Silicon wafer deviation rectifying mechanism
By designing a silicon wafer correction mechanism including a mounting base, a bracket, a bias correction plate and a bias correction teeth, the problem of poor alignment of the silicon wafer in the lifting device is solved, and the effective alignment of the silicon wafer is achieved to ensure the normal progress of the subsequent process.
Patent Information
- Application Number
- CN202421252670.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-06-03
AI Technical Summary
During the process of silicon wafer processing, the silicon wafer is prone to poor alignment in the lifting device, which affects the processing of subsequent processes.
A silicon wafer deviation correction mechanism is designed, including a mounting base, a bracket arranged in parallel, a deviation correction plate, a deviation correction teeth and a driving member. Through the coordination of the correcting plate and the correcting teeth on the bracket, the silicon wafer is corrected by the action of the correcting plate and the correcting teeth when passing through the bracket.
Effectively adjust the attitude of the silicon wafer to ensure that the silicon wafer is straightened and avoid affecting the processing of subsequent processes.
Smart Images
Figure CN222546328U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon slice processing equipment, in particular to a silicon slice deviation correction mechanism. Background Art
[0002] Silicon is refined from quartz sand. Silicon wafers are purified silicon elements. Then the pure silicon is made into silicon crystal rods, which become the material of quartz semiconductors for manufacturing integrated circuits. With the development of large-scale integrated circuits, silicon wafers are widely used as the main substrate material for semiconductors and other electronic products.
[0003] During the silicon wafer processing, the silicon wafer needs to be transferred between different processing techniques. During the transfer process, the silicon wafer is often not in a straight position in the lifting device, which affects the processing of subsequent processes.
[0004] In view of this, a silicon wafer correction mechanism is urgently needed. Summary of the invention
[0005] In view of the problems existing in the prior art, the utility model solves the problems with the following technical structure.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A silicon wafer deflection correction mechanism comprises: a mounting seat, one side of which is provided with two parallel brackets;
[0008] Two deviation-correcting plates are arranged on opposite sides of the two brackets, and the two deviation-correcting plates on the same bracket are arranged in parallel along the vertical direction.
[0009] A further feature is that
[0010] A plurality of deflection correcting teeth are arranged on the sides of the deflection correcting plates on the two brackets that are close to each other.
[0011] The deflection correcting teeth are fixed on the deflection correcting plate by bolts.
[0012] The two upper deflection correcting plates are arranged with their ends close to each other tilted downward.
[0013] The deflection correcting plate located at the top is a first deflection correcting plate, and the deflection correcting plate located at the bottom is a second deflection correcting plate. The second deflection correcting plate is arranged below the first deflection correcting plate through a connecting member.
[0014] The first deviation correcting plate is fixed on the bracket by a plurality of bolts.
[0015] The bracket is provided with a plurality of waist-shaped mounting holes along the horizontal direction, and a plurality of the bolts are respectively arranged in the corresponding waist-shaped mounting holes.
[0016] The two brackets are slidably arranged on the mounting seat.
[0017] The mounting seat is provided with a slide rail, and the ends of the two brackets are clamped on the slide rail.
[0018] The mounting seat is provided with a driving member, and the driving member is used to drive the two brackets to move synchronously toward or away from each other on the mounting seat.
[0019] The above structure of the utility model can achieve the following beneficial effects:
[0020] When in use, the silicon wafer handling assembly moves from top to bottom and passes between the two brackets. Since the spacing between the correcting plates on the two brackets is adapted to the width of the silicon wafer, when the silicon wafer on the silicon wafer handling assembly passes between the two brackets, the two sides of the silicon wafer contact the correcting plates on both sides, and the silicon wafer in an unaligned state rotates in the vertical direction until it is aligned by the correcting plates and passes between the two brackets, thereby adjusting the posture of the silicon wafer on the silicon wafer handling assembly to ensure that the silicon wafer is aligned to avoid affecting the processing of subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a structural schematic diagram of this embodiment.
[0022] In the figure: 1. mounting seat; 2. bracket; 21. waist-shaped mounting hole; 3. correction plate; 4. correction teeth; 5. slide rail; 6. driving part. DETAILED DESCRIPTION
[0023] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0024] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.
[0025] The following is combined with Figure 1 This application is described in further detail.
[0026] refer to Figure 1The silicon wafer correction mechanism shown in the figure includes: a mounting base 1, two parallel brackets 2 are arranged in parallel on one side of the mounting base 1; two correction plates 3 are arranged on the opposite sides of the two brackets 2, the spacing between the correction plates 3 on the two brackets 2 is adapted to the width of the silicon wafer, and the two correction plates 3 on the same bracket 2 are arranged in parallel in the vertical direction. In this way, when in use, the silicon wafer conveying assembly (lifting device) moves from top to bottom and passes between the two brackets 2. Since the spacing between the correction plates 3 on the two brackets 2 is adapted to the width of the silicon wafer, when the silicon wafer on the silicon wafer conveying assembly passes between the two brackets 2, the two sides of the silicon wafer contact with the correction plates 3 on both sides, and the silicon wafer in an unaligned state rotates in the vertical direction until it is aligned by the correction plate 3 and passes between the two brackets 2, thereby adjusting the posture of the silicon wafer on the silicon wafer conveying assembly to ensure that the silicon wafer is aligned to avoid affecting the processing of subsequent processes.
[0027] refer to Figure 1 As shown, the correcting plates 3 on the two brackets 2 are provided with a plurality of correcting teeth 4 on the side close to each other, so that the correcting plates 3 and the correcting teeth 4 thereon are shaped like a comb, and the spacing between the correcting teeth 4 is consistent with the spacing between two adjacent silicon wafers on the silicon wafer handling assembly, so that the silicon wafers are separated by the correcting teeth 4 when passing between the two brackets 2. In order to facilitate the installation and removal of the correcting teeth 4, the correcting teeth 4 are fixed to the correcting plates 3 by bolts.
[0028] refer to Figure 1 As shown, the two upper correcting plates 3 are tilted downward at one end that is close to each other. In this way, when the silicon wafer is broken during the straightening process, the broken silicon wafer will not remain on the upper correcting plate 3, but will slide along the tilted correcting plate 3 to avoid affecting the subsequent straightening work.
[0029] refer to Figure 1 As shown, the correcting plate 3 located at the top is the first correcting plate, and the correcting plate 3 located at the bottom is the second correcting plate. The second correcting plate is arranged below the first correcting plate through a connecting piece. The first correcting plate is fixed to the bracket 2 by a plurality of bolts, and the second correcting plate is installed below the first correcting plate, so as to ensure that the first correcting plate keeps synchronization with the second correcting plate on the same side. In order to facilitate the adjustment of the position of the correcting plate 3, the bracket 2 is provided with a plurality of waist-shaped mounting holes 21 in the horizontal direction, and a plurality of the bolts are respectively arranged in the corresponding waist-shaped mounting holes 21. The position of the correcting plate 3 on the bracket 2 can be adjusted by sliding the bolts in the waist-shaped mounting holes 21.
[0030] refer to Figure 1As shown, in order to facilitate the alignment of silicon wafers of different specifications, the two brackets 2 are slidably arranged on the mounting seat 1, so that the spacing between the two brackets 2 can be adjusted to adapt to the posture adjustment of silicon wafers of different widths. The installation method of the bracket 2 can be preferably: a slide rail 5 is arranged on the mounting seat 1, and the ends of the two brackets 2 are clamped on the slide rail 5 to complete the limitation of the bracket 2 and facilitate the adjustment of the position of the bracket 2. A driving member 6 can be arranged on the mounting seat 1, and the driving member 6 is used to drive the two brackets 2 to move synchronously toward or away from each other on the mounting seat 1. The driving member 6 can be a motor-driven belt to make the two brackets 2 move synchronously, or two cylinders can be used to drive the corresponding brackets 2 to move respectively. In actual production, adaptive selection is made according to needs.
[0031] In summary, when in use, the silicon wafer handling assembly moves from top to bottom and passes between the two brackets 2. Since the spacing between the correcting plates 3 on the two brackets 2 is adapted to the width of the silicon wafer, when the silicon wafer on the silicon wafer handling assembly passes between the two brackets 2, the two sides of the silicon wafer contact the correcting plates 3 on both sides, and the silicon wafer in an unaligned state rotates in the vertical direction until it is aligned by the correcting plates 3 and passes between the two brackets 2, thereby adjusting the posture of the silicon wafer on the silicon wafer handling assembly to ensure that the silicon wafer is aligned to avoid affecting the processing of subsequent processes.
[0032] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.
Claims
1. A silicon wafer correction mechanism, characterized in that: include: A mounting seat (1), wherein two brackets (2) are arranged in parallel on one side of the mounting seat (1); Two deflection correcting plates (3) are arranged on opposite sides of the two brackets (2), and the two deflection correcting plates (3) on the same bracket (2) are arranged in parallel along the vertical direction.
2. The silicon wafer deflection correction mechanism according to claim 1, characterized in that: A plurality of deflection correcting teeth (4) are provided on the mutually adjacent sides of the deflection correcting plates (3) on the two brackets (2).
3. The silicon wafer deflection correction mechanism according to claim 2, characterized in that: The deflection correcting teeth (4) are fixed on the deflection correcting plate (3) by means of bolts.
4. The silicon wafer deflection correction mechanism according to claim 1, characterized in that: The two deflection correcting plates (3) located at the top are arranged with their ends close to each other tilted downward.
5. The silicon wafer correction mechanism according to claim 1, characterized in that: The deflection correcting plate (3) located at the top is a first deflection correcting plate, and the deflection correcting plate (3) located at the bottom is a second deflection correcting plate, and the second deflection correcting plate is arranged below the first deflection correcting plate through a connecting member.
6. The silicon wafer deflection correction mechanism according to claim 5, characterized in that: The first deviation-correcting plate is fixed on the bracket (2) by means of a plurality of bolts.
7. The silicon wafer deflection correction mechanism according to claim 6, characterized in that: The bracket (2) is provided with a plurality of waist-shaped mounting holes (21) along the horizontal direction, and a plurality of the bolts are respectively arranged in corresponding waist-shaped mounting holes (21).
8. The silicon wafer deflection correction mechanism according to claim 1, characterized in that: The two brackets (2) are slidably arranged on the mounting seat (1).
9. The silicon wafer deflection correction mechanism according to claim 8, characterized in that: A slide rail (5) is provided on the mounting seat (1), and ends of the two brackets (2) are clamped on the slide rail (5).
10. The silicon wafer deviation correction mechanism according to claim 8, characterized in that: A driving member (6) is provided on the mounting seat (1), and the driving member (6) is used to drive the two brackets (2) on the mounting seat (1) to move synchronously towards or away from each other.