Novel vapor chamber

Abstract

The utility model discloses a novel uniform temperature plate, which comprises a first cover plate and a second cover plate, the second cover plate and the first cover plate are oppositely covered and combined to form an airtight space, a liquid injection port is arranged on the first cover plate or the second cover plate and communicated with the airtight space, and one side of the first cover plate in the airtight space is provided with criss-cross V-shaped grooves. The face, in the airtight space, of the first cover plate is divided into a plurality of parallelogram blocks identical in shape and size through the crisscrossed V-shaped grooves. The bionic vein capillary groove structure is arranged in the airtight space and formed on the surface layers of the V-shaped grooves and the parallelogram blocks; the temperature equalizing plate can be attached to an electronic device to cool the electronic device, the maximum heat exchange and the minimum flow resistance serve as targets, the V-shaped grooves serve as the main flow channels, the bionic vein capillary grooves of different shapes and structures serve as the secondary flow channels, a working medium can more rapidly and fully participate in phase change circulation heat transfer, and the heat transfer performance of the temperature equalizing plate is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a novel temperature balancing plate. Background Art

[0002] In recent years, electronic devices have been increasingly miniaturized, high-performance, and integrated. The high heat generation of electronic devices increases their temperature, resulting in a decrease in performance. Studies have shown that when the operating temperature of electronic devices is at high temperature for a long time, their reliability will be significantly reduced by 50%. Effectively solving the heat dissipation problem of electronic devices has become one of the keys to the development of current electronic technology. As a good thermal conductive device, the heat spreader can make the heat flux generated by the heat source of electronic devices tend to be uniform. Its thermal conductivity can be as high as hundreds of times that of pure copper. It transfers heat by changing the vapor and liquid phases of the circulating medium in a fully enclosed vacuum chamber. It is often used in small electronic products with fast heat dissipation, as well as other application scenarios with high heat dissipation requirements. However, due to the capillary force of the existing heat spreader capillary structure and the slow reflux speed of the working medium after condensation, the heat dissipation effect of the heat spreader is affected, which leads to product failure and cannot meet the user's heat dissipation needs. Utility Model Content

[0003] In order to solve the above problems, the utility model provides a new type of temperature equalizing plate, including:

[0004] first cover plate;

[0005] A second cover plate, the second cover plate and the first cover plate are relatively covered and jointly form an airtight space, a side of the second cover plate in the airtight space is provided with crisscrossing V-shaped grooves, and the crisscrossing V-shaped grooves divide the side of the second cover plate in the airtight space into a plurality of parallelogram blocks of exactly the same shape and size;

[0006] The bionic leaf vein capillary groove structure is arranged in the airtight space and formed on the surface of the V-shaped groove and parallelogram block;

[0007] A liquid injection port, provided on the first cover plate or the second cover plate and communicated with the airtight space;

[0008] The working medium is filled into the airtight space through the liquid injection port.

[0009] Furthermore, the bionic leaf vein capillary groove structure is a sintered body formed by sintering copper powder.

[0010] Furthermore, the copper powder has a particle size of 10 to 90 μm.

[0011] Furthermore, the bionic leaf vein capillary groove structure takes the center point of the second cover plate as the starting point and radially extends to the surrounding areas to form a plurality of capillary grooves, and the end of each capillary groove is divided into three and the width is reduced.

[0012] Furthermore, the bionic leaf vein capillary groove structure takes the center point of the second cover plate as the starting point and presents a spider web structure.

[0013] Furthermore, it also includes a graphite composite film, which is arranged in the airtight space and formed on the surface of the bionic leaf vein capillary groove structure.

[0014] Furthermore, the graphite composite film includes a first copper-aluminum alloy heat sink, a graphene powder layer, a second copper-aluminum alloy heat sink, a first graphite sheet layer, a copper foil layer, and a second graphite sheet layer stacked in sequence from bottom to top. The first copper-aluminum alloy heat sink and the second copper-aluminum alloy heat sink are bonded to each other at their edges by a thermally conductive adhesive layer, and both the first graphite sheet layer and the second graphite sheet layer are provided with mesh holes.

[0015] Furthermore, the V-groove has a depth of 0.1 to 10 mm.

[0016] Furthermore, the working medium is any one of methanol, ethanol, acetone and pure water.

[0017] Furthermore, the working medium filling height is 5 to 20% of the depth of the airtight space.

[0018] The beneficial effect is that the present application can be attached to electronic devices to cool the electronic devices, with the goal of maximum heat exchange and minimum flow resistance, using V-shaped grooves as the main flow channel and bionic leaf vein capillary groove structures of different shapes and structures as secondary flow channels, so that the working medium can more quickly and fully participate in the phase change cycle heat transfer, further improving the heat transfer performance of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1 This is a schematic structural diagram of a side of the first cover plate of the utility model facing away from the airtight space;

[0021] Figure 2 This is a schematic structural diagram of one side of the second cover plate of the utility model facing the airtight space;

[0022] Figure 3 It is a schematic diagram of the enlarged structure of the V-shaped groove and the parallelogram block of the utility model;

[0023] Figure 4 It is a schematic diagram of the enlarged structure of the bionic leaf vein capillary grooves of different shapes in the utility model;

[0024] In the figure:

[0025] 1. first cover plate; 11. thermal contact surface;

[0026] 2. Second cover plate; 21. V-shaped groove; 22. Parallelogram block; 23. Bionic leaf vein capillary groove structure;

[0027] 3. Liquid injection port. DETAILED DESCRIPTION

[0028] The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0029] It should be noted that all directional indications such as up, down, left, right, front, back... in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0030] In addition, in the present utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present utility model. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0031] Example 1

[0032] See also Figures 1 to 3 , Figure 1 This is a schematic structural diagram of the first cover plate of the utility model facing away from the airtight space. Figure 2 This is a schematic diagram of the structure of the second cover plate of the utility model facing the airtight space. Figure 3The schematic diagram of the enlarged structure of the V-shaped groove and the parallelogram block of the utility model. This embodiment provides a new type of temperature equalizing plate, including a first cover plate 1 and a second cover plate 2. The second cover plate 2 and the first cover plate 1 are relatively covered and jointly form an airtight space. The liquid injection port 3 is arranged on the first cover plate 1 or the second cover plate 2 and is connected to the airtight space. The working medium is filled in the airtight space through the liquid injection port 3. The working medium is any one of methanol, ethanol, acetone, and pure water. The working medium filling height is 5-20% of the depth of the airtight space. The first cover plate 1 is provided with a thermal contact surface 11 on the side facing away from the airtight space. The thermal contact surface 11 is used to place heat sources such as chips. Experiments have shown that when the working medium filling height is 5-20% of the depth of the airtight space, the heat dissipation performance of the temperature equalizing plate is optimal. As the working medium filling height increases, the heat transfer coefficient of the working medium condensation surface will first increase and then decrease, thereby limiting the overall heat transfer performance in a limited space.

[0033] A graphite composite film is arranged on one side of the first cover plate 1 facing the airtight space, and the graphite composite film includes a first copper-aluminum alloy heat sink, a graphene powder layer, a second copper-aluminum alloy heat sink, a first graphite sheet, a copper foil layer, and a second graphite sheet stacked from bottom to top. The first copper-aluminum alloy heat sink is bonded to the second copper-aluminum alloy heat sink at its edge by a heat-conducting adhesive layer. The first graphite sheet and the second graphite sheet are both provided with mesh holes for easy ventilation, which effectively increases the heat diffusion area and can directly form a better heat dissipation effect for the heat source. Contacting the heat source with the graphite composite film can increase the heat transfer rate of the temperature equalizing plate, shorten the heat retention time, and improve the heat dissipation efficiency.

[0034] A criss-crossed V-groove 21 is provided on one side of the second cover plate 2 in the airtight space, and the depth of the V-groove 21 is 0.1 to 10 mm. The criss-crossed V-groove 21 divides one side of the second cover plate 2 in the airtight space into a plurality of parallelogram blocks 22 of exactly the same shape and size; a bionic leaf vein capillary groove structure 23 is arranged in the airtight space and formed on the surface of the V-groove 21 and the parallelogram block 22; the bionic leaf vein capillary groove structure 23 is a sintered body formed by sintering copper powder with a particle size of 10 to 90 μm. If the copper powder particle size is too small, the coolant flow resistance will be too large, and if the copper powder particle size is too large, the capillary force will be too small. Therefore, the copper powder particle size needs to be within an appropriate range to ensure the optimal thermal resistance performance of the temperature equalizing plate. When the vaporized working medium enters the bionic leaf vein capillary groove structure 23, the capillary force causes the gaseous working medium to condense into liquid, and accelerates the flow speed of the working medium in the bionic leaf vein capillary groove, reduces the flow resistance, and thus accelerates the cooling speed of the gaseous working medium, thereby improving the heat dissipation performance.

[0035] See also Figure 4 , Figure 4 This is a schematic diagram of the enlarged structure of the bionic leaf vein capillary grooves of different shapes in the utility model. Figure 4The bionic leaf vein capillary groove structure 23 on the left side takes the center point of the second cover plate 2 as the starting point and presents a spider web structure. Figure 4 The bionic leaf vein capillary groove structure 23 on the right side starts from the center point of the second cover plate 2 and radially extends to form multiple capillary grooves. The end of each capillary groove is divided into three and the width is reduced. The number of splitting levels is 5 to 8. The bionic leaf vein capillary groove structure 23 of these two shapes and structures is conducive to improving space utilization, ensuring that the capillary force of the temperature equalizing plate as a whole reaches the maximum value, the condensation effect of the gaseous working medium reaches the best, and the working medium reflux speed is the fastest.

[0036] In summary, the present application can be attached to electronic devices to cool them, and is particularly suitable for chips. A graphite composite film is covered on one side of the first cover plate 1 of the temperature equalizer facing the airtight space. The contact of the graphite composite film with the heat source can improve the heat transfer rate of the temperature equalizer. A criss-crossing V-shaped groove 21 and a parallelogram block 23 are provided on one side of the second cover plate 2 facing the airtight space to guide the flow of the working medium in the airtight space of the temperature equalizer, so that the heat obtained by the temperature equalizer from the heat source can be more evenly transferred. The heat is delivered to various places of the second cover plate 2 of the temperature equalizer to improve the heat dissipation effect of the temperature equalizer. Finally, a bionic leaf vein capillary groove structure 23 is set on the surface of the criss-crossed V-shaped grooves 21 and the parallelogram block 22. When the working medium enters the bionic leaf vein capillary groove structure 23, due to the existence of capillary force, the gaseous working medium condenses into liquid, and the flow speed of the working medium in the bionic leaf vein capillary groove structure 23 is accelerated, the flow resistance is reduced, the cooling speed of the gaseous working medium is accelerated, and the heat dissipation performance of the temperature equalizer is further improved. With the maximum heat exchange and the lowest flow resistance as the goal, the V-shaped groove is used as the main flow channel, and the bionic leaf vein capillary grooves of different shapes and structures are used as the secondary flow channel, so that the working medium can participate in the phase change cycle heat transfer more quickly and fully, thereby improving the heat transfer performance of the temperature equalizer.

[0037] The above is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims

1. A new type of temperature equalizing plate, characterized in that: include: A first cover plate (1); A second cover plate (2), the second cover plate (2) and the first cover plate (1) are relatively covered and together form an airtight space, a side of the second cover plate (2) in the airtight space is provided with crisscrossing V-shaped grooves (21), and the crisscrossing V-shaped grooves (21) divide the side of the second cover plate (2) in the airtight space into a plurality of parallelogram blocks (22) of completely identical shape and size; A bionic leaf vein capillary groove structure (23) is arranged in the airtight space and formed on the surface of the V-shaped groove (21) and the parallelogram block (22); A liquid injection port (3) is provided on the first cover plate (1) or the second cover plate (2) and is communicated with the airtight space; The working medium is filled into the airtight space through the liquid injection port (3).

2. The novel temperature equalizing plate according to claim 1 is characterized in that: The bionic leaf vein capillary groove structure (23) is a sintered body formed by sintering copper powder.

3. The novel temperature equalizing plate according to claim 2 is characterized in that: The copper powder has a particle size of 10 to 90 μm.

4. The novel temperature equalizing plate according to claim 1 is characterized in that: The bionic leaf vein capillary groove structure (23) takes the center point of the second cover plate (2) as the starting point and radially extends to the surrounding areas to form a plurality of capillary grooves, and the end of each capillary groove is divided into three and the width is reduced.

5. The novel temperature equalizing plate according to claim 1 is characterized in that: The bionic leaf vein capillary groove structure (23) takes the center point of the second cover plate (2) as a starting point and presents a spider web structure.

6. The novel temperature equalizing plate according to claim 1 is characterized in that: It also comprises a graphite composite film, which is arranged in the airtight space and formed on one side of the first cover plate (1) in the airtight space.

7. The novel temperature equalizing plate according to claim 6, characterized in that: The graphite composite film includes a first copper-aluminum alloy heat sink, a graphene powder layer, a second copper-aluminum alloy heat sink, a first graphite sheet layer, a copper foil layer, and a second graphite sheet layer stacked in sequence from bottom to top. The first copper-aluminum alloy heat sink and the second copper-aluminum alloy heat sink are bonded to each other at their edges through a thermally conductive adhesive layer, and both the first graphite sheet layer and the second graphite sheet layer are provided with mesh holes.

8. The novel temperature equalizing plate according to claim 1 is characterized in that: The V-shaped groove (21) has a depth of 0.1 to 10 mm.

9. The novel temperature equalizing plate according to claim 1, characterized in that: The working medium is any one of methanol, ethanol, acetone and pure water.

10. The novel temperature equalizing plate according to claim 1, characterized in that: The working medium filling height is 5-20% of the depth of the airtight space.

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