Electroplating equipment with adjustable sealing coefficient

Abstract

The utility model relates to the field of electroplating liquid sealing in the electroplating process, in particular to electroplating equipment with an adjustable sealing coefficient, which comprises a tank body for electroplating operation, an opening is arranged on the side surface of the tank body, a window is arranged in the opening, and a sealing mechanism with an adjustable expansion coefficient is arranged between the window and the opening. And the sealing mechanism is filled with gas to fill a gap between the window and the tank body. According to the utility model, the sealing mechanism with the variable expansion coefficient is used, the variable capacity can cope with the change of gaps, so that the problem of leakage of electroplating liquid is solved, and compared with a traditional sealing strip, the variable capacity of the expansion coefficient can avoid the problem of frequent replacement and save a large amount of cost; furthermore, the mode of expanding by virtue of gas is adopted, so that the positions of the window and the traditional sealing strip do not need to be manually and deliberately adjusted, and therefore, the assembly stability brought by the sealing mechanism is remarkably improved.

Description

Technical Field

[0001] The utility model relates to the field of sealing electroplating liquid in the electroplating process, in particular to electroplating equipment with adjustable sealing coefficient. Background Art

[0002] The visual window in the electroplating equipment is designed to facilitate operators to observe the preparation of the coating on the circuit board in the electroplating solution.

[0003] In the electroplating equipment, the window 300, as a part of the liquid storage container, needs to be sealed with the first shell; conventional sealing treatment is an assembly method of squeezing a sealing strip (not shown in the figure) through glass, such as Figure 1-3 As shown, the first shell and the second shell 301 are fixedly connected. In this assembly method, the glass is squeezed against the sealing strip in the sealing groove 303 of the first shell through the handle 302 on the window 300, and the handle 302 is rotated so that the engaging part on the handle 302 is inserted into the groove on the second shell 301, thereby achieving sealing between the glass and the shell.

[0004] However, this assembly method has the following problems:

[0005] 1. Since the inner side of the window is often adhered to by plating liquid, which is a kind of chemical liquid and is corrosive, the glass will be affected by the plating liquid after long-term use, which will affect the sealing effect between the window and the sealing strip.

[0006] 2. The sealing strip itself will also age, and the sealing performance will decrease with the passage of time.

[0007] 3. Since the glass is pre-pressed manually and then positioned by rotating the handle, during the pre-pressing step, there is a situation where the position of the glass and the rubber strip is not completely consistent, and the plating liquid will seep out from the gap.

[0008] In order to prevent the problem of electroplating liquid leakage, the sealing strip needs to be replaced frequently. Since the size of the sealing strip is fixed, simply replacing the sealing strip after the window is corroded cannot solve the leakage problem. Therefore, the window needs to be replaced regularly. This mode of replacing windows and sealing strips has high costs. In addition, the entire production line needs to be shut down during replacement. Frequent replacement will affect the production efficiency of the entire production line. Utility Model Content

[0009] In order to solve the above problems, the utility model provides an electroplating device with an adjustable sealing coefficient, which adjusts the expansion coefficient in different stages by using an inflatable sealing structure, thereby solving the problem of frequent replacement of sealing strips and windows.

[0010] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an electroplating device with an adjustable sealing coefficient, comprising a trough body for electroplating operations, an opening being provided on the side of the trough body, and a window being arranged in the opening, characterized in that a sealing mechanism with an adjustable expansion coefficient is provided between the window and the opening, and the sealing mechanism is filled with gas inside to fill the gap between the window and the trough body.

[0011] Furthermore, the sealing mechanism comprises a sealing strip, a solenoid valve and an air pump. The sealing strip is located between the window and the opening. The sealing strip is an internally hollow structure. The output end of the air pump is connected to the sealing strip via a pneumatic valve.

[0012] Furthermore, the back side of the window includes a frame body corresponding to the edge of the opening, and the sealing strip is sleeved on the outer peripheral surface of the frame body.

[0013] Furthermore, a groove adapted to the sealing strip is provided on the outer peripheral surface of the frame, and the sealing strip is arranged in the groove.

[0014] Furthermore, the electroplating equipment also includes a conveying mechanism and a clamp, wherein the clamp is fixed on the transport surface of the conveying mechanism, and the circuit board is clamped by the clamp to move in the tank body, wherein the clamp is connected to the cathode, and a conductive plate contacting the circuit board is provided at the bottom of the tank body, and the conductive plate is connected to the positive electrode.

[0015] Furthermore, the conveying mechanism has a stationary surface, a lifting plate is provided on the stationary surface, and a movable track with a slope is provided on the lifting plate. The clamp includes a lower clamp fixed on the conveying mechanism, and an upper clamp movably connected to the side of the lower clamp. One end of the upper clamp and the lower clamp is provided with a clamping end formed with an arc, and the other end of the upper clamp extends toward the movable track, and a lifting rod that can enter the movable track is provided on its side. After the lifting rod passes the slope, the clamping end of the upper clamp is away from the clamping end of the lower clamp.

[0016] Beneficial effects of the utility model:

[0017] The utility model uses a sealing mechanism with a variable expansion coefficient. This variable ability can cope with changes in the gap, thereby solving the problem of electroplating liquid leakage. Secondly, compared with traditional sealing strips, the variable expansion coefficient ability can avoid the problem of frequent replacement and save a lot of cost. Furthermore, by relying on gas expansion, there is no need to deliberately adjust the position of the window and the traditional sealing strip like manual labor. Therefore, the assembly stability brought by the sealing mechanism is significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a stereogram in the prior art.

[0019] Figure 2 yes Figure 1 A three-dimensional image of the middle shell and window after being unpacked.

[0020] Figure 3 yes Figure 2 Enlarged schematic diagram of point C.

[0021] Figure 4 It is a stereogram of the utility model.

[0022] Figure 5 yes Figure 4 An enlarged schematic diagram of point A.

[0023] Figure 6 yes Figure 4 An enlarged schematic diagram of point B.

[0024] Figure 7 It is a three-dimensional diagram after the window and the sealing mechanism are connected.

[0025] Figure 8 yes Figure 7 Another perspective view.

[0026] Fig. 9 yes Figure 7 A three-dimensional diagram of the sealing mechanism after separation.

[0027] Fig.10 It is the structural diagram of the fixture. DETAILED DESCRIPTION

[0028] This embodiment is an electroplating device used to thicken copper on a circuit board.

[0029] like Figure 4-5 As shown, the electroplating equipment includes a tank body 4, and the interior of the tank body 4 is combined with other spraying equipment to perform copper plating operations on the circuit board.

[0030] A conveying mechanism 1, a clamp 2 and a conductive plate 3 are provided in the trough body 4. The conveying surface of the conveying mechanism 1 is located on the circumferential surface of the conveying mechanism 1, which is obtained by adjusting the position relationship of the conventional conveying mechanism 1. The clamp 2 is assembled on the conveying surface. Under the action of the conveying surface, the clamp 2 clamps the circuit board and pushes it in the exit direction X. The conductive plate 3 is located at the bottom of the trough body 4. When the circuit board is pushed by the clamp 2, the circuit board is in contact with the conductive plate 3.

[0031] The conductive plate 3 is connected to the anode, the fixture 2 is connected to the cathode, and the tank 4 is filled with electroplating liquid. When the circuit is turned on, the copper ions are transferred to the circuit board to achieve copper thickening.

[0032] like Fig.10As shown, the clamp 2 includes an upper clamp 2a and a lower clamp 2b, the upper clamp 2a and the lower clamp 2b are slidably connected, the lower clamp 2b is fixed on the transport surface, and a lifting rod 3 is provided on the top side of the upper clamp 2a. The top surface of the conveying mechanism 1 is a stationary surface adjacent to the transport surface, and a lifting plate 100 (such as Figure 6 As shown in the figure, a moving track 100a with a slope E is provided on the lifting plate 100, and the bottom ends of the upper clamping piece 2a and the lower clamping piece 2b are both clamping ends 2' to be curved, and are maintained in an upper and lower position relationship. When moving on the transport surface, the lifting rod 3 will enter the moving track 100a, and due to the existence of the slope E, the upper clamping piece 2a will move upward, and the clamping end 2' of the upper clamping piece 2a will be lifted from the clamping end 2' of the lower clamping piece 2b, forming a space for the circuit board to enter;

[0033] It should be noted that between the upper clamp 2a and the lower clamp 2b, there are a guide seat 200, a compression spring 201, and a pressure plate 202 in sequence from top to bottom. The guide seat 200 is fixed on the surface of the lower clamp 2b, and the pressure plate 202 is arranged on the back of the upper clamp 2a. The upper clamp 2a is slidably connected to the guide seat 200. When the upper clamp 2a passes through the slope E, the pressure plate 202 applies pressure to the compression spring 201, causing the compression spring 201 to produce a deformed state; when the upper clamp 2a passes through the slope E, the upper clamp 2a will be in a state of clamping the circuit board with the lower clamp 2a due to the reset relationship of the compression spring 201.

[0034] In the embodiment, a plurality of such clamps 2 are provided.

[0035] An opening is provided on the side of the groove body 4, and the window 5 is arranged in the opening. A sealing mechanism with an adjustable expansion coefficient is provided between the window 5 and the opening. The sealing mechanism is filled with gas inside to fill the gap between the window 5 and the groove body 4. It is not difficult to see that the ability of the sealing mechanism to expand in volume can cope with the situation where the window 5 is corroded and the gap becomes larger, thereby reducing the replacement frequency of the window 5.

[0036] like Figure 7-9 As shown, specifically, the sealing mechanism includes a sealing strip 51, a solenoid valve (not shown in the figure) and an air pump (not shown in the figure). The sealing strip 51 is a hollow structure and is located between the window 5 and the opening. The output end of the air pump is connected to the sealing strip 51 through a pneumatic valve. By injecting air into the sealing strip 51, the sealing strip 51 expands. When the gap needs to be enlarged, compressed air is introduced through the air pump to make the sealing strip 51 continue to expand.

[0037] In the embodiment, the back side of the window 5 includes a frame 52 , and the sealing strip 51 is sleeved on the outer peripheral surface of the frame 52 .

[0038] The outer surface of the frame 52 is provided with a groove 52' adapted to the sealing strip 51, and the sealing strip 51 is arranged in the groove 52'. Before assembly, the sealing strip 51 can be pre-set in the groove 52'. The groove 52' can impose certain constraints on the sealing strip 51, so that the sealing strip 51 is not easy to fall off from the window 5 during assembly.

[0039] The above implementation modes are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary engineering and technical personnel in the field shall fall within the protection scope determined by the claims of the present invention.

Claims

1. An electroplating device with adjustable sealing coefficient, comprising a tank body for electroplating operation, an opening is provided on the side of the tank body, and a window is provided in the opening, characterized in that: A sealing mechanism with an adjustable expansion coefficient is arranged between the window and the opening. The sealing mechanism is filled with gas to fill the gap between the window and the slot body.

2. The electroplating equipment with adjustable sealing coefficient according to claim 1, characterized in that: The sealing mechanism comprises a sealing strip, a solenoid valve and an air pump. The sealing strip is located between the viewing window and the opening, and the output end of the air pump is connected to the sealing strip through a pneumatic valve.

3. The electroplating equipment with adjustable sealing coefficient according to claim 1, characterized in that: The back of the window includes a frame, and the sealing strip is sleeved on the outer peripheral surface of the frame.

4. The electroplating equipment with adjustable sealing coefficient according to claim 3, characterized in that: A groove adapted to the sealing strip is arranged on the outer peripheral surface of the frame, and the sealing strip is arranged in the groove.

5. The electroplating equipment with adjustable sealing coefficient according to claim 1, characterized in that: The electroplating equipment also includes a conveying mechanism and a clamp, which is fixed on the transport surface of the conveying mechanism. The circuit board is clamped by the clamp and moves in the tank body, wherein the clamp is connected to the cathode, and a conductive plate contacting the circuit board is provided at the bottom of the tank body, and the conductive plate is connected to the positive electrode.

6. The electroplating equipment with adjustable sealing coefficient according to claim 5, characterized in that: The conveying mechanism has a stationary surface, a lifting plate is provided on the stationary surface, and a moving track with a slope is provided on the lifting plate. The clamp includes a lower clamp fixed on the conveying mechanism, and an upper clamp movably connected to the side of the lower clamp. One end of the upper clamp and the lower clamp is provided with a clamping end formed with an arc, and the other end of the upper clamp extends toward the moving track, and a lifting rod that can enter the moving track is provided on its side. After the lifting rod passes the slope, the clamping end of the upper clamp is away from the clamping end of the lower clamp.

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