 are fixedly mounted on the circuit board of the first PCB board 2, the first heat dissipation adhesive 204 is located on the end surface of the radiator substrate 801, and the heat dissipation adhesive poured on the first PCB board 2 is blocked by the first protective baffle 203, and fills over the surface of the first PCB board 2, but should not overflow the corresponding docking or spiral fixed terminals.

[0092] It should be noted that the first (type) component 201 dissipates heat through the attached radiator 8, and the second (type) component 202 does not need to be attached to the radiator, and can be cooled by air cooling. The first (type) component 201 represents the components with higher heat generation on the first PCB board 2, so the radiator directly attached to the bottom is used for direct heat dissipation. The second (type) component 202 represents the components with lower heat generation on the first PCB board 2, so the components are directly installed facing the air above and dissipate heat through the air. For the closed electric control box, the second (type) component 202 can optionally conduct heat through front glue filling.

[0093] In an optional embodiment, the second enclosure baffle 303 is fixedly connected to the base of the radiator substrate 801, and reserves a larger area than the second PCB board 3, and is sealed with the radiator base. The second enclosure baffle 303 is fixedly connected to the outer wall of the second heat dissipation adhesive 304, and the middle partition 5 is used to separate the first PCB board 2, the second PCB board 3 and the third PCB board 6 from the electrical control box 1; the second heat dissipation adhesive 304 is wrapped around the outer wall of the third (type) component 301 and is placed in the enclosure baffle 303 for injecting heat dissipation adhesive on the second PCB board 3).

[0094] It should be noted that the height of the second enclosure baffle 303 is adjusted according to actual needs to facilitate glue filling and heat dissipation. The first enclosure baffle 203 is made of plastic parts that do not "poison" the heat dissipation glue or other materials used to define the space; the second enclosure baffle 303 is made of plastic parts that do not "poison" the heat dissipation glue or other materials used to define the space, and the middle partition 5 is made of sheet metal or plastic and other materials. The middle partition 5 adopts a multi-section partition and sealed layout combined with a partial device board separation layout. This method can more safely eliminate the possibility of contact between electronic control devices and refrigerant, and realize multi-layer protection. At the same time, the partition layout is combined with the reliability and economy of electronic control heating, which has the advantage of more flexibility.

[0095] In an optional embodiment, a third (type) component 301 is fixedly mounted on the circuit board of the second PCB board 3 , and the second heat dissipation adhesive 304 is wrapped around the outer side wall of the third (type) component 301 .

[0096] It should be noted that the third (type) component 301 is of a type that generates a large amount of heat and needs to be added with a second heat dissipation adhesive 304 to enable effective heat transfer between it and the heat sink 8 , such as an inductor.

[0097] In an optional embodiment, one or more first wire-passing rubber plug holes 4 are provided in the middle portion of the middle partition plate 5, and the first wire-passing rubber plug holes 4 are used for arranging and installing the wires passing through the middle partition plate 5; one end of the electric control box 1 is provided with a second wire-passing rubber plug hole 7 close to the third PCB board 6, and the second wire-passing rubber plug hole 7 includes a third wire-passing rubber plug hole 701 and a fourth wire-passing rubber plug hole 702, and the third wire-passing rubber plug hole 701 and the fourth wire-passing rubber plug hole 702 are both provided at one end of the electric control box 1 or at different positions.

[0098] It should be noted that one or more wire holes and one or more wire plug holes 4 are provided on the partition plate used to separate each area. The number of wire holes and first wire plug holes 4 is limited according to demand. The total wire outlet hole of the electric control box 1 is also provided with a second wire plug hole 7. The positions of the wire holes and the wire hole plugs are not limited to the upper, lower, front, rear and other positions of the electric control box 1, and are determined based on the actual wiring.

[0099] After the connecting wire body of the PCB board of the electric control box 1 passes through the first wire plug sleeve hole 4 or the second wire plug sleeve hole 7, the plug will be sealed (such as by tying with a cable tie). Of course, the form of the wire hole plug is not limited to the embodiment. The purpose is to seal the wire body after passing through to prevent airflow from passing through.

[0100] In an optional embodiment, the radiator substrate 801 is fixedly connected to the bottom of the electric control box 1, and the first heat dissipation adhesive 204 and the second heat dissipation adhesive 304 are attached to the radiator substrate 801.

[0101] It should be noted that the radiator 8 may be a fin type radiator cooled by air, or may be a radiator cooled by other coolants.

[0102] In an optional embodiment, the third PCB board 6 has fixedly mounted thereon a fourth (type) component 601 having a smaller heat generation than the second (type) component 202 and a fifth (type) component 602 having substantially zero heat generation.

[0103] Example 2

[0104] For easier understanding, see Figures 5 to 7 , this embodiment adopts the device separation method: device boards with large differences in heat generation are separated (such as: inductor and driver board), and the heat sink is divided into two or more pieces to correspond to different device boards);

[0105] This embodiment includes a segmented heat sink structure: a first segmented heat sink substrate 801, a first segmented heat sink fin 802 and a second segmented heat sink substrate 803, a second segmented heat sink fin 804 for real-time temperature reduction processing.

[0106] The middle partition 5 adopts a multi-section partition and sealed layout combined with a separation layout of some device boards. This method can more safely prevent the possibility of contact between electronic control devices and (flammable) refrigerants, and realize multi-layer protection. At the same time, the partition layout is combined with the satisfaction of electronic control heating reliability (based on the heat generation and the temperature or function that the components can withstand as a distinction, so that different specifications of device boards are arranged in each area, so that reliability can be further improved) and economic considerations, and has the advantage of being more flexible.

[0107] For some components on some device boards, the temperature is high, while the operating temperature of some components is not high. The components with high heat generation (such as inductors, etc.) are separated, such as the second PCB board 3:

[0108] On the one hand, for components with high heat generation, the components (boards) with high heat generation, such as the second PCB board 3, are flipped upside down and face the fin-type heat sink 8 by separating, reassembling and then flipping them upside down. For those that cannot be directly attached, the second heat dissipation glue 304 for sealing and strengthening heat dissipation is filled between the components (boards), such as the second PCB board 3 and the fin-type heat sink 8, so as to quickly and effectively conduct heat to the fin-type heat sink 8 and ensure its reliability in operation;

[0109] On the other hand, for a device board that does not generate much heat, such as the first PCB board 2, a separation-and-post-installation method is adopted, and a first heat dissipation adhesive 204 for sealing and strengthening heat dissipation is optionally directly filled, so that the first heat dissipation adhesive 204 is filled between the heat sink 8 and the device board, and a certain amount of the first heat dissipation adhesive 204 is optionally covered on the front area of ​​the device board, so that the entire device board will have a good heat conduction effect with the fin-type heat sink 8 through the first heat dissipation adhesive 204.

[0110] Example 3

[0111] For easier understanding, see Figures 8 to 10 , this embodiment does not separate the components (boards) with large differences in heat generation, but instead adopts a method of enhancing heat dissipation for the components with high local heat generation (e.g., filling the inductor area with heat dissipation glue to make it contact with the heat sink);

[0112] For components with high heat generation, the separation method can be omitted. The PCB board is still installed in a normal manner. The lower part of the PCB is a fin-type heat sink. The third (type) component 301 with high heat generation in the PCB (such as an inductor, etc.) is directly partially filled with glue (the filling area of ​​the third (type) component 301 with high heat generation in the PCB is defined by the enclosure structure), and the filling area can be connected to the fin-type heat sink at the bottom with a large area, and finally the heat generated by the third (type) component 301 with high heat generation in the PCB is taken away through the fin-type heat sink at the bottom. This ensures the overall heat dissipation effect of the PCB.

[0113] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation structure of an air conditioner electric control box, characterized in that: include An electric control box (1), wherein the electric control box is divided into multiple sealed space partitions, and different sealed space partitions are correspondingly installed with device boards with different heat generation, and device boards with high heat generation are concentrated in one or more separate sealed space partitions with enhanced heat exchange function, and the different sealed space partitions include a multi-layer structure, the bottom layer structure is used to arrange the device boards, and the bottom layer, side or upper layer structure can be used to arrange line sealing pipes; A partition assembly, the partition assembly comprising a first enclosure baffle (203), a second enclosure baffle (303) and a middle partition (5), the partition assembly being arranged inside the electric control box (1); The device board comprises a first PCB board (2), a second PCB board (3) and a third PCB board (6), and part or all of the first PCB board (2), the second PCB board (3) and the third PCB board (6) are provided with a temperature sensing device; the first PCB board (2), the first PCB board (2) is arranged in one of the enclosed space partitions in a positive manner, and the surface of the first PCB board (2) is provided with a first heat dissipation adhesive (204); the second PCB board (3), the second PCB board (3) is arranged in one of the enclosed space partitions in a reverse manner, a PCB board fixing bracket (302) is fixedly installed at the bottom of the second PCB board (3), and a second heat dissipation adhesive (304) is arranged below the second PCB board (3) and in the side wall of the second enclosure baffle (303); the third PCB board (6), the third PCB board (6) is arranged in another enclosed space partition; A heat sink (8), the heat sink (8) comprising a heat sink substrate (801), heat sink fins (802) or a first segmented heat sink substrate (801), a first segmented heat sink fins (802) and a second segmented heat sink substrate (803), a second segmented heat sink fins (804); the heat sink (8) is arranged on one side of the bottom of the electric control box (1) and is used for heat conduction and temperature reduction treatment of the first PCB board (2) and the second PCB board (3).

2. The heat dissipation structure of the air conditioner electric control box according to claim 1, characterized in that: The top of the electric control box (1) is provided with an electric control box top cover (101), and a sealing treatment is adopted between the electric control box top cover (101) and the electric control box body in a manner not limited to adding a sealing strip.

3. The heat dissipation structure of the air conditioner electric control box according to claim 1, characterized in that: A heat sink (8) is arranged at the lower part of the first PCB board (2); a first enclosure baffle (203) is arranged around the first PCB board (2); the first enclosure baffle (203) is fixedly connected to the surrounding base of the heat sink substrate (801), reserves a larger area than the first PCB board (2), and is sealed with the heat sink base; a first component (201) with high heat generation and requiring direct contact with the heat sink substrate (801) and a second component (202) with average heat generation and capable of heat dissipation through air ducts or natural cooling are fixedly mounted on the circuit board of the first PCB board (2); The first heat dissipation adhesive (204) is located on the end surface of the heat sink substrate (801), and the heat dissipation adhesive poured onto the first PCB board (2) is blocked by the first enclosure baffle (203) and fills and overflows the surface of the first PCB board (2), but does not overflow the corresponding docking or screw-fixed wiring terminals; The first heat dissipation adhesive (204) is located on the end surface of the heat sink substrate (801), and the heat dissipation adhesive poured onto the first PCB board (2) is blocked by the first enclosure baffle (203) but does not fill over the surface of the first PCB board (2).

4. The heat dissipation structure of the air conditioner electric control box according to claim 1, characterized in that: The second enclosure baffle (303) is fixedly connected to the surrounding base of the radiator substrate (801) and reserves a larger area than the second PCB board (3), and is sealed with the radiator base. The second enclosure baffle (303) is fixedly connected to the outer wall of the second heat dissipation glue (304), and the middle partition (5) is used to separate the first PCB board (2), the second PCB board (3) and the third PCB board (6) from the electric control box (1).

5. The heat dissipation structure of the air conditioner electric control box according to claim 1, characterized in that: The second heat dissipation adhesive (304) is wrapped around the outer wall of the third component (301) and is placed inside a second enclosure baffle (303) for injecting heat dissipation adhesive into the second PCB board (3).

6. The heat dissipation structure of the air conditioner electric control box according to claim 4, characterized in that: One or more first wire-passing rubber plug sleeve holes (4) are provided in the middle of the middle partition (5), and the first wire-passing rubber plug sleeve holes (4) are used to install wire bodies passing through the middle partition (5).

7. The heat dissipation structure of the air conditioner electric control box according to claim 1, characterized in that: One end of the electric control box (1) is provided with a second wire-passing rubber plug sleeve hole (7) close to the third PCB board (6), and the second wire-passing rubber plug sleeve hole (7) includes a third wire-passing rubber plug sleeve hole (701) and a fourth wire-passing rubber plug sleeve hole (702), and the third wire-passing rubber plug sleeve hole (701) and the fourth wire-passing rubber plug sleeve hole (702) are both arranged at one end of the electric control box (1) or at different positions.

8. The heat dissipation structure of an air conditioner electric control box according to claim 1, characterized in that: The radiator substrate (801) is fixedly connected to the bottom of the electric control box (1); the first heat dissipation adhesive (204) and the second heat dissipation adhesive (304) are in contact with the radiator substrate (801); the radiator (8) may be an integral structure or two or more separate structures, which correspond as a whole or separately to the heat dissipation of the aforementioned PCB board; the fins of the integral radiator are arranged at the bottom of the radiator substrate (801); or the segmented radiator, the first segmented radiator fins (802) and the second segmented radiator fins (804) are respectively arranged at the bottom of the first segmented radiator substrate (801) and the second segmented radiator substrate (803).

9. The heat dissipation structure of the air conditioner electric control box according to claim 8, characterized in that: The structure of the radiator (8) is an air-cooled fin-type structure, or a liquid or gas-liquid two-phase coolant cooling structure.

10. The heat dissipation structure of an air conditioner electric control box according to claim 1, characterized in that: A fourth component (601) having a smaller heat generation than the second component (202) and a fifth component (602) having a substantially zero heat generation are fixedly mounted on the circuit board of the third PCB board (6).

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