Diode welding buffer mechanism
By designing the diode welding buffer mechanism, the buffering effect is achieved using telescopic springs and buffer blocks, and the PCB circuit board is clamped through the positioning plate and the feed assembly, the damage caused by rigid contact during diode welding is solved and the welding quality is improved.
Patent Information
- Application Number
- CN202421261089.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-06-04
AI Technical Summary
During the diode welding process, due to the rigid contact between the diode, PCB circuit board and the solder pen, the diode and PCB circuit board are easily damaged, affecting the soldering quality.
A diode welding buffer mechanism is designed, including a buffer structure and a fixed structure. The buffer structure connects the buffer block in the buffer member through the telescopic spring on the guide rod, and uses a trapezoidal block to squeeze the buffer block to achieve the buffering effect; the fixed structure firmly clamps the PCB circuit board through the positioning plate and the feed assembly.
It effectively avoids damage caused by rigid contact during diode welding, improves welding quality, and facilitates control of positioning board movement, ensuring stable clamping of PCB circuit board.
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of diode welding, in particular to a diode welding buffer mechanism. Background Art
[0002] A diode is an electronic device made of semiconductor materials. A diode has two electrodes, the positive electrode is called the anode and the negative electrode is called the cathode. When a forward voltage is applied between the two electrodes of the diode, the diode is turned on. When a reverse voltage is applied, the diode is cut off. The conduction and cutoff of the diode are equivalent to the on and off of a switch. The diode has unidirectional conductivity. When it is turned on, the current flows from the anode through the tube to the cathode. The diode is one of the earliest semiconductor devices and is widely used, especially in various electronic circuits. Diodes are reasonably connected with components such as resistors, capacitors, and inductors to form circuits with different functions, which can realize various functions such as rectification of alternating current, detection of modulated signals, limiting, and stabilization of power supply voltage.
[0003] In the current prior art, diode welding is usually carried out on a welding tool. The PCB circuit board needs to be fixed on a welding table, and then a worker holds a soldering pen to melt the metal between the metal electrode and the PCB circuit board to form a welding joint, and presses one end of the diode's soldering foot to the welding joint to complete the welding of the diode. Since the diode, the PCB circuit board and the soldering pen are all in rigid contact, it is easy to cause damage to the diode and the PCB circuit board, thereby affecting the welding quality of the diode and the PCB circuit board. Therefore, a diode welding buffer mechanism is proposed to solve the above problem. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a diode welding buffer mechanism, which has the advantages of buffering and fixing the PCB circuit board, and solves the problem that a worker holds a soldering pen to melt the metal between the metal electrode and the PCB circuit board to form a welding joint, and presses one end of the diode's soldering foot to the welding joint to complete the welding of the diode. Since the diode, PCB circuit board and soldering pen are in rigid contact, the diode and the PCB circuit board are easily damaged, thereby affecting the welding quality of the diode and the PCB circuit board.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a diode welding buffer mechanism, comprising a welding tool, the welding tool is provided with a welding table and a welding pen, the welding table is provided with a buffer structure and a fixing structure;
[0006] The buffer structure includes an installation frame fixedly installed on the top of the welding table, a support frame for supporting a PCB circuit board is slidably installed inside the installation frame, a guide rod is fixedly installed inside the installation frame, a buffer is slidably installed on the guide rod, a telescopic spring for buffering is sleeved on the outer surface of the guide rod, and a trapezoidal block for extrusion and transmission of force is fixedly installed on the inner top wall of the support frame.
[0007] Furthermore, the fixed structure includes a limit assembly for limiting the up and down movement trajectory of the support frame, two positioning plates for clamping the PCB circuit board are slidably mounted on the support frame, and a feed assembly for controlling the left and right movement of the two positioning plates is provided on the support frame.
[0008] Furthermore, the welding table is fixedly installed on the top of the welding tool, a bracket for hanging a welding pen is fixedly installed on the top of the welding tool, a control cabinet is fixedly installed on the right side of the welding tool, and the welding pen is hung on the bracket.
[0009] Furthermore, the installation frame includes a rectangular frame and two vertical plates, the two vertical plates are fixedly installed on the inner bottom wall of the rectangular frame, the guide rod is fixedly installed between opposite sides of the two vertical plates, and the rectangular frame is fixedly installed on the welding table.
[0010] Furthermore, the buffer component includes two buffer blocks, both of which are slidably mounted on the outer surface of the guide rod, and the opposite sides of the two buffer blocks are fixedly connected to the left and right sides of the telescopic spring respectively, and the inclined surfaces of the two buffer blocks are in contact with the inclined surfaces of the trapezoidal block respectively.
[0011] Furthermore, the limiting assembly includes a limiting strip and a limiting groove, the limiting groove is opened on the rear side wall of the inner cavity of the installation frame, the limiting strip is fixedly installed on the back of the support frame, and the inner wall of the limiting groove is slidably connected to the outer surface of the limiting strip.
[0012] Furthermore, the feeding assembly includes two electric push rods, which are respectively fixedly installed on the left and right sides of the support frame and both penetrate into the interior of the support frame, and the telescopic ends of the two electric push rods are respectively fixedly connected to the two positioning plates.
[0013] Furthermore, four through slots are provided on the top of the support frame, and the two positioning plates are both concave in shape when viewed from the left, and the inner walls of the two through slots on the same side are respectively slidably connected to the positioning plates on the same side.
[0014] Compared with the prior art, the technical solution of this application has the following beneficial effects:
[0015] The diode welding buffer mechanism is provided with a buffer structure and a fixing structure, and realizes connecting two buffer blocks in the buffer member by using a telescopic spring on a guide rod, so that after a force is applied to the support frame, the two buffer blocks are squeezed by the trapezoidal block, and a buffering effect is achieved by using the connected telescopic spring, so that damage to the diode, the PCB circuit board and the soldering pen due to direct rigid contact during the diode welding process is avoided, and it is convenient to control the movement of the positioning plate by using a feed assembly, so that the PCB circuit board is firmly clamped on the top of the support frame by using the two positioning plates, so that the diode welding is convenient, and the practicality of the diode welding buffer mechanism is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the structure of the utility model Figure 1 A in the enlarged view;
[0018] Figure 3 It is a three-dimensional schematic diagram of the installation frame and the support frame of the structural schematic diagram of the utility model.
[0019] In the figure: 1. welding tool; 2. welding table; 3. welding pen; 41. mounting frame; 42. support frame; 43. guide rod; 44. buffer; 45. telescopic spring; 46. trapezoidal block; 47. limit assembly; 48. positioning plate; 49. feed assembly; 5. bracket; 6. control cabinet. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] See also Figure 1-3 A diode welding buffer mechanism in this embodiment includes a welding tool 1, on which a welding table 2 and a welding pen 3 are provided, and a buffer structure and a fixing structure are provided on the welding table 2. The welding table 2 is fixedly installed on the top of the welding tool 1, and a bracket 5 for hanging the welding pen 3 is fixedly installed on the top of the welding tool 1. A control cabinet 6 is fixedly installed on the right side of the welding tool 1, and the welding pen 3 is suspended on the bracket 5.
[0022] In the present embodiment, the buffer structure includes a mounting frame 41 fixedly mounted on the top of the welding table 2, a support frame 42 for supporting the PCB circuit board is slidably mounted inside the mounting frame 41, a guide rod 43 is fixedly mounted inside the mounting frame 41, the mounting frame 41 includes a rectangular frame and two vertical plates, the two vertical plates are fixedly mounted on the inner bottom wall of the rectangular frame, the guide rod 43 is fixedly mounted between the opposite sides of the two vertical plates, the rectangular frame is fixedly mounted on the welding table 2, and it is convenient to support the fixed installation of the guide rod 43, a buffer member 44 is slidably mounted on the guide rod 43, and a telescopic spring 45 for buffering is sleeved on the outer surface of the guide rod 43 to buffer the rigid force, and a trapezoidal block 46 for extrusion and transmission force is fixedly mounted on the inner top wall of the support frame 42 to facilitate the conduction of the rigid force.
[0023] Among them, the buffer component 44 includes two buffer blocks, both of which are slidably installed on the outer surface of the guide rod 43, and the opposite sides of the two buffer blocks are fixedly connected to the left and right sides of the telescopic spring 45 respectively. The inclined surfaces of the two buffer blocks are respectively in contact with the inclined surfaces of the trapezoidal block 46, so that the trapezoidal block 46 can be used to squeeze the two buffer blocks, thereby pulling the telescopic spring 45 to achieve a buffering effect.
[0024] By adopting the above technical solution, the force of the soldering pen 3 on the PCB circuit board is transmitted to the trapezoidal block 46 through the support frame 42, so that the trapezoidal block 46 is used to move downward the two buffer blocks in the extrusion buffer 44, so that the two buffer blocks move to opposite sides, thereby stretching the telescopic spring 45 on the guide rod 43, thereby achieving the rigid force during the buffer diode welding process.
[0025] In the implementation of this example, the fixed structure includes a limit assembly 47 for limiting the upward and downward movement trajectory of the support frame 42. Two positioning plates 48 for clamping the PCB circuit board are slidably installed on the support frame 42. Four through grooves are opened on the top of the support frame 42. The left view of the two positioning plates 48 is concave in shape. The inner walls of the two through grooves on the same side are respectively slidably connected to the positioning plates 48 on the same side, which is convenient for the sliding of the positioning plates 48 and the clamping of the PCB circuit board. A feeding assembly 49 for controlling the left and right movement of the two positioning plates 48 is provided on the support frame 42. The feeding assembly 49 includes two electric push rods, which are respectively fixedly installed on the left and right sides of the support frame 42 and both penetrate into the interior of the support frame 42. The telescopic ends of the two electric push rods are respectively fixedly connected to the two positioning plates 48, which is convenient for controlling the two positioning plates 48 to move to the opposite side or the opposite side.
[0026] Among them, the limit assembly 47 includes a limit strip and a limit groove. The limit groove is opened on the rear side wall of the inner cavity of the installation frame 41. The limit strip is fixedly installed on the back of the support frame 42. The inner wall of the limit groove is slidably connected to the outer surface of the limit strip, so as to limit the support frame 42 to move up and down only inside the installation frame 41.
[0027] By adopting the above technical solution, the PCB circuit board is placed on the support frame 42, and the two electric push rods in the feed assembly 49 are started, so that the positioning plate 48 is driven to move by the extension and retraction of the electric push rods, thereby controlling the positioning plate 48 to clamp and fix the PCB circuit board.
[0028] The working principle of the above embodiment is:
[0029] When the diode welding buffer mechanism is in use, the PCB circuit board is placed on the support frame 42, and the two electric push rods in the feed assembly 49 are started, so that the positioning plate 48 is driven to move by the extension and retraction of the electric push rods, so as to control the positioning plate 48 to clamp and fix the PCB circuit board. When the diode is welded, the force of the welding pen 3 on the PCB circuit board is transmitted to the trapezoidal block 46 through the support frame 42, so that the trapezoidal block 46 is used to move downward to squeeze the two buffer blocks in the buffer member 44, so that the two buffer blocks move to opposite sides, thereby reaching the extension spring 45 on the guide rod 43, so as to achieve the rigid force of the buffer diode welding process.
[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A diode welding buffer mechanism, comprising a welding tool (1), characterized in that: The welding tool (1) is provided with a welding platform (2) and a welding pen (3), and the welding platform (2) is provided with a buffer structure and a fixing structure; The buffer structure comprises a mounting frame (41) fixedly mounted on the top of the welding table (2); a support frame (42) for supporting a PCB circuit board is slidably mounted inside the mounting frame (41); a guide rod (43) is fixedly mounted inside the mounting frame (41); a buffer member (44) is slidably mounted on the guide rod (43); a telescopic spring (45) for buffering is sleeved on the outer surface of the guide rod (43); and a trapezoidal block (46) for extrusion transmission force is fixedly mounted on the inner top wall of the support frame (42).
2. A diode welding buffer mechanism according to claim 1, characterized in that: The fixed structure comprises a limit assembly (47) for limiting the upward and downward movement trajectory of the support frame (42); two positioning plates (48) for clamping the PCB circuit board are slidably mounted on the support frame (42); and a feeding assembly (49) for controlling the left and right movement of the two positioning plates (48) is arranged on the support frame (42).
3. A diode welding buffer mechanism according to claim 1, characterized in that: The welding table (2) is fixedly mounted on the top of the welding tool (1); a bracket (5) for hanging a welding pen (3) is fixedly mounted on the top of the welding tool (1); a control cabinet (6) is fixedly mounted on the right side of the welding tool (1); and the welding pen (3) is hung on the bracket (5).
4. A diode welding buffer mechanism according to claim 1, characterized in that: The installation frame (41) comprises a rectangular frame and two vertical plates, the two vertical plates are fixedly mounted on the inner bottom wall of the rectangular frame, the guide rod (43) is fixedly mounted between opposite sides of the two vertical plates, and the rectangular frame is fixedly mounted on the welding table (2).
5. The diode welding buffer mechanism according to claim 1, characterized in that: The buffer member (44) includes two buffer blocks, both of which are slidably mounted on the outer surface of the guide rod (43), and opposite sides of the two buffer blocks are fixedly connected to the left and right sides of the telescopic spring (45) respectively, and the inclined surfaces of the two buffer blocks are in contact with the inclined surfaces of the trapezoidal block (46) respectively.
6. A diode welding buffer mechanism according to claim 2, characterized in that: The limiting assembly (47) comprises a limiting strip and a limiting groove, wherein the limiting groove is provided on the rear side wall of the inner cavity of the installation frame (41), the limiting strip is fixedly mounted on the back side of the support frame (42), and the inner wall of the limiting groove is slidably connected to the outer surface of the limiting strip.
7. A diode welding buffer mechanism according to claim 2, characterized in that: The feeding assembly (49) includes two electric push rods, which are respectively fixedly installed on the left and right sides of the support frame (42) and penetrate into the interior of the support frame (42). The telescopic ends of the two electric push rods are respectively fixedly connected to the two positioning plates (48).
8. The diode welding buffer mechanism according to claim 2, characterized in that: The top of the support frame (42) is provided with four through slots. The left side view of the two positioning plates (48) are both concave in shape. The inner walls of the two through slots on the same side are respectively slidably connected to the positioning plates (48) on the same side.