Baking and flattening jig
By designing a baking and flattening ware including a rectangular base plate, limiting column, a weight table and a weighted sheet, the problems of substrate bending and gold ball breaking during the baking process of semiconductor chips are solved, and a more convenient and accurate baking and flattening effect is achieved to ensure product quality.
Patent Information
- Application Number
- CN202421302401.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-06-07
AI Technical Summary
In the existing semiconductor chip packaging process, the substrate is prone to bend during baking, resulting in layering and breaking of the gold ball, resulting in product scrapping. The existing baking and flattening methods are inconvenient, difficult to achieve flattening, and inaccurate weight selection, which makes it easy to compress the chip or fail to achieve flattening effect.
A baking and flattening ware is designed, including a rectangular base plate, limit column, a weight table and a weight sheet. A weight sensor is installed on the bottom of the pressure table and a weight display screen is installed on the front. These components are accurately selected to level and flatten.
The flat stacking and pressure weight of the semiconductor chip outside the oven is achieved, ensuring that the chip does not bending or break during the baking process, and the operation is more convenient and quick, avoiding chip damage caused by improper weight selection.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chip packaging, in particular to a baking and flattening jig. Background Art
[0002] In the existing semiconductor chip packaging process, after the plastic sealing process is completed, the product needs to be placed in an oven for baking. During the baking process, the high temperature will cause the substrate to bend, resulting in stratification of the substrate and breakage of the gold balls in the substrate, causing the product to be scrapped.
[0003] Therefore, it is necessary to bake and flatten the semiconductor chips during the baking process to prevent the semiconductor chips from bending during baking. The existing method is to stack the semiconductor chips in the oven and directly press heavy objects on the surface of the semiconductor chips. This operation has the following disadvantages: first, it is inconvenient to operate in the oven; second, the stacked semiconductor chips are prone to deflection and cannot be flattened; third, the weight requirements for placing heavy objects on different products are different, and the required weight cannot be accurately selected. If the weight is too heavy, it is easy to damage the semiconductor chip, and if the weight is too light, it will not play the role of baking and flattening. Utility Model Content
[0004] In order to solve the above technical problems, the utility model designs a baking and flattening jig.
[0005] The utility model adopts the following technical solutions:
[0006] A baking flattening jig comprises a jig body, wherein the jig body comprises a rectangular bottom plate, wherein the four corners of the rectangular bottom plate are respectively fixedly connected to limiting columns, and a semiconductor chip product stacking space with an upper end open is formed between the four limiting columns, and a weighting platform matched with the cross-section of the semiconductor chip product and a plurality of weighting sheets of different weights are correspondingly placed in the semiconductor chip product stacking space, which are used to flatten the semiconductor chip product, and a weight sensor is installed on the bottom surface of the weighting platform, and a weight display screen is installed on the front surface of the weighting platform, which is connected to display the weight sensor sensing weight.
[0007] Preferably, the limiting posts are L-shaped posts, and a semiconductor chip product stacking space with a rectangular cross-section is formed between the four limiting posts.
[0008] Preferably, the side surfaces of the weighting platform and the weighting sheet are provided with carrying openings, so as to facilitate the weighting platform and the weighting sheet to be placed flatly in the stacking space of the semiconductor chip products and press the flatly stacked semiconductor chip products.
[0009] Preferably, the carrying opening is a waist-shaped hole.
[0010] Preferably, handles are installed on both sides of the fixture body, so as to facilitate putting the baking flattening fixture and the semiconductor chip into the oven during baking.
[0011] Preferably, the rectangular bottom plate and the four limiting columns are fixedly connected by hand-tightened bolts and screw holes.
[0012] The beneficial effects of the utility model are as follows: the utility model designs a baking flattening jig, which can accurately select the required weight of the weighting sheet through the weight sensor installed on the bottom surface of the weighting platform and the weight display screen installed on the front surface of the weighting platform to press the flatly stacked semiconductor chip products. At the same time, the semiconductor chip products can be stacked and weighed outside the oven, and then put into the oven together with the jig, which is more convenient, quick and labor-saving. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a structural schematic diagram of the utility model;
[0014] Figure 2 It is a front view of the utility model;
[0015] Figure 3 It is a left side view of the utility model;
[0016] In the figure: 1. rectangular bottom plate, 2. limiting column, 3. weight platform, 4. weight plate, 5. hand-tightened bolts, 6. handle, 7. weight display screen, 8. carrying port. DETAILED DESCRIPTION
[0017] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings:
[0018] Example: Figure 1-Figure 3 As shown, a baking flattening jig includes a jig body, wherein the jig body includes a rectangular bottom plate 1, and the four corners of the rectangular bottom plate are respectively fixedly connected to limiting columns 2, and a semiconductor chip product stacking space with an upper end open is formed between the four limiting columns. A weighting platform 3 matched with the cross-section of the semiconductor chip product and a plurality of weighting sheets 4 of different weights are correspondingly placed in the semiconductor chip product stacking space, which are used to flatten the semiconductor chip product. A weight sensor is installed on the bottom surface of the weighting platform, and a weight display screen 7 is installed on the front surface of the weighting platform, which is connected to display the weight sensed by the weight sensor.
[0019] The limiting columns are L-shaped columns, and a semiconductor chip product stacking space with a rectangular cross-section is formed between the four limiting columns.
[0020] The sides of the weighting platform and the weighting sheet are provided with a hand port 8. The hand port is a waist-round hole.
[0021] Handles 6 are respectively installed on both sides of the fixture body. The rectangular bottom plate and the four limit columns are fixedly connected by hand-tightening bolts 5 and screw holes.
[0022] When using the baking flattening jig, place semiconductor chip products one by one into the stacking space of semiconductor chip products, about 15 pieces, then use the handle to extract the weighting platform and flatten it on top of the semiconductor chip product, check the weight displayed on the weight display, and add weighting sheets as needed until the weight displayed on the weight display meets the weight requirements. Finally, use the handle to put the baking flattening jig and the product into the oven for baking, which is convenient, fast and labor-saving.
[0023] The above-described embodiment is only a preferred solution of the present invention and does not limit the present invention in any form. There are other variations and modifications without exceeding the technical solution described in the claims.
Claims
1. A baking flattening jig, comprising a jig body, characterized in that: The fixture body includes a rectangular base plate, and the four corners of the rectangular base plate are respectively fixedly connected to limit columns, and a semiconductor chip product stacking space with an open upper end is formed between the four limit columns. A weighting platform that matches the cross-section of the semiconductor chip product and a plurality of weighting sheets of different weights are placed in the semiconductor chip product stacking space, which are used to flatten and press the semiconductor chip product. A weight sensor is installed on the bottom surface of the weighting platform, and a weight display screen is installed on the front of the weighting platform, which is connected to display the weight sensor sensing weight.
2. The baking and flattening jig according to claim 1, characterized in that: The limiting posts are L-shaped posts, and a semiconductor chip product stacking space with a rectangular cross section is formed between the four limiting posts.
3. The baking and flattening jig according to claim 1, characterized in that: The sides of the weight-bearing platform and the weight-adding sheet are provided with carrying openings.
4. The baking and flattening jig according to claim 3, characterized in that: The carrying opening is a waist-round hole.
5. The baking and flattening jig according to claim 1, characterized in that: Handles are respectively installed on both sides of the fixture body.
6. The baking and flattening jig according to claim 1, characterized in that: The rectangular bottom plate and the four limiting columns are fixedly connected by hand-tightened bolts and screw holes.