Chip cooling device

Abstract

The utility model provides a chip cooling device, which relates to the technical field of chip cooling, and comprises a material conveying mechanism capable of bearing and conveying a plurality of chips; at least one cooling chamber is arranged in each cooling box body, one side of each cooling chamber is open and is used for allowing the material conveying mechanism to pass through, and each cooling chamber can accommodate at least one material conveying mechanism; the inductive switch is arranged on the cooling box body and is used for entering a closed state when the material conveying mechanism enters the cooling chamber; the timing part is connected with the inductive switch and is used for recording the duration of the inductive switch in the on-off state; the problems that in the cooling process after the chips are baked, due to the fact that the number of the chips in each batch is large, the discharging time is not uniform and the like, taking, placing and timing of the chips at the cooling position are tedious, and errors are prone to occurring are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip cooling, and more specifically relates to a chip cooling device. Background Art

[0002] Integrated circuit chips need to be screened for performance before being assembled into electronic products. This process is the chip testing process. There is a key link in the chip testing process, namely chip baking. Chip testing needs to ensure that the performance of the product is not affected by moisture, and at the same time avoid affecting product safety during the reflow soldering process. Therefore, a baking step will be performed before or after the test to remove moisture. This baking process usually needs to be carried out in an environment of 125 degrees Celsius for 12 hours. Since the baked product carries a high temperature, it is necessary to wait for the product temperature to drop to room temperature before normal testing. During the production process, the testing factory generally adopts the natural cooling method, that is, the baked chip is placed on the material transport cart for 1 hour at room temperature, and the next step of testing is carried out after the product temperature drops. Since the number of products in each batch is large and the time of leaving the oven is not uniform, this requires operators to mark the status of the baked product, record the start time of cooling, and distinguish the cooling time. If these operations are performed in the wrong position or with wrong records, it is easy to cause the baked products to be tested before they reach room temperature, thus affecting the test results and data. At the same time, materials or carriers that have not been completely cooled may pose a risk of burns to operators. Utility Model Content

[0003] The utility model aims to provide a chip cooling device in view of the deficiencies in the prior art, so as to solve the problem that in the process of cooling the chips after baking, the placement and timing of the chips at the cooling position are cumbersome and prone to errors due to the large number of chips in each batch and the non-uniform baking time.

[0004] In order to achieve the above object, the utility model provides a chip cooling device, comprising:

[0005] A material transport mechanism, wherein the material transport mechanism is capable of carrying and transporting a plurality of chips;

[0006] At least two cooling boxes, each of which is provided with at least one cooling chamber, one side of which is open to accommodate the passage of the material transport mechanism, and each of which can accommodate at least one material transport mechanism;

[0007] An induction switch, which is arranged on the cooling box and is used to enter a closed state when the material transport mechanism enters the cooling chamber;

[0008] A timing component is connected to the induction switch and is used to record the duration that the induction switch is in a closed state.

[0009] Optionally, the material transport mechanism is a material transport trolley, and the material transport trolley is provided with a carrying plate, and the carrying plate is used to carry the chip.

[0010] Optionally, air supply components are provided on the top wall and side walls of the cooling box body, and the air supply components are connected to the induction switch and are started up by controlling the induction switch.

[0011] Optionally, the air supply component is an ion fan.

[0012] Optionally, the induction switch is a proximity induction switch.

[0013] Optionally, it also includes a control unit and an indication unit, wherein the control unit is connected to the timing component and the indication unit, and the control unit is used to control the indication unit to send a first indication signal when the duration recorded by the timing component reaches a set duration.

[0014] Optionally, the indicating unit includes a three-color indicator light, and one of the three-color indicator lights is arranged on the outside of the cooling chamber corresponding to the position of each material transport mechanism.

[0015] Optionally, the control unit is provided with a safety lock.

[0016] The utility model provides a chip cooling device, which has the beneficial effect that: the chip cooling device can carry and transport multiple chips at one time through a material conveying mechanism, and can conveniently and efficiently realize the taking and placing of chips during the cooling process. The chip cooling device has at least two cooling boxes, each of which is provided with at least one cooling chamber, and each cooling chamber can accommodate at least one material conveying mechanism. When the material conveying mechanism enters the cooling chamber, the induction switch automatically senses the entry of the material conveying mechanism, and the timing component automatically performs timing, which can accurately record the cooling time of the chip on the material conveying mechanism in the cooling chamber, which is convenient for the operator to take and place the chip, and improves the accuracy of recording the taking and placing position and the cooling time.

[0017] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present invention.

[0019] Figure 1A three-dimensional structural schematic diagram of a chip cooling device according to an embodiment of the utility model is shown.

[0020] Figure 2 A schematic diagram of the front structure of a chip cooling device according to an embodiment of the utility model is shown.

[0021] Figure 3 A partially enlarged schematic diagram of a chip cooling device according to an embodiment of the utility model is shown.

[0022] Figure 4 A schematic diagram of the ion wind flow direction of a chip cooling device according to an embodiment of the utility model is shown.

[0023] Description of reference numerals:

[0024] 1. Material transport mechanism; 2. Cooling box; 3. Cooling chamber; 4. Air supply component; 5. Control unit; 6. Three-color indicator light; 7. Safety lock. DETAILED DESCRIPTION

[0025] The preferred embodiments of the present invention will be described in more detail below. Although the preferred embodiments of the present invention are described below, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0026] like Figure 1 and Figure 2 As shown, the utility model provides a chip cooling device, comprising:

[0027] A material transport mechanism 1, which can carry and transport multiple chips;

[0028] At least two cooling boxes 2, each cooling box 2 is provided with at least one cooling chamber 3, one side of the cooling chamber 3 is open for accommodating the material transport mechanism 1 to pass through, and each cooling chamber 3 can accommodate at least one material transport mechanism 1;

[0029] The induction switch is arranged on the cooling box 2 and is used to enter a closed state when the material transport mechanism 1 enters the cooling chamber 3;

[0030] The timing component is connected to the induction switch and is used to record the length of time the induction switch is in a closed state.

[0031] Specifically, in order to solve the problem that during the cooling process of the chip after baking, the placement and timing of the chips at the cooling position are cumbersome and prone to errors due to the large number of chips in each batch and the non-uniform baking time; the chip cooling device provided by the utility model can carry and transport multiple chips at a time through the conveying mechanism 1, so as to conveniently and efficiently realize the placement of the chips during the cooling process. The chip cooling device has at least two cooling boxes 2, each cooling box 2 is provided with at least one cooling chamber 3, and each cooling chamber 3 can accommodate at least one conveying mechanism 1. When the conveying mechanism 1 enters the cooling chamber 3, the induction switch automatically senses the entry of the conveying mechanism 1, and the timing component automatically counts, which can accurately record the cooling time of the chip on the conveying mechanism 1 in the cooling chamber 3, which is convenient for the operator to take and place the chip, and improves the accuracy of the recording of the placement position and the cooling time.

[0032] Optionally, the material transport mechanism 1 is a material transport trolley, and the material transport trolley is provided with a carrying plate, and the carrying plate is used to carry the chip.

[0033] Specifically, a transport trolley, which is a commonly used transport tool after chip baking, is used. A load plate on the transport trolley is used to carry multiple chips without changing the original chip loading and transportation method. In addition, the transport trolley has a larger capacity, which is conducive to improving work efficiency.

[0034] In this embodiment, the material transport cart includes a rectangular frame with casters at the bottom of the frame for easy movement. A multi-layer supporting plate is arranged inside the frame, and the multi-layer supporting plate can carry a large number of chips with baking ports so as to push them into the cooling chamber 3 for cooling.

[0035] Optionally, air supply components 4 are provided on the top wall and the side walls of the cooling box body 2, and the air supply components 4 are connected to the induction switch and are started up by the induction switch.

[0036] Specifically, the air supply component 4 is used to form an air flow in the cooling chamber 3 to improve the cooling efficiency of the chip. The air supply component 4 is started by a sensing switch. When the sensing switch senses that the material transport vehicle enters the cooling chamber 3, the sensing switch is closed and the air supply component 4 starts automatically.

[0037] Optionally, the air supply component 4 is an ion fan.

[0038] Specifically, the air supply component 4 uses an ion fan to increase the cooling rate; the ion fans are installed in multiple positions to further shorten the cooling time, while also increasing the ESD protection of the product.

[0039] Optionally, the induction switch is a proximity induction switch.

[0040] Specifically, the induction switch can be a proximity induction switch. When the material transport trolley enters the cooling chamber 3, the material transport trolley approaches the induction switch, and the induction switch enters a closed state.

[0041] Optionally, it further includes a control unit 5 and an indication unit, the control unit 5 is connected to the timing component and the indication unit, and the control unit 5 is used to control the indication unit to send a first indication signal when the duration recorded by the timing component reaches a set duration.

[0042] Specifically, the control unit 5 can adopt a PLC, in which a set time is set. When the time when the induction switch is in a closed state recorded by the timing component reaches the set time, the control unit 5 controls the indication unit to send a first indication signal to remind the operator that the chips in the material transport cart have reached the cooling time and the cooling is completed.

[0043] In this embodiment, the control unit 5 further controls the air supply component 4 to shut down when the control indication unit sends the first indication signal.

[0044] Optionally, the indicating unit includes a three-color indicator light 6 , and a three-color indicator light 6 is arranged on the outside of the cooling chamber 3 corresponding to the position of each material transport mechanism 1 .

[0045] Specifically, the indication unit adopts a three-color indicator light 6, and the first indication signal is an indicator light signal of the first color, such as red. That is, when the chips in the material transport cart reach the cooling time and the cooling is completed, the three-color indicator light 6 emits a red light to remind the operator that the material transport cart can be taken away.

[0046] In this embodiment, if Figure 3 As shown, after the material transport trolley in the cooling chamber 3 is taken away, when the sensing switch does not sense the material transport trolley, the sensing switch is in the off state. At this time, under the control of the control unit 5, the indication unit sends a second indication signal, and the second indication signal is an indicator light signal of a second color, such as yellow, that is, when the cooling chamber 3 is idle, the three-color indicator light 6 corresponding to the cooling chamber 3 emits a yellow light; when the air supply component 4 is in the starting state, the control unit 5 controls the indication unit to send a third indication signal, and the third indication signal is an indicator light signal of a third color, such as green, that is, when the cooling chamber 3 is in working state and the air supply component 4 is in the starting process, the three-color indicator light 6 corresponding to the cooling chamber 3 emits a green light.

[0047] Optionally, the control unit 5 is provided with a safety lock 7 .

[0048] Specifically, in order to prevent the setting time parameters set in the control unit 5 from being unprotected and the risk of being accidentally modified by others, a safety lock 7 is provided to prevent unauthorized others from modifying the parameters.

[0049] In summary, when the chip cooling device provided by the utility model is used, the operator places the baked chip product in the material transport cart and uses the material transport cart for transportation; checks the light color of the three-color indicator light 6 on the outside of the cooling chamber 3, yellow represents the waiting state, and the material transport cart can be pushed in to cool the chips on it; after the material transport cart is pushed into place, the induction switch senses the material transport cart, the timing component automatically counts and starts the air supply component 4 to run, at this time the light of the three-color indicator light 6 is green, indicating that cooling is in progress; when the timing component reaches the set time, the countdown ends, the air supply component 4 is turned off, the three-color indicator light 6 emits a red light, and at the same time an alarm is issued, indicating that the cooling of the chips in the material transport cart is completed; the operator pushes the material transport cart out of the cooling chamber 3, and simultaneously presses the alarm cancellation button; after cooling is completed, the material transport cart is transported to the next process.

[0050] The chip cooling device adopts multi-directional ion wind circulation, which can effectively cool the surface and surrounding areas of the chip product. Figure 4 As shown, the ion wind conducts heat with the product heat, thereby ensuring that the chip product after baking has a wide coverage of the cooling position, less obstruction, and uniform cooling. The operator only needs to place the product to be cooled in the empty space of the cooling chamber 3, and directly take out the corresponding product that has been cooled, which greatly reduces the operator's work intensity and improves work efficiency. The setting of the induction switch, timing component, and control unit 5 can ensure that the cooling product meets the requirements of the process room temperature, avoid the adverse effects of inaccurate testing due to high product temperature during the test process; use ion wind cooling in all directions to provide ESD protection for the product during the cooling process; ensure that the cooling time meets the process requirements, and effectively protect the process parameters.

[0051] The various embodiments of the utility model have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A chip cooling device, characterized in that: include: A material transport mechanism, wherein the material transport mechanism is capable of carrying and transporting a plurality of chips; At least two cooling boxes, each of which is provided with at least one cooling chamber, one side of which is open to accommodate the passage of the material transport mechanism, and each of which can accommodate at least one material transport mechanism; An induction switch, which is arranged on the cooling box and is used to enter a closed state when the material transport mechanism enters the cooling chamber; A timing component is connected to the induction switch and is used to record the duration that the induction switch is in a closed state.

2. The chip cooling device according to claim 1, characterized in that: The material transport mechanism is a material transport trolley, and the material transport trolley is provided with a carrying plate, and the carrying plate is used to carry chips.

3. The chip cooling device according to claim 1, characterized in that: The top wall and the side wall of the cooling box are provided with air supply components, which are connected to the induction switch and are started up by the induction switch.

4. The chip cooling device according to claim 3, characterized in that: The air supply component is an ion fan.

5. The chip cooling device according to claim 1, characterized in that: The induction switch is a proximity induction switch.

6. The chip cooling device according to claim 1, characterized in that: It also includes a control unit and an indication unit, wherein the control unit is connected to the timing component and the indication unit, and the control unit is used to control the indication unit to send a first indication signal when the duration recorded by the timing component reaches a set duration.

7. The chip cooling device according to claim 6, characterized in that: The indicating unit comprises a three-color indicator light, and one of the three-color indicator lights is arranged on the outside of the cooling chamber corresponding to the position of each material transport mechanism.

8. The chip cooling device according to claim 6, characterized in that: The control unit is provided with a safety lock.

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