Thermal transfer printing device

Abstract

The utility model provides a heat transfer printing device. The heat transfer printing device comprises a shell, a first handle, a heating piece, a first control circuit and a heat dissipation piece. The shell comprises a first side and a second side which are oppositely arranged; the first handle is arranged on the first side, and a first accommodating cavity is formed in the first handle; the heating piece is arranged on the second side and used for executing a heat transfer printing task on a workpiece to be machined. The first control circuit is arranged in the first accommodating cavity; the heat dissipation piece is arranged on the first control circuit and located in the first containing cavity, and the heat dissipation piece is used for conducting heat dissipation on the first control circuit and does not make contact with the inner wall of the first containing cavity. According to the heat transfer printing device, the service life of the first control circuit is long, the heat dissipation stability of the heat dissipation piece on the first control circuit is good, and the use experience of an operator can be improved.

Description

Technical Field

[0001] The present application belongs to the field of thermal transfer processing technology, and in particular, relates to a thermal transfer device. Background Art

[0002] Thermal transfer, also known as thermal sublimation, is a special process in which any picture such as portraits and landscapes is printed on ordinary paper or high-precision printing paper using thermal transfer ink, and then the corresponding thermal transfer device is heated to a certain temperature within a few minutes to transfer the image on the paper to materials such as porcelain cups, porcelain plates, porcelain boards, clothes, and metals.

[0003] Most of the thermal transfer devices currently available on the market are in the form of a handle. Some control circuit boards are integrated into the handle. Since the control circuit board easily generates heat when powered on, the temperature of the control circuit board is high, which will affect the service life of the control circuit board. At the same time, since the handle needs to be held by the operator, the heat generated by the control circuit board will also cause the temperature of the handle to rise, affecting the operator's experience. Utility Model Content

[0004] In order to address the shortcomings of the prior art, the present application provides a thermal transfer device that can reduce the impact of the first control circuit on the temperature of the first handle, can reduce the impact on the service life of the first control circuit due to excessive heat generation of the first control circuit itself, and can also prevent the heat sink from being displaced relative to the first control circuit due to handle deformation caused by the operator holding the first handle, which is beneficial to ensuring the heat dissipation effect of the heat sink on the first control circuit.

[0005] The present application provides a thermal transfer device, comprising:

[0006] A housing including a first side and a second side disposed opposite to each other;

[0007] A first handle is disposed on the first side, wherein the first handle defines a first receiving cavity;

[0008] A heating element, disposed on the second side, and used for performing a thermal transfer task on the workpiece to be processed;

[0009] A first control circuit is disposed in the first receiving cavity; and

[0010] A heat sink is arranged on the first control circuit and located in the first receiving cavity. The heat sink is used to dissipate heat for the first control circuit and does not contact the inner wall of the first receiving cavity.

[0011] In a possible implementation, the thermal transfer device further includes:

[0012] a second handle disposed on the first side, the second handle being spaced apart from the first handle, and the second handle defining a second receiving cavity; and

[0013] The second control circuit is electrically connected to the first control circuit and is used to transmit electrical signals to the first control circuit.

[0014] In a possible implementation, the first control circuit is a heating control circuit, which is electrically connected to the heating element; the second control circuit is a main control circuit, which is electrically connected to the heating control circuit and is used to send a control electrical signal to the heating control circuit.

[0015] In a possible embodiment, the shell has a accommodating cavity, the heating element is at least partially accommodated in the accommodating cavity and the second side is exposed; the accommodating cavity is connected to the first accommodating cavity and forms a first through hole, and the heating control circuit is electrically connected to the heating element through a first electrical connector passing through the first through hole.

[0016] In a possible implementation, the accommodating cavity is communicated with the second accommodating cavity to form a second through hole, and the main control circuit is electrically connected to the heating control circuit via a second electrical connector penetrating the first through hole, the accommodating cavity and the second through hole.

[0017] In a possible embodiment, the thermal transfer device also includes a thermal insulation member, which is arranged between the first side of the shell and the heating element; the second electrical connection member that electrically connects the main control circuit and the heating control circuit is arranged between the first side of the shell and the thermal insulation member.

[0018] In a possible implementation, a first fixing column is provided on the first handle, and the first fixing column is fixed to the inner wall of the first receiving cavity; a first fixing groove is provided on the heating control circuit, and the first fixing column is clamped in the first fixing groove.

[0019] In a possible implementation manner, an avoidance groove is provided on the heat sink, and the avoidance groove does not contact the first fixing column.

[0020] In a possible embodiment, the first handle includes a first handle body, a first covering member and a first fixing member, the first handle body is provided with the first receiving cavity, the first covering member is covered on the side of the heat sink facing away from the heating control circuit; the first covering member is provided with a first fixing hole, the first fixing member passes through the first fixing hole and is connected to the first fixing column, so that the first covering member is fixedly connected to the first fixing member.

[0021] In a possible implementation, the first handle further includes a first decorative piece, which is mounted on a side of the first covering piece away from the heating control circuit; a first card slot is provided on the first covering piece, and a first buckle is provided on the first decorative piece, and the first buckle engages with the first card slot.

[0022] In a possible embodiment, a second fixing column is provided on the second handle, and the second fixing column is fixed to the inner wall of the second receiving cavity; a second fixing groove is provided on the main control circuit, and the second fixing column is clamped in the second fixing groove; the second handle includes a second handle body, a second covering member and a second fixing member, the second handle body is provided with the second receiving cavity, and the second covering member is covered on the side of the main control circuit away from the bottom wall of the second receiving cavity; a second fixing hole is provided on the second covering member, and the second fixing member passes through the second fixing hole and is connected to the second fixing column.

[0023] In one possible implementation,

[0024] The second handle also includes a second decorative piece, which is installed on a side of the second covering piece away from the heating control circuit; the second covering piece is provided with a second slot, the second decorative piece is provided with a second buckle, and the second buckle is engaged with the second slot.

[0025] The thermal transfer device provided by the present application integrates the first control circuit into the first receiving cavity of the first handle, so that the installation of the parts of the thermal transfer device is more compact, which is conducive to improving the space utilization efficiency of the thermal transfer device, and further miniaturizing the thermal transfer device. Moreover, by setting a heat sink to dissipate heat for the first control circuit, the influence of the first control circuit on the temperature of the first handle can be reduced, and the service life of the first control circuit affected by excessive heat generation of the first control circuit can be reduced. At the same time, by not contacting the heat sink with the inner wall of the first receiving cavity, the heat sink can be prevented from being displaced relative to the first control circuit due to the deformation of the handle caused by the operator holding the first handle, which is conducive to ensuring the heat dissipation effect of the heat sink on the first control circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some implementation methods provided by the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1It is a structural schematic diagram of a thermal transfer system provided in one embodiment of the present application;

[0028] Figure 2 It is a schematic diagram of the assembly of a thermal transfer device provided in one embodiment of the present application;

[0029] Figure 3 It is an exploded schematic diagram of a thermal transfer device provided by an embodiment of the present application;

[0030] Figure 4 is a cross-sectional view of a thermal transfer device provided in one embodiment of the present application Figure 1 ;

[0031] Figure 5 is a cross-sectional view of a thermal transfer device provided in one embodiment of the present application Figure 2 ;

[0032] Figure 6 It is a partial structural schematic diagram of a handle body provided in one embodiment of the present application;

[0033] Figure 7 This is a schematic diagram of an assembly structure of a heating control circuit and a heat sink provided in one embodiment of the present application;

[0034] Figure 8 is a structural schematic diagram of a first covering member provided in one embodiment of the present application;

[0035] Fig. 9 is a schematic structural diagram of a first decorative element provided in one embodiment of the present application;

[0036] Fig.10 This is a schematic diagram of the structure of a second handle body provided by an embodiment of the present application;

[0037] Fig.11 is a structural schematic diagram of a main control circuit provided by an embodiment of the present application;

[0038] Fig.12 is a structural schematic diagram of a second covering member provided in one embodiment of the present application;

[0039] Fig.13 It is a structural schematic diagram of a second decorative element provided in one embodiment of the present application. DETAILED DESCRIPTION

[0040] The technical solution of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described implementation methods are only part of the implementation methods of the present application, rather than all the implementation methods. Based on the implementation methods in the present application, all other implementation methods obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0041] In the description of the present application, the following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be implemented. The directional terms mentioned in the description of the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", "side wall", "top surface", "top wall", "bottom surface", "bottom wall", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, for example, "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. In the description of the present application, the "connection" and "connection" involved, unless otherwise specified, include direct connection (connection) and indirect connection (connection). The above definitions are only for the convenience of expression and cannot be understood as limitations on the present application.

[0042] See also Figure 1 , Figure 1 It is a structural schematic diagram of a thermal transfer system provided in one embodiment of the present application.

[0043] The present embodiment provides a thermal transfer system 1000, which includes a thermal transfer device 100 and an external extension structure 300, and the thermal transfer device 100 and the external extension structure 300 are detachably connected. The thermal transfer system 1000 includes a manual state and a semi-automatic state. In the manual state, the thermal transfer device 100 and the external extension structure 300 are separated, and the user can directly drive the thermal transfer device 100 to move to perform thermal transfer processing on the workpiece to be processed. The user can directly perform thermal transfer processing on the workpiece to be processed that is small in size and irregular in shape. In the semi-automatic state or the fully automatic state, the thermal transfer device 100 is connected to the external extension structure 300, and the thermal transfer device 100 can be driven to move by the external extension structure 300 to perform thermal transfer processing on the workpiece to be processed that is larger in size. It can be understood that the external extension structure 300 includes but is not limited to other structures such as a manipulator and a robotic arm, and this application does not limit this.

[0044] The thermal transfer system 1000 and the thermal transfer device 100 provided in the present application perform thermal transfer processing of the workpiece to be processed as hot pressing processing to achieve the transfer of the pattern, that is, the user places the thermal transfer device 100 on the transfer paper and the workpiece to be processed, so that the thermal transfer device 100 and the transfer paper are attached to each other, so that the pattern, text, etc. on the transfer paper are transferred to the workpiece to be processed under the action of the heat and pressure generated by the thermal transfer device 100. It can be understood that in other embodiments, the thermal transfer system 1000 and the thermal transfer device 100 can process the workpiece to be processed only by the heat generated by the thermal transfer device 100, or the thermal transfer system 1000 and the thermal transfer device 100 can process the workpiece to be processed only by the pressure generated by the thermal transfer device 100, and the present application does not limit this.

[0045] The thermal transfer system 1000 provided by the present application is detachably connected through the thermal transfer device 100 and the external extension structure 300, so that the thermal transfer system 1000 can be switched between a manual state and a semi-automatic state or a fully automatic state, so that the operation of the thermal transfer device 100 to process the workpiece to be processed is more flexible and convenient. Moreover, when the thermal transfer system 1000 is in a semi-automatic state or a fully automatic state, the thermal transfer device 100 is driven to move by the external extension structure 300 to process the workpiece to be processed. The user does not need to manually drive the thermal transfer device 100 to move, which can reduce the workload of the user when processing the workpiece to be processed, and can also improve the safety of the thermal transfer system 1000 processing the workpiece to be processed, which is conducive to improving the processing efficiency and processing safety of the thermal transfer system 1000 processing the workpiece to be processed.

[0046] In some embodiments, the thermal transfer system 1000 may further include a workbench 500, which is used to carry the workpiece to be processed. The workbench 500 is rotatably connected to the external expansion structure 300, and the external expansion structure 300 can drive the thermal transfer device 100 to rotate relative to the workbench, so that the thermal transfer device 100 can process the workpiece to be processed placed on the workbench 500.

[0047] In some embodiments, the thermal transfer system 1000 may further include a control device (not shown). In a semi-automatic state or a fully automatic state, the control device is used to control the movement of the external extension structure 300, thereby driving the thermal transfer device 100 connected to the external extension structure 300 to move, thereby processing the workpiece to be processed.

[0048] The thermal transfer system 1000 provided in this embodiment, by adding a control device in the thermal transfer system 1000, when it is necessary to perform batch processing on the workpieces to be processed, a control program can be preset in the control device so that the control device controls the movement of the external extension structure 300, and then drives the thermal transfer device 100 connected to the external extension structure 300 to move, so as to perform batch processing on the workpieces to be processed, so as to make the thermal transfer system 1000 intelligent, and also help to improve the efficiency of the thermal transfer system 1000 in processing the workpieces to be processed.

[0049] See also Figures 2 to 4 , Figure 2 is a schematic diagram of an assembly of a thermal transfer device provided in one embodiment of the present application. Figure 3 is an exploded schematic diagram of a thermal transfer device provided in one embodiment of the present application. Figure 4 is a cross-sectional view of a thermal transfer device provided in one embodiment of the present application Figure 1 .

[0050] In one embodiment, the thermal transfer device 100 includes a housing 10, a first handle 20, a heating element 40, a first control circuit 50 and a heat sink 70. The housing 10 includes a first side 10a and a second side 10b that are arranged opposite to each other. The first handle 20 is arranged on the first side 10a. The heating element 40 is arranged on the second side 10b. The heating element 40 is used to generate heat to achieve the thermal transfer task of the workpiece to be processed, that is, the heating element 40 can generate heat to provide heat to the workpiece to be processed during the hot pressing process. The first handle 20 has a first receiving cavity 21. The first control circuit 50 and the heat sink 70 are arranged in the first receiving cavity 21. The heat sink 70 is arranged on the first control circuit 50. The heat sink 70 is used to dissipate heat for the first control circuit 50. Among them, the first control circuit 50 includes but is not limited to a circuit that generates a large amount of heat when working, such as a heating control circuit.

[0051] The thermal transfer device 100 provided in this embodiment integrates the first control circuit 50 in the first receiving cavity 21 of the first handle 20, so that the installation of the components of the thermal transfer device 100 is more compact, which is conducive to improving the space utilization efficiency of the thermal transfer device 100, and further facilitates the miniaturization of the thermal transfer device 100. In addition, by disposing the heat sink 70 to dissipate the heat of the first control circuit 50, the influence of the first control circuit 50 on the temperature of the first handle 20 can be reduced, and the service life of the first control circuit 50 can be reduced due to excessive heat generation of the first control circuit 50.

[0052] In a specific embodiment, the heat sink 70 does not contact the inner wall of the first receiving cavity 21, which can prevent the heat sink 70 from being displaced relative to the first control circuit 50 due to the deformation of the handle caused by the operator holding the first handle 20, which is conducive to ensuring the heat dissipation effect of the heat sink 70 on the first control circuit 50. At the same time, it can also avoid the heat of the heat sink 70 being directly transferred to the first handle 20 due to the contact between the heat sink 70 and the inner wall of the first receiving cavity 21.

[0053] See also Figures 2 to 5 , Figure 5 is a cross-sectional view of a thermal transfer device provided in one embodiment of the present application Figure 2 .

[0054] In one embodiment, the thermal transfer device 100 includes a housing 10, a first handle 20, a second handle 30, a heating element 40, a first control circuit 50, a second control circuit 60 and a heat sink. The housing 10 includes a first side 10a and a second side 10b that are arranged opposite to each other, the first handle 20 is arranged on the first side 10a, the second handle 30 is arranged on the first side 10a, and the first handle 20 and the second handle 30 are arranged at intervals. The heating element 40 is arranged on the second side 10b, and the heating element 40 is used to generate heat to realize the thermal transfer function, that is, the heating element 40 can generate heat to provide heat to the workpiece to be processed during the hot pressing process. It can be understood that in the embodiment of the present application, the first control circuit 50 is a heating control circuit, and the heating control circuit is electrically connected to the heating element 40. The second control circuit 60 is a main control circuit. The main control circuit is electrically connected to the heating control circuit, and the main control circuit is used to send a control signal to the heating control circuit. The first handle 20 has a first receiving cavity 21, and the first control circuit 50 is arranged in the first receiving cavity 21, and the first control circuit 50 is electrically connected to the heating element 40. The second handle 30 has a second receiving cavity 31, and the second control circuit 60 is arranged in the second receiving cavity 31, and the second control circuit 60 is electrically connected to the first control circuit 50. Among them, since the first control circuit 50 is used to output an electrical signal to the heating element 40 so that the heating element 40 generates heat, in order to make the heating element 40 generate a large amount of heat in a short time, the voltage required to be input to the heating element 40 is correspondingly higher, so the first control circuit 50 is input with a higher voltage. The second control circuit 60 is only used to output a control electrical signal, which can be realized without a high voltage, so the second control circuit 60 is input with a lower voltage than the first control circuit 50, and the second control circuit 60 sends a control electrical signal to the first control circuit 50 to change the working mode of the thermal transfer device 100, the heating temperature of the heating element 40, the heating time of the heating element 40, etc. The heat sink 70 is disposed on the first control circuit 50 and located in the first receiving cavity 21 . The heat sink 70 is used to dissipate heat for the first control circuit 50 .

[0055] The thermal transfer device 100 provided in the present embodiment, in the first aspect, by setting the first handle 20 and the second handle 30 spaced apart on the housing 10, when the thermal transfer device 100 is in the manual state, the user can hold the first handle 20 and the second handle 30 at the same time, so that the thermal transfer device 100 is subjected to a more uniform force, which is beneficial to improving the thermal transfer effect and thermal transfer quality of the thermal transfer device 100 for transferring patterns, texts, etc. In the second aspect, based on the spacing of the first handle 20 and the second handle 30, by setting the first receiving cavity 21 on the first handle 20 and the second receiving cavity 31 on the main body of the second handle 30, the first control circuit 50 is set in the first receiving cavity 21, and the second control circuit 60 is set in the second receiving cavity 31, when the thermal transfer device 100 is working, the mutual interference between the first control circuit 50 and the second control circuit 60 is reduced, which is beneficial to ensure the stability of the working performance of the first control circuit 50 and the second control circuit 60, and also beneficial to ensure the service life of the first control circuit 50 and the second control circuit 60. On the third hand, by integrating the first control circuit 50 and the first handle 20, and the second control circuit 60 and the second handle 30, the installation of the components of the thermal transfer device 100 is more compact, which is conducive to improving the space utilization efficiency of the thermal transfer device 100, and further facilitates the miniaturization of the thermal transfer device 100. On the fourth hand, by dissipating the heat of the first control circuit 50 through the provision of the heat sink 70, the influence of the first control circuit 50 on the temperature of the first handle 20 can be reduced, and the service life of the first control circuit 50 can be reduced due to excessive heat generation of the first control circuit 50.

[0056] See also Figures 2 to 4 In one embodiment, the housing 10 has a receiving cavity 11, part of the heating element 40 is received in the receiving cavity 11 to be fixedly connected to the housing 10, and another part of the heating element 40 is exposed from the second side 10b of the housing 10 to realize the thermal transfer function. The receiving cavity 11 is connected to the first receiving cavity 21 and forms a first through hole 12. The first control circuit 50 passes through the first through hole 12 and is electrically connected to the heating element 40 through a first electrical connector (not shown). The receiving cavity 11 is connected to the first receiving cavity 21 and forms the first through hole 12, so that the first control circuit 50 can be electrically connected to the heating element 40 through the first electrical connector.

[0057] See also Figures 2 to 5 In one embodiment, the housing cavity 11 of the housing 10 is connected to the second housing cavity 31 and forms a second through hole 13. The first through hole 12, the housing cavity 11 and the second through hole 13 are sequentially connected. The first control circuit 50 is electrically connected to the second control circuit 60 through the second electrical connector (not shown) penetrating the first through hole 12, the housing cavity 11 and the second through hole 13. The first through hole 12, the housing cavity 11 and the second through hole 13 facilitate the electrical connection between the first control circuit 50 and the second control circuit 60.

[0058] See also Figures 2 to 5 In one embodiment, the thermal transfer device 100 further includes a heat insulating member 80, which is disposed between the first side 10a of the housing 10 and the heating member 40. The heat insulating member 80 is disposed between the first side 10a of the housing 10 and the heating member 40 to reduce heat conduction between the heating member 40 and the first side 10a of the housing 10, thereby reducing the heat effect of the heating member 40 on the components connected to the first side 10a of the housing 10 or between the first side 10a of the housing 10 and the heat insulating member 80. Specifically, the second electrical connector electrically connecting the first control circuit 50 and the second control circuit 60 is disposed between the first side 10a of the housing 10 and the heat insulating member 80. The second electrical connector is disposed between the first side 10a of the housing 10 and the heat insulating member 80, so that the heat effect of the heating member 40 on the second electrical connector electrically connecting the first control circuit 50 and the second control circuit 60 can be reduced.

[0059] See also Figures 3 to 6 and Figure 7 , Figure 6 is a partial structural diagram of a handle body provided in one embodiment of the present application. Figure 7 It is a schematic diagram of an assembly structure of a heating control circuit and a heat sink provided in one embodiment of the present application.

[0060] In one embodiment, a first fixing column 22 is provided on the first handle 20, the first fixing column 22 is fixed on the inner side wall of the first receiving cavity 21, and the first fixing column 22 extends from the first side 10a to the second side 10b. A first fixing groove 51 is provided on the first control circuit 50, the first fixing groove 51 is provided on the periphery of the first control circuit 50, and the opening of the first fixing groove 51 is located at the edge of the first control circuit 50. When the first control circuit 50 is installed in the first receiving cavity 21, the first fixing groove 51 cooperates with the first fixing column 22, and at least part of the first fixing column 22 is engaged in the first fixing groove 51, so as to fix the first control circuit 50 in the first receiving cavity 21. The first control circuit 50 is spaced apart from the bottom wall of the first receiving cavity 21, thereby ensuring that the first control circuit 50 is spaced apart from the first side 10a. The spacing setting between the first control circuit 50 and the bottom wall of the first receiving cavity 21 can be achieved by changing the size of the first fixing column 22, that is, the size of the bottom wall of the part of the first fixing column 22 close to the first receiving cavity 21 is larger than the size of the bottom wall of the part of the first fixing column 22 away from the first receiving cavity 21, so that the first fixing groove 51 and the part of the first fixing column 22 close to the bottom wall of the first receiving cavity 21 form a spacing setting.

[0061] The thermal transfer device 100 provided in this embodiment, on the one hand, prevents the first control circuit 50 from loosening and shaking in the first receiving cavity 21 by cooperating with the first fixing groove 51 on the first control circuit 50 and the first fixing column 22 on the inner wall of the first receiving cavity 21, so that the first control circuit 50 is fixed in the first receiving cavity 21, which is conducive to improving the stability of the first control circuit 50 installed in the first receiving cavity 21, and further can improve the performance stability of the first control circuit 50 when working. On the other hand, by setting the first control circuit 50 and the bottom wall of the first receiving cavity 21 apart, and further making the first control circuit 50 and the first side 10a apart, the heat generated by the heating element 40 can be reduced from being transmitted to the first control circuit 50 through the housing 10, and further reducing the influence of the heat generated by the heating element 40 on the electronic components on the first control circuit 50, which can ensure the stability of the performance of the first control circuit 50 when working, and also help to improve the service life of the first control circuit 50, and further improve the stability of the thermal transfer device 100 in achieving the thermal transfer function.

[0062] In a specific embodiment, the number of the first fixing columns 22 is 10, and the 10 first fixing columns 22 are sequentially spaced along the circumferential direction on the inner wall of the first receiving cavity 21. The number of the first fixing grooves 51 is 10, and the 10 first fixing grooves 51 are sequentially spaced along the circumference of the first control circuit 50. The 10 first fixing columns 22 and the 10 first fixing grooves 51 cooperate with each other to limit the first control circuit 50 in any direction along the first side 10a in the first receiving cavity 21, which is conducive to further improving the stability of the first control circuit 50 in the first receiving cavity 21.

[0063] It can be understood that in some other embodiments, the number of first fixing columns 22 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of first fixing slots 51 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the present application does not impose any restrictions on this.

[0064] See also Figure 3 , Figure 4 , Figure 6 and Figure 7In one embodiment, the heat sink 70 is fixedly mounted on the first control circuit 50. The heat sink 70 is used to dissipate heat from the first control circuit 50 so that the first control circuit 50 can work at a normal ambient temperature. The heat sink 70 can also continue to dissipate heat from the first control circuit 50 when the first control circuit 50 finishes working. In the thermal transfer device 100 provided in this embodiment, when the first control circuit 50 is working, the electronic components on the first control circuit 50 will generate heat. By arranging the heat sink 70 on the first control circuit 50, the heat sink 70 is used to dissipate heat from the first control circuit 50 to prevent the first control circuit 50 from having abnormal performance due to excessively high ambient temperature, thereby improving the stability of the first control circuit 50 when working, and ensuring that the thermal transfer device 100 can normally realize the thermal transfer function.

[0065] In a specific embodiment, an avoidance groove 71 is provided on the heat sink 70. The avoidance groove 71 is provided around the heat sink 70, and the avoidance groove 71 is spaced apart from the first fixed column 22 so that the first fixed column 22 does not contact the inner wall of the avoidance groove 71. This can prevent the heat sink 70 from being displaced relative to the first control circuit 50 due to the displacement of the first fixed column 22 caused by the deformation of the first handle 20, thereby ensuring the heat dissipation effect of the heat sink 70 on the first control circuit 50.

[0066] It can be understood that in some other embodiments, the thermal transfer device 100 may further include a sensor (not shown), which is used to monitor the ambient temperature when the first control circuit 50 is working in real time, and then control whether the heat sink 70 is working, or control the working power of the heat sink 70, so as to make the process of heat dissipation of the first control circuit 50 by the heat sink 70 intelligent.

[0067] See also Figures 3 to 5 and Figure 8 , Figure 8 It is a structural schematic diagram of a first covering member provided in one embodiment of the present application.

[0068] In one embodiment, the first handle 20 includes a first handle body 23, a first cover 24 and a first fixing member 25. The first receiving cavity 21 is located in the first handle body 23. The first cover 24 is provided on the side of the first control circuit 50 away from the bottom wall of the first receiving cavity 21. The first cover 24 is used to seal the first control circuit 50 in the first receiving cavity 21. A first fixing hole 241 is provided on the first cover 24. The first fixing member 25 passes through the first fixing hole 241 and is fixedly connected to the first fixing column 22 to fix the first cover 24 in the first receiving cavity 21.

[0069] The thermal transfer device 100 provided in this embodiment adds a first cover 24 to the first handle 20, and the first cover 24 is fixed in the first receiving cavity 21 via the first fixing member 25, so as to cover the first control circuit 50 in the first receiving cavity 21 of the first handle body 23, thereby preventing the first control circuit 50 from being exposed, and preventing dust and other impurities from falling on the first control circuit 50, causing electronic components on the first control circuit 50 to malfunction, which is conducive to improving the stability of the performance of the first control circuit 50 during operation. Moreover, the first cover 24 is fixed in the first receiving cavity 21 by the first fixing member 25, and the first control circuit 50 is limited in the direction from the first side 10a to the second side 10b under the action of the first cover 24, which is conducive to improving the stability of the first control circuit 50 in the first receiving cavity 21.

[0070] In a specific embodiment, the first fixing member 25 is a screw, the first fixing hole 241 on the first covering member 24 is a through hole extending from the first side 10a to the second side 10b, and the first fixing column 22 is provided with a first threaded hole 221. The first fixing member 25 passes through the first fixing hole 241 and is threadedly connected to the first threaded hole 221, so that the first covering member 24 can be removed from the first receiving cavity 21, which is convenient for the user to maintain or replace the first control circuit 50.

[0071] See also Figure 3 , Figure 4 , Figure 8 and Fig. 9 , Fig. 9 It is a structural schematic diagram of a first decorative element provided in one embodiment of the present application.

[0072] In one embodiment, the first handle 20 further includes a first decorative member 26, which is detachably mounted on a side of the first cover member 24 away from the first control circuit 50 and an opening of the first receiving cavity 21 of the first cover member 24 away from the first side 10a. The thermal transfer device 100 provided in this embodiment adds the first decorative member 26 to the first handle 20, so as to make the appearance of the first handle 20 and the thermal transfer device 100 more beautiful. Moreover, the first decorative member 26 can prevent the first fixing member 25 from being exposed to the environment and corroded and unable to be disassembled, which is conducive to improving the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0073] In a specific embodiment, a first slot 242 is provided on the first cover 24, and a first buckle 261 is provided on the first decorative member 26. The first buckle 261 is engaged with the first slot 242, so that the first decorative member 26 can be detachably mounted on the first cover 24. The first slot 242 penetrates the first cover 24 along the direction from the first side 10a to the second side 10b, and the first buckle 261 is provided on a side of the first decorative member 26 close to the first cover 24, so as to prevent the first buckle 261 from being exposed outside the first handle 20, thereby ensuring the aesthetics of the first handle 20. By the first decorative member 26 and the first cover 24 being connected by the buckle, the connection between the first decorative member 26 and the first cover 24 can be hidden, and the first buckle 261 of the first decorative member 26 can be prevented from being exposed to the environment and corroded and unable to be disassembled, which is conducive to improving the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0074] More specifically, in this embodiment, the number of the first card slots 242 is 10, and the 10 first card slots 242 are arranged in sequence and at intervals near the peripheral edge of the first cover member 24. The number of the first clips 261 is 10, and the 10 first clips 261 are arranged in sequence and at intervals near the peripheral edge of the first decorative member 26. The 10 first clips 261 are respectively engaged with the 10 first card slots 242, so that the first decorative member 26 can be detachably installed on the side of the first cover member 24 away from the first control circuit 50, which can also reduce the risk of the first decorative member 26 falling off the first cover member 24, which is beneficial to further improve the stability of the first decorative member 26 installed on the first cover member 24.

[0075] It can be understood that in some other embodiments, the number of first card slots 242 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of first clips 261 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc. It is only necessary to ensure that the number of first card slots 242 and first clips 261 are the same and the positions correspond, and this application does not impose any restrictions on this.

[0076] See also Figure 3 , Figure 5 , Fig.10 and Fig.11 , Fig.10 This is a schematic diagram of the structure of a second handle body provided in one embodiment of the present application. Fig.11 It is a structural schematic diagram of a main control circuit provided in one embodiment of the present application.

[0077] In one embodiment, a second fixing column 32 is provided on the second handle 30, the second fixing column 32 is fixed on the inner side wall of the second receiving cavity 31, and the second fixing column 32 extends from the first side 10a to the second side 10b. A second fixing groove 61 is provided on the second control circuit 60, the second fixing groove 61 is provided on the periphery of the second control circuit 60, and the opening of the second fixing groove 61 is located at the edge of the second control circuit 60. When the second control circuit 60 is installed in the second receiving cavity 31, the second fixing groove 61 cooperates with the second fixing column 32, and at least part of the second fixing column 32 is received in the second fixing groove 61, so as to fix the second control circuit 60 in the second receiving cavity 31. The second control circuit 60 is spaced apart from the bottom wall of the second receiving cavity 31, thereby ensuring that the second control circuit 60 is spaced apart from the first side 10a. The spacing setting between the second control circuit 60 and the bottom wall of the second receiving cavity 31 can be achieved by changing the size of the second fixing column 32, that is, the size of the bottom wall of the second fixing column 32 close to the second receiving cavity 31 is larger than the size of the bottom wall of the second fixing column 32 away from the second receiving cavity 31, so that the second fixing groove 61 and the part of the second fixing column 32 close to the bottom wall of the second receiving cavity 31 form a spacing setting.

[0078] The thermal transfer device 100 provided in this embodiment, on the one hand, prevents the second control circuit 60 from loosening and shaking in the second receiving cavity 31 by cooperating with the second fixing groove 61 on the second control circuit 60 and the second fixing column 32 on the inner wall of the second receiving cavity 31, so that the second control circuit 60 is fixed in the second receiving cavity 31, which is conducive to improving the stability of the second control circuit 60 installed in the second receiving cavity 31, and further can improve the performance stability of the second control circuit 60 when working. On the other hand, by setting the second control circuit 60 and the bottom wall of the second receiving cavity 31 apart, and further making the second control circuit 60 and the second side 10b apart, the heat generated by the heating element 40 can be reduced from being transmitted to the second control circuit 60 through the housing 10, and further reducing the influence of the heat generated by the heating element 40 on the electronic components on the second control circuit 60, which can ensure the stability of the performance of the second control circuit 60 when working, and also help to improve the service life of the second control circuit 60, and further improve the stability of the thermal transfer device 100 in achieving the thermal transfer function.

[0079] In a specific embodiment, the number of the second fixing columns 32 is 10, and the 10 second fixing columns 32 are sequentially spaced along the circumferential direction on the inner wall of the second receiving cavity 31. The number of the second fixing grooves 61 is 4, and the 4 second fixing grooves 61 are sequentially spaced along the circumference of the second control circuit 60. The 4 second fixing columns 32 and the 4 second fixing grooves 61 cooperate with each other to limit the second control circuit 60 in any direction along the second side 10b in the second receiving cavity 31, which is conducive to further improving the stability of the second control circuit 60 in the second receiving cavity 31.

[0080] It can be understood that in some other embodiments, the number of second fixing columns 32 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of second fixing slots 61 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the present application does not impose any restrictions on this.

[0081] See also Figure 3 , Figure 5 , Fig.10 and Fig.12 , Fig.12 It is a schematic structural diagram of a second covering member provided in one embodiment of the present application.

[0082] In one embodiment, the second handle 30 includes a second handle body 33, a second cover 34, and a second fixing member 35. The second receiving cavity 31 is located in the second handle body 33. The second cover 34 is covered on the side of the second control circuit 60 away from the bottom wall of the second receiving cavity 31. The second cover 34 is used to seal the second control circuit 60 in the second receiving cavity 31. A second fixing hole 341 is provided on the second cover 34. The second fixing member 35 passes through the second fixing hole 341 and is fixedly connected to the second fixing column 32 to fix the second cover 34 in the second receiving cavity 31.

[0083] The thermal transfer device 100 provided in this embodiment adds a second cover 34 to the second handle 30, and the second cover 34 is fixed in the second receiving cavity 31 via a second fixing member 35, so as to cover the second control circuit 60 in the second receiving cavity 31 of the second handle body 33, thereby avoiding the exposure of the second control circuit 60, and preventing dust and other impurities from falling on the second control circuit 60, causing the electronic components on the second control circuit 60 to malfunction, which is conducive to improving the stability of the performance of the second control circuit 60 during operation. Moreover, the second cover 34 is fixed in the second receiving cavity 31 by the second fixing member 35, and the second control circuit 60 is limited in the direction from the second side 10b to the second side 10b under the action of the second cover 34, which is conducive to improving the stability of the second control circuit 60 in the second receiving cavity 31.

[0084] In a specific embodiment, the second fixing member 35 is a screw, the second fixing hole 341 on the second cover member 34 is a through hole extending from the first side 10a to the second side 10b, and a second threaded hole 321 is provided on the second fixing column 32. The second fixing member 35 passes through the second fixing hole 341 and is threadedly connected to the second threaded hole 321, so that the second cover member 34 can be removed from the second accommodating cavity 31, which is convenient for the user to maintain or replace the second control circuit 60.

[0085] See also Figure 3 , Figure 5 , Fig.12 and Fig.13 , Fig.13 It is a structural schematic diagram of a second decorative element provided in one embodiment of the present application.

[0086] In one embodiment, the second handle 30 further includes a second decorative member 36, which is detachably mounted on a side of the second cover member 34 away from the second control circuit 60, and the second cover member 34 blocks the opening of the second receiving cavity 31 away from the second side 10b. The thermal transfer device 100 provided in this embodiment adds a second decorative member 36 to the second handle 30, so that the appearance of the second handle 30 and the thermal transfer device 100 is more beautiful. Moreover, the second decorative member 36 can prevent the second fixing member 35 from being exposed to the environment and corroding and cannot be disassembled, which is conducive to improving the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0087] In a specific embodiment, a second slot 342 is provided on the second cover 34, and a second buckle 361 is provided on the second decorative member 36. The second buckle 361 is engaged with the second slot 342, so that the second decorative member 36 can be detachably mounted on the second cover 34. The second slot 342 penetrates the second cover 34 along the direction from the second side 10b to the second side 10b, and the second buckle 361 is provided on a side of the second decorative member 36 close to the second cover 34, so as to prevent the second buckle 361 from being exposed outside the second handle 30, thereby ensuring the aesthetics of the second handle 30. By the second decorative member 36 and the second cover 34 being connected by the buckle, the connection between the second decorative member 36 and the second cover 34 can be hidden, and the second buckle 361 of the second decorative member 36 can be prevented from being exposed to the environment and corroded and unable to be disassembled, which is conducive to improving the efficiency of disassembly and maintenance of the thermal transfer device 100.

[0088] In a specific embodiment, the number of second card slots 342 is 10, and the 10 second card slots 342 are arranged in sequence and spaced apart at positions close to the peripheral edge of the second cover member 34. The number of second clips 361 is 10, and the 10 second clips 361 are arranged in sequence and spaced apart at positions close to the peripheral edge of the second decorative member 36. The 10 second clips 361 are respectively engaged with the 10 second card slots 342, so that the second decorative member 36 can be detachably installed on the side of the second cover member 34 away from the second control circuit 60, which can also reduce the risk of the second decorative member 36 falling off the second cover member 34, which is beneficial to further improve the stability of the second decorative member 36 installed on the second cover member 34.

[0089] It can be understood that in some other embodiments, the number of second card slots 342 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc., and the number of second clips 361 includes but is not limited to 1, 2, 3, 4, 5, 6, 7, 8, 9, etc. It is only necessary to ensure that the number of second card slots 342 and second clips 361 are the same and the positions correspond, and this application does not impose any restrictions on this.

[0090] The above are some implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A thermal transfer device, characterized in that: include: A housing including a first side and a second side disposed opposite to each other; A first handle is disposed on the first side, wherein the first handle defines a first receiving cavity; A heating element, disposed on the second side, and used for performing a thermal transfer task on the workpiece to be processed; A first control circuit is disposed in the first receiving cavity; as well as A heat sink is arranged on the first control circuit and located in the first receiving cavity. The heat sink is used to dissipate heat for the first control circuit and does not contact the inner wall of the first receiving cavity.

2. The thermal transfer device according to claim 1, characterized in that: The thermal transfer device also includes: a second handle disposed on the first side, the second handle being spaced apart from the first handle, and the second handle defining a second receiving cavity; and The second control circuit is electrically connected to the first control circuit and is used to transmit electrical signals to the first control circuit.

3. The thermal transfer device according to claim 2, characterized in that: The first control circuit is a heating control circuit, which is electrically connected to the heating element; the second control circuit is a main control circuit, which is electrically connected to the heating control circuit and is used to send a control electrical signal to the heating control circuit.

4. The thermal transfer device according to claim 3, characterized in that: The housing has a receiving cavity, and the heating element is at least partially received in the receiving cavity and exposes the second side; The accommodating cavity is communicated with the first receiving cavity to form a first through hole, and the heating control circuit is electrically connected to the heating element through a first electrical connector penetrating the first through hole.

5. The thermal transfer device according to claim 4, characterized in that: The accommodating cavity is communicated with the second accommodating cavity to form a second through hole, and the main control circuit is electrically connected to the heating control circuit through a second electrical connector penetrating the first through hole, the accommodating cavity and the second through hole.

6. The thermal transfer device according to claim 5, characterized in that: The thermal transfer device further comprises a heat insulating member, wherein the heat insulating member is disposed between the first side of the housing and the heat generating member; The second electrical connector electrically connecting the main control circuit and the heating control circuit is disposed between the first side of the housing and the thermal insulation member.

7. The thermal transfer device according to claim 3, characterized in that: The first handle is provided with a first fixing column, and the first fixing column is fixed to the inner wall of the first receiving cavity; The heating control circuit is provided with a first fixing groove, and the first fixing column is clamped in the first fixing groove.

8. The thermal transfer device according to claim 7, characterized in that: The heat sink is provided with an avoidance groove, and the avoidance groove is not in contact with the first fixing column.

9. The thermal transfer device according to claim 7, characterized in that: The first handle comprises a first handle body, a first covering member and a first fixing member, the first handle body is provided with the first receiving cavity, and the first covering member is provided to cover a side of the heat sink away from the heating control circuit; The first covering member is provided with a first fixing hole, and the first fixing member passes through the first fixing hole and is connected to the first fixing column, so that the first covering member is fixedly connected to the first fixing member.

10. The thermal transfer device according to claim 9, characterized in that: The first handle also includes a first decorative piece, which is installed on a side of the first covering piece away from the heating control circuit; the first covering piece is provided with a first slot, the first decorative piece is provided with a first buckle, and the first buckle is engaged with the first slot.

11. The thermal transfer device according to claim 3, characterized in that: The second handle is provided with a second fixing column, and the second fixing column is fixed to the inner wall of the second receiving cavity; The main control circuit is provided with a second fixing groove, and the second fixing column is clamped in the second fixing groove; The second handle comprises a second handle body, a second cover and a second fixing member, the second handle body is provided with the second receiving cavity, and the second cover is provided to cover a side of the main control circuit away from the bottom wall of the second receiving cavity; The second covering member is provided with a second fixing hole, and the second fixing member passes through the second fixing hole and is connected to the second fixing column.

12. The thermal transfer device according to claim 11, characterized in that: The second handle further comprises a second decorative member, and the second decorative member is mounted on a side of the second covering member away from the heating control circuit; The second covering member is provided with a second card slot, the second decorative member is provided with a second buckle, and the second buckle is engaged with the second card slot.

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