Wafer adsorption device
By introducing cleaning pipelines into the wafer adsorption device, the problem of excessive downtime caused by wafer debris is solved, and the effect of reducing re-machine time and improving production efficiency is achieved.
Patent Information
- Application Number
- CN202420412314.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-04
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-04
AI Technical Summary
The downtime caused by wafer fragmentation is too long, which affects production efficiency.
A wafer adsorption device is designed, including an adsorption arm, a vacuum line and a cleaning line. The cleaning pipeline is connected to the vacuum pipeline and the vacuum channel of the adsorption arm, and is used to provide cleaning gas and clean wafer fragments in the adsorption arm.
Clean the adsorbent arms through the cleaning pipeline to reduce the re-machine time, extend the device's use time, avoid long-term downtime caused by debris, and improve production efficiency.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductors, in particular to a wafer adsorption device. Background Art
[0002] The vacuum suction arms of current semiconductor measurement equipment all use point suction, which uses vacuum pipes to make the pressure at the point suction position much lower than that at nearby positions, so that the wafer is sucked onto the vacuum suction arm. Figure 1-2 ,in, Figure 1 This is a schematic diagram of the structure of the vacuum adsorption arm. Figure 2 For along Figure 1 The cross-sectional view along the AA' direction. Figure 1-2 As shown, the vacuum adsorption arm includes an arm 11 and a vacuum pipeline 12. The arm 11 includes a vacuum channel 21 and an adsorption hole 22. The vacuum adsorption pipeline 12 is connected to the vacuum channel 21 in the arm 11, provides a vacuum environment for the arm 11, and adsorbs the wafer through the adsorption hole 22. However, when the wafer is broken, the wafer fragments will enter the arm 11 through the adsorption hole 22, causing blockage, reducing the adsorption force of the vacuum adsorption arm, and affecting the normal operation of the machine. Replacing the vacuum adsorption arm will cause the machine to shut down for a long time, affecting production efficiency.
[0003] Therefore, how to reduce the downtime caused by wafer fragments and thus improve production efficiency is a problem that needs to be solved at present. Summary of the invention
[0004] The technical problem to be solved by the utility model is how to reduce the downtime caused by wafer fragments, thereby improving production efficiency, and provides a wafer adsorption device.
[0005] In order to solve the above problems, the utility model provides a wafer adsorption device, including: an adsorption arm, used to adsorb wafers, a vacuum channel is arranged in the adsorption arm, the first surface of the adsorption arm includes at least one adsorption hole, and the adsorption hole is connected to the vacuum channel; a vacuum pipeline, connected to the vacuum channel of the adsorption arm, used to provide a vacuum environment; a cleaning pipeline, connected to the vacuum pipeline and the vacuum channel of the adsorption arm, used to provide cleaning gas.
[0006] In some embodiments, the cleaning pipeline is connected to the vacuum pipeline and the vacuum channel of the adsorption arm through a three-way valve.
[0007] In some embodiments, the cleaning pipeline further includes a control valve to switch the opening and closing state of the cleaning pipeline.
[0008] In some embodiments, the adsorption arm also includes a second surface opposite to the first surface, the adsorption hole has a groove on the side away from the first surface, the groove passes through the second surface, and the wafer adsorption device is also provided with a plug that can be inserted into the groove.
[0009] In some embodiments, the plug includes a column that can be inserted into the groove and a sealing ring connected to the column.
[0010] In some embodiments, the sealing ring protrudes from the second surface, and a thread is disposed on a side of the column close to the sealing ring.
[0011] In some embodiments, the pillar is a cylinder with a smooth surface.
[0012] In some embodiments, the plug can be removed when wafer fragments enter the adsorption arm and cause blockage, so as to form a channel penetrating the first surface and the second surface through the adsorption hole and the groove, thereby cleaning the wafer fragments.
[0013] In some embodiments, the control valve is further used to open when wafer fragments enter the adsorption arm and become blocked, so as to allow cleaning gas to enter the adsorption arm, thereby cleaning the wafer fragments in the adsorption arm.
[0014] In some embodiments, the cleaning gas is high purity nitrogen.
[0015] The above technical solution can clean the adsorption arm by setting a cleaning pipeline connected to the vacuum pipeline and the vacuum channel of the adsorption arm in the wafer adsorption device. When the wafer is broken and the wafer fragments enter the adsorption arm through the adsorption hole and cause blockage, the wafer fragments in the adsorption arm can be cleaned through the cleaning pipeline. Cleaning the adsorption arm through the cleaning pipeline can reduce the recovery time, increase the use time of the wafer adsorption device, and avoid long-term downtime due to debris that requires replacement of the adsorption arm, affecting production efficiency. The adsorption arm can also be cleaned regularly through the cleaning pipeline to avoid the accumulation of particulate matter in the adsorption arm due to long-term use and affect the normal operation of the machine, so as to meet the cleaning and maintenance of the adsorption arm during daily use.
[0016] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the specific implementation of the utility model, the following is a brief introduction to the drawings required for the description of the specific implementation. Obviously, the drawings described below are only some specific implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0018] Figure 1 Schematic diagram of the structure of the vacuum adsorption arm.
[0019] Figure 2 For along Figure 1 Cross-sectional view along the AA' direction.
[0020] Figure 3 It is a structural schematic diagram of an embodiment of the wafer adsorption device of the utility model.
[0021] Figure 4 For along Figure 3 Cross-sectional view along the BB' direction.
[0022] Figure 5 It is a structural schematic diagram of an embodiment of a plug of the wafer adsorption device of the utility model. DETAILED DESCRIPTION
[0023] The technical scheme in the embodiment of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0024] See also Figure 3 to Figure 5 ,in, Figure 3 It is a structural schematic diagram of an embodiment of the wafer adsorption device of the utility model; Figure 4 For along Figure 3 Cross-sectional view in the BB' direction; Figure 5 It is a structural schematic diagram of an embodiment of a plug of the wafer adsorption device of the utility model.
[0025] like Figure 3-4As shown, the wafer adsorption device includes: an adsorption arm 31, a vacuum pipeline 32 and a cleaning pipeline 33. The adsorption arm 31 is used to adsorb wafers, and a vacuum channel 311 is provided in the adsorption arm 31. The first surface S1 of the adsorption arm 31 includes at least one adsorption hole 312, and the adsorption hole 312 is connected to the vacuum channel 311. The vacuum pipeline 32 is connected to the vacuum channel 311 of the adsorption arm 31 to provide a vacuum environment. The cleaning pipeline 33 is connected to the vacuum pipeline 32 and the vacuum channel 311 of the adsorption arm 31 to provide cleaning gas.
[0026] The above technical solution can clean the adsorption arm by setting a cleaning pipeline in the wafer adsorption device that is connected to the vacuum pipeline and the vacuum channel of the adsorption arm. Specifically, when the wafer is fragmented and the wafer fragments enter the adsorption arm through the adsorption hole and cause blockage, the wafer fragments in the adsorption arm can be cleaned up through the cleaning pipeline. Cleaning (Purge) the adsorption arm through the cleaning pipeline can reduce the recovery time, increase the use time of the wafer adsorption device, and avoid long-term downtime due to the need to replace the adsorption arm due to fragments, affecting production efficiency. In addition, the adsorption arm can also be cleaned regularly through the cleaning pipeline to avoid the adsorption arm from accumulating particulate matter (PA) due to long-term use and affecting the normal operation of the machine, so as to meet the cleaning and maintenance of the adsorption arm during daily use.
[0027] Please continue reading Figure 3-4 In some embodiments, the cleaning pipeline 33 is connected with the vacuum pipeline 32 and the vacuum channel 311 of the adsorption arm 31 through a three-way valve 34. The three-way valve 34 is used to control the switch state of the cleaning pipeline 33. When the wafer adsorption device adsorbs the wafer, the three-way valve 34 controls the communication channel between the vacuum pipeline 32 and the vacuum channel 311 of the adsorption arm 31 to be opened and the cleaning pipeline 33 to be closed, so as to ensure the vacuum state in the adsorption arm 31; when the adsorption arm 31 needs to be cleaned, the three-way valve 34 controls the communication channel between the cleaning pipeline 33 and the vacuum channel 311 of the adsorption arm 31 to be opened and the vacuum pipeline 32 to be closed, so as to clean the adsorption arm 31.
[0028] Furthermore, in order to prevent the three-way valve 34 from being damaged and causing the cleaning gas to flow out and affect the vacuum state in the adsorption arm 31, in some embodiments, a control valve 35 is further provided on the cleaning pipeline 33 to switch the opening and closing state of the cleaning pipeline 31. The control valve 35 can be opened or closed manually. When the adsorption arm 31 needs to be cleaned, the control valve 35 is manually opened and the control state of the three-way valve 34 is adjusted accordingly to allow the cleaning gas to enter the adsorption arm 31; when cleaning is not required, the control valve 35 is manually closed and the control state of the three-way valve 34 is adjusted accordingly. By dually controlling the opening and closing of the cleaning pipeline 33 by the three-way valve 34 and the control valve 35, the possibility of gas leakage during the operation of the wafer adsorption device can be reduced, the wafer can be prevented from being detached, and the stability of the device operation can be improved.
[0029] Please continue reading Figure 4 In some embodiments, the suction arm 31 further includes a second surface S2 opposite to the first surface S1, the suction hole 332 has a groove 333 on a side away from the first surface S1, and the groove 333 penetrates the second surface S2, and the wafer suction device is further provided with a plug 36 that can be inserted into the groove 333. When the wafer suction device is working, the plug 36 is inserted into the groove 333 to ensure the vacuum state of the suction arm 31.
[0030] See also Figure 4-5 The plug 36 includes a column 361 that can be inserted into the groove 333 and a sealing ring 362 connected to the column 361. The column 361 and the sealing ring 362 are used to ensure that the suction arm 31 has good airtightness when the plug 36 is set in the groove 333.
[0031] In some embodiments, the sealing ring 362 protrudes from the second surface S2, and a thread 363 is provided on one side of the column 361 close to the sealing ring 362. The plug 36 can be screwed to the slot 333 through the thread 363, so that the plug 36 is more tightly combined with the slot 333, preventing the plug 36 from falling off or popping out of the slot 333, and further ensuring the stability of the device.
[0032] In this embodiment, the column 361 is a cylinder with a smooth surface. In other embodiments, the column 361 can also be other shapes to adapt to slots 333 of different shapes to ensure that the suction arm 31 has good air tightness when the plug 36 is set in the slot 333.
[0033] In addition, in some embodiments, the plug 36 can be removed when wafer fragments enter the adsorption arm 31 and cause blockage, so as to form a channel passing through the first surface S1 and the second surface S2 through the adsorption hole 332 and the groove 333, thereby cleaning the wafer fragments.
[0034] In order to further improve the self-cleaning ability of the wafer device, the control valve 35 is further used to open when the wafer fragments enter the adsorption arm 31 and cause blockage, so as to allow the cleaning gas to enter the adsorption arm 31, thereby cleaning the wafer fragments in the adsorption arm 31. At this time, the plug 36 is removed, and a channel penetrating the first surface S1 and the second surface S2 is formed through the adsorption hole 332 and the slot 333, so that the wafer fragments in the adsorption arm 31 can be cleaned more thoroughly. The cleaning pipeline 33 can also regularly maintain the adsorption arm 31, reduce the failure rate of the wafer adsorption device, and extend the service life of the adsorption arm 31.
[0035] In some embodiments, the cleaning gas is high purity nitrogen (PN2).
[0036] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.
[0037] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connectivity / coupling" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.
[0038] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present utility model. In the above-mentioned embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.
[0039] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A wafer adsorption device, characterized in that: include: A suction arm, used for sucking the wafer, wherein a vacuum channel is provided in the suction arm, and a first surface of the suction arm comprises at least one suction hole, wherein the suction hole is connected to the vacuum channel; A vacuum pipeline, connected to the vacuum channel of the adsorption arm, for providing a vacuum environment; A cleaning pipeline is connected to the vacuum pipeline and the vacuum channel of the adsorption arm, and is used for providing cleaning gas.
2. The wafer adsorption device according to claim 1, characterized in that: The cleaning pipeline is connected with the vacuum pipeline and the vacuum channel of the adsorption arm through a three-way valve.
3. The wafer adsorption device according to claim 1, characterized in that: The cleaning pipeline is also provided with a control valve to switch the opening and closing state of the cleaning pipeline.
4. The wafer adsorption device according to claim 1, characterized in that: The adsorption arm also includes a second surface opposite to the first surface. The adsorption hole has a groove on a side away from the first surface. The groove runs through the second surface. The wafer adsorption device is also provided with a plug that can be inserted into the groove.
5. The wafer adsorption device according to claim 4, characterized in that: The plug includes a column that can be inserted into the groove and a sealing ring connected to the column.
6. The wafer adsorption device according to claim 5, characterized in that: The sealing ring protrudes from the second surface, and a thread is arranged on one side of the column close to the sealing ring.
7. The wafer adsorption device according to claim 5, characterized in that: The column is a cylinder with a smooth surface.
8. The wafer adsorption device according to claim 4, characterized in that: The plug can be removed when wafer fragments enter the adsorption arm and cause blockage, so as to form a channel penetrating the first surface and the second surface through the adsorption hole and the groove, thereby cleaning the wafer fragments.
9. The wafer adsorption device according to claim 3, characterized in that: The control valve is further used to open when wafer fragments enter the adsorption arm and become blocked, so as to allow cleaning gas to enter the adsorption arm, thereby cleaning the wafer fragments in the adsorption arm.
10. The wafer adsorption device according to claim 1, characterized in that: The cleaning gas is high-purity nitrogen.