Electroplating equipment for diamond tool

Abstract

The utility model discloses electroplating equipment for diamond tools, which comprises a sub-tank and a plating solution mother tank, a tank body water inlet pipe is mounted in the middle of the bottom of the sub-tank, a sub-tank body is mounted on the tank body water inlet pipe, a reaction water inlet is connected to the bottom of the tank body water inlet pipe, a cathode conductive plate and an anode conductive rod are arranged on the sub-tank body, and the cathode conductive plate and the anode conductive rod are connected to the bottom of the tank body water inlet pipe. An electroforming layer and carborundum are arranged in the sub-tank body, a graphite jig is positioned on the outer side of the sub-tank, and a water return straight pipe is positioned in the sub-tank. According to the electroplating equipment for the diamond tool, internal circulation of electroplating liquid of an electroplated layer is increased; external circulation is added, so that the temperature of the whole tank body and the jig is ensured; the decomposition of nickel beads in the plating solution mother tank is increased, when the plating solution stably passes through the carborundum, the anode and the cathode are linked with the rectifier, nickel ions in the plating solution can move to the surface of the graphite jig, and the nickel ions are bonded with the carborundum to slowly form a plating layer.

Description

Technical Field

[0001] The invention relates to the fields of electroplating industry and photovoltaic industry, and in particular to electroplating equipment for diamond tools. Background Art

[0002] The electroplating equipment for diamond tools is a supporting equipment for electroforming operations. In existing industrial applications, the buried sand method is used as the basic method based on the principle of electroforming technology, and the casting is carried out through a DC power supply. Specifically: the middle cylindrical titanium basket plus the nickel corner is used as the anode, which is connected to the positive pole of the DC rectifier; the outside is the product end connected to the cathode. The anode and cathode are immersed in the plating solution. Some production uses constant temperature, circulating filtration and other methods for electroplating. With the continuous development of science and technology, people have higher and higher requirements for the manufacturing process of electroplating equipment for diamond tools.

[0003] The existing electroplating equipment for diamond tools has certain drawbacks when in use. The existing method is the buried sand method. Diamond sand and plating solution are static during the electroplating process, and the edge effect of the current is obvious. The quality requirements of diamond tool products are becoming more and more precise. The local coating thickness is uneven and cannot meet the quality requirements. The existing circulation and filtration plating solution methods are mainly for the plating solution in the plating tank, while the cathode and anode surfaces cannot be circulated due to the buried sand method, and are relatively static at the microscopic level. This increases concentration polarization, potentially affecting the uniformity of thickness, and at the same time affecting the uniformity of local process parameters, thereby affecting the quality of the coating. The shapes of various models are different, and the anode is basically cylindrical, which produces different high and low current densities, thereby exacerbating the problem of uneven coating thickness. Based on the above reasons, it will affect the uniformity of diamond electrodeposition, resulting in uneven density of sand at different positions, thereby affecting the cutting and grinding capabilities of the tool during use. For this reason, we propose an electroplating equipment for diamond tools. Summary of the invention

[0004] Technical problem solved: In view of the deficiencies in the prior art, the present invention provides an electroplating device for diamond tools, which increases the internal circulation of the electroplating solution; increases the external circulation to ensure the temperature of the entire tank body and the fixture; increases the decomposition of nickel beads in the plating solution mother tank. When the plating solution stably passes through the corundum, the anode and the cathode are connected to the rectifier, and the nickel ions in the plating solution will move to the surface of the graphite fixture. The nickel ions bond to the corundum to slowly form a coating, which can effectively solve the problems in the background technology.

[0005] Technical solution: To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a diamond tool electroplating equipment, including a sub-trough and a plating solution main tank, a tank body water inlet pipe is installed in the middle of the bottom of the sub-trough, a sub-trough body is installed on the tank body water inlet pipe, a reaction water inlet is connected to the bottom of the tank body water inlet pipe, a cathode conductive plate and an anode conductive rod are arranged on the sub-trough body, an electroforming layer and corundum are arranged inside the sub-trough body, a graphite jig is positioned on the outside of the sub-trough, a return water straight pipe is positioned inside the sub-trough, and an upper cover plate is positioned on the inner wall of the sub-trough.

[0006] As a preferred technical solution of the present application, the sub-tank is located above the plating liquid main tank, a frame is positioned and installed on the outer side of the plating liquid main tank, the sub-tank is installed on the frame, a drain pipe is connected to the bottom of the plating liquid main tank, and an external circulation and an internal circulation are arranged between the sub-tank and the plating liquid main tank.

[0007] As a preferred technical solution of the present application, the external circulation structure includes a filter, a water pump, a heating pipe and a main return pipe, the filter is connected to the water pump, the water pump is connected to the sub-tank, and the heating pipe is connected to the main return pipe at the position of the sub-tank.

[0008] As a preferred technical solution of the present application, the internal circulation structure includes a reaction water inlet pipe, a liquid level temperature control probe and a micro water pump. The reaction water inlet pipe is connected to the position of the sub-trough body inside the sub-trough, and the other end of the reaction water inlet pipe is connected to the micro water pump, and the micro water pump is connected to the liquid level temperature control probe.

[0009] As a preferred technical solution of the present application, anode titanium blue and cathode titanium blue are arranged inside the plating solution master tank, and the cathode titanium blue is located between the two groups of anode titanium blue and is arranged at intervals.

[0010] As a preferred technical solution of the present application, the cathode conductive plate is fixed to the sub-slot body by bolts, the electroforming layer is integrally formed inside the sub-slot body, and the plating solution directly passes through the position of the corundum.

[0011] As a preferred technical solution of the present application, the sub-tank is connected to the plating solution main tank through internal circulation and external circulation, and the external circulation controls the temperature of the tank body and the fixture.

[0012] Beneficial effects: Compared with the prior art, the present invention provides a diamond tool electroplating device, which has the following beneficial effects: the diamond tool electroplating device increases the internal circulation of the electroplating layer plating solution; increases the external circulation to ensure the temperature of the entire tank body and the fixture; increases the decomposition of nickel beads in the plating solution mother tank, increases the reaction water inlet pipe, and uses a micro pump to extract the plating solution from the plating solution mother tank and directly flows through the corundum to form a stable water flow; when the plating solution stably passes through the corundum, the anode and the cathode are connected to the rectifier, and the nickel ions in the plating solution will move to the graphite fixture The nickel ions bond to the corundum and slowly form a coating on the surface; the water pump draws the plating solution from the plating solution mother tank through the filter into the sub-tank, and then returns to the mother tank from the total return water, so that the temperature of the entire sub-tank is maintained at a constant temperature; the anode titanium blue and cathode titanium blue are directly placed in the plating solution mother tank to directly decompose the nickel beads, so that the concentration in the plating solution tank is guaranteed to be within a reasonable range; the plating solution directly passes through the corundum and is integrally formed into a coating on the surface of the corundum. The entire diamond tool electroplating equipment has a simple structure, is easy to operate, and has a better effect than the traditional method. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The figure is a schematic diagram of the overall structure of an electroplating device for diamond tools according to the present invention.

[0014] Figure 2 The present invention is a schematic structural diagram of an overall front view of an electroplating device for diamond tools.

[0015] Figure 3 It is a structural schematic diagram of an overall side view of an electroplating device for diamond tools of the present invention.

[0016] Figure 4 It is a structural schematic diagram of an overall top view of an electroplating device for diamond tools of the present invention.

[0017] Figure 5 The present invention is a schematic structural diagram of a sub-trough in an electroplating device for diamond tools.

[0018] Figure 6 The present invention is a schematic structural diagram of a top view of a sub-slot in an electroplating device for diamond tools.

[0019] Figure 7 The present invention is a schematic structural diagram of an internal cross-sectional view of a sub-groove in an electroplating device for diamond tools.

[0020] Figure 8 The present invention is a schematic structural diagram of an electroplating method of an electroplating device for diamond tools.

[0021] In the figure: 1. sub-tank; 2. rack; 3. plating solution main tank; 4. heating tube; 5. liquid level temperature control probe; 6. filter; 7. water pump; 8. micro water pump; 9. anode titanium blue; 10. cathode titanium blue; 11. main return pipe; 12. reaction water inlet pipe; 13. drain pipe; 14. sub-tank body; 15. electroforming layer; 16. anode conductive rod; 17. graphite fixture; 18. upper cover plate; 19. corundum; 20. reaction water inlet; 21. cathode conductive plate; 22. return water straight pipe; 23. tank body water inlet pipe. DETAILED DESCRIPTION

[0022] The technical scheme of the present invention will be clearly and completely described below in conjunction with the accompanying drawings and specific embodiments, but it will be understood by those skilled in the art that the following described embodiments are part of embodiments of the present invention, rather than all embodiments, and are only used to illustrate the present invention, and should not be considered as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present invention. If specific conditions are not specified in the embodiments, they are carried out according to normal conditions or conditions recommended by the manufacturer. If the manufacturer is not specified in the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0023] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] like Figure 1-8As shown, a diamond tool electroplating equipment includes a sub-trough 1 and a plating solution main tank 3, a tank body water inlet pipe 23 is installed in the middle of the bottom of the sub-trough 1, a sub-trough body 14 is installed on the tank body water inlet pipe 23, a reaction water inlet 20 is connected to the bottom of the tank body water inlet pipe 23, a cathode conductive plate 21 and an anode conductive rod 16 are arranged on the sub-trough body 14, an electroforming layer 15 and corundum 19 are arranged inside the sub-trough body 14, a graphite fixture 17 is positioned outside the sub-trough 1, a return water straight pipe 22 is positioned inside the sub-trough 1, and an upper cover plate 18 is positioned on the inner wall of the sub-trough 1, thereby increasing the internal circulation of the electroplating solution; increasing the external circulation to ensure the temperature of the entire tank body and the fixture; and increasing the decomposition of nickel beads in the plating solution main tank.

[0026] Furthermore, the sub-tank 1 is located above the plating liquid main tank 3, a frame 2 is positioned and installed on the outer side of the plating liquid main tank 3, the sub-tank 1 is installed on the frame 2, a drain pipe 13 is connected to the bottom of the plating liquid main tank 3, and an external circulation and an internal circulation are arranged between the sub-tank 1 and the plating liquid main tank 3.

[0027] Furthermore, the external circulation structure includes a filter 6, a water pump 7, a heating pipe 4 and a main return pipe 11, the filter 6 is connected to the water pump 7, the water pump 7 is connected to the sub-tank 1, and the heating pipe 4 and the main return pipe 11 are connected to the position of the sub-tank 1.

[0028] Furthermore, the internal circulation structure includes a reaction water inlet pipe 12, a liquid level temperature control probe 5 and a micro water pump 8. The reaction water inlet pipe 12 is connected to the position of the sub-trough body 14 inside the sub-trough 1, and the other end of the reaction water inlet pipe 12 is connected to the micro water pump 8, and the micro water pump 8 is connected to the liquid level temperature control probe 5.

[0029] Furthermore, anode titanium blue 9 and cathode titanium blue 10 are arranged inside the plating solution master tank 3. The cathode titanium blue 10 is located between the two groups of anode titanium blue 9 and is arranged at intervals.

[0030] Furthermore, the cathode conductive plate 21 is fixed to the sub-slot body 14 by bolts, the electroformed layer 15 is integrally formed at a position inside the sub-slot body 14 , and the plating solution directly passes through the position of the corundum 19 .

[0031] Furthermore, the sub-tank 1 is connected to the plating solution main tank 3 through internal circulation and external circulation, and the external circulation controls the temperature of the tank body and the fixture.

[0032] Working principle: The present invention comprises a sub-tank 1, a frame 2, a plating solution main tank 3, a heating tube 4, a liquid level temperature control probe 5, a filter 6, a water pump 7, a micro water pump 8, an anode titanium blue 9, a cathode titanium blue 10, a total return water pipe 11, a reaction water inlet pipe 12, a drain pipe 13, a sub-tank body 14, an electroforming layer 15, an anode conductive rod 16, a graphite fixture 17, an upper cover plate 18, corundum 19, a reaction water inlet 20, a cathode conductive plate 21, a return water straight pipe 22, a tank body water inlet pipe 23, and a reaction water inlet pipe is added. The plating solution is directly drawn from the plating solution main tank through the corundum by a micro pump. , forming a stable water flow; when the plating solution passes through the corundum stably, the anode and cathode are connected to the rectifier, and the nickel ions in the plating solution will move to the surface of the graphite fixture, and the nickel ions will slowly form a coating by bonding the corundum; the water pump draws the plating solution from the plating solution mother tank through the filter into the sub-tank, and then returns to the mother tank from the total return water, so that the temperature of the entire sub-tank is maintained at a constant temperature; the anode titanium blue and the cathode titanium blue are directly placed in the plating solution mother tank to directly decompose the nickel beads, so that the concentration in the plating solution tank is guaranteed to be within a reasonable range; the plating solution directly passes through the corundum and is integrally formed as a coating on the surface of the corundum.

[0033] It should be noted that, in this article, relational terms such as first and second (number one, number two), etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0034] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A diamond tool electroplating device, comprising a sub-tank (1) and a plating solution main tank (3), characterized in that: A tank body water inlet pipe (23) is installed in the middle of the bottom of the sub-tank (1), a sub-tank tank body (14) is installed on the tank body water inlet pipe (23), a reaction water inlet (20) is connected to the bottom of the tank body water inlet pipe (23), a cathode conductive plate (21) and an anode conductive rod (16) are arranged on the sub-tank tank body (14), an electroforming layer (15) and corundum (19) are arranged inside the sub-tank tank body (14), a graphite jig (17) is positioned outside the sub-tank (1), a return water straight pipe (22) is positioned inside the sub-tank (1), and an upper cover plate (18) is positioned on the inner side wall of the sub-tank (1).

2. The electroplating equipment for diamond tools according to claim 1, characterized in that: The sub-tank (1) is located above the plating solution main tank (3); a frame (2) is positioned and installed outside the plating solution main tank (3); the sub-tank (1) is installed on the frame (2); a drain pipe (13) is connected to the bottom of the plating solution main tank (3); and an external circulation and an internal circulation are arranged between the sub-tank (1) and the plating solution main tank (3).

3. The electroplating equipment for diamond tools according to claim 2, characterized in that: The external circulation structure comprises a filter (6), a water pump (7), a heating pipe (4) and a main water return pipe (11), wherein the filter (6) is connected to the water pump (7), the water pump (7) is connected to the sub-tank (1), and the heating pipe (4) and the main water return pipe (11) are connected to the position of the sub-tank (1).

4. The electroplating equipment for diamond tools according to claim 2, characterized in that: The internal circulation structure comprises a reaction water inlet pipe (12), a liquid level temperature control probe (5) and a micro water pump (8); the reaction water inlet pipe (12) is connected to the position of the sub-trough body (14) inside the sub-trough (1); the other end of the reaction water inlet pipe (12) is connected to the micro water pump (8); and the micro water pump (8) is connected to the liquid level temperature control probe (5).

5. The electroplating equipment for diamond tools according to claim 1, characterized in that: Anode titanium blue (9) and cathode titanium blue (10) are arranged inside the plating solution master tank (3); the cathode titanium blue (10) is located between the two groups of anode titanium blue (9) and is arranged at intervals.

6. The electroplating equipment for diamond tools according to claim 1, characterized in that: The cathode conductive plate (21) is fixed to the sub-slot body (14) by bolts, and the electroformed layer (15) is integrally formed at a position inside the sub-slot body (14) and directly passes through the plating solution at the position of the corundum (19).

7. The electroplating equipment for diamond tools according to claim 2, characterized in that: The sub-tank (1) is connected to the plating solution main tank (3) via an internal circulation and an external circulation, and the external circulation controls the temperature of the tank body and the fixture.

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