Spot welding mechanism for integrated circuit chip machining

Abstract

The utility model discloses a spot welding mechanism for processing an integrated circuit chip, which comprises a mechanism main body, a cushion block is fixedly arranged on the inner wall of the mechanism main body, a rotating assembly is arranged at the top of the cushion block, the cushion block is provided with a rotating column through the rotating assembly, and clamping assemblies are arranged on the opposite surfaces of the rotating column. A spot welding assembly is arranged in the mechanism body, a collecting cover is fixedly arranged on the inner wall of the mechanism body, the spot welding mechanism for integrated circuit chip machining purifies harmful smoke, and the situations that poisonous waste gas is not treated in time and is inhaled by workers to cause chronic poisoning and harm to the bodies are prevented; the rotating column is driven by the rotating assembly to rotate, so that the rotating column drives the clamping assembly to rotate, the clamping assembly drives the chip to turn over, the situation that when spot welding is conducted on the back face of the chip, a worker needs to take down the chip from a clamp, turn over the chip and then clamp the chip again is avoided, and the machining speed of the chip is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chip processing, in particular to a spot welding mechanism for integrated circuit chip processing. Background Art

[0002] An integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring; the circuit is formed on the silicon substrate, the circuit has at least one output / input pad, the fixed sealing ring is formed on the silicon substrate and surrounds the circuit and the output / input pad, the grounding ring is formed between the silicon substrate and the output / input pad and is electrically connected to the fixed sealing ring, the guard ring is arranged on the silicon substrate and surrounds the output / input pad to be electrically connected to the fixed sealing ring, and spot welding is required during the processing of the integrated circuit chip.

[0003] However, when spot welding the integrated circuit chip, a large amount of toxic waste gas will be generated. If it is not handled in time, it will be inhaled by the staff, causing chronic poisoning and causing harm to the body. In addition, when spot welding the back of the chip, the existing spot welding mechanism for processing the integrated circuit chip requires the staff to remove the chip from the clamp, turn it over and then re-clamp it, which reduces the processing speed of the chip. Therefore, a spot welding mechanism for processing the integrated circuit chip is proposed. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a spot welding mechanism for processing integrated circuit chips, which is used to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A spot welding mechanism for processing integrated circuit chips, including a mechanism body, a pad is fixedly provided on the inner wall of the mechanism body, a rotating assembly is provided on the top of the pad, the pad is provided with a rotating column through the rotating assembly, a clamping assembly is provided on the opposite surface of the rotating column, a spot welding assembly is provided inside the mechanism body, a collecting hood is fixedly provided on the inner wall of the mechanism body, a connecting pipe is fixedly provided on the inner wall of the collecting hood, an exhaust fan is fixedly provided on the connecting pipe, and the front side of the exhaust fan is fixedly provided on the rear side of the mechanism body, a purification assembly is provided on the surface of the connecting pipe, and a filter is fixedly provided inside the mechanism body.

[0007] Preferably, the rotating assembly includes a motor fixedly arranged on the top of the pad, a rotating rod fixedly arranged on the output end of the motor, a support frame rotatably arranged on the surface of the rotating rod, the bottom of the support frame is fixedly arranged on the inner wall of the mechanism body, the inner wall of the support frame is rotatably arranged on the surface of the rotating column, a gear 1 is fixedly arranged on the surface of the rotating rod, a gear 2 is meshed inside the gear 1, and the inner wall of the gear 2 is fixedly arranged on the surface of the rotating column.

[0008] Preferably, the clamping assembly includes a flip sleeve fixedly arranged on the facing surface of the rotating column, a pressure plate is overlapped on the inner wall of the flip sleeve, a slide rod 1 is fixedly arranged on the top of the pressure plate, the slide rod 1 is slidably arranged with the inner wall of the flip sleeve, a connecting rod is fixedly arranged on one end of the slide rod 1, a slide rod 2 is fixedly arranged on the bottom of the connecting rod, the surface of the slide rod 2 is slidably arranged with the inner wall of the flip sleeve, one end of the slide rod 2 is fixedly arranged on the top of the pressure plate, a spring is fixedly arranged on the top of the pressure plate, and one end of the spring is fixedly arranged on the inside of the flip sleeve.

[0009] Preferably, the spot welding assembly includes an electric push rod fixedly arranged inside the mechanism body, a mounting plate is fixedly arranged at the output end of the electric push rod, and a spot welding head is fixedly arranged at the bottom of the mounting plate.

[0010] Preferably, the purification component comprises a purification box fixedly arranged on the surface of the connecting pipe, an activated carbon plate is fixedly arranged inside the purification box, and a filter screen 2 is fixedly arranged inside the purification box.

[0011] Preferably, a flip door is hingedly provided inside the mechanism body, and a transparent plate is fixedly provided inside the flip door.

[0012] Preferably, supporting legs are fixedly provided at the bottom of the mechanism body, and the number of the supporting legs is several and the several supporting legs are symmetrically distributed.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: when the spot welding mechanism for processing integrated circuit chips is spot welding on the chip, the exhaust fan is started to draw harmful smoke into the purification component through the collection cover and the connecting pipe for purification treatment, thereby preventing the toxic waste gas from being inhaled into the body by the staff due to untimely treatment and causing chronic poisoning and harm to the body. The rotating component drives the rotating column to rotate, so that the rotating column drives the clamping component to rotate, so that the clamping component drives the chip to turn over, avoiding the situation where the staff needs to remove the chip from the clamp, turn it over and then re-clamp it when spot welding on the back of the chip, thereby speeding up the processing speed of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the structural survey drawing of the utility model;

[0015] Figure 2 for Figure 1 Schematic diagram of the local structure;

[0016] Figure 3 It is a side sectional view of the structure of the utility model;

[0017] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0018] Figure 5 It is a front cross-sectional view of the local structure of the utility model;

[0019] Figure 6 It is a front cross-sectional view of another local structure of the utility model.

[0020] In the figure: 1. Mechanism body; 2. Pad; 3. Motor; 4. Rotating rod; 5. Support frame; 6. Gear 1; 7. Gear 2; 8. Rotating column; 9. Flip sleeve; 10. Press plate; 11. Slide bar 1; 12. Spring; 13. Connecting rod; 14. Slide bar 2; 15. Electric push rod; 16. Mounting plate; 17. Spot welding head; 18. Collecting hood; 19. Connecting pipe; 20. Exhaust fan; 21. Purification box; 22. Activated carbon plate; 23. Filter screen 2; 24. Flip door; 25. Transparent plate; 26. Filter screen 1; 27. Support leg. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Reference Figure 1-6A spot welding mechanism for processing integrated circuit chips, including a mechanism body 1, a pad 2 is fixedly arranged on the inner wall of the mechanism body 1, a rotating assembly is arranged on the top of the pad 2, the pad 2 is provided with a rotating column 8 through the rotating assembly, the rotating assembly includes a motor 3 fixedly arranged on the top of the pad 2, a rotating rod 4 is fixedly arranged on the output end of the motor 3, a support frame 5 is rotatably arranged on the surface of the rotating rod 4, the bottom of the support frame 5 is fixedly arranged on the inner wall of the mechanism body 1, the inner wall of the support frame 5 is rotatably arranged on the surface of the rotating column 8, a gear 1 6 is fixedly arranged on the surface of the rotating rod 4, a gear 2 7 is meshed with the inside of the gear 1 6, and the inner wall of the gear 2 7 is fixedly arranged on the surface of the rotating column 8, the rotating rod 4 is driven to rotate by the motor 3, so that the rotating rod 4 drives two gears 1 6 Rotate, the two gears 1 6 drive the two gears 2 7 to rotate, so that the two gears 2 7 drive the two rotating columns 8 to rotate synchronously, which is convenient for flipping the clamping assembly and the chip, avoiding the situation of manual disassembly and flipping. The facing surfaces of the rotating columns 8 are provided with clamping assemblies, and the clamping assemblies include a flip sleeve 9 fixedly provided on the facing surfaces of the rotating columns 8, and a pressure plate 10 is overlapped on the inner wall of the flip sleeve 9, and a slide bar 11 is fixedly provided on the top of the pressure plate 10, and the slide bar 11 is slidably arranged with the inner wall of the flip sleeve 9, and a connecting rod 13 is fixedly provided at one end of the slide bar 11, and a slide bar 2 14 is fixedly provided at the bottom of the connecting rod 13, and the surface of the slide bar 2 14 is slidably arranged with the inner wall of the flip sleeve 9, and one end of the slide bar 2 14 is fixedly provided with the top of the pressure plate 10, A spring 12 is fixedly arranged on the top of the plate 10, and one end of the spring 12 is fixedly arranged inside the flip sleeve 9. The spring 12 pushes the pressure plate 10 downward to fix the chip and prevent the chip from falling or tilting. A flip door 24 is hingedly arranged inside the mechanism body 1, and a transparent plate 25 is fixedly arranged inside the flip door 24. Through the setting of the transparent plate 25, it is convenient for the staff to observe the internal welding situation. A spot welding assembly is arranged inside the mechanism body 1. The spot welding assembly includes an electric push rod 15 fixedly arranged inside the mechanism body 1. A mounting plate 16 is fixedly arranged at the output end of the electric push rod 15. A spot welding head 17 is fixedly arranged at the bottom of the mounting plate 16. The mounting plate 16 is driven up and down by the electric push rod 15, so that the mounting plate 16 can be installed. The mounting plate 16 drives the spot welding head 17 to move up and down, which is convenient for spot welding of the chip. A collecting hood 18 is fixedly provided on the inner wall of the mechanism body 1, and a connecting pipe 19 is fixedly provided on the inner wall of the collecting hood 18. An exhaust fan 20 is fixedly provided on the connecting pipe 19, and the front side of the exhaust fan 20 is fixedly provided with the rear side of the mechanism body 1. A purification component is provided on the surface of the connecting pipe 19, and the purification component includes a purification box 21 fixedly provided on the surface of the connecting pipe 19, an activated carbon plate 22 is fixedly provided inside the purification box 21, and a filter screen 23 is fixedly provided inside the purification box 21. The smoke particles are filtered and purified by the multi-layer activated carbon plates 22 to avoid human inhalation. The setting of the filter screen 23 facilitates the effective protection of the activated carbon plate 22.A filter screen 26 is fixedly arranged inside the main body 1 of the mechanism, and a support leg 27 is fixedly arranged at the bottom of the main body 1 of the mechanism. The number of the support legs 27 is several, and the several support legs 27 are symmetrically distributed. When the spot welding mechanism for processing integrated circuit chips is used to spot weld the chip, the exhaust fan 20 is started to draw the harmful smoke into the purification component through the collection cover 18 and the connecting pipe 19 for purification treatment, thereby preventing the toxic waste gas from being inhaled into the body by the staff due to untimely treatment and chronic poisoning, which causes harm to the body. The rotating component drives the rotating column 8 to rotate, so that the rotating column 8 drives the clamping component to rotate, so that the clamping component drives the chip to turn over, avoiding the situation that the staff needs to remove the chip from the fixture, turn it over, and then re-clamp it when spot welding the back of the chip, thereby speeding up the processing speed of the chip.

[0023] When in use: open the flip door 24, pull the connecting rod 13 upward, so that the connecting rod 13 drives the slide bar 11 and the slide bar 2 14 to move upward, and the slide bar 11 and the slide bar 2 14 drive the pressure plate 10 to move upward, and at the same time the spring 12 is compressed, and the two sides of the integrated circuit chip are placed between the pressure plate 10 and the inner wall of the flip sleeve 9, and the pressure plate 10 is released, so that the pressure plate 10 clamps the integrated circuit chip, and then the flip door 24 is closed to start the electric push rod 15, so that the output end of the electric push rod 15 extends and drives the mounting plate 16 to move downward, and the mounting plate 16 drives the spot welding head 17 to move downward to perform spot welding on the integrated circuit chip. When it is necessary to spot weld the back of the integrated circuit chip, just start The motor 3 drives the rotating rod 4 to rotate, so that the rotating rod 4 drives the gear 1 6 to rotate, and the gear 1 6 drives the gear 2 7 to rotate, so that the gear 2 7 drives the rotating column 8 to rotate, so that the rotating column 8 drives the flip sleeve 9 to rotate, and the integrated circuit chip can be turned over to continue the spot welding work. When harmful smoke is generated during the spot welding process, it only needs to start the exhaust fan 20 to draw the harmful smoke inside the mechanism body 1 into the purification box 21 through the collection cover 18 and the connecting pipe 19. The smoke is finally discharged from the left and right sides of the purification box 21. During the discharge process, it is filtered by the multi-layer activated carbon plate 22, so that the fine harmful particles in the smoke are retained in the activated carbon plate 22 to avoid being inhaled into the body and causing harm.

[0024] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0025] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A spot welding mechanism for processing integrated circuit chips, comprising a mechanism body (1), characterized in that: A cushion block (2) is fixedly arranged on the inner wall of the mechanism body (1), a rotating assembly is arranged on the top of the cushion block (2), a rotating column (8) is arranged on the cushion block (2) through the rotating assembly, a clamping assembly is arranged on the opposite surface of the rotating column (8), a spot welding assembly is arranged inside the mechanism body (1), a collecting hood (18) is fixedly arranged on the inner wall of the mechanism body (1), a connecting pipe (19) is fixedly arranged on the inner wall of the collecting hood (18), an exhaust fan (20) is fixedly arranged on the connecting pipe (19), and the front side of the exhaust fan (20) is fixedly arranged on the rear side of the mechanism body (1), a purification assembly is arranged on the surface of the connecting pipe (19), and a filter screen (26) is fixedly arranged inside the mechanism body (1).

2. A spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: The rotating assembly comprises a motor (3) fixedly arranged on the top of the cushion block (2); a rotating rod (4) is fixedly arranged on the output end of the motor (3); a support frame (5) is rotatably arranged on the surface of the rotating rod (4); the bottom of the support frame (5) is fixedly arranged on the inner wall of the mechanism body (1); the inner wall of the support frame (5) is rotatably arranged on the surface of the rotating column (8); a gear 1 (6) is fixedly arranged on the surface of the rotating rod (4); a gear 2 (7) is meshed with the inside of the gear 1 (6); and the inner wall of the gear 2 (7) is fixedly arranged on the surface of the rotating column (8).

3. A spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: The clamping assembly comprises a flip sleeve (9) fixedly arranged on the opposite surface of the rotating column (8), a pressure plate (10) being overlapped on the inner wall of the flip sleeve (9), a sliding rod (11) being fixedly arranged on the top of the pressure plate (10), the sliding rod (11) being slidably arranged with the inner wall of the flip sleeve (9), a connecting rod (13) being fixedly arranged on one end of the sliding rod (11), a sliding rod (14) being fixedly arranged on the bottom of the connecting rod (13), the surface of the sliding rod (14) being slidably arranged with the inner wall of the flip sleeve (9), one end of the sliding rod (14) being fixedly arranged with the top of the pressure plate (10), a spring (12) being fixedly arranged on the top of the pressure plate (10), and one end of the spring (12) being fixedly arranged with the inside of the flip sleeve (9).

4. A spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: The spot welding assembly comprises an electric push rod (15) fixedly arranged inside a mechanism body (1), a mounting plate (16) being fixedly arranged at the output end of the electric push rod (15), and a spot welding head (17) being fixedly arranged at the bottom of the mounting plate (16).

5. A spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: The purification component comprises a purification box (21) fixedly arranged on the surface of the connecting pipe (19), an activated carbon plate (22) fixedly arranged inside the purification box (21), and a second filter screen (23) fixedly arranged inside the purification box (21).

6. A spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: A flip door (24) is hingedly arranged inside the mechanism body (1), and a transparent plate (25) is fixedly arranged inside the flip door (24).

7. A spot welding mechanism for processing integrated circuit chips according to claim 1, characterized in that: A supporting leg (27) is fixedly arranged at the bottom of the mechanism body (1), and there are a plurality of supporting legs (27), and the plurality of supporting legs (27) are symmetrically distributed.

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