Plasma etching chamber cover plate

Abstract

According to the plasma etching chamber cover plate provided by the utility model, the side wall of the plasma etching chamber cover plate is provided with the annular carrying groove of which the opening width is greater than the groove bottom width, so that the plasma etching chamber cover plate can be mounted and carried through the annular carrying groove, and the annular carrying groove can be convenient for a worker to adjust the carrying position; the contact area between the fingers and the plasma etching chamber cover plate is enlarged, labor is saved, extrusion between the fingers and the GDP adjusting support hook in the installation process can be avoided, the fingers of personnel are prevented from being injured, collision between the plasma etching chamber cover plate and the GDP adjusting support hook in the installation process can be avoided, and the installation efficiency is improved. The damage of the plasma etching chamber cover plate is avoided, so that the installation safety and reliability can be greatly improved; furthermore, the application convenience and the application range of the plasma etching chamber cover plate can be further expanded by setting various sizes and shapes of the annular carrying groove.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment and relates to a plasma etching chamber cover. Background Art

[0002] In the semiconductor field, etching is an important process in device preparation. Patterning can be performed through the etching process to form grooves or through-holes for interconnection, thereby meeting the preparation of interconnection lines in the process.

[0003] Plasma etching is a process whereby ionized plasma combines with the surface of the material being treated to react and produce volatile substances, which are then removed by vacuum to complete the surface treatment process. Plasma is generated by the electric field provided by the electrode coils in the plasma etching equipment acting on the gas introduced into the reaction chamber through the gas distribution plate (GDP), causing the gas to be generated under the action of the electric field.

[0004] In existing plasma etching equipment, see Figure 1 and Figure 2 A chamber cover 110 is located between the top electrode coil and the gas distribution plate. It is used to seal the etching chamber to ensure that the chamber reaches the required vacuum level. Four transfer slots 111 are spaced apart on the sidewalls of the chamber cover 110 to facilitate installation and transportation of the chamber cover 110.

[0005] In actual application, the chamber cover 110 itself is heavy, about 20 kg, and the contact surface of the transport groove 111 is narrow, so it is difficult to carry it. In addition, during the installation process, the location of the transport groove 111 is close to the location of the GDP adjustment bracket hook 120. Figure 2 The transport slot 111 corresponds to the GDP adjustment bracket hook 120 up and down, so when the chamber cover 110 is installed, it is very easy to be squeezed and collided, causing injuries to personnel fingers and damage to the chamber cover 110 itself.

[0006] Therefore, it is necessary to provide a plasma etching chamber cover. Utility Model Content

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a plasma etching chamber cover plate, which is used to solve the installation and transportation problems encountered by the plasma etching chamber cover plate in the prior art.

[0008] In order to achieve the above-mentioned purpose and other related purposes, the present invention provides a plasma etching chamber cover plate, wherein an annular conveying groove is provided on the side wall of the plasma etching chamber cover plate, and the opening width of the annular conveying groove is greater than the groove bottom width of the annular conveying groove, and the plasma etching chamber cover plate is installed and conveyed through the annular conveying groove.

[0009] Optionally, the cross-sectional shape of the annular conveying groove includes one or a combination of a trapezoid, a triangle and an arc.

[0010] Optionally, the opening width of the annular conveying groove is 2 to 5 cm; the groove depth of the annular conveying groove is 2 to 5 cm.

[0011] Optionally, the annular conveying grooves have the same or different opening widths, and the annular conveying grooves are symmetrically distributed along the center of the plasma etching chamber cover.

[0012] Optionally, the annular transport grooves have the same or different groove depths, and the annular transport grooves are symmetrically distributed along the center of the plasma etching chamber cover.

[0013] Optionally, the annular conveying groove is an S-shaped annular conveying groove, and the S-shaped annular conveying groove is symmetrically distributed along the center of the plasma etching chamber cover.

[0014] Optionally, the plasma etching chamber cover plate includes a ceramic cover plate or a quartz cover plate.

[0015] Optionally, the surface of the annular conveying groove is provided with anti-slip threads.

[0016] As described above, the plasma etching chamber cover of the present invention is provided with an annular conveying groove with an opening width greater than the groove bottom width on its side wall, so that the plasma etching chamber cover can be installed and transported through the annular conveying groove, wherein the annular conveying groove can facilitate the staff to adjust the conveying position, increase the contact area between the fingers and the plasma etching chamber cover, save effort, and avoid the squeezing of the fingers and the GDP adjustment bracket hook during the installation process, thereby avoiding injury to the personnel's fingers, and avoiding the collision between the plasma etching chamber cover and the GDP adjustment bracket hook during the installation process, thereby avoiding damage to the plasma etching chamber cover itself, thereby greatly increasing the installation safety and reliability; further, by setting the annular conveying groove to various sizes and morphologies, the application convenience and application scope of the plasma etching chamber cover can be further expanded. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of a chamber cover in the prior art.

[0018] Figure 2It shows a schematic structural diagram of the chamber cover when it is installed in the prior art.

[0019] Figure 3 Shown is a structural schematic diagram of a plasma etching chamber cover in an embodiment of the present invention.

[0020] Figure 4 Display as Figure 3 Schematic diagrams of three structures of annular conveying trough along the C-C' section.

[0021] Figure 5 Display as Figure 3 Schematic diagrams of three structures after the annular conveying trough along the D-D' section is unfolded.

[0022] Component number description

[0023] 110 chamber cover

[0024] 111 transport trough

[0025] 120 GDP adjustment bracket link

[0026] 210 plasma etching chamber cover

[0027] 211 annular conveying trough DETAILED DESCRIPTION

[0028] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0029] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0030] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] See Figure 3This embodiment provides a plasma etching chamber cover plate 210, and an annular conveying groove 211 is provided on the side wall of the plasma etching chamber cover plate 210. The opening width of the annular conveying groove 211 is greater than the groove bottom width of the annular conveying groove 211, so that the plasma etching chamber cover plate 210 can be installed and conveyed through the annular conveying groove 211.

[0032] Among them, the annular conveying groove 211 is annular, which can facilitate the staff to adjust the conveying position, avoid the squeezing of fingers and the GDP adjustment bracket hook during the installation process, avoid injury to personnel fingers, and avoid the collision of the plasma etching chamber cover 210 and the GDP adjustment bracket hook during the installation process, avoid damage to the plasma etching chamber cover 210 itself, and greatly increase the installation safety and reliability; the annular conveying groove 211 with an opening width greater than the groove bottom width can increase the contact area between the fingers and the plasma etching chamber cover 210, and facilitate the transfer of the annular conveying groove 211.

[0033] As an example, the cross-sectional shape of the annular conveying groove 211 may include one or a combination of a trapezoid, a triangle, and an arc.

[0034] Specifically, such as Figure 4 The annular conveying groove 211 is shown in three different shapes: (a) a trapezoidal cross-section, (b) a triangular cross-section, and (c) an arcuate cross-section. However, the cross-sectional shape of the annular conveying groove 211 is not limited to these and can be selected as needed. In this embodiment, the cross-sectional shape of the annular conveying groove 211 is preferably the arcuate cross-section shown in (c), but is not limited to this.

[0035] As an example, the opening width of the annular conveying groove 211 is engraved to be 2 to 5 cm; the groove depth of the annular conveying groove 211 is engraved to be 2 to 5 cm.

[0036] Specifically, in order to facilitate the installation and transportation of the annular conveying groove 211 by personnel, the opening width of the annular conveying groove 211 is preferably 2 to 5 cm, such as 2 cm, 3 cm, 5 cm, etc., and the groove depth of the annular conveying groove 211 can be 2 to 5 cm, such as 2 cm, 3 cm, 5 cm, etc., but the selection of the specific size of the annular conveying groove 211 is not limited to this, and no excessive restrictions are made here.

[0037] As an example, the annular conveying grooves 211 may have the same or different opening widths, and the annular conveying grooves 211 are symmetrically distributed along the center of the plasma etching chamber cover 210 .

[0038] Specifically, such as Figure 5 Indicated that Figure 3The three morphologies of the annular conveying groove 211 after the plasma etching chamber cover 210 is cut and unfolded along D-D' in the figure. (a) illustrates the morphology of the annular conveying groove 211 with the same opening width, and (b) illustrates the morphology of the annular conveying groove 211 with different opening widths. Because the annular conveying groove 211 in (b) has different opening widths, the conveying position can be flexibly selected according to the needs of the actual conveying personnel, such as the annular conveying groove 211 with a small opening width or the annular conveying groove 211 with a large opening width.

[0039] Among them, it is preferred that the annular conveying groove 211 is symmetrically distributed along the center of the plasma etching chamber cover 210 to facilitate conveying.

[0040] Similarly, the annular conveying groove 211 can be configured to have the same or different groove depths, and preferably the annular conveying groove 211 is symmetrically distributed along the center of the plasma etching chamber cover 210 so that the conveying position can be flexibly selected according to personnel needs.

[0041] As an example, the annular conveying groove 211 may be an S-shaped annular conveying groove 211 , and the S-shaped annular conveying groove 211 is symmetrically distributed along the center of the plasma etching chamber cover 210 .

[0042] Specifically, such as Figure 5 (a) illustrates the shape of the linear annular conveying groove 211, and (c) illustrates the shape of the S-shaped annular conveying groove 211. When the shape of the annular conveying groove 211 is set to be S-shaped, contact positions on different planes can be selected according to installation and conveying requirements to expand application flexibility and application range.

[0043] As an example, the plasma etching chamber cover plate 210 may include a ceramic cover plate or a quartz cover plate.

[0044] Specifically, the specific type of the plasma etching chamber cover plate 210 can be selected according to needs. For example, the plasma etching chamber cover plate 210 can be a ceramic cover plate or a quartz cover plate, etc., and no excessive restrictions are imposed here.

[0045] As an example, the surface of the annular conveying groove 211 may be provided with anti-slip threads.

[0046] Specifically, in order to further improve the stability when transporting the plasma etching chamber cover 210, anti-slip threads, such as strip anti-slip threads, mesh anti-slip threads, etc., can be set on the surface of the annular transport groove 211 to avoid slipping during installation and transportation. The specific selection can be made according to needs.

[0047] In summary, the plasma etching chamber cover of the present invention is provided with an annular conveying groove on its side wall, the opening width of which is greater than the width of the groove bottom, so that the plasma etching chamber cover can be installed and transported through the annular conveying groove. The annular conveying groove can facilitate the adjustment of the conveying position by the staff, increase the contact area between the fingers and the plasma etching chamber cover, save labor, and avoid the squeezing of the fingers and the GDP adjustment bracket hook during the installation process, thereby avoiding injury to the personnel's fingers. It can also avoid the collision between the plasma etching chamber cover and the GDP adjustment bracket hook during the installation process, thereby avoiding damage to the plasma etching chamber cover itself, thereby greatly increasing the safety and reliability of the installation. Furthermore, by setting the annular conveying groove in various sizes and shapes, the convenience of application and the scope of application of the plasma etching chamber cover can be further expanded. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0048] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. A plasma etching chamber cover plate, characterized in that: An annular conveying groove is arranged on the side wall of the plasma etching chamber cover plate, the opening width of the annular conveying groove is greater than the groove bottom width of the annular conveying groove, and the plasma etching chamber cover plate is installed and conveyed through the annular conveying groove.

2. The plasma etching chamber cover plate according to claim 1, characterized in that: The cross-sectional shape of the annular conveying groove includes one or a combination of a trapezoid, a triangle and an arc.

3. The plasma etching chamber cover plate according to claim 1, characterized in that: The opening width of the annular conveying groove is 2 to 5 cm; the groove depth of the annular conveying groove is 2 to 5 cm.

4. The plasma etching chamber cover plate according to claim 1, characterized in that: The annular conveying grooves have the same or different opening widths, and the annular conveying grooves are symmetrically distributed along the center of the plasma etching chamber cover.

5. The plasma etching chamber cover plate according to claim 1, characterized in that: The annular conveying grooves have the same or different groove depths, and the annular conveying grooves are symmetrically distributed along the center of the plasma etching chamber cover.

6. The plasma etching chamber cover plate according to claim 1, characterized in that: The annular conveying groove is an S-shaped annular conveying groove, and the S-shaped annular conveying groove is symmetrically distributed along the center of the plasma etching chamber cover.

7. The plasma etching chamber cover plate according to claim 1, characterized in that: The plasma etching chamber cover plate includes a ceramic cover plate or a quartz cover plate.

8. The plasma etching chamber cover plate according to claim 1, characterized in that: The surface of the annular conveying groove is provided with anti-skid threads.

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